CN104392954B - Case package fixture and the method for packing using the fixture - Google Patents
Case package fixture and the method for packing using the fixture Download PDFInfo
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- CN104392954B CN104392954B CN201410756220.7A CN201410756220A CN104392954B CN 104392954 B CN104392954 B CN 104392954B CN 201410756220 A CN201410756220 A CN 201410756220A CN 104392954 B CN104392954 B CN 104392954B
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Abstract
The present invention relates to a kind of encapsulation fixture of the shell for integrated circuit and method for packing, shell (22) include with long side and minor face, the encapsulation fixture：Positioning table (20), the positioning table have the storage tank for carrying out long side positioning to the shell (22)；With the geometrical clamp for the shell and the matching used cover plate of the shell (21) and the positioning table keep together.The method for packing includes：It is positioned in the storage tank by the shell and with the matching used cover plate of the shell, makes the solder face of the shell and the solder plane-plane contact of the cover plate；The shell, the cover plate and positioning table are kept together；And, the shell and the cover plate are placed in firing equipment and are welded.The present invention can improve the positioning precision of domestic little shell, it is ensured that cover plate and shell alignment, and then improve the encapsulation qualification rate of shell.
Description
Technical field
The present invention relates to the packaging process of integrated circuit, more particularly, to a kind of envelope of the shell for integrated circuit
Clamps and method for packing.
Background technology
With the deep development that part domesticizes, domestic shell is more applied to the packaging process of integrated circuit.But
For import shell, domestic shell scale error is larger, and precision is relatively low, and (size is little for particularly domestic small size shell
In 8mmx8mm) precision relatively lower, and wherein, the error of shell minor face compared with the big many of the error on its long side, such as one
The shell of 2.7mmx3.8mm, its minor face tolerance are ± 0.2mm, and its long side tolerance is only ± 0.02mm.Traditional case package
Fixture can only be positioned to shell with minor face, and this has resulted in the reduction of shell positioning precision, and then causes case package to close
The reduction of lattice rate.
Next, although domestic IC industry fast development, but the medium-sized and small enterprises of the country and research institution are still using
The method of manual positioning cover plate and shell position carries out case package, even with parallel sealing device, also inevitably needs
Manual positioning cover plate is wanted, and when welding, operating personnel also closely cannot operate.However, traditional case package fixture is
Three side sealing enclosed fixture, it is impossible to which the position between shell and cover plate is accurately adjusted, so that case package qualification rate
Relatively low.
In addition, traditional case package fixture is typically using positive capping mode, i.e. first put shell, then put cover plate, due to
Cover plate very little and very light in weight, so easily cause cover plate to move when anti-scratch potsherd and geometrical clamp is installed, so as to cause
Packaging effect exceeds required standard.And due to shell and the size of the cover plate close, cause excess solder nowhere to trickle, and along pipe
Shell is stretched to shell surface, makes encapsulated result unqualified.
Content of the invention
Therefore, an object of the present invention is to provide a kind of encapsulation fixture of the shell for integrated circuit and encapsulation side
Method, to solve at least one of the problems referred to above of prior art.
According to an aspect of the present invention, there is provided a kind of encapsulation fixture of the shell for integrated circuit, the shell tool
There are long side and minor face, it is characterised in that the encapsulation fixture includes：Positioning table, the positioning table has to be used for the shell
Carry out the storage tank of long side positioning；Be used for the shell and the matching used cover plate of the shell and the positioning table
The geometrical clamp for keeping together.Storage tank carries out long side positioning to shell, can improve the positioning precision of shell, it is also possible in peace
Make shell not easily shifted during dress geometrical clamp, effectively improve the encapsulation qualification rate of shell.
In some embodiments, the accommodating groove bottom polishing.Accommodating groove bottom polishing can ensure that and adopt inversion
During mode (first put cover plate, then put shell) of installation, cover plate and encapsulation fixture bottom surface can fit tightly, and prevent solder from being stretched
To lid surface.
In some embodiments, the width of the positioning table is adapted with the length of the minor face of the shell.Positioning table
Width close with the bond length of shell, the position of shell and cover plate can be adjusted by the both sides of positioning table, manual
Positioning cover plate, it is ensured that shell and cover plate alignment, without departing from regulation deviation.
According to another aspect of the present invention, there is provided one kind is packaged for integrated circuit using one of above-mentioned encapsulation fixture
Shell method, it is characterised in that comprise the following steps：A is put by the shell and with the matching used cover plate of the shell
It is placed in the storage tank, makes the solder face of the shell and the solder plane-plane contact of the cover plate；B is by the shell, described
Cover plate and positioning table keep together；With c is placed in the shell and the cover plate in firing equipment and welds.
