CN104332517A - Back contact type solar cell electric conduction backboard - Google Patents
Back contact type solar cell electric conduction backboard Download PDFInfo
- Publication number
- CN104332517A CN104332517A CN201410655173.7A CN201410655173A CN104332517A CN 104332517 A CN104332517 A CN 104332517A CN 201410655173 A CN201410655173 A CN 201410655173A CN 104332517 A CN104332517 A CN 104332517A
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- CN
- China
- Prior art keywords
- polyamide
- layer
- back contact
- maleic anhydride
- adipamide
- Prior art date
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- Pending
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- 239000004952 Polyamide Substances 0.000 claims abstract description 36
- 229920002647 polyamide Polymers 0.000 claims abstract description 36
- -1 polypropylene Polymers 0.000 claims abstract description 30
- 239000004743 Polypropylene Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 229920001155 polypropylene Polymers 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000956 alloy Substances 0.000 claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 9
- 239000011889 copper foil Substances 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 65
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 54
- 239000012790 adhesive layer Substances 0.000 claims description 21
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 claims description 20
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 19
- 229920002292 Nylon 6 Polymers 0.000 claims description 12
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical group C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 6
- 239000001361 adipic acid Substances 0.000 claims description 6
- 239000012760 heat stabilizer Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 235000011037 adipic acid Nutrition 0.000 claims description 4
- 239000003963 antioxidant agent Substances 0.000 claims description 4
- 230000003078 antioxidant effect Effects 0.000 claims description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000000806 elastomer Substances 0.000 claims description 4
- 229920006351 engineering plastic Polymers 0.000 claims description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 4
- 229920006225 ethylene-methyl acrylate Polymers 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 4
- 229920001912 maleic anhydride grafted polyethylene Polymers 0.000 claims description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 claims description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- 229920000426 Microplastic Polymers 0.000 claims description 2
- 229920000571 Nylon 11 Polymers 0.000 claims description 2
- 229920000299 Nylon 12 Polymers 0.000 claims description 2
- 229920003189 Nylon 4,6 Polymers 0.000 claims description 2
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 2
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 2
- 229920000572 Nylon 6/12 Polymers 0.000 claims description 2
- 229920006152 PA1010 Polymers 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- 238000012661 block copolymerization Methods 0.000 claims description 2
- QYMGIIIPAFAFRX-UHFFFAOYSA-N butyl prop-2-enoate;ethene Chemical compound C=C.CCCCOC(=O)C=C QYMGIIIPAFAFRX-UHFFFAOYSA-N 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 150000001470 diamides Chemical class 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 229920006245 ethylene-butyl acrylate Polymers 0.000 claims description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 239000003607 modifier Substances 0.000 claims description 2
- 229920006396 polyamide 1012 Polymers 0.000 claims description 2
- 229920006394 polyamide 410 Polymers 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 235000012222 talc Nutrition 0.000 claims description 2
- 229920001897 terpolymer Polymers 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 abstract description 8
- 239000011737 fluorine Substances 0.000 abstract description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract description 7
- 239000002985 plastic film Substances 0.000 abstract description 7
- 229920006255 plastic film Polymers 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 238000002834 transmittance Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract 3
- 239000005020 polyethylene terephthalate Substances 0.000 abstract 3
- 238000005728 strengthening Methods 0.000 abstract 2
- 230000005611 electricity Effects 0.000 abstract 1
- 238000005286 illumination Methods 0.000 abstract 1
- 230000032683 aging Effects 0.000 description 8
- 239000010408 film Substances 0.000 description 6
- 229920002620 polyvinyl fluoride Polymers 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 4
- 230000003179 granulation Effects 0.000 description 4
- 238000005469 granulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 4
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 125000003636 chemical group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002924 oxiranes Chemical group 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/552—Fatigue strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a back contact type solar cell electric conduction backboard. The back contact type solar cell electric conduction backboard comprises a weather resistance layer, a bonding layer, a structure strengthening layer, a connection layer and a metal electric conduction layer, which are sequentially arranged, and is characterized in that the weather resistance layer is made of polyamide, the structure strengthening layer is made of polypropylene or polypropylene alloy, and the metal electric conduction layer is made of copper foil. The back contact type solar cell electric conduction backboard has the advantages that 1) a back contact type is adopted, and therefore the illumination area of a photovoltaic module can be increased and electricity generation efficiency is improved; 2) moisture transmittance of a traditional PET (polyethylene terephthalate) backboard is larger than 2g/ (cubic centimeter*day), and compared with the traditional PET backboard, the back contact type solar cell electric conduction backboard is good in water resistance performance due to the fact that moisture transmittance of the back contact type solar cell electric conduction backboard is less than 1g/ (cubic centimeter*day), and therefore the metal electric conduction layer can not be corroded by moisture, and no short circuit or even module scrapping phenomenon can be caused during the use process of the solar module; 3) the polyamide is used to replace a fluorine plastic film of the traditional backboard, and therefore costs are reduced, and simultaneously fluorine pollution can be avoided.
