CN104347823A - 激光束照射装置及用该装置制造有机发光显示装置的方法 - Google Patents
激光束照射装置及用该装置制造有机发光显示装置的方法 Download PDFInfo
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- CN104347823A CN104347823A CN201410231251.0A CN201410231251A CN104347823A CN 104347823 A CN104347823 A CN 104347823A CN 201410231251 A CN201410231251 A CN 201410231251A CN 104347823 A CN104347823 A CN 104347823A
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- laser beam
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000007789 sealing Methods 0.000 claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 57
- KPHWPUGNDIVLNH-UHFFFAOYSA-M diclofenac sodium Chemical compound [Na+].[O-]C(=O)CC1=CC=CC=C1NC1=C(Cl)C=CC=C1Cl KPHWPUGNDIVLNH-UHFFFAOYSA-M 0.000 claims description 55
- 238000000034 method Methods 0.000 claims description 29
- 230000008859 change Effects 0.000 claims description 7
- 238000005286 illumination Methods 0.000 claims description 5
- 230000011514 reflex Effects 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 230000011218 segmentation Effects 0.000 description 25
- 238000010586 diagram Methods 0.000 description 12
- 239000000565 sealant Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 241001270131 Agaricus moelleri Species 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
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- 229910010272 inorganic material Inorganic materials 0.000 description 1
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- 238000002955 isolation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0063083 | 2013-05-31 | ||
KR1020130063083A KR102049445B1 (ko) | 2013-05-31 | 2013-05-31 | 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104347823A true CN104347823A (zh) | 2015-02-11 |
CN104347823B CN104347823B (zh) | 2018-01-12 |
Family
ID=50424067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410231251.0A Active CN104347823B (zh) | 2013-05-31 | 2014-05-28 | 激光束照射装置及用该装置制造有机发光显示装置的方法 |
Country Status (5)
Country | Link |
---|---|
US (3) | US10010973B2 (zh) |
EP (1) | EP2808915B1 (zh) |
KR (1) | KR102049445B1 (zh) |
CN (1) | CN104347823B (zh) |
TW (1) | TWI628026B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106159112A (zh) * | 2015-03-26 | 2016-11-23 | 上海微电子装备有限公司 | 一种激光封装设备 |
CN106346131A (zh) * | 2015-07-17 | 2017-01-25 | 株式会社迪思科 | 激光加工装置 |
CN107775187A (zh) * | 2016-08-31 | 2018-03-09 | 上海微电子装备(集团)股份有限公司 | 一种激光封装装置和方法 |
CN108292589A (zh) * | 2015-11-23 | 2018-07-17 | 应用材料公司 | 在处理工具中的板载计量(obm)设计与影响 |
CN111108611A (zh) * | 2017-11-08 | 2020-05-05 | 大成工程有限公司 | Led制造系统及led制造方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102049445B1 (ko) * | 2013-05-31 | 2019-11-28 | 삼성디스플레이 주식회사 | 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
CN105916627B (zh) * | 2014-01-17 | 2017-09-05 | 株式会社日立制作所 | 激光焊接方法以及焊接接头 |
KR20150102180A (ko) * | 2014-02-27 | 2015-09-07 | 삼성디스플레이 주식회사 | 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
KR102216677B1 (ko) * | 2014-08-01 | 2021-02-18 | 삼성디스플레이 주식회사 | 디스플레이 실링 장치 및 이를 이용한 디스플레이 장치 제조방법 |
WO2017221218A1 (en) * | 2016-06-25 | 2017-12-28 | Efacec Engenharia E Sistemas, S.A. | Laser-assisted hermetic encapsulation process and product thereof |
KR102603393B1 (ko) * | 2016-12-06 | 2023-11-17 | 삼성디스플레이 주식회사 | 레이저 가공 장치 |
KR102546064B1 (ko) * | 2017-11-08 | 2023-06-21 | 주식회사 대성엔지니어링 | Led 제조시스템 및 led 제조방법 |
KR102173947B1 (ko) * | 2019-07-18 | 2020-11-04 | (주)제이스텍 | 레이져 가공 동축 비젼시스템 |
KR102173946B1 (ko) * | 2019-07-18 | 2020-11-04 | (주)제이스텍 | 디스플레이 패널 커팅용 레이져 가공 동축 비젼시스템 |
Citations (6)
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JP2005140588A (ja) * | 2003-11-05 | 2005-06-02 | Toshiba Corp | 光学式表面電位測定装置および測定方法 |
