TW201505195A - Back-contact solar battery module - Google Patents
Back-contact solar battery module Download PDFInfo
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- TW201505195A TW201505195A TW103117604A TW103117604A TW201505195A TW 201505195 A TW201505195 A TW 201505195A TW 103117604 A TW103117604 A TW 103117604A TW 103117604 A TW103117604 A TW 103117604A TW 201505195 A TW201505195 A TW 201505195A
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 48
- 230000002093 peripheral effect Effects 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000003566 sealing material Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 168
- 239000000049 pigment Substances 0.000 claims description 58
- -1 polyethylene terephthalate Polymers 0.000 claims description 50
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 41
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 41
- 239000012790 adhesive layer Substances 0.000 claims description 35
- 239000012463 white pigment Substances 0.000 claims description 19
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 18
- 239000006229 carbon black Substances 0.000 claims description 18
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 15
- 229910000349 titanium oxysulfate Inorganic materials 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 238000001914 filtration Methods 0.000 claims description 7
- 239000003086 colorant Substances 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 61
- 229920005989 resin Polymers 0.000 description 51
- 239000011347 resin Substances 0.000 description 51
- 239000000853 adhesive Substances 0.000 description 41
- 230000001070 adhesive effect Effects 0.000 description 41
- 239000000463 material Substances 0.000 description 38
- 238000000034 method Methods 0.000 description 24
- 238000004519 manufacturing process Methods 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 238000002156 mixing Methods 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 16
- 239000005022 packaging material Substances 0.000 description 14
- 229910052782 aluminium Inorganic materials 0.000 description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- 238000004040 coloring Methods 0.000 description 13
- 239000005038 ethylene vinyl acetate Substances 0.000 description 13
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 13
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 12
- 239000011521 glass Substances 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 11
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 10
- 239000008393 encapsulating agent Substances 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 9
- 238000001125 extrusion Methods 0.000 description 9
- 239000004840 adhesive resin Substances 0.000 description 8
- 229920006223 adhesive resin Polymers 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000009820 dry lamination Methods 0.000 description 8
- 238000009413 insulation Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- 238000003475 lamination Methods 0.000 description 7
- 238000000059 patterning Methods 0.000 description 7
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229920006228 ethylene acrylate copolymer Polymers 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000002033 PVDF binder Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 5
- 238000010248 power generation Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 3
- 229920002620 polyvinyl fluoride Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 229910052809 inorganic oxide Inorganic materials 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 229920001179 medium density polyethylene Polymers 0.000 description 2
- 239000004701 medium-density polyethylene Substances 0.000 description 2
- 239000012860 organic pigment Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000005070 ripening Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- UPZFLZYXYGBAPL-UHFFFAOYSA-N 2-ethyl-2-methyl-1,3-dioxolane Chemical compound CCC1(C)OCCO1 UPZFLZYXYGBAPL-UHFFFAOYSA-N 0.000 description 1
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 206010049976 Impatience Diseases 0.000 description 1
- 229920003298 Nucrel® Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000004904 UV filter Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Photovoltaic Devices (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本發明係關於一種後觸點型太陽能電池模組。尤其係關於一種構成太陽能電池模組之附電路的背光片。 The present invention relates to a rear contact type solar cell module. In particular, it relates to a backlight sheet constituting an attached circuit of a solar cell module.
本專利申請案係根據在2013年5月21日於日本提出申請的特願2013-106987號、及2013年6月12日於日本提出申請的特願2013-123733號而主張優先權,於此援用其內容。 The present application claims priority based on Japanese Patent Application No. 2013-106987, filed on May 21, 2013 in Japan, and Japanese Patent Application No. 2013-123733, filed on Jun. Use its content.
近年來,利用天然能量之發電系統的太陽能發電之普及正急速進展中。用以進行太陽能發電之太陽能電池模組係鄰接複數之太陽能電池而配置,電性連接各太陽能電池單元而取出電力。一旦電性連接如此之太陽能電池單元彼此之佈線露出受光面側時,受光面積將會減少。因此,採用如下之後觸點型連接構造:在與太陽能電池單元受光面之相反側表面形成連接電極,在用以佈線該連接電極之電路片上,使連接材介於中間而連接。作為連接材,例如使用焊錫或銀糊等。用於如此之後觸點型太陽能電池模組的電路片,係於佈線時,以使連接材不進入所鄰接的電路上的方式來阻止連接材之移動的同時,同時設置絕緣電路間之絕緣層。 In recent years, the spread of solar power generation using natural energy power generation systems is rapidly progressing. The solar cell module for solar power generation is disposed adjacent to a plurality of solar cells, and electrically connected to each solar cell unit to take out electric power. When the wiring of the solar cell units electrically connected to each other is exposed to the light receiving surface side, the light receiving area is reduced. Therefore, a post-contact type connection structure is adopted in which a connection electrode is formed on the surface opposite to the light-receiving surface of the solar cell, and the connection material is interposed and connected to the circuit piece for wiring the connection electrode. As the connecting material, for example, solder or silver paste or the like is used. The circuit piece for the contact type solar cell module is used to prevent the movement of the connecting material while the connecting material does not enter the adjacent circuit, and at the same time, the insulating layer between the insulating circuits is provided. .
例如,在第5A圖至第5E圖顯示一般之後觸點型太陽能電池模組170的層構造之一例。第5A圖係從受光側(表面)起依序積層有透明基材11、透明封裝材12、太陽電池單元(後觸點單元)13、封裝材14、絕緣層110、電路片15、背光片16的太陽能電池模組170的層構造。以連接材19之黏著劑或銀糊電性連接太陽電池單元13之背面的連接電極18、與金屬層經圖案化的電路120而取出電力。電路片15係使接著層112介於中間而貼合金屬層與片基材者,使金屬層圖案化而形成連接電路120與電路間之佈線部121。又,在電路片15之背面,使接著層112介於中間而積層背光片16。 For example, an example of the layer structure of the general after-contact solar cell module 170 is shown in FIGS. 5A to 5E. 5A is a transparent substrate 11 , a transparent encapsulant 12 , a solar cell unit (rear contact unit) 13 , a package material 14 , an insulating layer 110 , a circuit sheet 15 , and a backlight sheet which are sequentially laminated from the light receiving side (surface). The layer structure of the solar cell module 170 of 16. The connection electrode 18 of the back surface of the solar cell unit 13 and the circuit 120 patterned with the metal layer are electrically connected by an adhesive or a silver paste of the connecting material 19 to extract electric power. In the circuit sheet 15, the metal layer and the sheet substrate are bonded to each other with the adhesive layer 112 interposed therebetween, and the metal layer is patterned to form the wiring portion 121 between the connection circuit 120 and the circuit. Further, on the back surface of the circuit board 15, the backlight layer 16 is laminated with the adhesive layer 112 interposed therebetween.
又,第5D圖係從受光側(表面)起依序積層有透明基材21、透明封裝材22、太陽電池單元(後觸點單元)23、封裝材24、電絕緣層29、電路片25、背光片26的模組,以連接材28之黏著劑或銀糊電性連接太陽電池單元23之背面的連接電極27、與金屬層經圖案化的電路211而取出電力。電路片25係使接著劑221介於中間而貼合金屬層與片基材214者,使金屬層圖案化而形成電路211。又,在電路片25之背面,使接著層221介於中間而積層背光片26。 Further, in the fifth drawing, the transparent substrate 21, the transparent package 22, the solar cell unit (back contact unit) 23, the package member 24, the electrically insulating layer 29, and the circuit sheet 25 are sequentially laminated from the light receiving side (surface). The module of the backlight sheet 26 is electrically connected to the connection electrode 27 on the back surface of the solar cell unit 23 by an adhesive or silver paste of the connection material 28, and the circuit 211 patterned by the metal layer. The circuit board 25 is formed by bonding the metal layer and the sheet substrate 214 with the adhesive 221 interposed therebetween, and patterning the metal layer to form the circuit 211. Further, on the back surface of the circuit board 25, the backlight layer 26 is laminated with the adhesive layer 221 interposed therebetween.
