CN104392949B - A kind of remote chip Transmission system - Google Patents
A kind of remote chip Transmission system Download PDFInfo
- Publication number
- CN104392949B CN104392949B CN201410781874.5A CN201410781874A CN104392949B CN 104392949 B CN104392949 B CN 104392949B CN 201410781874 A CN201410781874 A CN 201410781874A CN 104392949 B CN104392949 B CN 104392949B
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- CN
- China
- Prior art keywords
- chip
- conveyer belt
- transmission system
- remote
- transfer apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The present invention provides a kind of remote chip Transmission system, is related to technical field of semiconductor encapsulation, wherein, the system includes：Chip transfer apparatus；Power supplying apparatus, for providing conveying capacity to the chip transfer apparatus；Guider, for carrying out transmission guiding to the chip transfer apparatus, to ensure the transmission linearity of the chip transfer apparatus；Chip edge detection means, the marginal position for the chip to being positioned on the chip transfer apparatus carry out defects detection；Chip position detection means, for carrying out position detection to the chip.The solution of the present invention can be good at ensureing the accuracy of chip transmission, significant to follow-up chip-stack encapsulation technology and high-end chip package.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation, more particularly to a kind of remote chip Transmission system.
Background technology
With developing rapidly for global electronic information technology, improve chip package efficiency and be just particularly important, so brilliant
Circle develops towards maximization, therefore also more and more appear in encapsulates market to big wafer.Big wafer is developed rapidly to existing electricity
Sub- encapsulation technology proposes challenge, and one of them most important problem is exactly the remote precise delivery of chip.Remote chip
Operating procedure is widely used in electronic packaging industry production, for realizing the lossless precise delivery and key of IC chip
Close, such as die Bonder, arranging machine and flip-chip sealed in unit.Remote chip transmission operation is a pass in Electronic Packaging
Key technical process, its precision and reliability are the important performance indexes of IC equipment.Therefore remote chip transmission just has to have
The unalterable quota such as safety, steady, reliable, and ensure that on the premise of the above several high-speed transfer can be carried out again, it could so improve and set
Standby whole efficiency.
For chip in the transmitting procedure of high-speed motion, displacement caused by the small slide lock of chip all can be to whole encapsulated result
Produce a very large impact.IC chip is brittle semiconductor materials, and Die strength is low frangible, so must essence in chip transmitting procedure kind
The position of true control chip, while ensure that the chip is without damage in transportation.
The content of the invention
It is an object of the invention to provide a kind of remote chip Transmission system, can solve the problem that in current chip transmitting procedure,
The transmission accuracy of chip is not easy to ensure, so that the problem of being produced a very large impact to whole chip package result.
In order to solve the above-mentioned technical problem, embodiments of the invention provide a kind of remote chip Transmission system, wherein, bag
Include：
Chip transfer apparatus；
Power supplying apparatus, for providing conveying capacity to the chip transfer apparatus；
Guider, for carrying out transmission guiding to the chip transfer apparatus, to ensure the chip transfer apparatus
Transmit linearity；
Chip edge detection means, the marginal position for the chip to being positioned on the chip transfer apparatus lack
Fall into detection；
Chip position detection means, for carrying out position detection to the chip.
Wherein, the chip transfer apparatus includes：
One driving wheel；
One driven pulley；
One conveyer belt；
Wherein, one end of the conveyer belt is sheathed on the driving wheel, and the other end of the conveyer belt is sheathed on described
On driven pulley；The driving wheel drives the driven pulley to rotate by the conveyer belt.
Wherein, the chip transfer apparatus also includes：
One driven pulley strainer, for being tensioned to described driven pulley.
Wherein, the driven pulley strainer includes：
Backstand and tensioning screw.
Wherein, the positioning hole being distributed along the conveyer belt direction of transfer is provided with the conveyer belt；
Positioning bead corresponding with the positioning hole is provided with the driving wheel and/or the driven pulley.
Wherein, the power supplying apparatus include the drive motor with closed-loop control system.
Wherein, the drive motor is connected by a shaft coupling with the driving wheel.
Wherein, the guider includes：
The chip fixed guide disk being arranged at along the conveyer belt direction of transfer on the conveyer belt；Wherein described chip is consolidated
Determine the lead that there is the direction of transfer along the conveyer belt to set for positioning disk both sides；
The guide rail for setting along the conveyer belt both sides and coordinating with the lead on the chip fixed guide disk.
Wherein, the chip edge detection means includes：
Along symmetrically arranged first harvester in the conveyer belt both sides and the second harvester.