In some embodiments, step a includes：First the cover plate is positioned in the storage tank, then will
The shell is buckled on the cover plate.
In some embodiments, in step a, the short side direction along the shell is to the shell and the lid
The position of plate is adjusted, it is ensured that the shell and cover plate alignment.
According to said method, in the case of by the way of reverse mounted, using shell by shell button on the cover board
Weight come avoid cover plate move, and need not using anti-scratch potsherd in the case of can prevent cover plate scratch.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Accompanying drawing to be used needed for technology description is had to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, acceptable
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is to encapsulate the positioning table encapsulating package of fixture and the decomposing schematic representation of cover plate using existing；
Fig. 2 is to utilize the positioning table encapsulating package of encapsulation fixture described according to an embodiment of the present invention and dividing for cover plate
Solution schematic diagram；
Fig. 3 is the schematic diagram of the geometrical clamp of the encapsulation fixture according to an embodiment of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in embodiments of the invention is carried out clear,
Complete description, it is clear that described embodiment is merely possible to illustrate, and is not intended to limit the present invention.
It is to be shown using the decomposition of 10 encapsulating package 11 of positioning table and cover plate 12 of existing encapsulation fixture refering to Fig. 1-Fig. 3, Fig. 1
It is intended to；Fig. 2 is to encapsulate the positioning table encapsulating package of fixture and the decomposition of cover plate using described according to an embodiment of the present invention
Schematic diagram；Fig. 3 is the schematic diagram of the geometrical clamp of the encapsulation fixture according to an embodiment of the present invention.
As shown in Figures 2 and 3, with long side and minor face, encapsulate fixture includes positioning table 20 and geometrical clamp 30 to shell 22, its
In, positioning table 20 has the storage tank for carrying out long side positioning to the shell, and geometrical clamp 30 is used for shell 22 and shell
22 matching used cover plates 21 and positioning table 20 keep together, and prevent the generation between shell 22 and cover plate 21 in welding
Mobile.
For preventing solder from overflowing the surface of cover plate 21 of stretching in welding, before shell 22 and cover plate 21 are installed, can
The bottom surface of storage tank is polished in the way of adopting machining, it is ensured that cover plate 21 is tight with the bottom surface of the storage tank of positioning table 20
Laminating.
The width of positioning table 20 is processed as the size with the similar length of the minor face of shell 22, such as when shell 22
Bond length when being about 2.7mm, the width dimensions of positioning table 20 can be about 3.7mm, but not limited to this, such that it is able to by fixed
The both sides of position platform 20 are along the position adjustment of the short side direction to shell 22 and cover plate 21 of shell 22, it is ensured that both Accurate aligns.
The method that the shell for being packaged for integrated circuit according to an embodiment of the invention is described below.
By the way of reverse mounted, first the positioning table of encapsulation fixture will be positioned over 22 matching used cover plate 21 of shell
The bottom surface of 20 storage tank, makes its solder face dorsad bottom surface during placement.Afterwards, by shell 22 be buckled in cover plate with solder face
On side, the solder face of shell 22 and the solder plane-plane contact of cover plate 21.In addition, the weight of shell 22 pushes down cover plate 21, permissible
Reduce the movement of cover plate 21.
From the both sides of positioning table 20 along the position adjustment of the short side direction to shell 22 and cover plate 21 of the shell, both are made
Accurate align.Then shell 22, cover plate 21 and positioning table 20 are fixed together using geometrical clamp 30, wherein the knot of geometrical clamp 30
Structure is for example shown in Fig. 3, but is not limited to this.As cover plate 21 is Wei Yu shell 22 and positioning table 20 between, it is possible to which omitting makes
With anti-scratch potsherd.
The shell 22 being fixed together, cover plate 21 and positioning table 20 are positioned in firing equipment, such as heating furnace, shell
Shell 22 and cover plate 21 are welded together under high temperature action by the solder between 22 and cover plate 21.As positioning table has polishing
Bottom surface, so together with cover plate can be fitted tightly with bottom surface, so as to prevent solder from stretching to lid surface.
The present invention can improve the positioning precision of domestic little shell, it is ensured that cover plate and shell alignment, prevent solder from stretching, enter
And improve the encapsulation qualification rate of shell.
Only some embodiments of the present invention disclosed above.For the person of ordinary skill of the art, not
On the premise of departing from the invention design, some deformation and improvement can also be made, these belong to the protection model of the present invention
Enclose.