最近,正進行減低上述型式的太陽能電池模組生產成本之研發。例如顯示於第5B圖,已研發一種附電路之背光片17,其係使電路片15與背光片16一體化。例如,已研發一種附電路之背光片17,其係在作為背光片16之聚對苯二甲酸乙二酯薄膜或聚萘二甲酸乙二酯 薄膜上,使接著層介於中間而使銅箔或鋁箔等之金屬層貼合,使金屬層圖案化而形成電路120與連接電路間之佈線部121。絕緣層110係去除以連接材19連接連接電極18與電路120的部分所形成。第5C圖係顯示利用鋁框124所補強的後觸點型太陽能電池模組180。複數連接的太陽電池單元13,為了取出所產生的電力,連接導線122而向太陽能電池模組180外側之端子盒123連接。絕緣層110係去除以連接材19連接連接電極18與電路120的部分所形成。 Recently, research and development is being carried out to reduce the production cost of the above-mentioned type of solar cell module. For example, as shown in FIG. 5B, a circuit-backed backlight sheet 17 has been developed which integrates the circuit board 15 with the backlight sheet 16. For example, a circuit-backed backlight sheet 17 has been developed which is a polyethylene terephthalate film or polyethylene naphthalate as the backlight sheet 16. On the film, a metal layer such as a copper foil or an aluminum foil is bonded to the intermediate layer, and the metal layer is patterned to form a wiring portion 121 between the circuit 120 and the connection circuit. The insulating layer 110 is formed by removing a portion where the connecting member 19 connects the connection electrode 18 and the circuit 120. Fig. 5C shows a rear contact type solar cell module 180 reinforced by an aluminum frame 124. In order to take out the generated electric power, the plurality of connected solar battery cells 13 are connected to the terminal box 123 outside the solar battery module 180 by connecting the wires 122. The insulating layer 110 is formed by removing a portion where the connecting member 19 connects the connection electrode 18 and the circuit 120.
又,例如顯示於第5E圖,已研發一種使電路片25與背光片26一體化的附電路之背光片212。例如,已研發一種附電路之背光片212,其係在作為背光片26之聚對苯二甲酸乙二酯薄膜或聚萘二甲酸乙二酯薄膜上,使接著層221介於中間而使銅箔或鋁箔等之金屬層貼合,使金屬層圖案化而形成電路211。 Further, for example, as shown in FIG. 5E, a circuit-backed backlight sheet 212 in which the circuit board 25 and the backlight sheet 26 are integrated has been developed. For example, a circuit-backed backlight sheet 212 has been developed which is formed on a polyethylene terephthalate film or a polyethylene naphthalate film as the backlight sheet 26 with the adhesive layer 221 interposed therebetween to make copper A metal layer such as a foil or an aluminum foil is bonded to each other to pattern the metal layer to form a circuit 211.
絕緣層29、110係由所謂焊錫電阻之材料所形成,由於該材料價格昂貴,成為太陽能電池模組之生產成本高的主要原因。期望使用盡可能少的材料。還有,於絕緣層之形成中,於印刷後使其熱硬化或藉紫外線所造成的硬化步驟成為必要。尤其,熱硬化通常在100至160℃下經歷10至60分鐘。一般而言,為了以20至30μm之厚度形成,採用以網板印刷形成,且藉熱處理或紫外線照射而使其硬化之方法。由於絕緣層為價格昂貴、網板印刷之生產性為低廉等而生產成本變高,因此已研發減低焊錫光阻之用量、或省略焊錫光阻而使封裝材14、24具有絕緣功能者。 The insulating layers 29 and 110 are formed of a material of a so-called solder resistor, and since the material is expensive, it is a main cause of high production cost of the solar cell module. It is desirable to use as little material as possible. Further, in the formation of the insulating layer, it is necessary to thermally harden or to cure by ultraviolet rays after printing. In particular, thermal hardening typically takes 10 to 60 minutes at 100 to 160 °C. In general, in order to form a thickness of 20 to 30 μm, a method of forming by screen printing and hardening it by heat treatment or ultraviolet irradiation is employed. Since the insulating layer is expensive, the productivity of screen printing is low, and the production cost is high, it has been developed to reduce the amount of solder resist or to omit the solder resist to make the package materials 14, 24 have an insulating function.
又,由於焊錫光阻經著色,具有藉焊錫光阻吸收紫外線而防止背光片--例如聚對苯二甲酸乙二酯薄膜脆化之效果。因此,雖然藉由省略焊錫光阻、使封裝材具有絕緣功能而能減低生產成本,相反地,將會發生聚對苯二甲酸乙二酯薄膜脆化之問題。 Further, since the solder resist is colored, it absorbs ultraviolet rays by the solder resist to prevent embrittlement of the backlight sheet, for example, a polyethylene terephthalate film. Therefore, although the solder resist is omitted and the package material has an insulating function, the production cost can be reduced, and conversely, the problem of embrittlement of the polyethylene terephthalate film occurs.
也考慮於封裝材14、24中摻合濾除紫外線之著色劑,例如碳黑等之黑色顏料,氧化鈦、硫酸鋇等之白色顏料,但該等顏料會在封裝材--例如乙烯-乙酸乙烯酯共聚物(EVA)樹脂中移動(遷移),而有進一步移動至受光面側之透明封裝材而妨礙受光、使發電效率降低之虞。 It is also considered to incorporate a UV-filtering coloring agent in the packaging materials 14, 24, such as a black pigment such as carbon black, a white pigment such as titanium oxide or barium sulfate, but the pigments may be in a packaging material such as ethylene-acetic acid. When the vinyl ester copolymer (EVA) resin moves (migrates), it moves to the transparent sealing material on the light-receiving surface side, thereby hindering light reception and lowering power generation efficiency.
又,背光片必須具優越之機械特性,且具備耐候性、耐熱性、耐濕性及耐水解性等之各種特性。作為如此之背光片,期望具有可承受長期使用,亦即承受耐用年數(約20年)之屋外曝露的耐候性,可舉出氟系樹脂薄膜或具有耐候性之聚對苯二甲酸乙二酯薄膜等。 Further, the backlight sheet must have excellent mechanical properties and have various properties such as weather resistance, heat resistance, moisture resistance, and hydrolysis resistance. As such a backlight sheet, it is desirable to have weather resistance for outdoor exposure which can withstand long-term use, that is, durability (about 20 years), and a fluorine-based resin film or a polyethylene terephthalate having weather resistance can be cited. Ester film and the like.
但是,雖然氟系樹脂薄膜係具有耐候性,但有材料成本高之問題。另一方面,雖然聚對苯二甲酸乙二酯薄膜之價格較為低廉,但耐熱性或耐候性稱不上足夠。尤其使提高耐候性之要求變高。 However, although the fluorine-based resin film has weather resistance, there is a problem that the material cost is high. On the other hand, although the price of the polyethylene terephthalate film is relatively low, heat resistance or weather resistance is not sufficient. In particular, the requirement for improving weather resistance is increased.
有賦予聚對苯二甲酸乙二酯薄膜耐候性之提案。例如,有在聚對苯二甲酸乙二酯薄膜中含有紫外線吸收劑之提案(專利文獻1);使用含有二氧化鈦之白色聚對苯二甲酸乙二酯薄膜而減低紫外線穿透率之提案(專利文獻2);在含有紫外線吸收劑之聚對苯二甲酸乙二酯薄膜表面設置水蒸氣阻障層之提案(專利文獻3)等。 There is a proposal to impart weather resistance to a polyethylene terephthalate film. For example, there is a proposal to contain an ultraviolet absorber in a polyethylene terephthalate film (Patent Document 1); a proposal to reduce ultraviolet transmittance by using a white polyethylene terephthalate film containing titanium dioxide (patent) Document 2); a proposal to provide a water vapor barrier layer on the surface of a polyethylene terephthalate film containing a UV absorber (Patent Document 3).