Description
Technical field
The present invention relates to a kind of back contact solar battery conductive backings.
Background technology
In the photovoltaic cells, need by the mode of serial or parallel connection, multiple photovoltaic module to be connected together, just have many strip metals grid line on the surface of photovoltaic cell like this.Will grid line be done very thin to reduce surperficial shading, but thin grid line can make again Electrodes increase, and too increases technology difficulty simultaneously.
Grid line and electric contact have been moved on to the back side of battery by back contacts photovoltaic cell, reduce or completely eliminate the shading of positive surface grids, increase light-receiving area, improve the generating efficiency of photovoltaic module; Simultaneously because positive and negative electrode is all positioned at cell backside, can battery packaging technology be simplified, more easily realize automation, and the area ratio shared by back side base stage and emitter can be regulated, reduce the contact resistance of electrode.Moreover, back contacts photovoltaic cell also will be more attractive in appearance.Therefore, the developing direction that back contacts photovoltaic cell will be following photovoltaic art, has wide market prospects.
In numerous types of back-contact battery, conversion ratio is higher and be easy to realize industrialization for metal piercing formula back electrode solar cell (Metallization Wrap Through, MWT).In MWT battery, metal is wound to rear surface via a limited number of aperture by front surface.Like this, solar energy backboard must design support and connection circuit, be connected with two electrodes (base stage and emitter) of battery, form circuit.Back contact solar battery conductive backings, by improving conventional backing plate, be embodied directly in by connecting circuit on solar energy backboard, the encapsulation of such back contact battery will be simpler.
Solar energy backboard mainly comprises weathering layer, structure enhancement layer and reflector three-decker, and the back board structure usually used at present has TPT structure and TPE structure, wherein T refers to the Tedlar film of E.I.Du Pont Company, composition is polyvinyl fluoride (PVF), P refers to PETG (PET) film, E refers to ethylene-vinyl acetate resin (EVA) film, therefore, TPT structure refers to PVF film/PET film/PVF membrane structure, and TPE structure refers to PVF film/PET film/eva film structure, bonding with adhesive between three-layer thin-film.Use in conventional backing plate and use fluorine plastic film as weathering layer, its ageing properties of resistance to long-term outdoor is excellent, but fluorine plastic film itself with high costs, can limit its more massive application.In addition, the ageing-resistant performance of fluorine plastic film excellence is its advantage, is also its shortcoming simultaneously.That is exactly when following solar components is scrapped, these material requires recycle, and corrosion-resistant, ageing-resistant performance that fluorine plastic film itself is excellent, prevent environment to the ability of its degradation treatment, and, form because solar energy backboard mostly is MULTILAYER COMPOSITE, because its layers of material is different, reclaim reprocessing difficulty.In future, fluoroplastics pollute more difficult than present white pollution.In addition, the PET film plastics of the structure enhancement layer use of conventional backing plate, its wet-heat resisting hydrolysis property is poor, brittlely can ftracture, cause deterioration or the inefficacy of solar cell properties in long-term hygrothermal environment uses.Conventional P ET backboard water vapor transmittance >2 gram/cc of sky, like this in solar components use procedure, its metal conducting layer of back-contact conductive backings is easy to be subject to vapour corrosion, cause short circuit even assembly scrap.Therefore, research and develop the back-contact conductive backings that a kind of cost is low, resistance to ag(e)ing is excellent, water vapor rejection performance is good, the generating efficiency of photovoltaic module can not only be increased, more can improve photovoltaic module useful life, the development of photovoltaic industry is now had great significance.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of back contact solar battery conductive backings.
