CN104377479A - Method for designing crimp connector capable of reducing loss of signals - Google Patents
Method for designing crimp connector capable of reducing loss of signals Download PDFInfo
- Publication number
- CN104377479A CN104377479A CN201410716085.3A CN201410716085A CN104377479A CN 104377479 A CN104377479 A CN 104377479A CN 201410716085 A CN201410716085 A CN 201410716085A CN 104377479 A CN104377479 A CN 104377479A
- Authority
- CN
- China
- Prior art keywords
- pin
- connector
- crimp connector
- loss
- holding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
Abstract
The invention discloses a method for designing a crimp connector capable of reducing loss of signals. On the technical basis of the crimp connector, a crimping mode is used on base pins of ground electrodes, and base pins of signal lines are spring plate devices. The method has the advantages that by a base pin connecting mode of the crimp connector, Via-Stud is eliminated during connection of the connector and a PCB (printed circuit board), when the signal transmitting speed is 40G or is higher than 40G, a transmitting state of a system can be good, and loss of the signals is reduced.
Description
Technical field
The present invention relates to electronics and PCB design field, be specifically related to a kind of method for designing reducing the crimp connector of loss of signal.
Background technology
Improving constantly along with speed, also more and more higher to the requirement of the loss of passage at present.The loss how reducing passage becomes the topic constantly discussed now.In the interconnection of server, connector is an indispensable part, and the interconnection of plate inter-stage connects often through connector, and connector is divided into: reflow soldering connector, as shown in Figure 1; Crimp connector, as shown in Figure 2; Wave-soldering connector, as shown in Figure 3.
The each pluses and minuses of having oneself by oneself of different connectors, Reflow Soldering connector, loss ratio can be controlled better, as control Via-Stub(improving constantly along with speed, Via-Stub impact as shown in Figure 4 becomes principal element, have to cause engineer to pay much attention to), but there is dispute in fastness; Although wave-soldering connector fastness is fine, loss ratio is larger; Crimp connector is the main flow of at present design, as shown in Figure 5, and can very firmly also can the length of control Via-Stub.At present in server design the mode of control Via-Stub be back drill as shown in Figure 6, at this moment, have again a problem to occur, for crimp connector, if brill is too dark, then fastness just goes wrong, if that bores is too shallow, also can exist by some Via-Stub.If it is even higher that speed really reaches 40G, originally not all right system, after removing this part Via-Stub, system will improve.So the present invention solves this problem by the interconnection mode changing connector.
The mode that current crimp connector and pcb board link as shown in Figure 5, if transmission line is linked to connector from top layer outlet, such Via-Stub can be very long, and we can adopt back drill usually, back drill schematic diagram as shown in figure 6, but still has the existence of a bit of Via-Stub.
Note: blind buried via hole wiring board, also referred to as HDI plate, often be used for mobile phone, in the application of GPS navigation etc. high-end product. the structure of conventional multilayer circuit board, containing internal layer circuit and outer-layer circuit, recycling boring, and metallized processing procedure in hole, make to realize linking function between the inside of each sandwich circuit.Along with electronic product is to high density, high accuracy develops, and tackles wiring board mutually and proposes same requirement.And to improve the most effective method of pcb density be the quantity reducing through hole, and accurately arrange blind hole, buried via hole realizes this requirement, meets the tendency thus and creates HDI plate.
Buried via hole can not be seen also referred to as BURIED HOLE(skin), be the through hole of interior interlayer, upper and lower surface is all in the inside of plank, and layer is to see after pressing. so the area of skin need not be taken.
Blind hole also referred to as BLIND HOLE, with through hole comparatively speaking, through hole refers to that the hole that each layer all drills through, blind hole are then non-holes drilled through; One side can be seen but another side is we in plank also be can't see in blind hole surface simply, popular saying is exactly the dish that we plant at ordinary times, and cauline leaf Huadu rises, and breaks through earth, but coring is inside earth, we can't see.
