CN104341717A - Epoxy resin composition, and film and substrate both prepared by employing same - Google Patents
Epoxy resin composition, and film and substrate both prepared by employing same Download PDFInfo
- Publication number
- CN104341717A CN104341717A CN201310343289.2A CN201310343289A CN104341717A CN 104341717 A CN104341717 A CN 104341717A CN 201310343289 A CN201310343289 A CN 201310343289A CN 104341717 A CN104341717 A CN 104341717A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- component
- composition
- ore powder
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
A disclosed epoxy resin composition comprises a component A: epoxy resin; a component B: a hardener; a component C: a promoter; and a component D: a filler which is a sheet-like inorganic mineral powder. The inorganic mineral powder comprises 54 +/- 5% of silicon dioxide and 38 +/- 5% of aluminium oxide. By employing the epoxy resin composition, a prepared film/substrate possesses relatively good processability. The invention also provides the film and the substrate both prepared by utilizing the epoxy resin composition.
Description
Technical field
The present invention relates to a kind of composition epoxy resin, be specially a kind of composition epoxy resin containing inorganic ore powder and the film prepared for raw material with it and substrate.
Background technology
In recent years, due to the high performance of electronics, multifunction, miniaturization, thus require day by day to improve to the miniaturization of the electronic component for electronics, lightness; Thereupon, more require all physical property such as thermotolerance, physical strength, electrical characteristic improving electronic component, such as, tool more high-density, high function and high-performance is required to the printed circuit board (PCB) of structure dress semiconductor subassembly.
Printed circuit board (PCB) is generally by impregnation film (PP), utilize the abundant pressing of hot pressing program to form containing plural films such as Copper Foil film (Copper clad laminate, CCL) or Copper Foils; Wherein impregnation film be impregnated in an epoxy resin adhesive liquid by glasscloth, and carry out the dry slim film of one waiting subsequent technique to be formed.Along with the execution of environmental protection act (as RoHS, WEEE), lead-free solder technique replaces the technique having lead solder gradually, and so assembling temperature need be improved about 30 to 40 degree by this kind of mode, thus significantly promotes the heat resistant requirements of substrate.
Being usually used in the practice promoting thermotolerance at present, is add high amount of inorganic filler and fire retardant material (as silicon-dioxide, filling aluminium hydrate etc.), to improve the characteristic electron of substrate and heat-resisting or flame-retarding characteristic in resin composition; For example, Japanese Patent Laid-Open 2000-183539 publication discloses a kind of with the mineral filler of specified particle diameter, coordinate principal constituent to be the varnish of high molecular weight epoxy polymer and polyfunctional epoxy resin etc., coat the multilayer insulation manufacture of substrates as insulation layer on carrier.But, add a large amount of mineral fillers and can bring the problem such as processing procedure processing and interlayer thinning difficulty; Such as, the interpolation of silicon-dioxide and filling aluminium hydrate can cause sheet material hardening, make it be difficult to carry out mechanical workout, when substrate carries out bore process, substrate de-lamination may be caused, the resin layer of substrate cracks, drill point fracture or the drill point wearing and tearing bad phenomenon such as excessive.
In addition, be usually used in making the kaolin powder covering rubber outside electric wire, also can be used as the mineral filler of resin combination.General kaolinic composition in addition to silica, more comprises more than at least 30% aluminum oxide, to give this oil/fat composition fire-retardant and difficult combustion effect.Moreover this mineral filler also has the lower physical property of Mohs' hardness, therefore relative to general high rigidity silica filler, preferably processibility can be had with the substrate made by the resin combination containing kaolin powder, thus boring or resin crackle can be improved.But, due to kaolinic silica composition (lower than 40%) on the low side, cause electric characteristics (as Dk, Df) requirement being difficult to meet made substrate, and can be poor for the stripping strength of the Copper Foil in substrate.
In addition, talcum powder also can be used as the mineral filler of resin combination, to increase the electric characteristics of made substrate, thus can meet the demand of the communications applications substrate of low-k (as Dk, Df).General talcous composition in addition to silica, more comprise a large amount of magnesium oxide, although magnesium oxide has obvious effect for fire-retardant, but magnesium oxide can produce the phenomenon that condensation suspends in basic solution, thus the potential of hydrogen being controlled resin combination is needed, in other words, talcum powder only can be used for the resin combination under specific acid base number condition.In sum, new composition epoxy resin is needed at present badly to solve the problem.