The present invention is achieved through the following technical solutions:
A kind of back contact solar battery conductive backings, comprise the weathering layer, adhesive layer, structure enhancement layer, articulamentum, the metal conducting layer that set gradually, described weathering layer is that polyamide is made, and described structure enhancement layer is polypropylene or polypropylene alloy, and described metal conducting layer is Copper Foil.Add metal conducting layer, adopt back-contact, the illuminating area of photovoltaic module can be increased, improve generating efficiency.Adopt polypropylene alloy layer to make structure enhancement layer, replace the PET polyester of conventional backing plate, its hydrolysis, ageing-resistant performance are more excellent.Adopt polyamide to make weathering layer, replace the fluorine plastic film of conventional backing plate, possess excellent ageing-resistant performance, cost reduces, and can avoid fluoride pollution simultaneously.The water vapor transmittance <1 gram/cc sky of this patent backboard, is better than 2 grams/cc of skies of conventional backing plate, can protect metal conducting layer in the use of photovoltaic module not by moisture attacks, extend the useful life of photovoltaic module.
Further, described polyamide is one or more the combination be selected from following component: polyamide 6, polyamide 66, polyamide 46, polyamide 410, polyamide 610, polyamide 612, polyamide 6 14, polyamide 6 13, polyamide 6 15, polyamide 6 16, polyamide 11, polyamide 12, polyamide 10, polyamide 912, polyamide 913, polyamide 914, polyamide 915, polyamide 6 16, polyamide 1010, polyamide 1012, polyamide 1013, polyamide 1014, polyamide 1210, polyamide 1212, polyamide 1213, polyamide 1214, poly terephthalic acid adipamide, poly terephthalic acid nonanedioyl amine, poly terephthalic acid decanediamide, poly terephthalic acid 12 diamides, adipic acid adipamide/terephthalic acid (TPA) adipamide copolyamide, terephthalic acid (TPA) adipamide/M-phthalic acid adipamide copolyamide, poly-adipic acid meta-xylene acid amides, terephthalic acid (TPA) adipamide/terephthalic acid (TPA) 2-methyl glutaryl amine, adipic acid adipamide/terephthalic acid (TPA) adipamide/M-phthalic acid adipamide copolyamide, polycaprolactam-terephthalic acid (TPA) adipamide, described polypropylene alloy is the alloy of polypropylene or modified polypropene and engineering plastics, described engineering plastics are polyamide or polyphenylene oxide, described polypropylene is selected from one or more in HOPP, COPP and block copolymerization polypropylene.
Further, described articulamentum is ethene, esters of acrylic acid, the binary of glycidyl methacrylate three or terpolymer, or the polymer of the olefines of maleic anhydride graft.
As a kind of optimal way, between described structure enhancement layer and articulamentum, add adhesive layer.
Further, described adhesive layer is the polymer of the olefines of maleic anhydride graft, the polymer of the olefines of described maleic anhydride graft is one or more combination following: the ethylene-methyl acrylate copolymer of the copolymer of maleic anhydride grafted polyethylene, maleic anhydride and ethene, the ethylene-vinyl acetate copolymer of maleic anhydride graft, maleic anhydride graft, the ethylene-ethyl acrylate copolymer of maleic anhydride graft, the ethylene-butyl acrylate copolymer of maleic anhydride graft, the polypropylene of maleic anhydride graft.
Further, described adhesive layer and articulamentum respectively with POE elastomer blended modifier; Described POE elastomer is ethene, propylene, butylene, hexene, the binary of octene or multiple copolymer.
Further, described weathering layer, adhesive layer, structure enhancement layer and articulamentum all add heat stabilizer, antioxidant and inorganic filler, and described inorganic filler is selected from the one in calcium carbonate, titanium dioxide, barium sulfate, mica, talcum, kaolin, glass microballoon and glass fibre.
Further, described metal conducting layer needs by cutting or grind formation circuit.
