CN104364701A - Backlight unit - Google Patents
Backlight unit Download PDFInfo
- Publication number
- CN104364701A CN104364701A CN201380019415.7A CN201380019415A CN104364701A CN 104364701 A CN104364701 A CN 104364701A CN 201380019415 A CN201380019415 A CN 201380019415A CN 104364701 A CN104364701 A CN 104364701A
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- China
- Prior art keywords
- heat
- led module
- mentioned
- heat pipe
- sidepiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/009—Positioning aspects of the light source in the package
Abstract
The present invention relates to a backlight unit. The backlight unit of the present invention comprises: a light guide plate for scattering the light introduced into the side surface thereof; a light-emitting element for emitting light into the side surface of the light guide plate; a circuit board, the length of which corresponds to the lateral length of the light guide plate; a heat pipe for absorbing heat generated by the circuit board and dissipating said heat; and a housing for accommodating at least one of the heat pipe, the circuit board, the light-emitting element and the light guide plate. The heat pipe includes: one end that is elongated, for absorbing heat from the circuit board; and another end that is bent at an angle different from that of the first end and elongated to dissipate the heat absorbed by the first end. According to the present invention, one end of the heat pipe is elongated to increase a heat absorbing area, thus providing excellent heat-dissipating performance.
Description
[technical field]
The present invention relates to a kind of back light unit, more particularly, the present invention relates to a kind of heat generated by light-emitting component by heat pipe and dispelled the heat and the back light unit cooled.
[background technology]
In flat display, Fig. 1 and Fig. 2 is the flat display of the back light unit being suitable for prior art, and it is the 10-1047726 patent (title: back light unit and possess the display device of this back light unit) being registered in the Korean Patent Room.
As shown in Figure 1, backlight is made up of the LED module (1) comprising light-emitting component that light emitting diode forms and circuit board, forms back light unit after itself and illustrated light guide plate (2), the metallic heat radiation rack (3) be made up of section bar, heat pipe (4) and shell (5) combine.
At this, aforementioned heat pipe (4) as Fig. 1 with to be formed as illustrated in fig. 2 plate after be adjacent to shell (5) as illustrated in fig. 2.And aforementioned heat radiation rack (3) is adjacent to heat pipe (4) as illustrated in fig. 2, in bending side, the LED module (1) be made up of the circuit board having mounted light-emitting component (1a) (1b) is then installed.And aforementioned light guide plate (2) is accommodated by shell (5) as illustrated in fig. 2 together with heat pipe (4) and heat radiation rack (3).
The back light unit of the prior art allows the heat of LED module (1) be delivered to heat pipe (4) via heat radiation rack (3) and dispel the heat as illustrated in fig. 2.
But the prior art allows the heat of LED module (1) be delivered to heat pipe (4) by heat radiation rack (3), makes LED module (1) and heat radiation rack (3) and the heat resist (Thermalresistance) between heat radiation rack (3) and heat pipe (4) have influence on radiating effect.That is, the heat transfer efficiency of the heat radiation rack (3) be made up of metalwork lower than the heat pipe (4) relying on inner working fluid quick heat radiating, the heat dispersion that therefore realized heat dispersion is relatively low when passing to the radiators such as shell (5) after heat pipe (4) directly accepts the heat of LED module (1).
In addition, aforementioned heat pipe (4) is formed as linear as shown in Figure 3, is dispelled the heat by the other end after being adjacent to heat radiation rack (3) and being able to absorb the heat of LED module (1) by an end in an end.
But the prior art makes endotherm area be confined to an end because only having an ends contact heat radiation rack (3) of heat pipe (4), also can occur the isolation section (G) that cannot absorb heat as shown in figure.Therefore, prior art makes the amount of being discharged of the heat of the light-emitting component (1a) being configured in isolation section (G) periphery relatively less due to the isolation distance between isolation section (G) light-emitting component (1a) that causes and has influence on life-span and light beam, and heat pipe (4) ignore be present in isolation section (G) light-emitting component (1a) and only for be configured on an end portion width of heat pipe (4) light-emitting component (1a) heat absorption, the shortage of heat absorbed is to have given play to the heat transfer property of heat pipe (4) completely, that is, absorb the heat of light-emitting component (1a) and heat pipe (4) endothermic section forming heat pipe (4) end contacts with narrow and small area with light-emitting component (1a) and limitedly can only absorb the heat of light-emitting component (1a), the working fluid that is heated in heat pipe (4) inside possibly cannot be delivered to heat pipe (4) the other end terminal that can give play to condensing portion function and cause dead angle area (△ L).
And, it is a rectilinear configuration that the heat pipe (4) of prior art is formed as shown, therefore in order to reduce in heat pipe (4) the isolation section (G) that cannot transmit heat as far as possible as shown in figure with high-density installation heat pipe (4) or install heat pipe (4) continuously, or illustrated heat pipe (4) is not installed and not shown wide cut heat pipe is installed to make with reducing isolation section (G) as far as possible.But in this case, the increase of heat pipe (4) quantity or wide cutization but can improve and produce unit price or production cost.
In addition, the pictorial symbolization 11 illustrated is not had to be reflecting plates of the light of Refl-Luminous element (1a) in Fig. 1, pictorial symbolization 12 is the support members giving support for the display panel demonstrating picture, pictorial symbolization 13 is the diffuser plates allowing light spread, and pictorial symbolization 15 is the upper covers (top cover) combined with shell (5).