Summary of the invention
Main purpose of the present invention, be to provide a kind of composition epoxy resin, it utilizes ultra-soft silica flour to add in resin adhesive liquid to be used as inorganic type stopping composition, contribute to the materialization part promoting organism (epoxy resin), thus the processibility of film (Prepreg, PP) and substrate (Laminate) can be promoted.
According to one embodiment of the invention, described composition epoxy resin comprises component (A): epoxy resin; Component (B): stiffening agent; Component (C): promotor; Component (D): stopping composition, for the inorganic ore powder of sheet, in the moiety of wherein said inorganic ore powder, there is the silicon-dioxide of 54 ± 5% and the aluminum oxide of 38 ± 5% by weight percentage, and the length-to-diameter ratio (aspect ratio) of described inorganic ore powder is between 10.8 to 20.5; And component (E): additive, comprises at least one tensio-active agent.
According to above-mentioned composition epoxy resin, the present invention separately provides a kind of and glasscloth be impregnated in film made in this composition epoxy resin.
According to above-mentioned film, the present invention provides again the substrate of the printed circuit board (PCB) made by this film of a kind of application.
In one embodiment of this invention, the length-to-diameter ratio (aspect ratio) of described stopping composition is between 12 to 18.
In one embodiment of this invention, the length-to-diameter ratio (aspect ratio) of described stopping composition is between 14 to 16.
In one embodiment of this invention, the median size of described stopping composition is 3 μm.
In one embodiment of this invention, the Morse hardness of described stopping composition is 2.4.
In one embodiment of this invention, also comprise component (E): additive, described additive is a tensio-active agent.
In one embodiment of this invention, also comprise component (F): solvent, described solvent is butanone (MEK), propylene glycol monomethyl ether (PM), pimelinketone or its combination.
The present invention at least has following beneficial effect, the inorganic ore powder that the present invention adds sheet in epoxy resin component as stopping composition, described flaky inorganic ore powder is because be easier to average dispersion, contact frequency between woven fiber glass and film can be increased to improve flame retardancy and processibility, such as improve and promote substrate in lead-free solder processing procedure to the thermotolerance of high temperature, and substrate de-lamination may be caused when improving boring processing procedure, substrate cracks, drill point ruptures or the bad phenomenon such as excessive of wearing and tearing, to promote dimensional stability and intensity.
Further understand feature of the present invention and technology contents for enable, refer to following detailed description for the present invention.
Embodiment
The invention discloses a kind of composition epoxy resin, wherein containing ultra-soft fine powder material (inorganic ore powder); According to specification sheets of the present invention, using this inorganic ore powder as the stopping composition in composition epoxy resin, made substrate can be avoided in boring processing procedure to occur processing crackle, and fire-retardant/difficult combustion characteristic of this substrate can be improved.
Specifically, the present invention carrys out the applicability of stop collar epoxy resin composition by the adding proportion controlling inorganic ore powder, that is contribute to promoting organic materialization part, and then can promote the processibility of film (Prepreg, PP) with substrate (Laminate); Further, inorganic ore powder and epoxy resin is made to produce crosslinking structure by silane coupling agent, to help the flame retardancy promoting film and substrate.In addition, this specification sheets also carries out experiment discussion for the composition of inorganic ore powder and silane coupling agent and length-to-diameter ratio, avoids inorganic ore powder and silane coupling agent to have an impact to the voltinism of resin adhesive liquid and physical property.In addition, inorganic ore powder is added and silane coupling agent is basic thermotolerance and the water-absorbent that can maintain or promote film and substrate.
In this specific embodiment, composition epoxy resin, comprising: component (A): epoxy resin; Component (B): stiffening agent; Component (C): promotor; And component (D): stopping composition.