Wherein, the chip position detection means includes：
It is arranged at the 3rd harvester of predetermined position above the chip fixed guide disk.
Wherein, the conveyer belt includes：First conveyer belt part and the second conveyer belt part, the first conveyer belt part
It is opposite with the direction of transfer of the second conveyer belt part；
Wherein, the remote chip Transmission system also includes：It is arranged at the first conveyer belt part and described second
Between conveyer belt part and with an accommodation space vacuum tank；
The vacuum chip sucker connected with the accommodation space of the vacuum tank is provided with the chip fixed guide disk.
Wherein, it is provided with vacuum inlet on the vacuum tank.
The above-mentioned technical proposal of the present invention has the beneficial effect that：
The solution of the present invention utilizes horizontal transmission bands mechanism so that chip efficiency of transmission greatly improves, and improves complete machine
Operating efficiency；It is guaranteed by the method chip transmission precision of vacuum suction；The closed-loop control pulse of drive motor and
Linear transmission belt can ensure the accuracy of chip transmission very well；In chip transmitting procedure, identified by camera, can be right
Chip carry out chip edge defects detection and and determine chip position, have to chip-stack encapsulation technology and high-end chip package
It is significant.
Brief description of the drawings
Fig. 1 represents the remote chip Transmission system top view of the present invention；
Fig. 2 represents the remote chip Transmission system front view of the present invention；
Fig. 3 represents the remote chip Transmission system partial enlarged drawing of the present invention.
Embodiment
To make the technical problem to be solved in the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and tool
Body embodiment is described in detail.
The remote chip Transmission system of the present invention includes：
Chip transfer apparatus；
Power supplying apparatus, for providing conveying capacity to the chip transfer apparatus；
Guider, for carrying out transmission guiding to the chip transfer apparatus, to ensure the chip transfer apparatus
Transmit linearity；
Chip edge detection means, the marginal position for the chip to being positioned on the chip transfer apparatus lack
Fall into detection；
Chip position detection means, for carrying out position detection to the chip.
Below in conjunction with the accompanying drawings and specific embodiment is described in detail to the said structure of the present invention.
(1) chip transfer apparatus
With reference to Fig. 1 and Fig. 3, in one embodiment of this invention, the chip transfer apparatus can be made up of following several parts：
One driving wheel 11, a driven pulley 12 and a conveyer belt 13.Wherein, the driving wheel 11 drives the driven pulley 12 by the conveyer belt 13
Rotate.
The conveyer belt 13 is a horizontal conveying belt, in order to ensures stationarity of the chip 6 in transmitting procedure；In order to
Ensure the flatness of conveyer belt, it is necessary to install a strainer 121 to driven pulley 12, it is right to cause when conveyer belt 13 relaxes
Driven pulley 12 is adjusted, so as to tighten conveyer belt.Wherein, the strainer in a particular embodiment of the present invention, Ke Yiyou
One backstand and tensioning screw composition, naturally it is also possible to it is other tension structures, it is numerous to list herein.
, can be in the following way in order to avoid conveyer belt 13 operates for a long time and slide fastener phenomenon occurs：
As shown in figures 1 and 3, the positioning hole 14 being distributed along conveyer belt direction of transfer is set on the conveyer belt, in this hair
In bright specific embodiment, the linear type of distribution of the positioning hole 14 on conveyer belt 13, and between two neighboring positioning hole 14
Spacing is equal；Positioning bead 15 is provided with driving wheel 11 and/or driven pulley 12, wherein, positioning bead 15 is arranged to the axle around wheel
Line directional spreding, and distribution rule is：Between circular arc distance and two neighboring positioning hole 14 between two neighboring positioning bead 15
Spacing it is corresponding.Such a design structure serves the band positioning action to conveyer belt 13, effectively prevent the slide fastener of conveyer belt
The generation of phenomenon.
(2) power supplying apparatus
With reference to Fig. 1, the power supplying apparatus can be a drive motor 16 with closed-loop control system, the drive motor
16 can produce closed-loop control pulse；On the one hand the driving force of driving wheel 11 1 can be given, on the other hand, the drive motor 16 can
Realize when there is situation, can automatically control, to eliminate deviation caused by failure, ensure that chip 6 transmits accurate well
Property.Specifically, the drive motor 16 is connected by a shaft coupling 161 with the driving wheel 11.
(3) guider
With reference to Fig. 3, the guider is by lead 17, and the guide rail 18 coordinated with lead 17 is formed, and this is led
It is arranged on to post 17 on chip fixed guide disk 19.