[technical task of solution]
The present invention is intended to overcome the problems referred to above, the object of this invention is to provide a kind of back light unit, the side absorbing the heat pipe of the heat of LED module formed longlyer and the length direction of LED module be corresponding states install, the opposite side that the heat absorbed side is shifted the heat pipe of (transmission) then according to the angle being different from side longer to be formed and shift (transmission) with forming the angle being different from LED module length direction hot.
Another object of the present invention is to provide a kind of back light unit, by the radiating component of thermal conductivity material, the heat of LED module is shifted.
Another object of the present invention is to provide a kind of back light unit, and heat pipe allows other parts be adjacent to thermal conductivity radiator and heat is transferred to radiator amass the state being stacked in aforementioned radiating component in a part under.
Another object of the present invention is to provide a kind of back light unit, and the end forming the inscape of LED module is directly connected to heat pipe and allows heat pipe directly absorb heat and to be shifted,
Another object of the present invention is to provide a kind of back light unit, also can successfully be dispelled the heat by light even if LED module is installed to disperse state transmission or with the central portion of the component of disperse state transmission or adjacent central portion part.
[solving the technical scheme of problem]
The back light unit of the present invention realizing aforementioned object comprises: optical sheet, is formed by with the light guide plate of disperse state transmitted ray or with at least some in the diffuser plate of disperse state transmitted ray; At least one LED module, has for above-mentioned optical sheet provides the light-emitting component of light and the circuit of driving light-emitting component, has length; At least one heat pipe, absorbs heat that above-mentioned LED module occurs and transfers to opposite side and dispelled the heat in side; And shell, that accommodates in above-mentioned heat pipe and above-mentioned optical sheet and above-mentioned LED module is at least some; Above-mentioned heat pipe comprises: a sidepiece, and the length along above-mentioned LED module is formed longlyer and absorbs the heat of LED module along the length direction of LED module; And the other side, according to the angle being different from an above-mentioned sidepiece from a sidepiece longer to extend to form and the length direction of the angle formed and above-mentioned LED module is different, be able to the heat of transfer one sidepiece owing to extending from a sidepiece.
Also comprise heat radiation angle section, to be formed corresponding to the length of the above-mentioned LED module being housed in above-mentioned shell, make the heat of LED module dispel the heat towards side transfer because above-mentioned LED module is fixed on side, bending opposite side then long-pending folded above-mentioned heat pipe an above-mentioned sidepiece and by opposite side the heat of above-mentioned LED module transferred to a sidepiece of heat pipe or the heat of heat pipe is transferred directly to opposite side.
Above-mentioned heat pipe in order to amass the opposite side being laminated to above-mentioned heat radiation angle section at an above-mentioned sidepiece state under allow above-mentioned the other side be adjacent to above-mentioned shell and heat transferred to shell and has in above-mentioned the other side for forming tortuous inflection point.
Above-mentioned heat pipe also comprises orthogonal portion, and it extends to form at an above-mentioned sidepiece with becoming orthogonal state, is directly connected to the above-mentioned LED module with foregoing circuit and the heat of LED module is transferred to an above-mentioned sidepiece.
Above-mentioned orthogonal portion defines the substrate of pattern by the foregoing circuit of above-mentioned LED module owing to being adjacent to and being directly connected to LED module, or foregoing circuit is formed pattern and be directly connected according to the state that above-mentioned LED module becomes with one.
At least certain of above-mentioned LED module in the central portion of above-mentioned optical sheet or the position in adjacent central portion is installed with horizontality or plumbness, and an above-mentioned sidepiece of above-mentioned heat pipe is alongst long-pending to be folded or is adjacent to side.
Above-mentioned the other side of above-mentioned heat pipe is given prominence to along the length direction of above-mentioned LED module towards the side of LED module and forms the angle being different from above-mentioned LED module length direction.
[beneficial effect]
The present invention due to a sidepiece of heat pipe longer formed the other side then according to the angle being different from a sidepiece longer formed, the endotherm area of heat pipe can not only be increased, heat can also to be shifted (transmission) to the end of the other side is dispelled the heat, due to heat pipe a sidepiece along heat radiation angle section longer formed and as prior art, heat pipe densely need not be installed and also can guarantee required heat transfer property or heat dispersion.
And, because the heat radiation angle section of thermal conductivity material shifts the heat of LED module and dispelled the heat, therefore also can be dispelled the heat by the heat of heat radiation angle section to LED module.
And heat pipe allows the other side be adjacent to shell under relying on inflection point to form complications in the other side and being able to the state being adjacent to heat radiation angle section at a sidepiece, therefore also heat can be transferred to shell and dispel the heat.
Meanwhile, the substrate of LED module is arranged on the orthogonal portion of heat pipe or the circuit of LED module forms pattern in orthogonal portion and is able to the heat of LED module to be directly delivered to heat pipe, thus be improved heat transfer property and the heat dispersion of heat pipe, further, the heat transfer obstacle (heat resist) based on aforesaid base plate thickness can be eliminated when the circuit of LED module mounts light-emitting component after orthogonal portion forms pattern and be improved heat transfer property and heat dispersion, heat pipe can also be allowed to substitute the role of the substrate forming LED module.
And, even if LED module is arranged on central portion or the adjacent central portion part of optical sheet, can cooling LED module easily because heat pipe carries out dispelling the heat after the heat of a side absorbent LED module with transferring to the other side.
[accompanying drawing explanation]
Fig. 1 is the exploded perspective view of the back light unit of prior art.