The epoxy resin of the present embodiment can be brominated phenols formaldehyde epoxy resin, bisphenol-A phenolic epoxy resin, four functional group's epoxy resin (FR4 epoxy resin), comprises two or more hybrid resin aforementioned, but the present invention is non-as limit.And the stiffening agent of the present embodiment can select phenolic aldehyde stiffening agent, such as bisphenol-A phenolic stiffening agent, but be not limited thereto, its consumption is 30 parts of this component (A); In other words, the epoxy resin of component (A) is 100 parts, and the phenolic aldehyde stiffening agent of component (B) is then 30 parts, and it is the weight part (PHR) relative to the epoxy resin of component (A).
The promotor of the present embodiment can be 2-ethyl-4-methylimidazole, and its consumption is 0.1 part of this component (A), and in other words, the epoxy resin of component (A) is 100 parts, and the promotor of component (C) is then 0.1 part; Kind due to promotor is non-is emphasis of the present invention, therefore does not repeat them here.
Table one be classified as the detail file of the stopping composition of component (D).The stopping composition of the present embodiment is the inorganic ore powder of sheet, there is in its moiety silicon-dioxide and aluminum oxide, wherein silica composition is limited with 54 ± 5%, to control the hardness of inorganic ore powder, the hardness be comparatively suitable for can be provided to be applied in stopping composition, and then there is the strong condition of Drilling operation slight crack in the resin layer that can reduce made substrate; And aluminum oxide is (with chemical formula Al
2o
3representative) composition at least needs to be greater than 38 ± 5%, and made substrate can be made to possess splendid flame-retarding characteristic.
Table one
| Major ingredient: | 54±5%SiO 2、38±5%Al 2O 3 |
| Proportion: | 2.3 |
| Mohs (Mohs) hardness: | 2.4 |
| Water ratio (%): | 0.19 |
| Thermal conduction K value: | 0.58～0.61W/(m*K) |
| Shape: | Sheet |
| Median size (D): | 3μm |
| Thermal expansivity: | 8 |
| Specific inductivity: | 4.1 |
Please join the experimental data of table two, the present invention is defined for the length/thickness rate (Aspect ratio) of powder particle size in inorganic ore powder composition, to adjust inorganic ore powder to the reactive impact of resin adhesive liquid further.
Particle size measurement procedure
Length-to-diameter ratio is generally the short-cut method that the shapes such as particle are quantitatively showed, in the present embodiment, the long axis length (maximum major diameter) of particle that length-to-diameter ratio is measured by electron microscope observations such as SEM is tried to achieve divided by minor axis length (length that most long portion is divided in the vertical direction of major diameter).When axial length deviation is uneven, measures multiple point (such as 10 points) by SEM, calculated by its mean value.Or, even if measurement 30 points, 100 also can obtain same calculating result.Length-to-diameter ratio represents that particle shape is fibrous bar-shaped or spherical index, and when particle is threadiness, length-to-diameter ratio is large, is then 1.0 when particle is spherical.
It is worth mentioning that, the length-to-diameter ratio (aspect ratio) of the stopping composition of component (D) between 10.8 to 20.5, need be preferably between 12 to 18, is more preferably between 14 to 26.Accordingly, flaky inorganic ore powder can comparatively easily on average disperse, thus the contact frequency that can increase between woven fiber glass and film is to improve flame retardancy and processibility, such as improve and promote substrate in lead-free solder technique to the thermotolerance of high temperature, and substrate de-lamination may be caused when improving boring processing procedure, substrate cracks, drill point ruptures or the bad phenomenon such as excessive of wearing and tearing, to promote dimensional stability and intensity.Further it, adopt the stopping composition of specific length-to-diameter ratio to be easy to adjustment material viscosity, and by being adjusted to the viscosity being applicable to being shaped, can shortening shaping cycle, become the material that formability is superior.
Water-absorbent (rate) can be called water absorbability again, and it is mainly the water absorption character judging copper-clad base plate, because copper-clad base plate by envrionment temperature and humidity effect dilatational strain or can adsorb aqueous vapor.And when copper-clad base plate water content, packed moisture are too high, easily produce the problem of plate bursting or the defect of other circuit cards etc., therefore absorptive characteristic is one of important feature of film/copper-clad base plate.Traditionally, IR spectroscopic analysis or the analysis of thermo-gravimetric loss method can be carried out, to confirm the water-absorbent of this copper-clad base plate for this material.