Claims (5)
1. a kind of encapsulation fixture of the shell for integrated circuit, the shell have long side and minor face, it is characterised in that described
Encapsulation fixture includes：
Positioning table, the positioning table have the storage tank for carrying out long side positioning to the shell；With
For the shell and the shell being supported the use and the cover plate reverse mounted with the shell and the positioning
The geometrical clamp that platform keeps together.
2. encapsulation fixture as claimed in claim 1, it is characterised in that the accommodating groove bottom polishing.
3. encapsulation fixture as claimed in claim 1 or 2, it is characterised in that the width of the positioning table is short with the shell
The length on side is adapted.
4. the method that the encapsulation fixture described in a kind of one of utilization claim 1-3 is packaged for the shell of integrated circuit, which is special
Levy and be, comprise the following steps：
A. it is positioned in the storage tank, wherein by the shell and with the matching used cover plate of the shell, first by the lid
Plate is positioned in the storage tank, then the shell is buckled on the cover plate, makes the solder face of the shell and the lid
The solder plane-plane contact of plate；
B. the shell, the cover plate and positioning table are kept together；With
C. the shell and the cover plate are placed in firing equipment and weld.
5. method as claimed in claim 4, it is characterised in that in step a, the short side direction along the shell is to institute
The position for stating shell and the cover plate is adjusted, it is ensured that the shell and cover plate alignment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410756220.7A CN104392954B (en) | 2014-12-10 | 2014-12-10 | Case package fixture and the method for packing using the fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410756220.7A CN104392954B (en) | 2014-12-10 | 2014-12-10 | Case package fixture and the method for packing using the fixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104392954A CN104392954A (en) | 2015-03-04 |
| CN104392954B true CN104392954B (en) | 2017-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410756220.7A Active CN104392954B (en) | 2014-12-10 | 2014-12-10 | Case package fixture and the method for packing using the fixture |
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| CN (1) | CN104392954B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105244288B (en) * | 2015-08-28 | 2017-11-07 | 中国电子科技集团公司第四十七研究所 | Method for encapsulating integrated circuit |
| CN111477563B (en) * | 2019-01-24 | 2022-04-22 | 中国电子科技集团公司第二十四研究所 | Alignment tool for fusing and sealing semiconductor device |
Citations (7)
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| US5641112A (en) * | 1995-06-30 | 1997-06-24 | Moradi; Vahid | Plate assembly and soldering device for changing screens of circuit boards using soldering and method of application thereof |
| US6818863B1 (en) * | 2003-07-28 | 2004-11-16 | Cheng Uei Precision Industry Co., Ltd. | Electric heat sealing apparatus |
| CN202129524U (en) * | 2011-06-27 | 2012-02-01 | 华为终端有限公司 | Fixture for detaching large-size module and jacking device |
| CN102858095A (en) * | 2012-08-27 | 2013-01-02 | 歌尔声学股份有限公司 | Supporting jig of flexible circuit board |
| CN203406275U (en) * | 2013-07-11 | 2014-01-22 | 江苏博普电子科技有限责任公司 | Accurate locating pasting device |
| CN103579017A (en) * | 2013-11-14 | 2014-02-12 | 无锡中微高科电子有限公司 | Automatic column mounting and welding device for ceramic column grid array packaging |
| CN203804458U (en) * | 2013-11-29 | 2014-09-03 | 中国电子科技集团公司第四十七研究所 | FP type ceramic cartridge parallel seam welding packaging fixture |
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2014
- 2014-12-10 CN CN201410756220.7A patent/CN104392954B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5641112A (en) * | 1995-06-30 | 1997-06-24 | Moradi; Vahid | Plate assembly and soldering device for changing screens of circuit boards using soldering and method of application thereof |
| US6818863B1 (en) * | 2003-07-28 | 2004-11-16 | Cheng Uei Precision Industry Co., Ltd. | Electric heat sealing apparatus |
| CN202129524U (en) * | 2011-06-27 | 2012-02-01 | 华为终端有限公司 | Fixture for detaching large-size module and jacking device |
| CN102858095A (en) * | 2012-08-27 | 2013-01-02 | 歌尔声学股份有限公司 | Supporting jig of flexible circuit board |
| CN203406275U (en) * | 2013-07-11 | 2014-01-22 | 江苏博普电子科技有限责任公司 | Accurate locating pasting device |
| CN103579017A (en) * | 2013-11-14 | 2014-02-12 | 无锡中微高科电子有限公司 | Automatic column mounting and welding device for ceramic column grid array packaging |
| CN203804458U (en) * | 2013-11-29 | 2014-09-03 | 中国电子科技集团公司第四十七研究所 | FP type ceramic cartridge parallel seam welding packaging fixture |
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| Publication number | Publication date |
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| CN104392954A (en) | 2015-03-04 |
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