Fig. 2 is the side partial cross-sectional of back light unit shown in Fig. 1.
Fig. 3 is the front view in the front being shown schematically in back light unit shown in Fig. 1.
Fig. 4 is the front view of the back light unit of the first embodiment of the present invention.
Fig. 5 is the cut-open view of the line of A-A shown in Fig. 4.
Fig. 6 is the cut-open view of the back light unit of the 2nd embodiment of the present invention;
Fig. 7 is the cut-open view of the back light unit of the 3rd embodiment of the present invention;
Fig. 8 is the cut-open view of the back light unit of the 4th embodiment of the present invention;
Fig. 9 is the front view of the back light unit of the 5th embodiment of the present invention;
Figure 10 is the front view of the back light unit of the 6th embodiment of the present invention;
Figure 11 is the front view of the back light unit of the 7th embodiment of the present invention;
Figure 12 is the front view of the back light unit of the 8th embodiment of the present invention;
Figure 13 is the front view of the back light unit of the 9th embodiment of the present invention; And
Figure 14 is the front view of the back light unit of the 10th embodiment of the present invention.
[embodiment]
The back light unit of the first embodiment of the present invention is described below in conjunction with Fig. 4 and Fig. 5.
As Fig. 4 with as shown in Figure 5, the back light unit of the first embodiment of the present invention comprises optical sheet (53), LED module (50), heat pipe (60) and shell (54).
Optical sheet (53) is formed by with the general light guide plate of disperse state transmitted ray or with at least some in the general diffuser plate of disperse state transmitted ray.When optical sheet (53) is made up of light guide plate, as shown in Figure 5, be configured in the front of LED module (50) and the light entirety entered by side by LED module (50) is distributed to light guide plate equably.When optical sheet (53) is made up of diffuser plate, as Fig. 9 with as shown in figure 14, LED module (50) is installed in the back side and the light entirety of the LED module (50) entered from the back side is spread equably.This optical sheet (53) is general component, and therefore description is omitted.
As an example, LED module (50) comprises supplies the light-emitting component (51) of light and the circuit of driving light-emitting component (51) to aforementioned optical sheet (53).Now, circuit can form pattern at substrate (52) as illustrated in fig. 4.And light-emitting component (51) can be made up of the light emitting diode being mounted on substrate (52) or the general LED that comprises this light emitting diode as illustrated in fig. 4.Therefore, LED module (50) can be made up of light-emitting component (51) and the substrate (52) that forms circuit pattern as illustrated in fig. 4.
If Fig. 4 and Fig. 9 is to as shown in figure 14, LED module (50) is formed longlyer and forms at least one.When optical sheet (53) is made up of light guide plate, LED module (50) be configured in as illustrated in fig. 4 optical sheet (53) side and to the side-emitted light of optical sheet (53).
The backward opposite side of heat that heat pipe (60) generates from side absorption LED module (50) conducts heat (transfer or transmission) and is dispelled the heat.Heat pipe (60) is made up of at least one flat plate type heat tube and possesses a sidepiece (66) and the other side (68) as illustrated in fig. 4.
One sidepiece (66) as illustrated in fig. 4 along the length of LED module (50) longer to be formed and length direction along LED module (50) is installed.Therefore, heat pipe (60) passes through along the length direction of LED module (50) heat that a sidepiece (66) absorbs LED module (50).This heat pipe (60) due to a sidepiece (66) longer formed and make endotherm area (contact area) much larger than prior art, therefore, it is possible to successfully absorb the heat of LED module (50).That is heat pipe (60) makes absorbed heat far more than prior art due to the expansion of endotherm area.
Have its side as illustrated in fig. 5 when having installed heat radiation angle section (56) of LED module (50), a sidepiece (66) is long-pending is stacked in heat radiation angle section (56).Now, the length direction of a sidepiece (66) as illustrated in fig. 4 along heat radiation angle section (56) is long-pending folded.This sidepiece (66) can allow a lateral area be stacked in the back side of heat radiation angle section (56) as illustrated in fig. 5, and the side due to heat radiation angle section (56) has been installed LED module (50) and has been able to the heat by heat radiation angle section (56) transfer (transmission) LED module (50).
Shell described later (54) is then adjacent to as illustrated in fig. 5 in contrast to the long-pending another side being stacked in heat radiation angle section (56) in one sidepiece (66).Therefore, transfer from the heat of dispel the heat angle section (56) is transferred to described later the other side (68) to shell (54) while being dispelled the heat the heat trnasfer shifted by heat radiation angle section (56) by a sidepiece (66).
The other side (68) then due to bending and as illustrated in fig. 4 according to the angle being different from a sidepiece (66) from a sidepiece (66) longer extend to form and make the length direction of formed angle and LED module (50) different.The other side (68) is able to the heat of transfer one sidepiece (66) owing to extending from a sidepiece (66).
The other side (68) can bend by as illustrated in fig. 4 with one sidepiece (66) with forming inclination (θ), is formed with also can being different from diagramatic content bend squarely with a sidepiece (66).Now, aforementioned inclination (θ) is as illustrated in fig. 4 to be formed at the visual horizontal line (H) of a sidepiece (66) end for benchmark is between the scope of-90 ° of < θ <+90 °.That is, tilt (θ) between following scope, this scope allow the other side (68) and a sidepiece (66) not shape in line, make the other side (68) not overlapping with a sidepiece (66).This other side (68) determines angle according to required heat dispersion, in order to allow the inner working fluid rising after condensation that successfully gasifies return and better for benchmark forms 0 °≤θ <+90 ° with aforementioned horizontal line (H), 0 °≤θ≤+ 45 are ° then better.That is, the other side (68) in order to allow gasification working fluid move smoothly (risings) and with horizontal line (H) for benchmark towards horizontal line (H) upper side formed inclination (θ) better.
