CN110293220A - A kind of alloy core metallization treating method - Google Patents

A kind of alloy core metallization treating method Download PDF

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Publication number
CN110293220A
CN110293220A CN201910680736.0A CN201910680736A CN110293220A CN 110293220 A CN110293220 A CN 110293220A CN 201910680736 A CN201910680736 A CN 201910680736A CN 110293220 A CN110293220 A CN 110293220A
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CN
China
Prior art keywords
magnetic powder
alloy
treating method
layer
alloy core
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Pending
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CN201910680736.0A
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Chinese (zh)
Inventor
胡庚
朱圆圆
耿振伟
韩仕杰
王雪珂
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Shenzhen Microgate Technology Co ltd
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Shenzhen Microgate Technology Co ltd
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Priority to CN201910680736.0A priority Critical patent/CN110293220A/en
Publication of CN110293220A publication Critical patent/CN110293220A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • B22F1/052Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/02Compacting only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/24Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
    • C23C22/33Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds containing also phosphates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/022Electroplating of selected surface areas using masking means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206Manufacturing of magnetic cores by mechanical means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206Manufacturing of magnetic cores by mechanical means
    • H01F41/0246Manufacturing of magnetic circuits by moulding or by pressing powder

Abstract

The present invention discloses a kind of alloy core metallization treating method, and this method includes the following steps: (1), magnetic powder pretreatment;(2), magnetic powder is granulated: pretreated alloy magnetic powder, binder, coupling agent, solvent being mixed 1 hour, toasted after stirring, is sieved after baking by mesh screen;(3), it forms: magnetic powder is formed in 500~1500MPa pressure maintaining, 5~600s;(4), it is sintered: product after molding is sintered 30~120min in the environment of 600~1200 DEG C;(5), it cleans;(6), it toasts;(7), electroplating processes, electroplating current density is 0.052A/cm2~0.095A/cm2, electroplate liquid pH value 7.5~8.5 when plating, electroplated layer is followed successively by plating silver layer, electroless nickel layer, electric nickel tin layers from inside to outside, 4~8um of silver layer, 0.7~2.0um of electroless nickel layer is wherein electroplated, 1~4um of tin layers is electroplated.