Thermotolerance: namely float tin result, copper-clad base plate, according to industry standard IPC-TM-650Method2.4.13.1, is soaked in 288 DEG C of tin stoves to plate bursting required time (dividing) by heat-resistant experiment system.
Flame resistivity: i.e. flame retardancy, measures according to UL94 method, refers to that plastic material flame resistivity is tested, its with the autoignition time of plastic material standard test piece after flame, spontaneous combustion speed, the graininess that drops to stipulate the resistance to combustion grade of plastic material.And good and bad according to resistance to combustion grade, be HB, V-2 successively, V-1, V-0, be up to 5V grade.And UL94 testing method refers to that plastic material burns in a vertical manner on flame.Be a test period with every ten seconds, its step is as follows: step one: test piece is put in flame ten seconds and remove, measures this test piece after removing and burns away the time (T1); Step 2: after test piece fray-out of flame, then put in flame ten seconds into and remove again, then measure remove after this test piece burn away the time (T2); Step 3: repeat test and get its mean value for several times; Step 4: the sum total calculating T1+T2.And the requirement of UL94V-0 grade is neither must more than 10 seconds the average of the average of test piece T1 single combustion time and T2, and the sum total of its T1 and T2 just must not meet UL94V-0 requirement more than 50 seconds.
Processibility: hole on above-mentioned copper-clad base plate, and calculate in 27 borings, the hole count that resin layer cracks.Fewer resin layer crackle hole count, then represent that substrate has preferably processibility.
Table two
| Ultra-soft silica flour material | |||
| Numbering | Thickness | Length | Length-to-diameter ratio |
| 1 | 0.698 | 7.99 | 11.447 |
| 2 | 0.398 | 7.39 | 18.568 |
| 3 | 0.444 | 9.06 | 20.405 |
| 4 | 0.496 | 10.1 | 20.363 |
| 5 | 0.565 | 10.7 | 18.938 |
| 6 | 0.656 | 7.55 | 11.509 |
| 7 | 0.398 | 5.69 | 14.296 |
| 8 | 0.49 | 8.07 | 16.469 |
| 9 | 0.528 | 6.84 | 12.955 |
| 10 | 0.517 | 10.5 | 20.309 |
| 11 | 0.703 | 10.1 | 14.367 |
| 12 | 0.701 | 7.63 | 10.884 |
| 13 | 0.403 | 5.82 | 14.442 |
| 14 | 0.559 | 6.78 | 12.129 |
| 15 | 0.591 | 6.96 | 11.777 |
| 16 | 0.523 | 7.619 | 14.568 |
| On average | 15.214 |
In an alternate embodiment, composition epoxy resin of the present invention can comprise further: component (E): additive.This additive can select one or more tensio-active agent, such as, be coupler or other additives etc., but be not limited thereto.For example, in order to promote component (D) stopping composition in the compatibility of silicon-dioxide and resin, the present invention first carries out upgrading to silicon-dioxide by the silane coupling agent (silane coupling agent) of interpolation 0.04 part, to generate silane group silicon (silanized silica), thus promote the compatibility of silicon-dioxide and resin, the physical property of the film/copper-clad base plate made by promoting further.Above-mentioned silane coupling agent can be but is not limited to the coupler of the tradition interpolations such as aminosilane coupling agent, epoxy radicals silicone hydride coupler, titanium class coupler.
Please join the experimental data of table three, next the collocation of many group embodiments will be carried out for composition epoxy resin, the plurality of advantages that the copper-clad base plate being added with the composition epoxy resin of the inorganic ore powder of the specific length-to-diameter ratio of tool to illustrate application the present invention can be reached.
Embodiment 1:
The composition epoxy resin of embodiment 1 comprises: (A) epoxy resin of 100 parts; (B) bisphenol-A phenolic stiffening agent of 30 parts; (C) 2-ethyl-4 Methylimidazole (promotor) of 0.1 part; (D) stopping composition of 35 parts; And (E) silane coupling agent (additive) of 0.04 part.