The function in condensing portion has successfully been given play to as illustrated in fig. 4 by means of the angle being different from a sidepiece (66) in the other side (68) away from LED module (50) or heat radiation angle section described later (56).Now, the other side (68) due to a sidepiece (66) as previously mentioned longer formed and rely on increased contact area to improve caloric receptivity and the heat of a sidepiece (66) can be transferred to the end forming free end.Therefore, the heat shifting a sidepiece (66) of coming can successfully be shifted or reject heat to shell described later (54) by the other side (68).
In addition, what previous housings (54) was accommodated in heat pipe (60) and LED module (50) and optical sheet (53) as illustrated in fig. 5 is at least some.This shell (54) is combined in the lid as the most gabarit of not shown display and protects aforementioned inscape.The edge of foregoing shell (54) is bending as shown in figure and formed plate so that and not shown lid combination.Shell (54) is made up of the material possessing rigidity and thermal conductivity, such as, can be made up of metalwork or working of plastics.
On the other hand, aforementioned heat radiation angle section (56) is made up of thermal conductivity material and is formed with the length corresponding to LED module (50) length as illustrated in fig. 4.Heat radiation angle section (56) is as shown in figure in side fixing base (52), and a sidepiece (66) of folded heat pipe (60) is then amassed at the back side of bending opposite side.This heat radiation angle section (56) is connected to shell (54) by heat pipe (60) as illustrated in fig. 5.
Foregoing 1st embodiment is as illustrated in fig. 5 the side of the heat trnasfer of LED module (50) to heat radiation angle section (56).Heat radiation angle section (56) is then dispelled the heat the heat passed over and is transferred to the long-pending sidepiece (66) being stacked in the heat pipe (60) of opposite side.Now, heat pipe (60) the heat trnasfer of a sidepiece (66) to the other side (68).And heat pipe (60) transfers heat to shell (54) by being adjacent at the sidepiece (66) of shell (54) and the other side (68) and dispels the heat as illustrated in fig. 5.Therefore, LED module (50) is successfully dispelled the heat because heat can be delivered to heat radiation angle section (56) and heat pipe (60) and shell (54).
And, heat pipe (60) forms as shown in Figure 5 longlyer and is adjacent to and be stacked in heat radiation angle section (56) along the length direction of heat radiation angle section (56) is long-pending as illustrated in fig. 4 at a sidepiece (66) of heat radiation angle section (56), and therefore endotherm area (contact area) is greater than prior art and the heat absorbed also transfers to the other side (68) more than prior art.And, heat pipe (60) due to absorb and the heat shifted to be transferred heat to the end of the other side (68) more than prior art.Therefore, not only can not there is the dead angle area (△ L) as prior art in heat pipe (60), the heat of LED module (50) can also be transferred to the end (terminal part) of the other side (68) and the radiating effect that is greatly improved.
In addition, all structures of the 2nd embodiment of the present invention are identical with aforementioned 1st embodiment as illustrated in fig. 6, itself and the difference of the first embodiment are only be stacked in because the sidepiece (66) of heat pipe (60) is long-pending as shown in figure dispel the heat angle section (56) and directly cannot contact shell (54), and the other side (68) have inflection point (60a, 60b).Therefore only this difference is described below in conjunction with Fig. 6.
2nd embodiment of the present invention allows a sidepiece (66) of heat pipe (60) amass the opposite side top being stacked in heat radiation angle section (56) as illustrated in fig. 6, possesses inflection point (60a, 60b) in order to allow the other side (68) be adjacent at shell (54) in the other side (68).It is better that heat pipe (60) possesses multiple inflection point (60a, 60b) as shown in figure.Heat pipe (60) bends at inflection point (60a, 60b) as shown in figure and allows the other side (68) be formed tortuous and to make the other side (68) be adjacent to shell (54).Therefore, heat pipe (60) is transferred to shell (54) by the other side (68) the heat of LED module (50) and dispels the heat.
At this, aforementioned heat radiation angle section (56) may form space in the contraflexure starting point (60a) of heat pipe (60) between the contraflexure terminal (60b) starting to be adjacent to shell (54), therefore so that the form of filling space the end of opposite side can be formed as shown in the enlarged drawing of Fig. 6, the lower position of heat transference efficiency can be eliminated in this case.
In addition, heat pipe (60) is stacked in the opposite side top of heat radiation angle section (56) because a sidepiece (66) is long-pending and allows substrate (52) be directly connected to a sidepiece (66) with long-pending overlapping state as illustrated in fig. 6.Heat pipe (60) directly can shift the heat of LED module (50) by a sidepiece (66) in this case.Therefore, heat pipe (60) effectively can absorb the heat of LED module (50) and be dispelled the heat with transferring to the other side (68).Now, heat pipe (60) is delivered to the other side (68) fast the heat that not shown internal process fluid absorbs.And heat pipe (60) is stacked in heat radiation angle section (56) because a sidepiece (66) is long-pending and the heat of the LED module (50) being directly delivered to a sidepiece (66) is directly delivered to the opposite side of heat radiation angle section (56).