Usual mobile phone board or navigation instrument are useful the plank that blind hole and buried via hole technique are combined together, it is with high content of technology that this type of plank requires, accuracy is accurate, so comparatively speaking, require more high than common multi-layer sheet to the machinery equipment of factory, the cost of corresponding this kind of wiring board also can be higher than general multi-layer sheet, and so-called the higher the price, the better the quality, what say is exactly that this has been managed, with high content of technology, price also just has got on naturally, and expanding economy also can be tending towards progressive day by day!
Solder reflow techniques is not strange at electronic manufacturing field, element on the various boards used in our computer is all welded on wiring board by this technique, there is a heater circuit inside of this equipment, air or nitrogen are heated to sufficiently high temperature after-blow to the wiring board posting element, allow the solder of elements on either side melt after and mainboard bond.The advantage of this technique is that temperature is easy to control, and can also avoid oxidation in welding process, manufacturing cost also more easily controls.
Wave-soldering allows the solder side of card directly contact with high-temperature liquid state tin reach welding object, and its high-temperature liquid state tin keeps an inclined-plane, and makes liquid tin form the phenomenon of the similar wave of a lot of by special device, so cry " wave-soldering ".
Summary of the invention
The technical problem to be solved in the present invention is: object of the present invention mainly writes in server in order to the information of the parts likely gone wrong by server with the form of FRU, so information that can inquire certain server internal parts very easily.
The technical solution adopted in the present invention is:
Reduce a method for designing for the crimp connector of loss of signal, in the technical foundation of crimp connector, the pin of ground wire takes crimping mode, and the pin of holding wire adopts shrapnel device.
When holding wire is from when coming by top layer transmission line, by the pin of the ground wire of connector and plank interconnected, interconnected hard power signal pin to be pressed on pcb board by shell fragment and with PCB UNICOM, need not via hole be beaten.
When holding wire is come from internal layer transmission line, at the blind buried via hole in position that pcb board holding wire connects, the pin and the plank that then pass through the ground wire of connector are interconnected, and the shell fragment of signal pin is pressed into pcb board internal layer holding wire position by blind buried via hole, with PCB UNICOM.Realize the situation not having Via-Stub.
Reduce a crimp connector for loss of signal, the ground pin of described connector is the ground pin of crimping mode, and the pin of holding wire is shrapnel device.
Beneficial effect of the present invention: technique effect of the present invention is, by arranging the pin connected mode of crimp connector, eliminate Via-Stub when connector is connected with pcb board, when the transmission rate of signal reaches the even higher words of 40G, system can keep good transmission state, reduces the loss of signal.
Accompanying drawing explanation
Fig. 1 is the structural representation of Reflow Soldering connector;
Fig. 2 is the structural representation of crimp connector
Fig. 3 is the structural representation of solder connector
Fig. 4 is Via-Stub schematic diagram;
Fig. 5 is that crimp connector is in PCB connection diagram;
Fig. 6 is that crimp connector connects the structural representation of back drill at PCB;
Fig. 7 is the structural representation of connector of the present invention;
Fig. 8 is the structural representation of signal pin shell fragment of the present invention;
Fig. 9 is the structural representation that connector of the present invention and pcb board top layer interconnect;
Figure 10 is the structural representation of signal lead internal layer of the present invention when adopting blind buried via hole.
Embodiment
Below according to Figure of description, in conjunction with specific embodiments, the present invention is further described:
Embodiment 1:
As shown in Figure 7, a kind of method for designing reducing the crimp connector of loss of signal, in the technical foundation of crimp connector, the pin of ground wire takes crimping mode, and the pin of holding wire adopts shrapnel device, as shown in Figure 8.
Embodiment 2:
On the basis of embodiment 1, in the present embodiment, when holding wire is from when coming by top layer transmission line, by the pin of the ground wire of connector and plank interconnected, interconnected hard power signal pin to be pressed on pcb board by shell fragment and with PCB UNICOM, as shown in Figure 9, need not via hole be beaten.
Embodiment 3:
On the basis of embodiment 1, in the present embodiment, when holding wire is come from internal layer transmission line, at the blind buried via hole in position that pcb board holding wire connects, then the pin and the plank that pass through the ground wire of connector are interconnected, the shell fragment of signal pin is pressed into pcb board internal layer holding wire position by blind buried via hole, with PCB UNICOM.As shown in Figure 10, the situation not having Via-Stub is realized.