Specifically, the chip fixed guide disk 19 is arranged on the conveyer belt 13 along the direction of transfer of the conveyer belt 13, tool
The quantity of body determines that the both sides of chip fixed guide disk 19 have to be set along the direction of transfer of the conveyer belt 13 according to actual conditions
The lead 17 put.The guide rail 18 along it is described transmission 13 band both sides set and with the chip fixed guide disk 19
Lead 17 coordinate.The cooperation of lead 17 and guide rail 18, it ensure that the linearity that conveyer belt 13 transports.
Wherein, the positioning disk 19 is used to hold chip 6, in order to ensure in the case where not damaging chip 6, and is able to ensure that
The precise delivery of chip 6, the solution of the present invention is in the following way：Ensure the upper surface of chip 6 during chip 6 transports
Always with the presence of atmospheric pressure.Generally, the conveyer belt 13 can be divided into the first conveyer belt part and the second transmission band portion
Point, and the direction of transfer of the two parts is opposite, then can be set between the two parts with an accommodating sky
Between vacuum tank 20, can make application of vacuum in the accommodation space of the vacuum tank 20；In the bottom of the chip fixed guide disk 19
The vacuum chip sucker 21 connected with the accommodation space can be opened up.By such as upper type, the chip fixed guide disk is positioned over
Chip 6 in 19 can be more than the air pressure of lower surface due to the air pressure of the upper surface of chip 6, and the stable chip that is attracted to is fixed
On positioning disk 19.In addition can (quantity be voluntarily set according to designer's wish by the vacuum inlet 22 that is arranged on vacuum tank 20
Fixed, in a particular embodiment of the present invention, preferably 2) vacuum pressure in the accommodation space of regulation vacuum tank 20, to enter one
Step ensures the absorption chip 6 that chip fixed guide disk 19 can be stablized, so that it is guaranteed that while the transmission task of chip 6 is completed,
Chip 6 will not be damaged.
(4) chip edge detection means
Gathered with reference to Fig. 1 and Fig. 2, including along symmetrically arranged first harvester 31 and second in the both sides of conveyer belt 13
Device 32, in a particular embodiment of the present invention, the harvester 32 of the first harvester 31 and second can be camera,
When chip 6 is transmitted between two cameras, two cameras can carry out the detection of defect to the edge of chip 6, follow-up to ensure
Chip 6 is retained and discard processing.
(5) chip position detection means
With reference to Fig. 3, including be arranged at the top predetermined position of chip fixed guide disk 19 the 3rd harvester 33.
Wherein, the 3rd harvester can also be camera, and the camera can be in the default position of the vertical direction of chip fixed guide disk
Put place.When chip 6 is sent to below, the camera carries out position detection to chip 6, to ensure subsequently to the position of chip 6
Put and calibrated.
The operation principle of the system is described in detail below：
With reference to Fig. 2, chip 6 is picked up by the first chip pick-up first 41 from the first chip platform 51, is placed on conveyer belt 13
Chip fixed guide disk 19 in, now drive motor 16 is started working, driving conveyer belt 13 by fixed chip positioning disk 18
Chip 6 be sent between the first harvester 31 and the second harvester 32, the detection of chip 6 edge defect is carried out, if the side of chip 6
Side is defective, then records and make waste paper processing.After the rim detection of chip 6, chip 6 to the 3rd is transmitted by conveyer belt 13 and adopted
Under acquisition means 33, position correction is carried out to chip 6.During the entire process of the transmission of chip 6, vacuum tank 20 is all connected with vacuum, leads to
Cross vacuum chip sucker 21 and adsorb chip 6, ensure transport precision.The 3rd harvester 33 assist calibration after, chip 6 by
Second chip pick-up first 42 is placed into the second chip platform 52, that is, completes the transmitting procedure of whole chip 6.
To sum up, the system is guaranteed by the method transmission precision of vacuum suction；The closed-loop control of drive motor
Pulse and linear transmission belt can ensure the accuracy that chip 6 transmits very well；In the transmitting procedure of chip 6, pass through camera
Identification, chip edge defects detection can be carried out to chip 6 and determines the position of chip 6, to chip-stack encapsulation technology and high-end core
Piece encapsulation is significant.
Certainly, in whole transmitting procedure, chip 6 can be carried out the processing such as preheating, the follow-up heat pressing process that carries out is risen
To the effect of pretreatment.
