CN101717978B - Preliminary treatment method for electroplating of chip ferrite product - Google Patents
Preliminary treatment method for electroplating of chip ferrite product Download PDFInfo
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- CN101717978B CN101717978B CN200910189026.4A CN200910189026A CN101717978B CN 101717978 B CN101717978 B CN 101717978B CN 200910189026 A CN200910189026 A CN 200910189026A CN 101717978 B CN101717978 B CN 101717978B
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Abstract
The invention discloses a preliminary treatment method for electroplating of a chip ferrite product, comprising the following steps: I. the chip ferrite semi-finished product after silver ink firing is carried out is arranged in ferrum complex saturated aqueous solution, and then is soaked at normal temperature, and the chip ferrite semi-finished product is taken out after complexing is carried out to ferric ions on the surface of a magnet completely; II. The chip ferrite semi-finished product is cleaned for 3-5 times by pure water with 55-100 DEG C, so as to clean the ferrum complex left on the silver end, and then the chip ferrite semi-finished product can be directly electroplated after being arranged in a basket; the design principle is that: the ferrum complex aqueous solution is utilized to remove the ferric ions left on the surface of the magnet of the chip ferrite semi-finished product after the silver ink firing is carried out to the chip ferrite, no ferric ions are deoxidized when in electroplating, so as not to form an overplating substrate. The preliminary treatment method for electroplating of the chip ferrite product has convenient operation, good effect and short time; the method not only can prevent the chip ferrite semi-finished product from generating the overplating phenomenon in the electroplating procedure, but also can not cause poor plating layer; in addition, the welding reliability of the chip ferrite after being electroplated is ensured.
Description
Technical field
What the present invention related to is the electro-plating pre-treatment method of the manufacture method of chip ferrite product, particularly a kind of chip ferrite product.
Background technology
Chip ferrite product, the phenomenon that exists in appearance two end electrodes to extend to center, is called and climbs plating this type of product appearance defect.Climb plating phenomenon and come across electroplating work procedure in the manufacturing processed of product.This electroplating work procedure is by electric current, to deposit respectively layer of Ni metal level and one deck Sn metal level in the termination silver electrode 2 of the later half product 1 of chip ferrite silver ink firing (seeing Fig. 1), and electrolytic coating 3, to realize the weldability of product.But when actual job, except termination silver electrode 2, metal Ni and Sn also can deposit along termination silver electrode 2 inwards on chip ferrite product matrix 4 surfaces, what form that termination silver electrode 2 extends to centre climbs metal cladding 5 (seeing Fig. 2).The generation of climbing plating mainly contains the reason of two aspects.The one, there is the condition of metal deposition while electroplating in product itself, the magnet material of chip ferrite product is NiCuZn ferrite, the composite oxides that this sintering forms are understood the residual metal ion that does not enter on a small quantity lattice conventionally in magnet, and wherein part metals ion is present in magnet surface.In electroplating process, the end electrode of product is as negative electrode, except Ni
2+/ Sn
2+become outside atomic deposition, also must follow evolving hydrogen reaction simultaneously.[H] atom major part of separating out is converted to hydrogen and emits, but is adsorbed on a small quantity in magnet surface in addition, extremely active, the metal ion atomize that its electromotive force can exist magnet surface, that is: n[H]+[Me]
n+→ n[H]
++ [Me].Like this, the atoms metal being reduced, as electroplating cathode, becomes the substrate of climbing plating.Because evolving hydrogen reaction mainly occurs near end electrode, thereby climb plating and present the phenomenon being extended to center by end electrode.The 2nd, electroplating process product inhomogeneous makes to climb plating and occurred.Chip ferrite product generally adopts barrel plating technique now, and the distribution of product in plating basket exists certain randomness, and the place at portioned product place is because product is piled up, and [H] atom could not be converted into hydrogen completely to be got rid of, and is easily adsorbed in product surface.Region in these [H] atom enrichments, will produce and climb plating after metal ion atomize.
Traditional method of climbing plating that prevents mainly contains two kinds.The one, increase the operation of melting down before electroplating, by product insulation for a long time at a certain temperature.The shortcoming of this method is to increase new equipment, and length consuming time increases production cycle and cost.The 2nd, improve electroplating technology, owing to plating the design of basket and the parameter of plating, there is certain limitation, generally can adopt the method that reduces thickness of coating, shorten electroplating time and reduce electroplating current.The shortcoming of this method is that the minimizing of thickness of coating can cause Product jointing degradation.
Summary of the invention
Object of the present invention is exactly the deficiency for existing technique, provides a kind of anti-creep plating effective, and can not cause the electro-plating pre-treatment method of the chip ferrite product that other performances of product are bad.
The electro-plating pre-treatment method of chip ferrite product of the present invention is achieved through the following technical solutions.
The electro-plating pre-treatment method of this chip ferrite product, comprises that following work step is rapid:
One, work in-process after chip ferrite silver ink firing are placed in iron complex saturated aqueous solution, soak at normal temperatures, after the complete complexing of iron ion quilt of magnet surface, taken out;
Two, with the pure water of 55～100 ℃, clean 3～5 times, iron complex residual on silver-colored termination is cleaned up, can directly fill basket and electroplate.