但是,於聚對苯二甲酸乙二酯薄膜中含有紫外線吸收劑者係有生產成本變高、與金屬層之接著性降低等之問題。又,含有二氧化鈦之聚對苯二甲酸乙二酯薄膜同樣有生產成本變高之問題。又,在含有紫外線吸收劑之薄膜表面中設置水蒸氣阻障層者,有因紫外線吸收劑之遷移而降低與水蒸氣阻障層之接著性的憂慮。 However, the ultraviolet absorber containing the polyethylene terephthalate film has a problem that the production cost is high and the adhesion to the metal layer is lowered. Further, the polyethylene terephthalate film containing titanium dioxide also has a problem of high production cost. Further, in the case where a water vapor barrier layer is provided on the surface of the film containing the ultraviolet absorber, there is a concern that the adhesion to the water vapor barrier layer is lowered by the migration of the ultraviolet absorber.
從上述,期望一種後觸點型太陽能電池模組,其使生產成本減低,且背光片不會脆化。 From the above, a rear contact type solar cell module is desired which reduces the production cost and the backlight sheet does not become brittle.
專利文獻1 日本特開2009-188105號公報 Patent Document 1 Japanese Patent Laid-Open Publication No. 2009-188105
專利文獻2 日本特開2006-270025號公報 Patent Document 2 Japanese Patent Laid-Open Publication No. 2006-270025
專利文獻3 日本特開2006-261189號公報 Patent Document 3 Japanese Patent Laid-Open Publication No. 2006-261189
本發明係欲解決上述問題者,目的在於提供一種後觸點型太陽能電池模組,其減少絕緣層中所使用的材料,使生產成本減低,且背光片不會脆化。 The present invention has been made in an effort to solve the above problems, and an object of the invention is to provide a rear contact type solar cell module which reduces the material used in the insulating layer, reduces the production cost, and does not embrittle the backlight.
又,本發明之目的在於提供一種後觸點型太陽能電池模組,其係在省略絕緣層,亦即在省略焊錫光阻之構造中,具有生產性,且背光片不會脆化。 Further, an object of the present invention is to provide a rear contact type solar cell module which is industrially omitted in the structure in which the solder resist is omitted, and the backlight sheet is not embrittled.
有關本發明之第一形態的後觸點型太陽能電池模組,其係具有依序所積層的透明基材、透明密封材、 太陽能電池單元、密封材、與附電路之背光片;該附電路之背光片係由積層有已摻合具有紫外線濾除性之顏料的著色絕緣層、圖案化金屬層而成之電路與連接該電路間的佈線部、與背光片的積層體所形成;該著色絕緣層係形成於該附電路之背光片外圍邊緣的非佈線部。 A back contact type solar cell module according to a first aspect of the present invention includes a transparent substrate and a transparent sealing material which are sequentially laminated. a solar cell unit, a sealing material, and a backlight sheet with a circuit; the backlight of the circuit is a circuit formed by laminating a colored insulating layer and a patterned metal layer which have been blended with a UV-filtering pigment; The wiring portion between the circuits and the laminate of the backlight sheet are formed; and the colored insulating layer is formed on the non-wiring portion of the peripheral edge of the backlight of the circuit.
在有關本發明之第一形態之後觸點型太陽能電池模組中,於該著色絕緣層中已摻合包含碳黑或鈦黑之黑色顏料,相對於該著色絕緣層之重量而言,該黑色顏料之摻合比例亦可為1至4重量%。 In the contact type solar cell module after the first aspect of the present invention, a black pigment containing carbon black or titanium black has been blended in the colored insulating layer, the black being relative to the weight of the colored insulating layer The blending ratio of the pigment may also be from 1 to 4% by weight.
在有關本發明之第一形態之後觸點型太陽能電池模組中,於該著色絕緣層中已摻合包含氧化鈦或硫酸鋇之白色顏料,相對於該著色絕緣層之重量而言,該白色顏料之摻合比例亦可為5至15重量%。 In the contact type solar cell module after the first aspect of the present invention, a white pigment containing titanium oxide or barium sulfate has been blended in the colored insulating layer, the white color relative to the weight of the colored insulating layer The blending ratio of the pigment may also be 5 to 15% by weight.
在有關本發明之第一形態之後觸點型太陽能電池模組中,該背光片亦可由聚對苯二甲酸乙二酯薄膜所形成。 In the contact type solar cell module after the first aspect of the invention, the backlight sheet may also be formed of a polyethylene terephthalate film.
有關本發明之第二形態的後觸點型太陽能電池模組,其係具有依序所積層的透明基材、透明密封材、太陽能電池單元、密封材、與附電路之背光片;該附電路之背光片係由積層有金屬層、已摻合具有紫外線濾除性之顏料的著色接著層、與背光片所形成;圖案化該金屬層而形成電路。 A rear contact type solar cell module according to a second aspect of the present invention includes a transparent substrate, a transparent sealing material, a solar cell unit, a sealing material, and a backlight sheet with a circuit laminated in sequence; the attached circuit The backlight sheet is formed of a colored adhesive layer in which a metal layer, a pigment having ultraviolet ray-removing pigment has been laminated, and a backlight sheet; and the metal layer is patterned to form an electric circuit.
在有關本發明之第二形態之後觸點型太陽能電池模組中,於該著色接著層中已摻合包含碳黑或鈦黑之黑色顏料,相對於該著色接著層之重量而言,該黑色顏料之摻合比例亦可為1至4重量%。 In the contact type solar cell module after the second aspect of the present invention, a black pigment containing carbon black or titanium black has been blended in the colored adhesive layer, the black color relative to the weight of the colored adhesive layer The blending ratio of the pigment may also be from 1 to 4% by weight.
在有關本發明之第二形態之後觸點型太陽能電池模組中,於該著色接著層中已摻合包含氧化鈦或硫酸鋇之白色顏料,相對於該著色接著層之重量而言,該白色顏料之摻合比例亦可為5至15重量%。 In the contact type solar cell module after the second aspect of the present invention, a white pigment containing titanium oxide or barium sulfate has been blended in the colored adhesive layer, the white color relative to the weight of the colored adhesive layer The blending ratio of the pigment may also be 5 to 15% by weight.
在有關本發明之第二形態之後觸點型太陽能電池模組中,該背光片亦可由聚對苯二甲酸乙二酯薄膜所形成。 In the contact type solar cell module after the second aspect of the present invention, the backlight sheet may also be formed of a polyethylene terephthalate film.
若根據本發明之第一形態之後觸點型太陽能電池模組,由於在背光片外圍邊緣之非佈線部形成附電路之背光片的著色絕緣層,能防止因紫外線所造成的背光片脆化。又,由於能減少使用於絕緣層之絕緣樹脂,故能使生產成本減低。 According to the contact type solar cell module of the first aspect of the present invention, since the colored insulating layer of the backlight sheet with the circuit is formed on the non-wiring portion at the peripheral edge of the backlight sheet, the backlight sheet can be prevented from being embrittled by the ultraviolet ray. Further, since the insulating resin used for the insulating layer can be reduced, the production cost can be reduced.