Description

A kind of alloy core metallization treating method
Technical field
The present invention discloses a kind of alloy core metallization treating method, and the invention belongs to magnetic core fields.
Background technique
Recently as the development of the communication technology, increase to the electronic components demand such as transformer, inductance.Alloy material The transformer and inductor core saturation electric current of production are big, are increasingly subject to favor, but the alloy core of alloy material production at present There is following two in the water depositing process of use: 1) directly adopt will appear when traditional water depositing process is metallized climb plating and Tin layers are not fine and close, tin difficulty phenomenon on product;2) position that product to be electroplated is exposed, first on the surface that product does not need plating One layer of epoxy resin is coated, is electroplated again after toasted solidification, this technique process is long and qualification rate is low.Therefore a kind of energy is found Carry out water plating, low in cost, upper tin effect is good, is easy to the metallization process of large-scale production, become alloy core it is urgent highly necessary It asks.
Summary of the invention
It can not be using traditional water depositing process for the alloy core of alloy material in the prior art production mentioned above The shortcomings that being metallized, the present invention provide a kind of alloy core metallization treating method, pass through the pre- place to alloy magnetic powder Reason makes its surface coat one layer of fine and close megohmite insulant, and alloy core after molding is made to have high insulation resistance, can be directly It is metallized using water depositing process.
The technical solution used to solve the technical problems of the present invention is that: a kind of alloy core metallization treating method, the party Method includes the following steps:
(1), magnetic powder pre-processes;
(2), magnetic powder is granulated: pretreated alloy magnetic powder, binder, coupling agent, solvent being mixed 1 hour, after stirring Baking, is sieved by 80,100,200 and 300 mesh mesh screens after baking, carries out next step after being mixed according to the proportion; Wherein the binder is the epoxy resin of 1.0 ~ 4.0wt.%E20 of the total volume, coupling agent is of the total volume 0.10 ~ The KH550 coupling agent of 0.50wt.%, remaining is alloy magnetic powder, and solvent is AR rank alcohol or acetone.
Match after screening as follows: wherein (+80) account for 0% ~ 1.0wt.%, and (- 80+100) accounts for 10.0 ~ 20.0wt.%, (- 100 ,+ 200) 30.0 ~ 55.5wt.% is accounted for, (- 200 ,+300) account for 12.0 ~ 15.0wt.%, remaining is -300 mesh;
(3), it forms: magnetic powder is formed in 500~1500MPa pressure maintaining, 5~600s;
(4), it is sintered: product after molding is painted into silver paste in the position to be electroplated, be then sintered in the environment of 600~1200 DEG C 30~120min;
(5), it cleans;
(6), it toasts;
(7), electroplating processes, electroplating current density is 0.052A/cm2~0.095A/cm2 when plating, electroplate liquid pH value 7.5~ 8.5, electroplated layer is followed successively by plating silver layer, electroless nickel layer, electric nickel tin layers from inside to outside, wherein plating 4~8um of silver layer, electronickelling 0.7~2.0um of layer, is electroplated 1~4um of tin layers.
The technical scheme adopted by the invention to solve the technical problem further comprises:
The magnetic powder pretreatment includes the following steps:
(1-1), the alloy magnetic powder of 100 parts by weight is poured into and stirs 1~5min in the acid solution of 300 parts by weight;
(1-2), alloy magnetic powder clean after acid solution is handled;
(1-3), the alloy magnetic powder after cleaning is poured into 20~120min of processing in passivating solution;
(1-4), the alloy magnetic powder after passivation is cleaned;
(1-5), baking.
The acid solution uses the concentration to be for 1~5wt.% liquor potassic permanganate, 1~25wt.% oxalic acid solution, concentration 1~20wt.% acetum, concentration are 1~15wt.% hydrochloric acid solution or concentration is 1~5wt.% sulfuric acid solution.
The passivating solution uses the chromate that concentration is 5~50wt.% for the phosphate solution or concentration of 3~25wt.% Solution.
When the described cleaning, first with the alcohol washes of 500~1500 parts by weight, then the clear water with 500~1500 parts by weight Cleaning is finally cleaned with the deionized water of 500~1500 parts by weight.
The baking is to toast 30min under conditions of 50~140 DEG C.
When mesh screen sieves in the step (2), the mesh screen of 80,100,200 and 300 mesh is successively used.
Due to alloy powder be it is conductive, be also by the product that it is pressed into it is conductive, no matter lead in plating product It needs electroplating site or does not need the surface of electroplating site all plate tin, that is, occur climbing plating and the tin layers of plating are not fine and close. But it is treated by the present method after powder surface form one layer of fine and close passivation layer, due to passivation layer insulation and fine and close, so electric Uniform in the position coating for needing to be electroplated when plating, upper tin effect is good, and the position for not needing plating would not occur climbing plating phenomenon.
The beneficial effects of the present invention are: the present invention has, at low cost, operation is easier, tin is imitated on product after metalized The advantages that fruit is good.Pretreatment process and electroplating work procedure are crucial and cores in the present invention, are had to alloy metallization performance Decisive role.
Specific embodiment
The present embodiment is the preferred embodiment for the present invention, other its all principles and basic structure are identical or close as the present embodiment As, within that scope of the present invention.
The present invention mainly protects a kind of alloy core metallization treating method, mainly includes that magnetic powder pre-processes, at plating (in the present embodiment, other treatment process successively include that magnetic powder is granulated, molding, sintering, cleans and dry for reason and other treatment process It is roasting), specific as follows:
(1), magnetic powder pre-processes:
(1-1), the alloy magnetic powder (alloy magnetic powder of conventional for transformer and inductor magnetic core) of 100 parts (parts by weight) is fallen Enter 1~5min of stirring in the acid solution of 300 parts (parts by weight), the acid solution in the present embodiment includes but is not limited to that concentration is 1~5wt.% liquor potassic permanganate, 1~25wt.% oxalic acid solution, concentration are 1~20wt.% acetum, concentration be 1~ 15wt.% hydrochloric acid solution and/or concentration are 1~5wt.% sulfuric acid solution;
(1-2), alloy magnetic powder routinely clean after acid solution is handled, in the present embodiment, when cleaning, first with 500~1500 weights The alcohol washes (because alloyed powder is 100 parts by weight, the weight ratio of alcohol and alloyed powder is 5 ~ 15:1) of part are measured, then are used The clear water of 500~1500 parts by weight cleans, and is finally cleaned with the deionized water of 500~1500 parts by weight;
(1-3), the alloy magnetic powder after cleaning is poured into 20~120min of processing in passivating solution, the passivating solution in the present embodiment includes But it is not limited to the phosphate solution that concentration is 3~25wt.% or the chromatedsolution that concentration is 5~50wt.%;
(1-4), the alloy magnetic powder after passivation carries out to conventional cleaning, in the present embodiment, when cleaning, first with 500~1500 weight Part alcohol washes (because alloyed powder is 100 parts by weight, the weight ratio of alcohol and alloyed powder is 5 ~ 15:1), then with 500 The clear water of~1500 parts by weight cleans, and is finally cleaned with the deionized water of 500~1500 parts by weight;
(1-5), baking: it in the present embodiment, toasts to toast 30min under conditions of 50~140 DEG C;
(2), magnetic powder is granulated: pretreated alloy magnetic powder, binder, coupling agent, solvent being mixed 1 hour, after stirring Baking is sieved after baking by 80,100,200 and 300 mesh mesh screens, is matched after screening as follows: wherein (+80) account for 0% ~ 1.0wt.%, (- 80+100) account for 10.0 ~ 20.0wt.%, and (- 100 ,+200) account for 30.0 ~ 55.5wt.%, and (- 200 ,+300) account for 12.0 ~ 15.0wt.%, remaining forms the magnetic powder with good fluidity for -300 mesh;
Wherein the binder is 1.0 ~ 4.0wt.%E20 epoxy resin, and coupling agent is 0.10 ~ 0.50wt.%KH550 coupling Agent, solvent are AR rank alcohol or acetone.
(3), it forms: magnetic powder is formed in 500~1500MPa pressure maintaining, 5~600s;
(4), it is sintered: product after molding is sintered 30~120min in the environment of 600~1200 DEG C;
(5), it cleans: in the present embodiment, when cleaning, first with the alcohol washes of 500~1500 parts by weight (because alloyed powder is 100 Parts by weight, so, the weight ratio of alcohol and alloyed powder is 5 ~ 15:1), then cleaned with the clear water of 500~1500 parts by weight, finally It is cleaned with the deionized water of 500~1500 parts by weight;
(6), it toasts: in the present embodiment, toasting to toast 30min under conditions of 50~140 DEG C;
(7), electroplating processes, electroplating current density is 0.052A/cm when plating2~0.095A/cm2, electroplate liquid pH value 7.5~ 8.5.Electroplated layer is followed successively by plating silver layer, electroless nickel layer, electric nickel tin layers from inside to outside, wherein plating 4~8um of silver layer, electronickelling 1~4um of tin layers is electroplated in 0.7~2.0um of layer, and three-layer plating layer is that plating is formed by several times, and through detecting, coating is uniform, tin thickness It is moderate, meet the needs of production.