Further, the thickness of described weathering layer is at 10-100 micron, and the thickness of described adhesive layer is at 10-100 micron, and the thickness of described structure enhancement layer is at 100-500 micron, the thickness of described articulamentum is at 10-100 micron, and the thickness of described metal conducting layer is at 10-100 micron.
As a kind of preferred version, the thickness of described weathering layer is at 20-50 micron, and the thickness of described adhesive layer is at 20-50 micron, and the thickness of described structure enhancement layer is 100-300 micron, the thickness of described articulamentum is at 20-50 micron, and the thickness of described metal conducting layer is at 20-50 micron.
Further, be expressed in same mould by described weathering layer, adhesive layer, structure enhancement layer, articulamentum plastic pellet respectively by extruder, metal level is compound on articulamentum while extruding, one-step shaping.
Compared with prior art, the invention has the beneficial effects as follows:
1. this patent additional metal conductive layer on solar energy backboard, and by cutting or grind formation circuit, adopt back-contact, the illuminating area of photovoltaic module can be increased, improve generating efficiency.
2. this patent structure enhancement layer is polypropylene alloy layer, and replace the PET polyester of conventional backing plate, its hydrolysis, ageing-resistant performance are more excellent.Conventional P ET backboard water vapor transmittance >2 gram/cc of sky, the block-water performance of this patent backboard is more excellent, water vapor transmittance <1 gram/cc sky, like this in solar components use procedure, metal conducting layer can not by vapour corrosion, cause short circuit even assembly scrap.
3. adopt polyamide to replace the fluorine plastic film of conventional backing plate, cost reduces, and can avoid fluoride pollution simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment 1.
Fig. 2 is the structural representation of embodiment 2.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described:
Embodiment 1
As shown in Figure 1, back contact solar battery conductive backings, by the weathering layer 1 of compound successively, adhesive layer 2, structure enhancement layer 3, articulamentum 4, metal conducting layer 5 forms.
Weathering layer 1 is made up of polyamide (PA), stabilizer, antioxidant and inorganic material, is specially 100 weight portion PA12,0.3 weight portion Irganox 245 and 3 weight portion TiO
2blended, through extruder granulation.Wherein, the heat stabilizer produced for BASF joint-stock company of Irganox 245.
Adhesive layer 2 is 80 parts by weight maleic anhydride grafted polyethylenes, 20 parts by weight of ethylene-methyl acrylate copolymer, 0.3 weight portion Irganox B225 is blended forms.Wherein, Irganox B225 is the heat stabilizer that BASF joint-stock company produces.
Structure enhancement layer 3 is made up of modified polypropene.Modified polypropene is then formed by HOPP (homopolymerization PP) and heat stabilizer blending and modifying, is specially 100 parts of homopolymerization PP, 10 parts of polyphenylene oxide PPO and 0.3 part of Irganox B225 are blended, through extruder granulation.
Articulamentum 4 is 80 parts of maleic anhydride grafted polyethylenes, 20 parts of ethylene-methyl acrylate copolymers, 0.3 part of Irganox B225 are blended forms.
Above four layer materials are by multilayer extrusion machine melting co-extrusion, and composition metal conductive layer on articulamentum 4 simultaneously, thickness is the Copper Foil of 25 microns, and forms circuit by cutting.Five layer thicknesses are respectively 30/20/250/50/25 micron, the back contact solar battery conductive backings gross thickness 375 microns made thus.The interlaminar strength of Copper Foil is the interlaminar strength of the Copper Foil after 11.6N/cm, Damp-Heat 1000 hours aging (85 DEG C, 85% humidity) is 9.8N/cm.Wherein, peel strength test (180 degree, 0.2m/min peeling rate) normative reference is ASTM D1876, Damp-Heat hydrothermal aging (85 DEG C, 85% humidity, 1000h) normative reference is IEC61215.
Embodiment 2
As shown in Figure 2, a kind of back contact solar battery conductive backings, by the weathering layer 1 of compound successively, adhesive layer 2, structure enhancement layer 3, adhesive layer 6, articulamentum 4, metal conducting layer 5 forms.
Weathering layer 1 is made up of polyamide (PA), stabilizer, antioxidant and inorganic material, is specially 100 parts of PA12,0.3 part of Irganox-245 and 3 part TiO
2blended, through extruder granulation.