US20100118912A1 (en) * | 2008-11-10 | 2010-05-13 | Changyi Lai | Quality control of the frit for oled sealing |
US20100296291A1 (en) * | 2009-05-20 | 2010-11-25 | Samsung Mobile Display Co., Ltd. | Light radiating device and method of fabricating organic light emitting diode display device using the same |
CN102157709A (zh) * | 2010-01-19 | 2011-08-17 | 三星移动显示器株式会社 | 激光束照射装置以及制造有机发光显示设备的方法和装置 |
CN102185114A (zh) * | 2010-01-07 | 2011-09-14 | 三星移动显示器株式会社 | 激光束照射装置以及制造有机发光显示器的方法 |
CN102754524A (zh) * | 2010-07-23 | 2012-10-24 | 松下电器产业株式会社 | 显示面板及其制造方法 |
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KR102049445B1 (ko) * | 2013-05-31 | 2019-11-28 | 삼성디스플레이 주식회사 | 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
-
2013
- 2013-05-31 KR KR1020130063083A patent/KR102049445B1/ko active IP Right Grant
-
2014
- 2014-03-31 EP EP14162974.1A patent/EP2808915B1/en active Active
- 2014-05-28 CN CN201410231251.0A patent/CN104347823B/zh active Active
- 2014-05-30 TW TW103118984A patent/TWI628026B/zh active
- 2014-06-02 US US14/293,495 patent/US10010973B2/en active Active
-
2018
- 2018-05-23 US US15/987,218 patent/US10456859B2/en active Active
-
2019
- 2019-10-28 US US16/665,620 patent/US10967457B2/en active Active
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JP2005140588A (ja) * | 2003-11-05 | 2005-06-02 | Toshiba Corp | 光学式表面電位測定装置および測定方法 |
US20100118912A1 (en) * | 2008-11-10 | 2010-05-13 | Changyi Lai | Quality control of the frit for oled sealing |
US20100296291A1 (en) * | 2009-05-20 | 2010-11-25 | Samsung Mobile Display Co., Ltd. | Light radiating device and method of fabricating organic light emitting diode display device using the same |
CN102185114A (zh) * | 2010-01-07 | 2011-09-14 | 三星移动显示器株式会社 | 激光束照射装置以及制造有机发光显示器的方法 |
CN102157709A (zh) * | 2010-01-19 | 2011-08-17 | 三星移动显示器株式会社 | 激光束照射装置以及制造有机发光显示设备的方法和装置 |
CN102754524A (zh) * | 2010-07-23 | 2012-10-24 | 松下电器产业株式会社 | 显示面板及其制造方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106159112A (zh) * | 2015-03-26 | 2016-11-23 | 上海微电子装备有限公司 | 一种激光封装设备 |
CN106159112B (zh) * | 2015-03-26 | 2017-12-29 | 上海微电子装备(集团)股份有限公司 | 一种激光封装设备 |
CN106346131A (zh) * | 2015-07-17 | 2017-01-25 | 株式会社迪思科 | 激光加工装置 |
CN106346131B (zh) * | 2015-07-17 | 2020-02-21 | 株式会社迪思科 | 激光加工装置 |
CN108292589A (zh) * | 2015-11-23 | 2018-07-17 | 应用材料公司 | 在处理工具中的板载计量(obm)设计与影响 |
CN107775187A (zh) * | 2016-08-31 | 2018-03-09 | 上海微电子装备(集团)股份有限公司 | 一种激光封装装置和方法 |
CN111108611A (zh) * | 2017-11-08 | 2020-05-05 | 大成工程有限公司 | Led制造系统及led制造方法 |
CN111108611B (zh) * | 2017-11-08 | 2024-04-12 | 大成工程有限公司 | Led制造系统及led制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20140356987A1 (en) | 2014-12-04 |
US10456859B2 (en) | 2019-10-29 |
US10967457B2 (en) | 2021-04-06 |
KR20140141379A (ko) | 2014-12-10 |
CN104347823B (zh) | 2018-01-12 |
US20180264589A1 (en) | 2018-09-20 |
EP2808915A1 (en) | 2014-12-03 |
US10010973B2 (en) | 2018-07-03 |
EP2808915B1 (en) | 2021-05-26 |
TW201511873A (zh) | 2015-04-01 |
US20200061737A1 (en) | 2020-02-27 |
TWI628026B (zh) | 2018-07-01 |
KR102049445B1 (ko) | 2019-11-28 |
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Inventor after: Li Tingmin Inventor after: LEE, JUNG-MIN Inventor after: GEHLEN, ELMAR Inventor after: KIND, HEIDRUN Inventor after: Arnold Gilles Inventor before: Li Tingmin Inventor before: LEE, JUNG-MIN Inventor before: GEHLEN, ELMAR Inventor before: KIND, HEIDRUN |
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COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: LI TINGMIN OLOWINSKY ALEXANDER GEHLEN ELMAR? KIND HEIDRUN TO: LI TINGMIN OLOWINSKY ALEXANDER GEHLEN ELMAR? KIND HEIDRUN GILLNER ARNOLD |
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