Claims (7)

1. a kind of alloy core metallization treating method, it is characterized in that: the method includes the following steps:
(1), magnetic powder pre-processes;
(2), magnetic powder is granulated: pretreated alloy magnetic powder, binder, coupling agent, solvent are mixed, toasted after stirring, It is sieved after baking by mesh screen;
(3), it forms: magnetic powder is formed in 500~1500MPa pressure maintaining, 5~600s;
(4), it is sintered: product after molding is sintered 30~120min in the environment of 600~1200 DEG C;
(5), it cleans;
(6), it toasts;
(7), electroplating processes, electroplating current density is 0.052A/cm2~0.095A/cm2 when plating, electroplate liquid pH value 7.5~ 8.5, electroplated layer is followed successively by plating silver layer, electroless nickel layer, electric nickel tin layers from inside to outside, wherein plating 4~8um of silver layer, electronickelling 0.7~2.0um of layer, is electroplated 1~4um of tin layers.
2. alloy core metallization treating method according to claim 1, it is characterized in that: the magnetic powder pretreatment includes Following step:
(1-1), the alloy magnetic powder of 100 parts by weight is poured into and stirs 1~5min in the acid solution of 300 parts by weight;
(1-2), alloy magnetic powder clean after acid solution is handled;
(1-3), the alloy magnetic powder after cleaning is poured into 20~120min of processing in passivating solution;
(1-4), the alloy magnetic powder after passivation is cleaned;
(1-5), baking.
3. alloy core metallization treating method according to claim 2, it is characterized in that: the acid solution is using dense Degree is 1~5wt.% liquor potassic permanganate, 1~25wt.% oxalic acid solution, concentration are 1~20wt.% acetum, concentration be 1~ 15wt.% hydrochloric acid solution or concentration are 1~5wt.% sulfuric acid solution.
4. alloy core metallization treating method according to claim 2, it is characterized in that: the passivating solution uses concentration The chromatedsolution that phosphate solution or concentration for 3~25wt.% are 5~50wt.%.
5. alloy core metallization treating method according to claim 1 or 2, it is characterized in that: first being used when the described cleaning The alcohol washes of 500~1500 parts by weight, then cleaned with the clear water of 500~1500 parts by weight, finally with 500~1500 parts by weight Deionized water clean.
6. alloy core metallization treating method according to claim 1 or 2, it is characterized in that: the baking is 50 30min is toasted under conditions of~140 DEG C.
7. alloy core metallization treating method according to claim 1, it is characterized in that: mesh screen in the step (2) When screening, the mesh screen of 80,100,200 and 300 mesh is successively used.
CN201910680736.0A 2019-07-26 2019-07-26 A kind of alloy core metallization treating method Pending CN110293220A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113880560A (en) * 2021-11-17 2022-01-04 广东泛瑞新材料有限公司 Split type water-plating metallization method for magnetic core