Specifically, the epoxy resin of component (A) be brominated phenols formaldehyde epoxy resin, bisphenol-A phenolic epoxy resin and four functional group's epoxy resin institute makers-ups; The stopping composition of component (D) is selected mica, by the silicon-dioxide (SiO of 54 ± 5%
2) and 38 ± 5% aluminum oxide (Al
2o
3) formed, the median size of described stopping composition is particle diameter 0.5 ~ 4um, and length-to-diameter ratio: 10.8 ~ 20.5.
Embodiment 2:
The composition epoxy resin of embodiment 2 comprises: (A) epoxy resin of 100 parts; (B) bisphenol-A phenolic stiffening agent of 30 parts; (C) 2-ethyl-4 Methylimidazole (promotor) of 0.1 part; (D) stopping composition of 35 parts; And (E) silane coupling agent (additive) of 0.1 part.In the present embodiment, except the usage quantity of the additive of component (E) is different from embodiment 1, the composition of stopping composition is also different from embodiment 1; Specifically, described stopping composition by 54 ± 5% silicon-dioxide (SiO
2) and 38 ± 5% aluminum oxide (Al
2o
3) formed, the median size of described stopping composition is particle diameter 0.5 ~ 3um, and length-to-diameter ratio: 14 ~ 16.
Reference examples 1:
Reference examples 1 is compared with embodiment 1, and the difference of the composition epoxy resin of itself and embodiment 1 is, the stopping composition of component (D) is kaolin, and described kaolin is by the silicon-dioxide (SiO of 45%
2) and 38% aluminum oxide (Al
2o
3) formed.
Reference examples 2:
Reference examples 2 is compared with embodiment 1, and the difference of the composition epoxy resin of itself and embodiment 1 is, the stopping composition of component (D) is kaolin, and described kaolin is by the silicon-dioxide (SiO of 75%
2) and 15% aluminum oxide (Al
2o
3) formed.
Reference examples 3:
Reference examples 3 is compared with embodiment 1, and the difference of the composition epoxy resin of itself and embodiment 1 is, the stopping composition of component (D) is kaolin, and described kaolin is by the silicon-dioxide (SiO of 45%
2), the aluminum oxide (Al of 31%
2o
3) and be added the oxidation being greater than 10% and receive (NaO) and potassium oxide (KO) formed.
Table three
The specific experiment example arranged by table three can be learnt, the copper-clad base plate (contrast 1 ~ 3) made by composition epoxy resin of traditional stopping composition (as kaolin etc.) is added with compared to utilization, utilize the above-mentioned copper-clad base plate (embodiment 1 and 2) made by composition epoxy resin being added with the stopping composition (selected mica) of specific length-to-diameter ratio, except can bearing higher high glass transition temperature (Tg), also possesses good processibility, high-peeling strength, low gel time, low water absorption, the plurality of advantages such as low-k (Dk/Df), and can resistance to combustion UL94V-0 level estimate be passed through, therefore the suitability of composition epoxy resin of the present invention is more extensive.
Further it, this silane coupling agent can be the interfacial agents being applied to resin and inorganic fillings, and it has increases inorganic fillings surface-active function, thus can increase the physical property of matrix material, such as intensity, wear resistance etc.With regard to chemical structure, this silane coupling agent has silicone resin (Silicone) monomer of the different reactive group of two or more in the molecule, one of them is the reactive group be combined with inorganic fillings, and another is then the reactive group be combined with organic resin material.By this, inorganic fillings can be made to combine with organic resin material, to improve release, flame resistivity and the processibility of molding film (prepreg, prepreg).
This composition epoxy resin more can comprise component (F): solvent.This solvent can be butanone (MEK), propylene glycol monomethyl ether (PM), pimelinketone, two or more mixing aforementioned, and its addition is 100 parts of component (A).
According to the composition epoxy resin of the present embodiment, the present invention separately provides a kind of and uses film shaping made by this composition epoxy resin.Making method is that a glasscloth is flooded (dipping) in the glue of this epoxy resin composition, to make the impregnation film (PP) of the better resistance to combustion of tool and heat-resistant quality or to contain Copper Foil film (Copper clad laminate, CCL) or other films; Further, aforementioned film can make the substrate (copper-clad base plate as in embodiment) of use in printed circuit board further, and still maintains quite good processibility when passing through boring processing procedure.