Adhesive layer 2, adhesive layer 6 are 100 parts of maleic anhydride inoculated polypropylenes, 0.3 part of Irganox B225 is blended forms.
Structure enhancement layer 3 is made up of modified polypropene.Modified polypropene is then formed by HOPP (homopolymerization PP) and heat stabilizer blending and modifying, is specially 100 parts of homopolymerization PP, 10 parts of polyphenylene oxide PPO and 0.3 part of Irganox B225 are blended, through extruder granulation.
Articulamentum 4 is 40 parts of ethylene copolymers containing epoxide group
pTW, 60 parts of LLDPE, 0.3 part of Irganox B225 is blended forms, wherein
pTW is that Dupont Chemical Group (China) Co., Ltd produces.
Above five layer materials are by multilayer extrusion machine melting co-extrusion, and composition metal conductive layer on articulamentum 4 simultaneously, thickness is the Copper Foil of 25 microns, and forms circuit by cutting.Six layer thicknesses are respectively 30/20/250/20/50/25 micron, the back contact solar battery conductive backings gross thickness 395 microns made thus.The interlaminar strength of Copper Foil is the interlaminar strength of the Copper Foil after 13.2N/cm, Damp-Heat 1000 hours aging (85 DEG C, 85% humidity) is 11.4N/cm.
All simple distortion of making when not departing from core of the present invention or amendment all fall into protection scope of the present invention.
Claims (10)
1. a back contact solar battery conductive backings, comprise the weathering layer, adhesive layer, structure enhancement layer, articulamentum, the metal conducting layer that set gradually, it is characterized in that, described weathering layer is that polyamide is made, described structure enhancement layer is polypropylene or polypropylene alloy, and described metal conducting layer is Copper Foil.
2. a kind of back contact solar battery conductive backings according to claim 1, is characterized in that, described polyamide is one or more the combination be selected from following component: polyamide 6, polyamide 66, polyamide 46, polyamide 410, polyamide 610, polyamide 612, polyamide 6 14, polyamide 6 13, polyamide 6 15, polyamide 6 16, polyamide 11, polyamide 12, polyamide 10, polyamide 912, polyamide 913, polyamide 914, polyamide 915, polyamide 6 16, polyamide 1010, polyamide 1012, polyamide 1013, polyamide 1014, polyamide 1210, polyamide 1212, polyamide 1213, polyamide 1214, poly terephthalic acid adipamide, poly terephthalic acid nonanedioyl amine, poly terephthalic acid decanediamide, poly terephthalic acid 12 diamides, adipic acid adipamide/terephthalic acid (TPA) adipamide copolyamide, terephthalic acid (TPA) adipamide/M-phthalic acid adipamide copolyamide, poly-adipic acid meta-xylene acid amides, terephthalic acid (TPA) adipamide/terephthalic acid (TPA) 2-methyl glutaryl amine, adipic acid adipamide/terephthalic acid (TPA) adipamide/M-phthalic acid adipamide copolyamide, polycaprolactam-terephthalic acid (TPA) adipamide, described polypropylene alloy is the alloy of polypropylene or modified polypropene and engineering plastics, described engineering plastics are polyamide or polyphenylene oxide, described polypropylene is selected from one or more in HOPP, COPP and block copolymerization polypropylene.
3. a kind of back contact solar battery conductive backings according to claim 1, it is characterized in that, described articulamentum is ethene, esters of acrylic acid, the binary of glycidyl methacrylate three or terpolymer, or the polymer of the olefines of maleic anhydride graft.
4. a kind of back contact solar battery conductive backings according to claim 3, is characterized in that, adds adhesive layer between described structure enhancement layer and articulamentum.
5. a kind of back contact solar battery conductive backings according to any one of claim 1-4, it is characterized in that, described adhesive layer is the polymer of the olefines of maleic anhydride graft, the polymer of the olefines of described maleic anhydride graft is one or more combination following: maleic anhydride grafted polyethylene, the copolymer of maleic anhydride and ethene, the ethylene-vinyl acetate copolymer of maleic anhydride graft, the ethylene-methyl acrylate copolymer of maleic anhydride graft, the ethylene-ethyl acrylate copolymer of maleic anhydride graft, the ethylene-butyl acrylate copolymer of maleic anhydride graft, maleic anhydride inoculated polypropylene.
