CN104387642A - 一种微流控芯片模具 - Google Patents
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920000642 polymer Polymers 0.000 claims abstract description 9
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims abstract description 6
- 235000017491 Bambusa tulda Nutrition 0.000 claims abstract description 6
- 241001330002 Bambuseae Species 0.000 claims abstract description 6
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims abstract description 6
- 239000011425 bamboo Substances 0.000 claims abstract description 6
- 239000003610 charcoal Substances 0.000 claims abstract description 6
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- 229910052602 gypsum Inorganic materials 0.000 claims abstract description 6
- 239000002994 raw material Substances 0.000 claims abstract description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid group Chemical group C(C=1C(C(=O)O)=CC=CC1)(=O)O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- -1 polyethylene Polymers 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- 239000004902 Softening Agent Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 229920003193 cis-1,4-polybutadiene polymer Polymers 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000000945 filler Substances 0.000 abstract 1
- 229920002521 macromolecule Polymers 0.000 abstract 1
- 239000004014 plasticizer Substances 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
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Abstract
本发明公开了一种微流控芯片模具，以30-50重量份的高分子聚合物为原料，还包括以下重量份的组分：填充剂10-15份；增塑剂1-3份；石膏8-10份；竹炭3-5份；铝粉5-8份；铁粉20-25份。本发明的有益效果是：组分配合合理可靠，添加了铝粉和铁粉，能大大增强微流控芯片模具的耐磨性和强度，能有效的延长模具的使用寿命，大大降低了生产成本。
Description
技术领域
本发明涉及一种模具，尤其涉及一种微流控芯片模具。
背景技术
高分子聚合物是制备微流控芯片的一种最常见的材料，由于高聚物具有材料成本和加工成本低廉、适合大批量生产制备等特点，特别适用于微流控芯片的科学基础研究和生产应用两大领域。目前的聚合物微流控芯片的加工方法，主要分为直接加工方法和间接加工方法，其中，基于模具复制的间接制备方法是现在最主要的聚合物芯片的加工方法，这种方法特别适合于聚合物芯片的批量制备，因此在微流控芯片的产业化中具有重要的位置。但是目前微流控芯片在使用过程中硬度不高，耐磨性差，不能满足生产的需求。
因此，为解决上述问题，特提供一种新的技术方案。
发明内容
本发明提供一种微流控芯片模具。
本发明采用的技术方案是：
一种微流控芯片模具，以30-50重量份的高分子聚合物为原料，还包括以下重量份的组分：
填充剂 10-15份；
增塑剂 1-3份；
石膏 8-10份；
竹炭 3-5份；
铝粉 5-8份；
铁粉 20-25份。
进一步的，所述高分子聚合物为聚乙烯、聚丙乙烯、丁苯橡胶、顺丁橡胶或合成纤维其中的一种或两种组合。
进一步的，所述填充剂为硅藻土、石墨、炭黑、氧化铝粉或金刚砂。
进一步的，所述增塑剂为邻苯二甲酸二(2-乙基己)酯。
本发明的有益效果是：组分配合合理可靠，添加了铝粉和铁粉，能大大增强微流控芯片模具的耐磨性和强度，能有效的延长模具的使用寿命，大大降低了生产成本。
具体实施方式
为了加深对本发明的理解，下面将结合实施例对本发明作进一步详述，该实施例仅用于解释本发明，并不构成对本发明的保护范围的限定。
实施例1
一种微流控芯片模具，以30重量份的丁苯橡胶为原料，还包括以下重量份的组分：
炭黑 10份；
邻苯二甲酸二(2-乙基己)酯 1份；
石膏 8份；
竹炭 3份；
铝粉 5份；
铁粉 20份。
实施例2
一种微流控芯片模具，以40重量份的聚乙烯为原料，还包括以下重量份的组分：
硅藻土 12份；
邻苯二甲酸二(2-乙基己)酯 2份；
石膏 9份；
竹炭 4份；
铝粉 6份；
铁粉 22份。
实施例3
一种微流控芯片模具，以50重量份的聚丙乙烯为原料，还包括以下重量份的组分：
石墨 15份；
邻苯二甲酸二(2-乙基己)酯 3份；
石膏 10份；
竹炭 5份；
铝粉 8份；
铁粉 25份。
高分子聚合物还可以为顺丁橡胶或合成纤维。
填充剂还可以为氧化铝粉或金刚砂。