A sidepiece (66) of folded heat pipe (60) is amassed in heat radiation angle section (56) on the top of opposite side owing to installing LED module (50) in side as illustrated in fig. 6, therefore the heat of LED module (50) is directly delivered to side and accepts to transmit the heat from a sidepiece (66) of heat pipe (60) at opposite side.Heat radiation angle section (56) allows the rear-face contact shell (54) of opposite side of the sidepiece (66) having installed heat pipe (60) as shown in figure.Therefore, the heat transfer effect of heat radiation angle section (56) heat that the heat trnasfer of the LED module (50) directly transmitted is transmitted to shell (54) and a sidepiece (66) of heat pipe (60) with being also delivered to shell (54) auxiliary heat pipe (60), therefore, it is possible to more effectively dispel the heat to the heat of LED module (50).Its result, 2nd embodiment of the present invention allows the heat of LED module (50) be delivered to heat radiation angle section (56) and heat pipe (60) simultaneously, and make the heat being delivered to heat radiation angle section (56) effectively contact the external cooling bodies such as shell (54) and transmit, therefore, it is possible to significantly increase the heat radiation of LED module (50).
Especially, the other side (68) of the heat pipe (60) of the 2nd embodiment starts to be adjacent to shell (54) in direction, condensing portion (end side of free end) in the long-pending folded place of terminating with heat radiation angle section (56), and therefore can more effectively dispel the heat in condensing portion.Whereby, the heat radiation angle section (56) of the 2nd embodiment of the present invention and heat pipe (60) achieve excellent heat dispersion to the heat of shell (54) transfer LED module (50) simultaneously.That is the heat of LED module (50) can be dispelled the heat and achieve excellent heat dispersion by the 2nd embodiment with transferring to shell (54) in many aspects.
In addition, all structures of the 3rd embodiment of the present invention are identical with aforementioned 1st embodiment as illustrated in fig. 7, and the difference of itself and the first embodiment is only eliminate aforementioned heat radiation angle section (56) and have the orthogonal portion (60a) that bends in approximate right angle with heat pipe (60) and at orthogonal portion (60a) directly connection substrate (52).Therefore only this difference is described below in conjunction with Fig. 7.
One sidepiece (66) of the heat pipe (60) of the 3rd embodiment of the present invention is formed as shown the orthogonal portion (60a) extended with orthogonal state.The sidepiece (66) being installed to heat pipe (60) is integratedly become after orthogonal portion (60a) can make separately, unlike this, also, after a sidepiece (66) of heat pipe (60) can be allowed more broadly to be formed than previous embodiment, a part for a sidepiece (66) is bent to become with heat pipe (60) squarely make integratedly.This orthogonal portion (60a) as shown in figure in snapping-like state directly connect the substrate (52) of LED module (50) and the heat of absorptive substrate (52).
Orthogonal portion (60a) although can not form the channel of dredging working fluid as shown in the enlarged drawing in the figure upper right corner in inside, the channel forming the channel of connection one sidepiece (66) in order to more successfully heat radiation as shown in the enlarged drawing in the figure lower right corner in inside is better.At this, channel can be relied on when possessing channel and the thickness in orthogonal portion (60a) that allow the thickness in orthogonal portion (60a) be greater than to illustrate above.
Heat pipe (60) allows the heat of LED module (50) be directly delivered to a sidepiece (66) because LED module (50) is directly connected to orthogonal portion (60a).The heat that this heat pipe (60) allows a sidepiece (66) absorb dispels the heat ground simultaneously with transferring to shell (54), in order to allow the heat of a sidepiece (66) can quick heat radiating and the working fluid of inside is promptly moved to the other side (68) and by the thermal diffusion of LED module (50) to whole inside.Now, a sidepiece (66) allows an end (bottom) of substrate (52) more successfully can absorb the heat of LED module (50) when state is amassed folded in snapping-like as shown in figure.
Foregoing 3rd embodiment is adjacent to the orthogonal portion (60a) of heat pipe (60) and the area that heat pipe (60) is contacted with substrate (52) is greater than the heat pipe (60) of the aforementioned 1st and the 2nd embodiment due to substrate (52).That is the endotherm area of heat pipe (60) is greater than the 1st and the 2nd embodiment in the 3rd embodiment.And the 3rd embodiment eliminate aforementioned heat radiation angle section (50), therefore owing to eliminating the heat radiation angle section (50) of playing the part of heat resist (Thermal resistance) role in the heat transfer path with substrate (52) and reducing heat resist significantly.Therefore, the 3rd embodiment can than the 1st and the 2nd embodiment absorb more heat after dispelled the heat, can absorb easily and shift the heat of LED module (50).
In addition, all structures of the back light unit of the 4th embodiment of the present invention are identical with aforementioned 3rd embodiment as illustrated in fig. 8, and its difference is only upper for the substrate (52) in the inscape of foregoing LED module (50) circuit forming pattern is directly printed onto the orthogonal portion (60a) of heat pipe (60) and eliminates aforesaid base plate (52).Therefore only this difference is described below in conjunction with Fig. 8.
4th embodiment of the present invention allows circuit (52a) directly form pattern on surface, the orthogonal portion (60a) of heat pipe (60) and make the orthogonal portion (60a) of heat pipe (60) instead of the function of aforesaid base plate (52) as shown in figure.That is the 4th embodiment is allowed the circuit (52a) being printed on aforesaid base plate (52) over and is directly printed on heat pipe (60).And the 4th embodiment is mounted on light-emitting component (51) on the circuit (52a) defining pattern in orthogonal portion (60a) as shown in figure.Therefore, the 4th embodiment allows LED module (50) be directly connected to heat pipe (60) with a volume morphing.