若根據本發明之第一形態,由於附電路之背光片係由積層有已摻合具有紫外線濾除性之顏料的著色絕緣層、圖案化金屬層而成之電路與連接該電路間的佈線部、與背光片的積層體所形成,且著色絕緣層係由在背光片外圍邊緣之非佈線部所形成而成,能防止背光片外圍邊緣之非佈線部的脆化。在連接背光片上之電路或電路間之佈線部,由於具有金屬層,因而濾除紫外線、背光片之脆化不會發生,藉由在外圍邊緣之非佈線部形成著色絕緣層而能防止背光片之脆化。 According to the first aspect of the present invention, the backlight of the circuit is formed by a circuit in which a colored insulating layer having a pigment having ultraviolet ray-removing pigment, a patterned metal layer, and a wiring portion connecting the circuits are laminated. The laminated body is formed of a laminate of the backlight sheet, and the colored insulating layer is formed of a non-wiring portion on the peripheral edge of the backlight sheet, and the non-wiring portion of the peripheral edge of the backlight sheet can be prevented from being embrittled. In the wiring portion connecting the circuit or the circuit on the backlight sheet, since the metal layer is provided, ultraviolet rays are removed, and embrittlement of the backlight sheet does not occur, and the backlight sheet can be prevented by forming a colored insulating layer on the non-wiring portion of the peripheral edge. Embossed.
又,藉由僅在背光片外圍邊緣之非佈線部形成著色絕緣層而能減少使用於絕緣層之絕緣樹脂,故能謀求生產成本之減低。 Further, since the colored insulating layer is formed only on the non-wiring portion on the peripheral edge of the backlight sheet, the insulating resin used for the insulating layer can be reduced, so that the production cost can be reduced.
又,若根據本發明之第一形態,著色絕緣層已摻合包含碳黑或鈦黑之黑色顏料,藉由相對於該著色絕緣層之重量而言,該黑色顏料之摻合比例為1至4重量%,能效率佳地吸收紫外線而加以濾除。 Further, according to the first aspect of the present invention, the colored insulating layer has been blended with a black pigment containing carbon black or titanium black, and the blending ratio of the black pigment is 1 to the weight of the colored insulating layer. 4% by weight, it can absorb ultraviolet rays efficiently and filter it out.
又,若根據本發明之第一形態,著色絕緣層已摻合包含氧化鈦或硫酸鋇之白色顏料,藉由相對於該著色絕緣層之重量而言,該白色顏料之摻合比例為5至15重量%,能效率佳地使紫外線反射而加以濾除。 Further, according to the first aspect of the present invention, the colored insulating layer has been blended with a white pigment containing titanium oxide or barium sulfate, and the blending ratio of the white pigment is 5 to 5 by weight with respect to the weight of the colored insulating layer. 15% by weight, the ultraviolet rays can be efficiently reflected and filtered.
又,若根據本發明之第一形態,藉由背光片係由聚對苯二甲酸乙二酯構成,為價格較低廉的材料,能減低生產成本。 Further, according to the first aspect of the present invention, since the backlight sheet is made of polyethylene terephthalate, it is a relatively inexpensive material, and the production cost can be reduced.
若根據本發明之第二形態,由於附電路之背光片係由積層有金屬層、已摻合具有紫外線濾除性之顏料的著色接著層與背光片之積層體構成,使金屬層圖案化而形成電路的同時,也在背光片積層有著色接著層,為能防止背光片之脆化者。 According to the second aspect of the present invention, since the backlight sheet with the circuit is composed of a laminated body in which a metal layer, a colored adhesive layer having a pigment having ultraviolet absorbing property and a backlight sheet are laminated, the metal layer is patterned. At the same time as the formation of the circuit, a colored adhesive layer is also laminated on the backlight sheet to prevent embrittlement of the backlight sheet.
若根據本發明之第二形態,由積層有金屬層、已摻合具有紫外線濾除性之顏料的著色接著層與背光片之積層體構成,使金屬層圖案化而作成電路。於所形成的附電路之背光片中,由於著色接著層係積層於背光片上,故能賦予背光片耐候性,而能防止脆化。 According to the second aspect of the present invention, a layered body in which a metal layer is laminated and a pigmented back layer having a pigment having ultraviolet absorbing property is mixed with a backlight sheet is formed, and the metal layer is patterned to form an electric circuit. In the formed backlight of the circuit, since the colored adhesive layer is laminated on the backlight, it is possible to impart weather resistance to the backlight and prevent embrittlement.
著色接著層中所含之具有紫外線濾除性之顏料不會向封裝材移動,也不會對與封裝材之接著性帶來不良的影響。 The pigment having ultraviolet ray absorbing property contained in the colored back layer does not move to the package material, and does not adversely affect the adhesion to the package material.
若根據本發明之第二形態,著色接著層係摻合包含碳黑或鈦黑之黑色顏料,藉由相對於該著色接著層之重量而言,該黑色顏料之摻合比例為1至4重量%,能效率佳地吸收紫外線而加以濾除。 According to a second aspect of the present invention, the colored adhesive layer is blended with a black pigment comprising carbon black or titanium black, and the black pigment blending ratio is 1 to 4 by weight with respect to the weight of the colored adhesive layer. %, can absorb ultraviolet rays efficiently and filter out.
若根據本發明之第二形態,著色接著層係摻合包含氧化鈦或硫酸鋇之白色顏料,藉由相對於該著色接著層之重量而言,該白色顏料之摻合比例為5至15重量%,能使紫外線效率佳地反射而加以濾除。 According to a second aspect of the present invention, the colored adhesive layer is blended with a white pigment comprising titanium oxide or barium sulfate, and the blending ratio of the white pigment is 5 to 15 by weight with respect to the weight of the colored adhesive layer. %, which can reflect the ultraviolet light efficiently and filter it out.
若根據本發明之第二形態,藉由背光片係由聚對苯二甲酸乙二酯構成,為價格較低廉的材料,由於具有機械強度、耐熱性等而能減低生產性成本。 According to the second aspect of the present invention, the backlight sheet is made of polyethylene terephthalate, which is a relatively inexpensive material, and can reduce the productivity cost due to mechanical strength, heat resistance and the like.
1A‧‧‧紫外線 1A‧‧‧UV
11、21‧‧‧透明基材 11, 21‧‧‧ transparent substrate
12、22‧‧‧透明封裝材 12, 22‧‧‧ Transparent packaging materials
13、23‧‧‧太陽電池單元 13, 23‧‧‧ solar battery unit
14、24‧‧‧封裝材 14, 24‧‧‧Package
15、25‧‧‧電路片 15, 25‧‧‧ circuit pieces
16、26‧‧‧背光片 16, 26‧‧‧ backlight film
17、212‧‧‧附電路之背光片 17, 212‧‧‧ Backlit film with circuit
18、27‧‧‧連接電極 18, 27‧‧‧ connection electrode
19、28‧‧‧連接材 19, 28‧‧‧Connecting materials
110、29‧‧‧絕緣層(電絕緣層) 110, 29‧‧‧Insulation (electrical insulation)
111‧‧‧著色絕緣層 111‧‧‧Colored insulation
210‧‧‧著色接著層 210‧‧‧Coloring layer
112‧‧‧接著層 112‧‧‧Next layer
120、211‧‧‧電路 120, 211‧‧‧ circuits
121‧‧‧佈線部 121‧‧‧Wiring Department
122‧‧‧導線 122‧‧‧Wire
123‧‧‧端子盒 123‧‧‧Terminal box
124‧‧‧鋁框 124‧‧‧Aluminum frame
130、213‧‧‧顏料 130, 213‧‧‧ pigments
140‧‧‧外圍邊緣 140‧‧‧ peripheral edge
141‧‧‧非佈線部 141‧‧‧ Non-wiring department
214‧‧‧片基材 214‧‧‧Sheet substrate
220‧‧‧金屬層 220‧‧‧metal layer
221‧‧‧接著層 221‧‧‧Next layer
222‧‧‧積層體 222‧‧‧Layer
150、230‧‧‧本發明之後觸點型太陽能電池模組 150, 230‧‧‧ contact solar cell module after the invention
160‧‧‧本發明之後觸點型太陽能電池模組(附鋁框) 160‧‧‧Contact solar cell module (with aluminum frame) after the present invention
170、240‧‧‧一般之後觸點型太陽能電池模組 170, 240‧‧‧General contact solar battery modules
180‧‧‧一般之後觸點型太陽能電池模組(附鋁框) 180‧‧‧General contact solar cell module (with aluminum frame)
第1A圖係顯示有關本發明之第1實施形態之後觸點型太陽能電池模組的層構造一例之說明圖。 Fig. 1A is an explanatory view showing an example of a layer structure of a contact type solar cell module according to the first embodiment of the present invention.