In sum, the present invention at least has following advantages:
1, the present invention add sheet inorganic ore powder in epoxy resin component as stopping composition, described flaky inorganic ore powder is because be easier to average dispersion, contact frequency between woven fiber glass and film can be increased to improve flame retardancy and processibility, such as improve and promote substrate in lead-free solder processing procedure to the thermotolerance of high temperature, and substrate de-lamination may be caused when improving boring processing procedure, substrate cracks, drill point ruptures or the bad phenomenon such as excessive of wearing and tearing, to promote dimensional stability and intensity.
The present invention mainly utilizes the inorganic ore powder of the silicon-dioxide with 54 ± 5% as the mineral filler in resin combination, to promote the workability of the film/substrate used made by this resin adhesive liquid.
2, on the other hand, the stopping composition of specific length-to-diameter ratio is adopted to be easy to adjust the viscosity of epoxy resin component; Further, by epoxy resin component is adjusted to suitable moulding viscosity, effectively can shorten shaping cycle, become the material that formability is superior.
3, more on the one hand, the present invention passes through by the limited proportion of the silicon-dioxide in stopping composition in the scope of 54 ± 5%, also helpful in the processibility promoting made film/substrate; And pass through by the limited proportion of aluminum oxide in stopping composition more than at least 35%, can give made substrate preferably flame resistivity, therefore, the present invention can take into account low water absorbable and the requirement of thermotolerance equal-specification of film/substrate.
The foregoing is only preferred embodiment of the present invention, be not intended to limit scope of patent protection of the present invention, therefore the equivalence change of such as using description of the present invention to do, be all contained in the scope of the present invention.
Claims (9)
1. a composition epoxy resin, is characterized in that, comprising:
Component (A): epoxy resin;
Component (B): stiffening agent;
Component (C): promotor;
Component (D): stopping composition is the inorganic ore powder of sheet; Wherein, in the moiety of described inorganic ore powder, there is the silicon-dioxide of 54 ± 5% and the aluminum oxide of 38 ± 5% by weight percentage, and the length-to-diameter ratio of described inorganic ore powder is between 10.8 to 20.5;
Component (E): additive, comprises at least one tensio-active agent.
2. composition epoxy resin according to claim 1, the length-to-diameter ratio of wherein said inorganic ore powder is between 12 to 18.
3. composition epoxy resin according to claim 2, the length-to-diameter ratio of wherein said inorganic ore powder is between 14 to 16.
4. composition epoxy resin according to claim 1, the median size of wherein said inorganic ore powder is 3 μm.
5. composition epoxy resin according to claim 1, the Morse hardness of wherein said inorganic ore powder is 2.4.
6. composition epoxy resin according to claim 1, wherein said additive-package is containing at least one silane coupling agent.
7. composition epoxy resin according to claim 1, also comprises component (F): solvent, and described solvent is butanone, propylene glycol monomethyl ether, pimelinketone or its combination.
8. film made in the composition epoxy resin that glasscloth be impregnated according to any one of claim 1 to 7.