4th embodiment makes owing to eliminating aforesaid base plate (52) to be reduced to heat resist between light-emitting component (51) and heat pipe (62) at light-emitting component (51) and substrate (52) and two heat resists occurring between substrate (52) and heat pipe (62), that is reduce to a heat resist and improve heat transfer property (heat transfer performance), the production cost of LED module (50) can also be saved.
At this, the heat pipe (60) of aforementioned 4th embodiment can form the channel that working fluid can be allowed to dredge at orthogonal portion (60a) as the 3rd embodiment, also can not possess channel.
In addition, as shown in Figure 9, although allow heat pipe (60) be made up of a sidepiece (66) and the other side (68) to the 5th embodiment of the present invention and previous embodiments, its discrepancy is the central portion that LED module (50) is arranged on optical sheet (53).Therefore only this difference is described below in conjunction with Fig. 9.
5th embodiment of the present invention allows the LED module (50) formed be installed to the central portion of optical sheet (53) in a horizontal manner as shown in figure longlyer.The light of light-emitting component (51) being used to provide the divergence of beam of light-emitting component (51) of image to overall optical sheet (53), and to be spread by the optical sheet (53) be made up of diffuser plate by LED module (50) under the state being flatly installed on optical sheet (53) central portion.This technology is the general technology of the art, and therefore description is omitted.
At this, aforementioned LED module (50) can as being illustratively arranged at least certain in the top of optical sheet (53) or central portion or bottom with dot-and-dash line in (b) of aftermentioned Figure 10 or Figure 14 in a horizontal manner.The installation site of this LED module (50) is determined according to the luminescent properties of light-emitting component (51) or the diffusion property of the characteristics of luminescence or optical sheet (53) etc.
In addition, a sidepiece (66) of heat pipe (60) as shown in the figure area be stacked in LED module (50).Now, heat pipe (60) forms a multiple and sidepiece (66) and builds up row along substrate (52) central authorities of the length direction of LED module (50) in LED module (50) are long-pending as shown in figure, or a sidepiece (66) is adjacent to the side of LED module (50) as shown in the enlarged view.Therefore, the heat of LED module (50) is directly delivered to heat pipe (60).
The other side (68) of heat pipe (60) protrudes from the side of LED module (50) as shown in figure and forms different angle with the length direction of LED module (50).The other side (68) is positioned at the top of a sidepiece (66) as shown in figure in order to allow inner working fluid successfully gasify.That is the other side (68) forming condensing portion is positioned at the top of the sidepiece (66) forming endothermic section and protrudes from the top of LED module (50).The other side (68) can be vertically formed, and also can bend to heeling condition unlike this as indicated by chain dotted lines.This other side (68) is formed as vertical or heeling condition according to required heat dispersion.
Heat pipe (60) can be benchmark with the centre of LED module (50) is as shown in figure that inverse state ground is installed opposite to each other in both sides.This heat pipe (60) is adjacent to the radiator of not shown previous housings (54) or not shown framework and so on.
Foregoing 5th embodiment geothermal tube (60) is transferred to previous housings (54) or not shown radiator the heat of the LED module (50) being directly delivered to a sidepiece (66) and is dispelled the heat.Now, heat pipe (60) is positioned at the top of a sidepiece (66) and condensing and promptly return a sidepiece (66) in the other side (68) after working fluid is successfully gasified due to the other side (68).Therefore, the 5th embodiment can successfully be dispelled the heat.
At this, the 5th embodiment can form insulating space (SP) in inverse state between ground heat pipe (60) in opposite directions as shown in figure.
In addition, all structures of the 6th embodiment of the present invention are identical with aforementioned 5th embodiment as illustrated in fig. 10, and its difference is only with the addition of straight heat pipes (62) as shown in figure.Therefore only this difference is described below in conjunction with Figure 10.
6th embodiment of the present invention installs straight heat pipes (62) as illustrated in fig. 10 between the heat pipe (60) be made up of an aforementioned sidepiece (66) and the other side (68).It is better that this straight heat pipes (62) is arranged on aforementioned insulating space (SP) as shown in figure.
As shown in the figure, long-pending to be stacked in LED module (50) the other end then parallel with aforementioned the other side (68) in an end of straight heat pipes (62).Therefore, the heat of LED module (50) that an end absorbs by straight heat pipes (62) is transferred to the other end and is dispelled the heat.
Straight heat pipes (62) can at right angle setting as shown in figure.Also heeling condition can be mounted to unlike this.And straight heat pipes (62) can be formed multiple and install with state that is vertical and mixing of tilting.
Foregoing 6th embodiment is dispelled the heat simultaneously and makes its radiating effect be better than the 5th embodiment due to heat pipe (60) and straight heat pipes (62).Especially, the 6th embodiment is installed straight heat pipes (62) at aforementioned insulating space (SP) and is able to insulating space (SP) to be applied to heat radiation purposes.
In addition, all structures the as illustrated in fig. 11 with 5th embodiment of the 7th embodiment of the present invention is identical, and itself and the difference of the 5th embodiment are only that heat pipe (60) does not arrange mutually on the contrary in the same direction.Therefore only this difference is described below in conjunction with Figure 11.
The installation direction of the heat pipe (60) of the 7th embodiment of the present invention is identical as shown in figure.Therefore, the 7th embodiment also can prevent the formation of aforementioned insulating space (SP) even without aforesaid rectilinear heat pipe (62), thus is minimized production cost.But the 7th embodiment makes radiating effect may lower than the 6th embodiment owing to not possessing aforesaid rectilinear heat pipe (62).