6. a kind of back contact solar battery conductive backings according to claim 5, is characterized in that, described adhesive layer and articulamentum respectively with POE elastomer blended modifier; Described POE elastomer is ethene, propylene, butylene, hexene, the binary of octene or multiple copolymer.
7. a kind of back contact solar battery conductive backings according to claim 5, it is characterized in that, described weathering layer, adhesive layer, structure enhancement layer and articulamentum all add heat stabilizer, antioxidant and inorganic filler, and described inorganic filler is selected from the one in calcium carbonate, titanium dioxide, barium sulfate, mica, talcum, kaolin, glass microballoon and glass fibre.
8. a kind of back contact solar battery conductive backings according to any one of claim 1-4, is characterized in that, described metal conducting layer needs by cutting or grind formation circuit.
9. a kind of back contact solar battery conductive backings according to any one of claim 1-4, it is characterized in that, the thickness of described weathering layer is at 10-100 micron, the thickness of described adhesive layer is at 10-100 micron, the thickness of described structure enhancement layer is at 100-500 micron, the thickness of described articulamentum is at 10-100 micron, and the thickness of described metal conducting layer is at 10-100 micron.
10. a kind of back contact solar battery conductive backings according to any one of claim 1-4, it is characterized in that, described weathering layer, adhesive layer, structure enhancement layer, articulamentum plastic pellet are expressed in same mould respectively by extruder, metal level is compound on articulamentum while extruding, one-step shaping.
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WO2017049798A1 (en) * | 2015-09-23 | 2017-03-30 | 苏州腾晖光伏技术有限公司 | Pid-resistant and wind sand resistant crystalline silicon solar cell assembly |
CN115725247A (en) * | 2022-11-03 | 2023-03-03 | 江苏东鋆光伏科技有限公司 | Conductive backboard for photovoltaic module and preparation method thereof |
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WO2019205494A1 (en) * | 2018-04-27 | 2019-10-31 | 北京铂阳顶荣光伏科技有限公司 | Conductive electrode membrane layer and photovoltaic element |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202434550U (en) * | 2012-02-17 | 2012-09-12 | 常熟市冠日新材料有限公司 | Backboard of MWT (metal wrap through) solar cell |
CN103715287A (en) * | 2014-01-08 | 2014-04-09 | 苏州尚善新材料科技有限公司 | Humidity-resistant and heat-resistant solar cell panel and manufacturing method thereof |
CN203567286U (en) * | 2013-09-18 | 2014-04-30 | 东莞市群跃电子材料科技有限公司 | Metal perforated rear panel for solar cell |
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CN102709359B (en) * | 2012-05-08 | 2014-11-26 | 常州天合光能有限公司 | Composite conductive rear panel of solar cell assembly and preparation and usage methods thereof |
CN202678369U (en) * | 2012-07-17 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Solar backplane of back contact solar cell |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202434550U (en) * | 2012-02-17 | 2012-09-12 | 常熟市冠日新材料有限公司 | Backboard of MWT (metal wrap through) solar cell |
CN203567286U (en) * | 2013-09-18 | 2014-04-30 | 东莞市群跃电子材料科技有限公司 | Metal perforated rear panel for solar cell |
CN103715287A (en) * | 2014-01-08 | 2014-04-09 | 苏州尚善新材料科技有限公司 | Humidity-resistant and heat-resistant solar cell panel and manufacturing method thereof |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017049798A1 (en) * | 2015-09-23 | 2017-03-30 | 苏州腾晖光伏技术有限公司 | Pid-resistant and wind sand resistant crystalline silicon solar cell assembly |
CN115725247A (en) * | 2022-11-03 | 2023-03-03 | 江苏东鋆光伏科技有限公司 | Conductive backboard for photovoltaic module and preparation method thereof |
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Address after: High tech Zone Suzhou city Jiangsu province 215151 Jianlin Road No. 666 Applicant after: DSM shangshasn solar technology (Suzhou) Co., Ltd. Address before: High tech Zone Suzhou city Jiangsu province 215151 Jianlin Road No. 666 Applicant before: Suzhou Shangshan New Material Technology Co., Ltd. |
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Application publication date: 20150204 |