第1B圖係顯示有關本發明之第1實施形態之後觸點型太陽能電池模組的層構造一例之說明圖。 Fig. 1B is an explanatory view showing an example of a layer structure of a contact type solar cell module according to the first embodiment of the present invention.
第2圖係顯示有關本發明之第1實施形態的附電路之背光片外圍邊緣部的層構造一例之說明圖。 Fig. 2 is an explanatory view showing an example of a layer structure of a peripheral edge portion of a backlight sheet with a circuit according to the first embodiment of the present invention.
第3圖係顯示有關本發明之第2實施形態之後觸點型太陽能電池模組的層構造一例之說明圖。 Fig. 3 is an explanatory view showing an example of a layer structure of a contact type solar cell module according to a second embodiment of the present invention.
第4A圖係顯示有關本發明之第2實施形態之後觸點型太陽能電池模組的層構造一例之說明圖。 Fig. 4A is an explanatory view showing an example of a layer structure of a contact type solar cell module according to the second embodiment of the present invention.
第4B圖係顯示本發明之後觸點型太陽能電池模組的層構造一例之說明圖。 Fig. 4B is an explanatory view showing an example of a layer structure of the contact type solar cell module of the present invention.
第5A圖係顯示一般太陽能電池模組的層構造一例之說明圖。 Fig. 5A is an explanatory view showing an example of a layer structure of a general solar battery module.
第5B圖係顯示一般太陽能電池模組的層構造一例之說明圖。 Fig. 5B is an explanatory view showing an example of a layer structure of a general solar battery module.
第5C圖係顯示一般太陽能電池模組的層構造一例之說明圖。 Fig. 5C is an explanatory view showing an example of a layer structure of a general solar battery module.
第5D圖係顯示一般太陽能電池模組的層構造一例之說明圖。 Fig. 5D is an explanatory view showing an example of a layer structure of a general solar battery module.
第5E圖係顯示一般太陽能電池模組的層構造一例之說明圖。 Fig. 5E is an explanatory view showing an example of a layer structure of a general solar battery module.
以下,針對本發明之第1實施形態加以說明。 Hereinafter, a first embodiment of the present invention will be described.
第1A及1B圖係顯示有關本發明之第1實施形態之後觸點型太陽能電池模組的層構造一例之說明圖。第1A圖係顯示太陽能電池模組150之層構造一例之說明圖。太陽能電池模組150係由如前面玻璃之透明基材11、透明封裝材12、太陽電池單元13、封裝材14、附電路之背光片17所形成。在太陽電池單元13之背面設置電子取出用電極之連接電極18,形成連接有電路120與連接電極18之連接材19。太陽電池單元13係複數所形成,藉佈線部121而連接各自的電路120。 1A and 1B are explanatory views showing an example of a layer structure of a contact type solar cell module according to the first embodiment of the present invention. Fig. 1A is an explanatory view showing an example of a layer structure of the solar battery module 150. The solar cell module 150 is formed of a transparent substrate 11 such as a front glass, a transparent encapsulant 12, a solar cell unit 13, a package material 14, and a backlight 17 with an electrical circuit. The connection electrode 18 of the electron extraction electrode is provided on the back surface of the solar cell unit 13, and the connection material 19 to which the circuit 120 and the connection electrode 18 are connected is formed. The solar battery cells 13 are formed in plural numbers, and the respective circuits 120 are connected by the wiring portion 121.
連接材19一般使用焊錫或銀糊等之導電性材料。附電路之背光片17係由使接著層112介於中間而 貼合金屬層與背光片16的積層體所形成,使該金屬層圖案化而形成連接電路120與電路間之佈線部121。又,除了利用連接材19來使連接電極18與電路120連接的位置之外,也使封裝材14介於中間而予以絕緣。又,也使透明封裝材12介於透明基材11與太陽電池單元13之中間。 The connecting material 19 is generally made of a conductive material such as solder or silver paste. The backlight sheet 17 with the circuit is made by interposing the layer 112 in the middle. The laminated metal layer and the laminated body of the backlight sheet 16 are formed, and the metal layer is patterned to form the wiring portion 121 between the connection circuit 120 and the circuit. Further, in addition to the position where the connection electrode 18 is connected to the circuit 120 by the connecting member 19, the sealing material 14 is also interposed and insulated. Further, the transparent encapsulant 12 is also interposed between the transparent substrate 11 and the solar cell unit 13.
於太陽能電池模組中,在太陽電池單元13或電路120與連接電路間的佈線部121等之金屬層所形成的部分,紫外線1A容易因金屬層而反射,難以發生背光片之脆化。但是,在背光片之外圍邊緣140的非佈線部141,亦即未形成金屬層之部分,容易發生紫外線1A所照射的背光片16之脆化。因此,藉由僅在背光片之外圍邊緣140的非佈線部141,亦即未形成金屬層之部分形成著色絕緣層111,能防止該部分脆化,同時也能防止背光片16整體之脆化。 In the solar battery module, in the portion where the metal layer such as the wiring portion 121 between the solar battery unit 13 or the circuit 120 and the connection circuit is formed, the ultraviolet ray 1A is easily reflected by the metal layer, and the backlight sheet is less likely to be embrittled. However, in the non-wire portion 141 of the peripheral edge 140 of the backlight sheet, that is, the portion where the metal layer is not formed, embrittlement of the backlight sheet 16 irradiated with the ultraviolet ray 1A is likely to occur. Therefore, by forming the colored insulating layer 111 only on the non-wiring portion 141 of the peripheral edge 140 of the backlight sheet, that is, the portion where the metal layer is not formed, the portion can be prevented from being embrittled, and the entire backlight sheet 16 can be prevented from being embrittled. .
第1B圖係顯示被鋁框所補強的狀態之後觸點型太陽能電池模組160之一例。顯示利用經耐酸鋁(alumite)處理的鋁框124補強太陽能電池模組的狀態之一例。所發電的電力係藉導線122而連接至背光片16之外側端子盒123。 Fig. 1B shows an example of the contact type solar cell module 160 after the state in which the aluminum frame is reinforced. An example of a state in which an aluminum frame 124 treated with an alumite is used to reinforce a solar cell module is shown. The electric power generated is connected to the terminal box 123 on the outer side of the backlight sheet 16 by the wire 122.
例如,在電路120或佈線電路間之佈線部121,係藉由金屬層而濾除紫外線1A。另一方面,在背光片外圍邊緣140之非佈線部141,亦即在鋁框124與佈線部121或電路120間之非佈線部141,則照射有紫外線A。因此,藉由僅在該非佈線部141形成著色絕緣層111,能防止背光片之脆化。 For example, in the wiring portion 121 between the circuit 120 or the wiring circuit, the ultraviolet rays 1A are filtered by the metal layer. On the other hand, the non-wiring portion 141 of the peripheral edge 140 of the backlight sheet, that is, the non-wiring portion 141 between the aluminum frame 124 and the wiring portion 121 or the circuit 120 is irradiated with the ultraviolet ray A. Therefore, by forming the colored insulating layer 111 only in the non-wiring portion 141, embrittlement of the backlight sheet can be prevented.