At this, an aforementioned sidepiece (66) of aforementioned heat pipe (60) can be stacked in LED module (50) by area as shown in the figure, also can be adjacent to the side of LED module (50) unlike this.And aforementioned the other side (68) of heat pipe (60) also can be formed with heeling condition as indicated by chain dotted lines.
On the other hand, the difference of the 8th embodiment of the present invention and aforementioned 5th embodiment is LED module (50) at right angle setting as illustrated in fig. 12.Therefore only this difference is described below in conjunction with Figure 12.
8th embodiment of the present invention allows LED module (50) be vertically mounted on the central portion of optical sheet (53) as Suo Shi (a) in figure.And heat pipe (60) is long-pending is stacked in LED module (50).Now, heat pipe (60) allows a sidepiece (66) build up row along the central authorities of LED module (50) are long-pending as shown in figure.The other side (68) of this heat pipe (60) is given prominence to towards the side of LED module (50) as shown in figure.
Heat pipe (60) allows the other side (68) be positioned at the top of a sidepiece (66) as shown in figure in order to allow working fluid successfully gasify.The other side (68) of this heat pipe (60) is installed to maintain enough isolation better as shown in figure with mutually staggering with "the" shape state in order to dispel the heat.
One sidepiece (66) of heat pipe (60) is adjacent to the side of LED module (50) with also can being different from diagramatic content.
The heat pipe (60) of foregoing 8th embodiment is transferred to the heat of vertically arranged LED module (50) side of LED module (50) and is dispelled the heat.Therefore, the heat of LED module (50) can successfully be dispelled the heat by the 8th embodiment.
At this, aforementioned LED module (50) can form multiple and at right angle setting as Suo Shi (b) and (c) in figure.Now, LED module (50) can as shown in figure at the central portion both sides at right angle setting of optical sheet (53), can also further at central portion at right angle setting.And, LED module (50) one is divided into also can being different from diagramatic content multiple after be vertically configured to row and install optical sheet (53) is vertically and comparatively long.
And heat pipe (60) also can be arranged on LED module (50) with various form (arrangement) as Suo Shi (b) and (c) in figure.
In addition, all structures of the 9th embodiment of the present invention are identical with aforementioned 8th embodiment as illustrated in fig. 13, and its difference is only allow heat pipe (60) be formed one group with a pair of as shown in figure and be arranged on vertically arranged LED module (50).Therefore only this difference is described below in conjunction with Figure 13.
9th embodiment of the present invention allows a pair of heat pipe (60) be formed multiple with being formed one group with inverse state as shown in figure, and a sidepiece (66) amasss at LED module (50) and builds up row.Heat pipe (60) allows the other side (68) give prominence to towards the side of LED module (50) as shown in figure.The other side (68) of heat pipe (60) also can be formed with horizontality or heeling condition as shown in solid line or dot-and-dash line.
At this, aforementioned the other side (68) can be adjacent to the side of LED module (50) as shown in the enlarged view.
Heat pipe (60) quantity of foregoing 9th embodiment can give play to more than aforementioned 8th embodiment the heat dispersion being better than the 8th embodiment.Especially, the 9th embodiment can give play to excellent heat dispersion because the other sides (68) of heat pipe (60) more broadly configures in the both sides of LED module (50).
9th embodiment can also comprise end heat pipe (65) as shown in figure, and this end heat pipe (65) forms the angle area being different from LED module (50) length direction and is stacked in or is adjacent to end in LED module (50).As an example, end heat pipe (65) can as shown in figure by being adjacent to portion (65a) and extension (65b) is formed.
Be adjacent to portion (65a) be adjacent to the end of LED module (50) as shown in figure and formed better with horizontality.Extension (65b) is in order to be formed extended at both sides with heeling condition at the both ends being adjacent to portion (65a) higher than being adjacent to portion (65a).This extension (65b) extends to form at the both ends being adjacent to portion (65a) with also can being different from diagramatic content in line.But extension (65b) is formed extended at both sides better to allow the working fluid of gasification rise smoothly as shown in figure with heeling condition.
Foregoing end heat pipe (65) absorbs the heat of LED module (50) by being adjacent to portion (65a) and being delivered to extension (65b).Therefore, end heat pipe (65) can shift the heat of the end side of LED module (50) dispelled the heat.Especially, end heat pipe (65) makes working fluid successfully to gasify because extension (65b) is formed obliquely and condensing, thus can promptly dispel the heat.
In addition, all structures of the 10th embodiment of the present invention are as identical with aforementioned 8th embodiment or the 9th embodiment in Figure 14, and its difference is only possess multiple LED module (50) as shown in figure and be not configured in the central authorities of optical sheet (53) and be arranged on the position of adjacent central with isolation.Therefore only this difference is described below in conjunction with accompanying drawing.
LED module (50) is vertically arranged on the central both sides of optical sheet (53) by the 10th embodiment of the present invention shown in dotted linely.This LED module (50) can be installed as indicated by chain dotted lines in a horizontal manner, also can be arranged on the both sides (up and down or left and right) of central authorities and central authorities as indicated by chain dotted lines.
Heat pipe (60) the 5 to the 9 embodiment can be arranged on LED module (50) and be delivered to previous housings (54) after absorbing the heat of LED module (50) as aforementioned.