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1580770A2 (en) * 2004-03-22 2005-09-28 Aisin Seiki Kabushiki Kaisha Soft magnetic powder and a method of manufacturing a soft magnetic powder compact
CN202887925U (en) * 2012-10-17 2013-04-17 深圳顺络电子股份有限公司 Magnetic core and chip inductor
CN202996518U (en) * 2013-01-10 2013-06-12 湖南创一电子科技有限公司 Novel manganese-zinc ferrite chip magnetic core
CN103614754A (en) * 2013-12-06 2014-03-05 深圳市麦捷微电子科技股份有限公司 Treatment method of sliced ferrite product before being electroplated
CN105036724A (en) * 2015-07-15 2015-11-11 深圳顺络电子股份有限公司 NiCuZn ferrite material, preparation method thereof and laminated sheet-type magnetic bead
CN105177396A (en) * 2015-09-01 2015-12-23 深圳顺络电子股份有限公司 Iron alloy composite and preparation method thereof
CN105632672A (en) * 2015-12-30 2016-06-01 深圳顺络电子股份有限公司 Surface treatment method and surface treatment fluid for electronic ceramic element
CN105679529A (en) * 2016-01-14 2016-06-15 深圳顺络电子股份有限公司 Magnetic device and manufacturing method thereof
CN107452458A (en) * 2017-07-05 2017-12-08 深圳顺络电子股份有限公司 A kind of ferroalloy magnetic material and preparation method thereof
CN107749345A (en) * 2017-09-14 2018-03-02 重庆正峰电子有限公司 The preparation method of SMD inductance core
CN109216006A (en) * 2018-08-29 2019-01-15 深圳顺络电子股份有限公司 soft magnetic alloy powder core and preparation method thereof

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1580770A2 (en) * 2004-03-22 2005-09-28 Aisin Seiki Kabushiki Kaisha Soft magnetic powder and a method of manufacturing a soft magnetic powder compact
CN202887925U (en) * 2012-10-17 2013-04-17 深圳顺络电子股份有限公司 Magnetic core and chip inductor
CN202996518U (en) * 2013-01-10 2013-06-12 湖南创一电子科技有限公司 Novel manganese-zinc ferrite chip magnetic core
CN103614754A (en) * 2013-12-06 2014-03-05 深圳市麦捷微电子科技股份有限公司 Treatment method of sliced ferrite product before being electroplated
CN105036724A (en) * 2015-07-15 2015-11-11 深圳顺络电子股份有限公司 NiCuZn ferrite material, preparation method thereof and laminated sheet-type magnetic bead
CN105177396A (en) * 2015-09-01 2015-12-23 深圳顺络电子股份有限公司 Iron alloy composite and preparation method thereof
CN105632672A (en) * 2015-12-30 2016-06-01 深圳顺络电子股份有限公司 Surface treatment method and surface treatment fluid for electronic ceramic element
CN105679529A (en) * 2016-01-14 2016-06-15 深圳顺络电子股份有限公司 Magnetic device and manufacturing method thereof
CN107452458A (en) * 2017-07-05 2017-12-08 深圳顺络电子股份有限公司 A kind of ferroalloy magnetic material and preparation method thereof
CN107749345A (en) * 2017-09-14 2018-03-02 重庆正峰电子有限公司 The preparation method of SMD inductance core
CN109216006A (en) * 2018-08-29 2019-01-15 深圳顺络电子股份有限公司 soft magnetic alloy powder core and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
王怡伟 等: "FeSiAl磁粉表面绝缘包覆及热处理对磁粉芯磁性能的影响", 《磁性材料及器件》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113880560A (en) * 2021-11-17 2022-01-04 广东泛瑞新材料有限公司 Split type water-plating metallization method for magnetic core
CN113880560B (en) * 2021-11-17 2022-08-02 广东泛瑞新材料有限公司 Split type water-plating metallization method for magnetic core

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Application publication date: 20191001