第2圖係顯示附電路之背光片外圍邊緣部的層構造一例之說明圖。在背光片外圍邊緣140之非佈線部141,積層有著色絕緣層111。由於著色絕緣層111係於均勻分散濾除紫外線的顏料130之狀態下被積層於背光片上,因此能防止背光片16之脆化。 Fig. 2 is an explanatory view showing an example of a layer structure of a peripheral edge portion of a backlight sheet with a circuit. A colored insulating layer 111 is laminated on the non-wiring portion 141 of the peripheral edge 140 of the backlight sheet. Since the colored insulating layer 111 is laminated on the backlight sheet in a state in which the ultraviolet ray-filtered pigment 130 is uniformly dispersed, the embrittlement of the backlight sheet 16 can be prevented.
還有,針對本實施形態詳加說明。 Further, the present embodiment will be described in detail.
作為透明基材11必須具有下列之各種功能:光線穿透率佳;經歷長期(約20年)而具有優越的耐候性,光線穿透率之降低少;塵埃等難以附著;水蒸氣穿透率極低等。作為材質,除了玻璃之外,也能使用由丙烯酸樹脂、聚碳酸酯樹脂、矽氧烷樹脂、氟樹脂等所構成的薄膜。又,也能將該等之薄膜作為複合薄膜使用。 As the transparent substrate 11, it must have the following various functions: good light transmittance; excellent long-term (about 20 years) and excellent weather resistance, less reduction in light transmittance; dust and the like are difficult to adhere; water vapor transmission rate Extremely low. As the material, a film made of an acrylic resin, a polycarbonate resin, a siloxane resin, a fluororesin or the like can be used in addition to glass. Moreover, these thin films can also be used as a composite film.
作為透明封裝材必須具有下列之各種功能:太陽光線之穿透率高;無光線穿透率降低等之物性變化;又,絕緣性高,不會腐蝕其它材料;不會發生因急遽之空氣條件變化等所造成的樹脂龜裂、界面剝離等。例如,能使用聚乙烯丁縮醛(PVB)樹脂、矽氧烷樹脂、氯乙烯樹脂、聚胺基甲酸酯等。也能使用乙烯-甲基丙烯酸甲酯共聚物(EMMA)、乙烯-丙烯酸酯共聚物(EAA)、離子鍵聚合物、聚丙烯樹脂等,特佳能使用乙烯-乙酸乙烯酯共聚物(EVA)樹脂。作為透明封裝材之厚度較佳為100至1000μm之範圍。若低於100μm則單元會破裂;若超過1000μm則為不節約。 As a transparent packaging material, it must have the following functions: high transmittance of sunlight; no change in physical properties such as reduced light transmittance; and high insulation, no corrosion of other materials; no air conditions due to impatience Resin cracking, interfacial peeling, etc. caused by changes, etc. For example, a polyvinyl butyral (PVB) resin, a decyl alkane resin, a vinyl chloride resin, a polyurethane, or the like can be used. Ethylene-methyl methacrylate copolymer (EMMA), ethylene-acrylate copolymer (EAA), ionomer, polypropylene resin, etc. can also be used, and ethylene-vinyl acetate copolymer (EVA) resin can be used. . The thickness of the transparent encapsulant is preferably in the range of 100 to 1000 μm. If it is less than 100 μm, the unit will be broken; if it exceeds 1000 μm, it will not be saved.
作為封裝材,能使用乙烯-乙酸乙烯酯共聚物(EVA)、乙烯-甲基丙烯酸甲酯共聚物(EMMA)、乙烯-丙 烯酸酯共聚物(EAA)、離子鍵聚合物、聚丙烯樹脂、聚乙烯丁縮醛(PVB)樹脂、矽氧烷樹脂等。又,為了使太陽能電池單元間之間隙不可見化,使用白色或黑色等之著色薄膜,或者也能使用用以使未被太陽能電池單元表面所吸收的光再度反射而提高發電效率之高反射薄膜或稜鏡片。 As the packaging material, ethylene-vinyl acetate copolymer (EVA), ethylene-methyl methacrylate copolymer (EMMA), ethylene-propylene can be used. Ethyl ester copolymer (EAA), ionomer, polypropylene resin, polyvinyl butyral (PVB) resin, decane resin, and the like. Further, in order to make the gap between the solar battery cells inconspicuous, a colored film such as white or black is used, or a highly reflective film for re-reflecting light that is not absorbed by the surface of the solar cell to improve power generation efficiency can be used. Or a picture.
作為形成封裝材之方法,例如能藉由利用T模頭擠出成形已混合乙烯-乙酸乙烯酯共聚物(EVA)樹脂與其它添加劑並使其加熱熔融的混合樹脂而形成封裝材。例如也能利用共擠出法製膜成二層而作成封裝材。作為封裝材之厚度,較佳為50μm至2mm之範圍。又,作為其它之方法,也能藉由壓延機成形而形成片狀。 As a method of forming the encapsulant, for example, a package material can be formed by extrusion molding a mixed resin in which an ethylene-vinyl acetate copolymer (EVA) resin and other additives are mixed and heat-melted by a T die. For example, a co-extrusion method can also be used to form a film into two layers to form a package. The thickness of the encapsulating material is preferably in the range of 50 μm to 2 mm. Further, as another method, it can be formed into a sheet shape by molding by a calender.
接著,針對著色絕緣層而詳加說明。 Next, the coloring insulating layer will be described in detail.
附電路之背光片係由使接著劑介於中間而積層金屬層與背光片的積層體所構成。使該金屬層圖案化而形成電路、及連接電路間之佈線部,之後,將著色絕緣層積層於背光片外圍邊緣之非佈線部而形成附電路之背光片。 The backlight sheet with a circuit is composed of a laminate in which a layer of a metal layer and a backlight sheet are laminated with an adhesive interposed therebetween. The metal layer is patterned to form a circuit and a wiring portion between the circuits, and then a colored insulating layer is laminated on the non-wiring portion of the peripheral edge of the backlight to form a circuit-backed backlight.
著色絕緣層被要求高的絕緣性。作為形成著色絕緣層之絕緣樹脂,能使用熱硬化樹脂、紫外線硬化樹脂等。作為熱硬化樹脂,例如能使用酚樹脂、環氧樹脂、不飽和聚酯樹脂、聚醯亞胺樹脂、聚酯樹脂、氟系樹脂、矽氧烷樹脂、聚碳酸酯樹脂、聚醚苯乙烯樹脂、聚醚醯亞胺樹脂等。 The colored insulating layer is required to have high insulation. As the insulating resin forming the colored insulating layer, a thermosetting resin, an ultraviolet curing resin, or the like can be used. As the thermosetting resin, for example, a phenol resin, an epoxy resin, an unsaturated polyester resin, a polyimide resin, a polyester resin, a fluorine resin, a siloxane resin, a polycarbonate resin, or a polyether styrene resin can be used. , polyether phthalimide resin and the like.
欲使熱硬化樹脂加熱乾燥時,由於一旦加熱超過背光片之Tg(玻璃轉移溫度)則也有因該熱而發生收縮或變形之情形,因此必須確認後再進行。 When the thermosetting resin is to be dried by heating, if it is heated to exceed the Tg (glass transition temperature) of the backlight sheet, it may shrink or deform due to the heat, and therefore it is necessary to confirm it.
又,作為紫外線硬化樹脂,能使用丙烯酸酯、不飽和聚酯等之自由基聚合型樹脂或是環氧樹脂等之陽離子聚合型。 Further, as the ultraviolet curable resin, a radical polymerization type resin such as an acrylate or an unsaturated polyester or a cationic polymerization type such as an epoxy resin can be used.