9. the substrate of printed circuit board (PCB) film made by of an application rights requirement described in 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310343289.2A CN104341717A (en) | 2013-08-06 | 2013-08-06 | Epoxy resin composition, and film and substrate both prepared by employing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310343289.2A CN104341717A (en) | 2013-08-06 | 2013-08-06 | Epoxy resin composition, and film and substrate both prepared by employing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104341717A true CN104341717A (en) | 2015-02-11 |
Family
ID=52498219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310343289.2A Pending CN104341717A (en) | 2013-08-06 | 2013-08-06 | Epoxy resin composition, and film and substrate both prepared by employing same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104341717A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016101497A1 (en) * | 2014-12-26 | 2016-06-30 | 广东生益科技股份有限公司 | Epoxy resin composition as well as prepreg and laminated plate using same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11199757A (en) * | 1998-01-05 | 1999-07-27 | Otsuka Chem Co Ltd | Conductive epoxy resin composition |
| JP2000183539A (en) * | 1998-12-18 | 2000-06-30 | Hitachi Chem Co Ltd | Manufacture of multilayer printed wiring board |
| JP2006249343A (en) * | 2005-03-14 | 2006-09-21 | Mitsui Chemicals Inc | Epoxy resin composition and package for housing semiconductor element |
| CN101287794A (en) * | 2005-08-24 | 2008-10-15 | 亨克尔两合股份公司 | Epoxy compositions having improved impact resistance |
| CN102040801A (en) * | 2009-10-10 | 2011-05-04 | 联茂电子股份有限公司 | Epoxy resin composition as well as film and substrate |
-
2013
- 2013-08-06 CN CN201310343289.2A patent/CN104341717A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11199757A (en) * | 1998-01-05 | 1999-07-27 | Otsuka Chem Co Ltd | Conductive epoxy resin composition |
| JP2000183539A (en) * | 1998-12-18 | 2000-06-30 | Hitachi Chem Co Ltd | Manufacture of multilayer printed wiring board |
| JP2006249343A (en) * | 2005-03-14 | 2006-09-21 | Mitsui Chemicals Inc | Epoxy resin composition and package for housing semiconductor element |
| CN101287794A (en) * | 2005-08-24 | 2008-10-15 | 亨克尔两合股份公司 | Epoxy compositions having improved impact resistance |
| CN102040801A (en) * | 2009-10-10 | 2011-05-04 | 联茂电子股份有限公司 | Epoxy resin composition as well as film and substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016101497A1 (en) * | 2014-12-26 | 2016-06-30 | 广东生益科技股份有限公司 | Epoxy resin composition as well as prepreg and laminated plate using same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5316474B2 (en) | Resin composition, metal foil with resin, insulating sheet with substrate and multilayer printed wiring board | |
| JP3412585B2 (en) | Epoxy resin composition for prepreg used for production of printed wiring board and multilayer printed wiring board, prepreg, multilayer printed wiring board | |
| CN102633990A (en) | Epoxy resin composition, prepreg made of epoxy resin composition and copper-coated laminate made of epoxy resin composition | |
| JP5090635B2 (en) | Resin composition, insulating sheet with substrate, and multilayer printed wiring board | |
| CN103917596A (en) | Resin composition, and prepreg and laminated sheet each produced using same | |
| CN104379668A (en) | Resin composition, prepreg, metal foil-clad laminate and printed wiring board | |
| JP2018523592A (en) | Organosilicone resin aluminum-based copper-clad laminate and preparation method thereof | |
| WO2012083728A1 (en) | Halogen-free resin composition and method for fabricating halogen-free copper clad laminate using the same | |
| CN103435812B (en) | A kind of benzoxazine intermediate and preparation method thereof | |
| CN102051023B (en) | Halogen-free resin composition and resin-coated copper foil and copper-clad plate prepared from same | |
| WO2016011705A1 (en) | Halogen-free resin composition as well as prepreg and laminated board used for printed circuit that are made of halogen-free resin composition | |
| WO2016119356A1 (en) | Halogen-free resin composition, and prepreg and laminated board manufactured therefrom | |
| CN109504038A (en) | A kind of Halogen-free high heat-resistant resin combination for HDI copper-clad plate | |
| CN104002524A (en) | Making method for high thermal conductive, high heat resistant and high CTI FR-4 copper-clad plate | |
| CN101906239A (en) | Halogen-free flame-retardant resin composition and application thereof in manufacturing copper-clad plate | |
| CN104109347A (en) | Halogen-free thermosetting resin composition, prepreg and laminated plate | |
| CN103665760A (en) | Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit board | |
| CN102320168B (en) | Phthalazinone polyarylether High performance plastic resin base copper-clad plate and preparation method thereof | |
| CN101955678B (en) | Flame retardant thermosetting resin composition and copper-clad plate | |
| CN102260402B (en) | Epoxy resin composition, and prepreg and printed circuit board manufactured therefrom | |
| CN104985909A (en) | Manufacturing method for high-thermal-conductivity and high-heat-resistance copper-clad plate | |
| WO2018120472A1 (en) | Halogen-free flame-retardant resin composition, and prepreg and copper clad laminate prepared from same | |
| CN104341717A (en) | Epoxy resin composition, and film and substrate both prepared by employing same | |
| CN102040801B (en) | Epoxy resin composition as well as film and substrate | |
| JP2012019240A (en) | Resin composite, insulation sheet with substrate and multilayer printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150211 |