Even if the position that foregoing 10th embodiment LED module (50) is arranged on central authorities and/or adjacent central also can by heat pipe (06) successfully heat of transfer and being dispelled the heat.
Above-mentioned many embodiments merely illustrate preferred embodiment of the present invention, range of application of the present invention must not be limited to foregoing teachings, when internal feature can be met, suitable distortion (structure or configuration being changed or local omission or supplementary) can be given in same idea category.And, a part for previous embodiment or most feature can be combined mutually.Therefore, structure or the configuration of each inscape mentioned by embodiments of the invention can be out of shape enforcement, and the distortion of this structure or configuration ought to be illustrated as and belong to appended claims of the present invention.
[purposes in industry]
One sidepiece of heat pipe of the present invention formed longlyer the other side then according to the angle being different from a sidepiece longer formed, the endotherm area of heat pipe can not only be increased, heat can also to be shifted (transmission) to the end of the other side is dispelled the heat, due to heat pipe a sidepiece along heat radiation angle section longer formed and as prior art, heat pipe densely need not be installed and also can guarantee required heat transfer property or heat dispersion.
Claims (7)
1. a back light unit, is characterized in that,
Comprise:
Optical sheet, is formed by with the light guide plate of disperse state transmitted ray or with at least some in the diffuser plate of disperse state transmitted ray;
At least one LED module, has for above-mentioned optical sheet provides the light-emitting component of light and the circuit of driving light-emitting component, has length;
At least one heat pipe, absorbs heat that above-mentioned LED module occurs and transfers to opposite side and dispelled the heat in side; And
Shell, that accommodates in above-mentioned heat pipe and above-mentioned optical sheet and above-mentioned LED module is at least some;
Above-mentioned heat pipe comprises:
One sidepiece, the length along above-mentioned LED module is formed longlyer and absorbs the heat of LED module along the length direction of LED module; And
The other side, according to the angle being different from an above-mentioned sidepiece from a sidepiece longer to extend to form and the length direction of the angle formed and above-mentioned LED module is different, be able to the heat of transfer one sidepiece owing to extending from a sidepiece.
2. back light unit according to claim 1, is characterized in that,
Also comprise heat radiation angle section, to be formed corresponding to the length of the above-mentioned LED module being housed in above-mentioned shell, make the heat of LED module dispel the heat towards side transfer because above-mentioned LED module is fixed on side, bending opposite side then long-pending folded above-mentioned heat pipe an above-mentioned sidepiece and by opposite side the heat of above-mentioned LED module transferred to a sidepiece of heat pipe or the heat of heat pipe is transferred directly to opposite side.
3. back light unit according to claim 2, is characterized in that,
Above-mentioned heat pipe in order to amass the opposite side being laminated to above-mentioned heat radiation angle section at an above-mentioned sidepiece state under allow above-mentioned the other side be adjacent to above-mentioned shell and heat transferred to shell and has in above-mentioned the other side for forming tortuous inflection point.
4. back light unit according to claim 1, is characterized in that,
Above-mentioned heat pipe also comprises orthogonal portion, and it extends to form at an above-mentioned sidepiece with becoming orthogonal state, is directly connected to the above-mentioned LED module with foregoing circuit and the heat of LED module is transferred to an above-mentioned sidepiece.
5. back light unit according to claim 4, is characterized in that,
Above-mentioned orthogonal portion defines the substrate of pattern by the foregoing circuit of above-mentioned LED module owing to being adjacent to and being directly connected to LED module, or foregoing circuit is formed pattern and be directly connected according to the state that above-mentioned LED module becomes with one.
6. back light unit according to claim 1, is characterized in that,
At least certain of above-mentioned LED module in the central portion of above-mentioned optical sheet or the position in adjacent central portion is installed with horizontality or plumbness, and an above-mentioned sidepiece of above-mentioned heat pipe is alongst long-pending to be folded or is adjacent to side.
7. back light unit according to claim 6, is characterized in that,
Above-mentioned the other side of above-mentioned heat pipe is given prominence to along the length direction of above-mentioned LED module towards the side of LED module and forms the angle being different from above-mentioned LED module length direction.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120038280A KR101354884B1 (en) | 2012-04-13 | 2012-04-13 | Backlight unit |
| KR10-2012-0038280 | 2012-04-13 | ||
| PCT/KR2013/003057 WO2013154370A1 (en) | 2012-04-13 | 2013-04-11 | Backlight unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104364701A true CN104364701A (en) | 2015-02-18 |
Family
ID=49327870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380019415.7A Pending CN104364701A (en) | 2012-04-13 | 2013-04-11 | Backlight unit |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5905640B2 (en) |
| KR (1) | KR101354884B1 (en) |
| CN (1) | CN104364701A (en) |
| WO (1) | WO2013154370A1 (en) |
Cited By (1)
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| CN109076722A (en) * | 2017-12-21 | 2018-12-21 | 深圳市大疆创新科技有限公司 | Camera, photographic device and unmanned plane |
Families Citing this family (1)
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|---|---|---|---|---|
| KR101892179B1 (en) * | 2016-07-01 | 2018-08-29 | 주식회사 테인엘티에스 | Heat spreader having heat pipe |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2015516659A (en) | 2015-06-11 |
| WO2013154370A1 (en) | 2013-10-17 |
| KR101354884B1 (en) | 2014-01-27 |
| JP5905640B2 (en) | 2016-04-20 |
| KR20130115715A (en) | 2013-10-22 |
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Application publication date: 20150218 |