於紫外線照射中,由於不伴隨加熱處理,使用紫外線硬化樹脂之情形,不會發生背光片之熱收縮問題。又,與熱硬化之步驟作一比較,紫外線硬化之步驟者之硬化時間更短而具更優越的經濟性。因而,藉由使用紫外線硬化樹脂而能提高背光片之生產性。進一步藉由在背光片外圍邊緣之非佈線部形成紫外線硬化樹脂,能進一步使背光片之生產性提高而減低生產成本。 In the case of ultraviolet irradiation, since the ultraviolet curable resin is used without the heat treatment, the problem of heat shrinkage of the backlight sheet does not occur. Moreover, in comparison with the step of thermal hardening, the step of curing the ultraviolet light has a shorter hardening time and is more economical. Therefore, the productivity of the backlight sheet can be improved by using an ultraviolet curable resin. Further, by forming the ultraviolet curable resin on the non-wiring portion on the peripheral edge of the backlight sheet, the productivity of the backlight sheet can be further improved and the production cost can be reduced.
著色絕緣層能形成至少將具有紫外線濾除性之顏料摻入絕緣樹脂中的著色絕緣劑,塗佈該著色絕緣劑而形成。 The colored insulating layer can be formed by forming a colored insulating agent which incorporates at least a pigment having ultraviolet absorbing property into an insulating resin, and coating the colored insulating agent.
作為顏料,能使用無機顏料、有機顏料等之各種顏料。作為黑色顏料,較佳為碳黑或鈦黑等,從其發色、分散性或成本等之觀點,平均粒徑較佳為0.01至0.5μm。又,作為白色顏料,較佳為氧化鈦或硫酸鋇等,從發色之觀點,關於氧化鈦,平均粒徑較佳為0.1至1.0μm。 As the pigment, various pigments such as inorganic pigments and organic pigments can be used. The black pigment is preferably carbon black or titanium black, and the average particle diameter is preferably from 0.01 to 0.5 μm from the viewpoints of color development, dispersibility, cost, and the like. Further, as the white pigment, titanium oxide or barium sulfate is preferable, and from the viewpoint of color development, the average particle diameter of the titanium oxide is preferably 0.1 to 1.0 μm.
又,例如黑色顏料之情形,相對於著色絕緣層之重量而言,顏料之摻合量較佳為1至4重量%之範圍。黑色顏料之摻合量低於1重量%之情形,會缺乏紫 外線濾除性,長期曝露於屋外時,有發生背光片劣化、黃變之情形。又,於黑色顏料之摻合量超過4重量%之情形下,由於顏料過多,將有對紫外線硬化樹脂之硬化帶來不良之影響、或移動至封裝材而使封裝材與著色絕緣層之緊貼性降低之虞。 Further, in the case of, for example, a black pigment, the blending amount of the pigment is preferably in the range of 1 to 4% by weight based on the weight of the colored insulating layer. If the blending amount of the black pigment is less than 1% by weight, the purple color may be lacking. The external filter has a long-term exposure to the outside of the house, and there is a case where the backlight is deteriorated or yellowed. Moreover, when the blending amount of the black pigment exceeds 4% by weight, the pigment may be excessively affected, which may adversely affect the curing of the ultraviolet curable resin, or may move to the packaging material to tightly seal the encapsulating material and the colored insulating layer. Reduced stickers.
白色顏料之情形,相對於著色絕緣層之重量而言,較佳為5至15重量%之範圍。白色顏料之摻合量低於5重量%之情形,會缺乏紫外線濾除性,長期曝露於屋外時,有發生背光片劣化、黃變之情形。又,白色顏料之摻合量超過15重量%之情形,由於顏料過多,將有對紫外線硬化樹脂之硬化帶來不良之影響、或移動至封裝材而使封裝材與著色絕緣層之緊貼性降低之虞。 The case of the white pigment is preferably in the range of 5 to 15% by weight based on the weight of the colored insulating layer. When the blending amount of the white pigment is less than 5% by weight, the ultraviolet filter property may be lacking, and when the film is exposed to the outside for a long period of time, the backlight sheet may be deteriorated or yellowed. Further, when the amount of the white pigment blended exceeds 15% by weight, the amount of the pigment is too large, which may adversely affect the hardening of the ultraviolet curable resin, or may move to the packaging material to make the packaging material adhere to the colored insulating layer. Reduce the embarrassment.
著色絕緣層能利用照相凹板印刷、絲網板印刷、噴墨印刷等之習知方法而形成。 The colored insulating layer can be formed by a conventional method such as gravure printing, screen printing, inkjet printing or the like.
為了獲得高的絕緣水準,著色絕緣層之厚度較佳為5至25μm之範圍。低於5μm之情形,將會使絕緣性變得不足;超過25μm之情形,則因為得不到更高的絕緣效果而且不經濟故不佳。 In order to obtain a high insulation level, the thickness of the colored insulating layer is preferably in the range of 5 to 25 μm. Below 5 μm, the insulation becomes insufficient; in the case of more than 25 μm, it is uneconomical because it does not obtain a higher insulation effect.
接著,針對作成附電路之背光片之製造方法的一例加以說明。 Next, an example of a method of manufacturing a backlight sheet with a circuit will be described.
附電路之背光片係由使接著層介於中間而貼合金屬層與背光片的積層體所構成。使該金屬層圖案化而形成電路、及連接電路間之佈線部,進一步將著色絕緣層積層於背光片外圍邊緣之非佈線部而形成附電路之背光片。 The backlight sheet with a circuit is composed of a laminate in which a metal layer and a backlight sheet are bonded together with an adhesive layer interposed therebetween. The metal layer is patterned to form a circuit and a wiring portion connecting the circuits, and a colored insulating layer is further laminated on the non-wiring portion of the peripheral edge of the backlight to form a backlight sheet with a circuit.
作為形成接著層之接著劑,能使用乾式積層用之接著劑。例如,能使用二液硬化型胺基甲酸酯系接著劑、聚酯胺基甲酸酯系接著劑、聚醚胺基甲酸酯系接著劑、丙烯酸系接著劑、聚酯系接著劑、聚醯胺系接著劑、環氧系接著劑等。 As the adhesive for forming the adhesive layer, an adhesive for dry build-up can be used. For example, a two-liquid curing type urethane-based adhesive, a polyester urethane-based adhesive, a polyether urethane-based adhesive, an acrylic adhesive, a polyester adhesive, or the like can be used. A polyamide-based adhesive, an epoxy-based adhesive, or the like.
作為接著劑之稀釋溶劑,例如可舉出甲苯、二甲苯、乙酸乙酯、丙酮、甲基乙基酮、甲基異丁基酮、四氫呋喃、二甲基甲醯胺、二甲基乙醯胺、甲醇、乙醇及水等。著色接著劑可為乳化型及溶劑型中任一種。 Examples of the diluent solvent for the adhesive include toluene, xylene, ethyl acetate, acetone, methyl ethyl ketone, methyl isobutyl ketone, tetrahydrofuran, dimethylformamide, and dimethylacetamide. , methanol, ethanol and water. The coloring adhesive may be either an emulsion type or a solvent type.
接著層係使用上述接著劑,例如能利用照相凹板塗布、輥塗布、刮刀塗布、模頭塗布等之習知方法而形成。作為接著層之厚度,較佳為5至15μm之厚度,能使接著強度牢固。接著層之厚度低於5μm之情形,接著強度將會不足;超過25μm之情形,生產成本則會增加。作為貼合之方法,亦可利用乾式積層法。 The layer is then formed using the above-mentioned adhesive, for example, by a conventional method such as gravure coating, roll coating, blade coating, die coating, or the like. As the thickness of the adhesive layer, a thickness of 5 to 15 μm is preferable, and the bonding strength can be made firm. When the thickness of the layer is less than 5 μm, the strength will be insufficient; if it exceeds 25 μm, the production cost will increase. As a method of bonding, a dry lamination method can also be utilized.