The further feature of the electro-plating pre-treatment method of chip ferrite product of the present invention is:
Described iron complex saturated aqueous solution is: a kind of or yellow prussiate of potash saturated aqueous solution in ethylenediamine tetraacetic acid (EDTA) (EDTA) saturated aqueous solution, phenanthroline saturated aqueous solution, yellow prussiate of potash saturated aqueous solution, Tripotassium iron hexacyanide saturated aqueous solution, the mixing of Tripotassium iron hexacyanide saturated aqueous solution.
After described chip ferrite silver ink firing, 1: 2 by volume ratio of work in-process and iron complex saturated aqueous solution is soaked in glass cylinder.
After described chip ferrite silver ink firing, the soak time of work in-process in iron complex saturated aqueous solution is 10～24 hours.
After described chip ferrite silver ink firing, work in-process soak in iron complex saturated aqueous solution, and the soak time under oscillatory regime is 10～30 minutes.
Describedly immersed with half-finished glass cylinder after chip ferrite silver ink firing, be placed in ultrasonic cleaning apparatus and vibrate.
In the described water that is placed on ultrasonic cleaning apparatus immersed with half-finished glass cylinder after chip ferrite silver ink firing, carry out water proof vibration, water liquid level is 1/2～2/3 of glass cylinder height.
Principle of design of the present invention is: utilize iron complex saturated aqueous solution when electroplating, not have iron ion to be reduced the residual iron ion removing of work in-process magnet surface after chip ferrite silver ink firing, can not form and climb plating substrate.
The technique effect that the present invention is useful is:
The electro-plating pre-treatment method of this chip ferrite product is easy to operate, effective, and the time is short.It both can prevent after chip ferrite silver ink firing that work in-process produce in electroplating work procedure and climb plating phenomenon, and can not cause the bad of coating again.After electroplating, the soldering reliability of chip ferrite product is guaranteed.
The specific implementation method of the electro-plating pre-treatment method of chip ferrite product of the present invention is provided in detail by following examples.
Accompanying drawing explanation
Fig. 1 is work in-process schematic diagram after chip ferrite silver ink firing.
Fig. 2 is the existing chip ferrite product plating phenomenon schematic diagram that swashes.
Fig. 3 is ferrite inductance finished product schematic diagram after the inventive method is processed.
Embodiment
Take and manufacture chip-type laminated ferrite inductor and describe as example.
Embodiment 1: the electro-plating pre-treatment method of ferrite product, comprises the following steps:
One, edta edta is dissolved in water, with NaOH solution, pH value is transferred to 7, its solubleness is increased, be made into EDTA saturated aqueous solution.
Two, ferrite semifinished product is placed in the glass cylinder that EDTA saturated aqueous solution is housed and is soaked, the volume ratio of ferrite semifinished product and EDTA saturated aqueous solution is 1: 2.
Three, glass cylinder is placed in the water of ultrasonic cleaning apparatus, water liquid level is 2/3 of glass cylinder height, and the vibrations time is 10 minutes.
Four, the ferrite semifinished product of handling well is taken out, with 80 ℃ of pure water, clean 5 times, complete the pre-electroplating treatment operation of ferrite product.
Above-mentioned ferrite semifinished product after pre-electroplating treatment is electroplated: adopt the mode of barrel plating at the foreign-plated nickel dam in silver-colored termination and tin layer, obtain ferrite inductance finished product 6 as shown in Figure 3, the iron ion of the magnet surface of ferrite inductance finished product matrix 4 is owing to being removed clean, therefore the termination silver electrode 2 after electroplating forms the electrolytic coating 3 of Ni and Sn, and does not climb plating phenomenon between the magnet surface of termination silver electrode 2 and matrix 4.
1005 size ferrite inductance products of employing re-plating after pre-electroplating treatment are 100 times of metallography microscope Microscopic observation product appearances and climb the plating length (length extending inward from termination, when two ends length is different, press long record, get the mean value of 50pcs), the soldering reliability of testing product, it is as shown in table 1 below that the data results of pre-treatment product is not done in contrast.Can find out, by pre-electroplating treatment, the iron ion on the magnet of removal ferrite inductance, makes product not climb plating phenomenon when electroplating, and soldering reliability is qualified.And do not do the product of pre-treatment, whole magnet surface is covered completely by Ni and Sn.
The outward appearance of table 1 product and reliability result
Embodiment 2: the electro-plating pre-treatment method of ferrite product, comprises the following steps:
One, edta edta is dissolved in water, with NaOH solution, pH value is transferred to 7, its solubleness is increased, be made into EDTA saturated aqueous solution.
Two, ferrite semifinished product is placed in the glass cylinder that EDTA saturated aqueous solution is housed and soaks 10hr, the volume ratio of ferrite semifinished product and EDTA saturated aqueous solution is 1: 2.
Three, the ferrite semifinished product of handling well is taken out, with 80 ℃ of pure water, clean 5 times, complete the pre-electroplating treatment operation of ferrite product.