Embodiment 4:
On the basis of above-mentioned any embodiment, a kind of crimp connector reducing loss of signal, the ground pin of described connector is the pin of crimping mode, and the pin of holding wire is shrapnel device.
Above execution mode is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.
Claims (4)
1. reduce a method for designing for the crimp connector of loss of signal, it is characterized in that: in the technical foundation of crimp connector, the pin of ground wire takes crimping mode, and the pin of holding wire adopts shrapnel device.
2. a kind of method for designing reducing the crimp connector of loss of signal according to claim 1, it is characterized in that: when holding wire is from when coming by top layer transmission line, by the pin of the ground wire of connector and plank interconnected, interconnected hard power signal pin to be pressed on pcb board by shell fragment and with PCB UNICOM.
3. a kind of method for designing reducing the crimp connector of loss of signal according to claim 1, it is characterized in that: when holding wire is come from internal layer transmission line, at the blind buried via hole in position that pcb board holding wire connects, then the pin and the plank that pass through the ground wire of connector are interconnected, the shell fragment of signal pin is pressed into pcb board internal layer holding wire position by blind buried via hole, with PCB UNICOM.
4. according to a kind of crimp connector reducing loss of signal of above-mentioned arbitrary claim, it is characterized in that: the ground pin of described connector is the ground pin of crimping mode, the pin of holding wire is shrapnel device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410716085.3A CN104377479A (en) | 2014-12-02 | 2014-12-02 | Method for designing crimp connector capable of reducing loss of signals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410716085.3A CN104377479A (en) | 2014-12-02 | 2014-12-02 | Method for designing crimp connector capable of reducing loss of signals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104377479A true CN104377479A (en) | 2015-02-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410716085.3A Pending CN104377479A (en) | 2014-12-02 | 2014-12-02 | Method for designing crimp connector capable of reducing loss of signals |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104377479A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106872791A (en) * | 2017-03-04 | 2017-06-20 | 郑州云海信息技术有限公司 | A kind of method and system of the FOOTPRINT losses for detecting connector |
| CN113964613A (en) * | 2021-12-16 | 2022-01-21 | 苏州浪潮智能科技有限公司 | Method, device and equipment for reducing stub of high-speed connector and readable medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594729A (en) * | 2008-05-27 | 2009-12-02 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN101989724A (en) * | 2009-07-30 | 2011-03-23 | 华为技术有限公司 | Connector |
| CN103153001A (en) * | 2013-02-05 | 2013-06-12 | 浙江宇视科技有限公司 | Printed circuit board (PCB) and processing method |
| CN203481542U (en) * | 2013-05-31 | 2014-03-12 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN104064896A (en) * | 2014-06-06 | 2014-09-24 | 华为技术有限公司 | Angle connector, connector assemble and communication assembly |
| CN104143732A (en) * | 2013-05-07 | 2014-11-12 | Fci公司 | Electric connector and method for installing same on substrate |
-
2014
- 2014-12-02 CN CN201410716085.3A patent/CN104377479A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594729A (en) * | 2008-05-27 | 2009-12-02 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN101989724A (en) * | 2009-07-30 | 2011-03-23 | 华为技术有限公司 | Connector |
| CN103153001A (en) * | 2013-02-05 | 2013-06-12 | 浙江宇视科技有限公司 | Printed circuit board (PCB) and processing method |
| CN104143732A (en) * | 2013-05-07 | 2014-11-12 | Fci公司 | Electric connector and method for installing same on substrate |
| CN203481542U (en) * | 2013-05-31 | 2014-03-12 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN104064896A (en) * | 2014-06-06 | 2014-09-24 | 华为技术有限公司 | Angle connector, connector assemble and communication assembly |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106872791A (en) * | 2017-03-04 | 2017-06-20 | 郑州云海信息技术有限公司 | A kind of method and system of the FOOTPRINT losses for detecting connector |
| CN113964613A (en) * | 2021-12-16 | 2022-01-21 | 苏州浪潮智能科技有限公司 | Method, device and equipment for reducing stub of high-speed connector and readable medium |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20150225 |