本发明的有益效果是：组分配合合理可靠，添加了铝粉和铁粉，能大大增强微流控芯片模具的耐磨性和强度，能有效的延长模具的使用寿命，大大降低了生产成本。
以上所述，仅是本发明的较佳实施例而已，并非是对本发明作任何其他形式的限制，而依据本发明的技术实质所作的任何修改或等同变化，仍属于本发明所要求保护的范围。
Claims (4)
1.一种微流控芯片模具，其特征在于：以30-50重量份的高分子聚合物为原料，还包括以下重量份的组分：
填充剂 10-15份；
增塑剂 1-3份；
石膏 8-10份；
竹炭 3-5份；
铝粉 5-8份；
铁粉 20-25份。
2.根据权利要求1所述的一种微流控芯片模具，其特征在于：所述高分子聚合物为聚乙烯、聚丙乙烯、丁苯橡胶、顺丁橡胶或合成纤维其中的一种或两种组合。
3.根据权利要求1所述的一种微流控芯片模具，其特征在于：所述填充剂为硅藻土、石墨、炭黑、氧化铝粉或金刚砂。
4.根据权利要求1所述的一种微流控芯片模具，其特征在于：所述增塑剂为邻苯二甲酸二(2-乙基己)酯。
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105150460A (zh) * | 2015-09-22 | 2015-12-16 | 芜湖奕辰模具科技有限公司 | 一种直通注塑模具 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1056393A (zh) * | 1990-05-08 | 1991-11-20 | 广州市华远电热电器厂 | 具有挠性及恒温特性的复合型导电高分子电发热体 |
| EP1167457A2 (en) * | 2000-06-23 | 2002-01-02 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone composition and semiconductor device |
| CN101381592A (zh) * | 2008-10-16 | 2009-03-11 | 广东恒大新材料科技有限公司 | 一种具有电磁屏蔽功能的密封剂组合物 |
| CN101805469A (zh) * | 2010-04-08 | 2010-08-18 | 中国铁道科学研究院金属及化学研究所 | 耐磨材料、制动用合成闸片及其制备方法 |
| CN101835365A (zh) * | 2002-10-21 | 2010-09-15 | 莱尔德技术公司 | 导热的电磁干扰屏蔽 |
| CN102604219A (zh) * | 2012-03-12 | 2012-07-25 | 东莞市兆科电子材料科技有限公司 | 高导热无机物热塑化组合物的制备方法及由该方法制造的散热部件 |
| JP5126175B2 (ja) * | 2009-07-27 | 2013-01-23 | 住友ベークライト株式会社 | 金属含有ペーストおよび半導体装置 |
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- 2014-09-25 CN CN201410496901.4A patent/CN104387642B/zh active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1056393A (zh) * | 1990-05-08 | 1991-11-20 | 广州市华远电热电器厂 | 具有挠性及恒温特性的复合型导电高分子电发热体 |
| EP1167457A2 (en) * | 2000-06-23 | 2002-01-02 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone composition and semiconductor device |
| CN101835365A (zh) * | 2002-10-21 | 2010-09-15 | 莱尔德技术公司 | 导热的电磁干扰屏蔽 |
| CN101381592A (zh) * | 2008-10-16 | 2009-03-11 | 广东恒大新材料科技有限公司 | 一种具有电磁屏蔽功能的密封剂组合物 |
| JP5126175B2 (ja) * | 2009-07-27 | 2013-01-23 | 住友ベークライト株式会社 | 金属含有ペーストおよび半導体装置 |
| CN101805469A (zh) * | 2010-04-08 | 2010-08-18 | 中国铁道科学研究院金属及化学研究所 | 耐磨材料、制动用合成闸片及其制备方法 |
| CN102604219A (zh) * | 2012-03-12 | 2012-07-25 | 东莞市兆科电子材料科技有限公司 | 高导热无机物热塑化组合物的制备方法及由该方法制造的散热部件 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105150460A (zh) * | 2015-09-22 | 2015-12-16 | 芜湖奕辰模具科技有限公司 | 一种直通注塑模具 |
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Effective date of registration: 20201111 Address after: 710000 no.0001 Xidian stone maker space, 10th floor, Haigui building, No.18, Gaoxin 1st Road, hi tech Zone, Xi'an City, Shaanxi Province Patentee after: Xi'an Yian Renxin Biotechnology Co., Ltd Address before: 314500 No. xd701-6, No. 1, Gongnong Road, Nanmen, Chongfu Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee before: JIAXING LONGLIE ELECTRONIC COMMERCE Co.,Ltd. |