Above-mentioned ferrite semifinished product after pre-electroplating treatment is electroplated: adopt the mode of barrel plating at the foreign-plated nickel dam in silver-colored termination and tin layer, obtain ferrite inductance finished product 6 as shown in Figure 3, the iron ion of the magnet surface of ferrite inductance finished product matrix 4 is owing to being removed clean, therefore the termination silver electrode 2 after electroplating forms the electrolytic coating 3 of Ni and Sn, and does not climb plating phenomenon between the magnet surface of termination silver electrode 2 and matrix 4.
1005 size ferrite inductance products of employing re-plating after pre-electroplating treatment are 100 times of metallography microscope Microscopic observation product appearances and climb the plating length (length extending inward from termination, when two ends length is different, press long record, get the mean value of 50pcs), the soldering reliability of testing product, data results is as shown in table 1 below.Can find out, by pre-electroplating treatment, the iron ion on the magnet of removal ferrite inductance, makes product not climb plating phenomenon when electroplating, and soldering reliability is qualified.
The outward appearance of table 1 product and reliability result
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (6)
1. an electro-plating pre-treatment method for chip ferrite product, comprises the following steps:
One, work in-process after chip ferrite silver ink firing are placed in iron complex saturated aqueous solution, soak at normal temperatures, after the complete complexing of iron ion quilt of magnet surface, taken out;
Described iron complex saturated aqueous solution is: a kind of or ferrocyanide aqueous solutions of potassium in edta solution, the phenanthroline aqueous solution, ferrocyanide aqueous solutions of potassium, potassium ferricyanide aqueous solution, the mixing of potassium ferricyanide aqueous solution;
Two, with the pure water of 55～100 ℃, clean 3～5 times, iron complex residual on silver-colored termination is cleaned up, can directly fill basket and electroplate.
2. the electro-plating pre-treatment method of chip ferrite product according to claim 1, is characterized in that:
After described chip ferrite silver ink firing work in-process and solution by volume 1:2 ratio in glass cylinder, soak.
3. the electro-plating pre-treatment method of chip ferrite product according to claim 2, is characterized in that:
After described chip ferrite silver ink firing, the soak time of work in-process in iron complex saturated aqueous solution is 10～24 hours.
4. the electro-plating pre-treatment method of chip ferrite product according to claim 2, is characterized in that:
After described chip ferrite silver ink firing, work in-process soak in iron complex saturated aqueous solution, and the soak time under oscillatory regime is 10～30 minutes.
5. the electro-plating pre-treatment method of chip ferrite product according to claim 4, is characterized in that:
Describedly immersed with half-finished glass cylinder after chip ferrite silver ink firing, be placed in ultrasonic cleaning apparatus and vibrate.
6. the electro-plating pre-treatment method of chip ferrite product according to claim 5, is characterized in that:
In the described water that is placed on ultrasonic cleaning apparatus immersed with half-finished glass cylinder after chip ferrite silver ink firing, carry out water proof vibration, water liquid level is 1/2～2/3 of glass cylinder height.
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| CN200910189026.4A CN101717978B (en) | 2009-12-16 | 2009-12-16 | Preliminary treatment method for electroplating of chip ferrite product |
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| CN200910189026.4A CN101717978B (en) | 2009-12-16 | 2009-12-16 | Preliminary treatment method for electroplating of chip ferrite product |
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| CN101717978B true CN101717978B (en) | 2014-10-01 |
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| CN104788127B (en) * | 2015-03-31 | 2017-03-29 | 深圳顺络电子股份有限公司 | Electronic ceramic component is suppressed to climb the surface treatment method and electronic ceramic component of plating |
| CN107470798B (en) * | 2017-07-21 | 2019-06-07 | 兰溪市拜瑞珂科技服务有限公司 | A kind of protective device on welding gun |
| CN111636077A (en) * | 2020-06-05 | 2020-09-08 | 成都宏明双新科技股份有限公司 | Process for preventing ceramic chip from being plated with nickel or gold by creeping plating |
| CN113046756B (en) * | 2021-01-29 | 2022-11-15 | 广东风华高新科技股份有限公司 | Solution for improving creeping plating of chip ferrite product and application thereof |
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| US6214685B1 (en) * | 1998-07-02 | 2001-04-10 | Littelfuse, Inc. | Phosphate coating for varistor and method |
| US6841191B2 (en) * | 2002-02-08 | 2005-01-11 | Thinking Electronic Industrial Co., Ltd. | Varistor and fabricating method of zinc phosphate insulation for the same |
| CN100576377C (en) * | 2007-08-03 | 2009-12-30 | 北京科技大学 | Termination electrode of a kind of sheet type ferrite inductor and preparation method thereof |
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Effective date of registration: 20210223 Address after: No. 301, Rong Le Dong Road, Songjiang District, Shanghai Patentee after: Shunluo (Shanghai) Electronics Co., Ltd Address before: Shenzhen City, Guangdong province Baoan District 518110 sightseeing road s Fuyuan sunlord Industrial Park Patentee before: Shenzhen Sunlord Electronics Co.,Ltd. |