Described above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, on the premise of principle of the present invention is not departed from, some improvements and modifications can also be made, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (9)
- A kind of 1. remote chip Transmission system, it is characterised in that including：Chip transfer apparatus, including：One driving wheel；One driven pulley；One conveyer belt；Wherein, one end of the conveyer belt is sheathed on the driving wheel, and the other end of the conveyer belt is sheathed on described driven On wheel；The driving wheel drives the driven pulley to rotate by the conveyer belt；The conveyer belt includes：First conveyer belt part and the second conveyer belt part, the first conveyer belt part and described The direction of transfer of two conveyer belt parts is opposite；Wherein, the remote chip Transmission system also includes：It is arranged at the first conveyer belt part and second transmission Point between band portion and the vacuum tank with an accommodation space；Power supplying apparatus, for providing conveying capacity to the chip transfer apparatus；Guider, for carrying out transmission guiding to the chip transfer apparatus, to ensure the transmission of the chip transfer apparatus Linearity；The guider includes：The chip fixed guide disk being arranged at along the conveyer belt direction of transfer on the conveyer belt； Wherein described chip fixed guide disk both sides have the lead that the direction of transfer along the conveyer belt is set；The guide rail for setting along the conveyer belt both sides and coordinating with the lead on the chip fixed guide disk；The vacuum chip sucker connected with the accommodation space of the vacuum tank is provided with the chip fixed guide disk；Chip edge detection means, the marginal position for the chip to being positioned on the chip transfer apparatus carry out defect inspection Survey；Chip position detection means, for carrying out position detection to transmission position of the chip on the conveyer belt.
- 2. remote chip Transmission system according to claim 1, it is characterised in that the chip transfer apparatus also wraps Include：One driven pulley strainer, for being tensioned to described driven pulley.
- 3. remote chip Transmission system according to claim 2, it is characterised in that the driven pulley strainer bag Include：Backstand and tensioning screw.
- 4. remote chip Transmission system according to claim 1, it is characterised in thatThe positioning hole being distributed along the conveyer belt direction of transfer is provided with the conveyer belt；Positioning bead corresponding with the positioning hole is provided with the driving wheel and/or the driven pulley.
- 5. remote chip Transmission system according to claim 1, it is characterised in that the power supplying apparatus include tool There is the drive motor of closed-loop control system.
- 6. remote chip Transmission system according to claim 5, it is characterised in that the drive motor passes through a shaft coupling Device is connected with the driving wheel.
- 7. remote chip Transmission system according to claim 1, it is characterised in that the chip edge detection means bag Include：Along symmetrically arranged first harvester in the conveyer belt both sides and the second harvester.
- 8. remote chip Transmission system according to claim 7, it is characterised in that the chip position detection means bag Include：It is arranged at the 3rd harvester of predetermined position above the chip fixed guide disk.
- 9. remote chip Transmission system according to claim 1, it is characterised in that be provided with vacuum on the vacuum tank Import.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410781874.5A CN104392949B (en) | 2014-12-16 | 2014-12-16 | A kind of remote chip Transmission system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410781874.5A CN104392949B (en) | 2014-12-16 | 2014-12-16 | A kind of remote chip Transmission system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104392949A CN104392949A (en) | 2015-03-04 |
| CN104392949B true CN104392949B (en) | 2017-11-10 |
Family
ID=52610827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410781874.5A Expired - Fee Related CN104392949B (en) | 2014-12-16 | 2014-12-16 | A kind of remote chip Transmission system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104392949B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6293408B1 (en) * | 1997-07-16 | 2001-09-25 | Robotic Vision Systems, Inc. (Rvsi) | Inspection handler apparatus and method |
| CN102263160A (en) * | 2010-05-25 | 2011-11-30 | 韩美半导体株式会社 | Chip Transmission Device And Location Sensing System And Visible Checking System Having Chip Transmission Device |
| CN203134901U (en) * | 2013-01-30 | 2013-08-14 | 东莞市鸿宝锂电科技有限公司 | Soft package lithium battery full-automatic five-in-one forming machine |
-
2014
- 2014-12-16 CN CN201410781874.5A patent/CN104392949B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6293408B1 (en) * | 1997-07-16 | 2001-09-25 | Robotic Vision Systems, Inc. (Rvsi) | Inspection handler apparatus and method |
| CN102263160A (en) * | 2010-05-25 | 2011-11-30 | 韩美半导体株式会社 | Chip Transmission Device And Location Sensing System And Visible Checking System Having Chip Transmission Device |
| CN203134901U (en) * | 2013-01-30 | 2013-08-14 | 东莞市鸿宝锂电科技有限公司 | Soft package lithium battery full-automatic five-in-one forming machine |
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| Publication number | Publication date |
|---|---|
| CN104392949A (en) | 2015-03-04 |
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