又,亦可利用擠出接著性樹脂之擠出積層法。作為該接著性樹脂,可舉出低密度聚乙烯、中密度聚乙烯、高密度聚乙烯、直鏈狀低密度聚乙烯、乙烯-甲基丙烯酸甲酯共聚物(EMMA)、乙烯-丙烯酸酯共聚物(EAA)等之樹脂。接著層之厚度較佳為15至30μm之範圍。接著層之厚度能根據接著強度而決定。 Further, an extrusion lamination method using an extrusion adhesive resin can also be used. Examples of the adhesive resin include low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, ethylene methyl methacrylate copolymer (EMMA), and ethylene-acrylate copolymerization. Resin such as (EAA). The thickness of the layer is then preferably in the range of 15 to 30 μm. The thickness of the layer can then be determined based on the strength of the bond.
作為金屬層,從導電性及材料成本方面,較佳為銅箔、鋁箔等。作為金屬層之圖案化,亦可利用蝕刻加工或穿孔加工等。 As the metal layer, copper foil, aluminum foil, or the like is preferable in terms of conductivity and material cost. As the patterning of the metal layer, etching processing, punching processing, or the like can also be used.
背光片係已形成電路、及連接電路間之佈線部的電路片。又,必須具有作為太陽能電池模組背面保護之功能。能從聚對苯二甲酸乙二酯薄膜、聚對苯二甲酸丁二酯(PBT)、聚萘二甲酸乙二酯薄膜、聚丙烯、聚乙烯等之聚烯烴薄膜;聚苯硫醚(PPS)等之薄膜或聚氟化乙烯酯(PVF)等適宜選擇。又,可以單層使用該等之薄膜,亦可使其複合化。例如,作為背光片之層構造,可舉出氟樹脂/聚對苯二甲酸乙二酯薄膜/氟樹脂或聚對苯二甲酸乙二酯薄膜/氟樹脂等。必要時,為了賦予阻氣性,亦即水蒸氣阻障性、氧阻障性等,能使用於該等薄膜貼合鋁箔之層、蒸鍍無機氧化物之層。又,從設計性之觀點,亦可為著色成白色片或黑色片之層。 The backlight sheet has formed a circuit and a circuit piece connecting the wiring portions between the circuits. In addition, it must have a function as a back surface protection of the solar cell module. A polyolefin film which can be obtained from polyethylene terephthalate film, polybutylene terephthalate (PBT), polyethylene naphthalate film, polypropylene, polyethylene, etc.; polyphenylene sulfide (PPS) A film or a polyvinylidene fluoride (PVF) or the like is suitably selected. Further, these thin films may be used in a single layer or may be composited. For example, a layer structure of the backlight sheet may be a fluororesin/polyethylene terephthalate film/fluororesin or a polyethylene terephthalate film/fluororesin. When necessary, in order to impart gas barrier properties, that is, water vapor barrier properties, oxygen barrier properties, and the like, a layer for bonding the aluminum foil to the film or a layer of the inorganic oxide may be deposited. Further, from the viewpoint of design, it may be a layer colored into a white sheet or a black sheet.
接著,針對後觸點型太陽能電池模組之製造方法的一例加以說明。 Next, an example of a method of manufacturing a back contact type solar cell module will be described.
例如,能在如前面玻璃之透明基材上,依序積層透明封裝材、太陽電池單元、封裝材、附電路之背光片,接著利用一面抽真空一面加熱壓黏之積層等之通常成形法進行一體成形而形成太陽電池模組。此時,在太陽電池單元之背面設置電子取出用電極之連接電極,以連接背光片之電路與連接電極的方式來形成連接材而予以一體成形。太陽電池單元係複數所形成,各自的電路係藉由佈線部予以連接。佈線部係藉導線而連接至背光片外側之端子盒。 For example, a transparent encapsulant, a solar cell unit, a package material, and a backlight sheet with a circuit can be sequentially laminated on a transparent substrate such as a front glass, and then subjected to a usual forming method in which a pressure-sensitive adhesive layer is heated while being vacuumed. The solar cell module is formed integrally. At this time, the connection electrode of the electron extraction electrode is provided on the back surface of the solar cell, and the connection material is formed by connecting the circuit of the backlight and the connection electrode, and integrally formed. The solar cell units are formed in plural numbers, and the respective circuits are connected by a wiring portion. The wiring portion is connected to the terminal box outside the backlight sheet by a wire.
若根據本實施形態之後觸點型太陽能電池模組,藉由僅在附電路之背光片外圍邊緣的非佈線部形成 著色絕緣層,能防止背光片之脆化。又,使得減少使用於絕緣層之絕緣樹脂成為可能,而使生產成本之減低成為可能。 According to the present embodiment, the contact type solar cell module is formed by the non-wiring portion only at the peripheral edge of the backlight of the attached circuit. The colored insulating layer prevents embrittlement of the backlight. Further, it is possible to reduce the insulating resin used for the insulating layer, and it is possible to reduce the production cost.
接著,針對第2實施形態詳加說明。 Next, the second embodiment will be described in detail.
第3圖係顯示有關本發明之後觸點型太陽能電池模組的層構造一例之說明圖。太陽能電池模組230係由如前面玻璃之透明基材21、透明封裝材22、太陽電池單元23、封裝材24、附電路之背光片212所構成。於太陽電池單元23之背面,設置p極、n極之電子取出用電極的連接電極27,形成連接電路211與連接電極之連接材28。一般將焊錫或銀糊等之導電性材料作為連接材28使用。附電路之背光片212係由使已摻合濾除紫外線之顏料的著色接著層210介於中間而貼合金屬層220與背光片26的積層體所形成,使該金屬層圖案化而形成有電路211之積層體。又,除了利用連接材28連接連接電極27與電路211的位置之外,使封裝材24介於中間而予以電絕緣。又,也使透明封裝材22介於透明基材21與太陽電池單元23之中間。 Fig. 3 is an explanatory view showing an example of a layer structure of a contact type solar cell module according to the present invention. The solar cell module 230 is composed of a transparent substrate 21 such as a front glass, a transparent encapsulant 22, a solar cell unit 23, a package member 24, and a backlight sheet 212 with an electric circuit. On the back surface of the solar cell unit 23, a connection electrode 27 of an electron extraction electrode of a p-pole and an n-pole is provided, and a connection material 28 connecting the circuit 211 and the connection electrode is formed. A conductive material such as solder or silver paste is generally used as the connecting material 28. The circuit-backed backlight sheet 212 is formed by laminating a layer of the metal layer 220 and the backlight sheet 26 with the colored adhesive layer 210 of the pigment having the ultraviolet-filtered pigment interposed therebetween, and the metal layer is patterned to form The laminated body of the circuit 211. Further, in addition to the position where the connection electrode 27 and the circuit 211 are connected by the connecting member 28, the package member 24 is interposed and electrically insulated. Further, the transparent encapsulant 22 is also interposed between the transparent substrate 21 and the solar cell unit 23.
第4A圖及第4B圖係顯示附電路之背光片的層構造之一例之說明圖。第4A圖係顯示使已摻合濾除紫外線之顏料213的著色接著層210介於中間而貼合金屬層220與背光片26的積層體222。又,顯示顏料213已被均勻分散於著色接著層210中之狀態。第4B圖係顯示使金屬層220圖案化而形成電路211後之狀態,顯示附 電路之背光片212。著色接著層210係由於使濾除紫外線之顏料213在均勻分散之狀態下積層於背光片26上,而能防止背光片26的脆化。 4A and 4B are explanatory views showing an example of a layer structure of a backlight sheet with a circuit. Fig. 4A shows a laminate 222 in which the color-bonding layer 210 of the pigment 213 having been subjected to the ultraviolet ray-filtering is interposed and the metal layer 220 and the backlight sheet 26 are bonded to each other. Further, the state in which the pigment 213 has been uniformly dispersed in the colored back layer 210 is shown. FIG. 4B shows a state in which the metal layer 220 is patterned to form the circuit 211, and the display is attached. The backlight sheet 212 of the circuit. The colored adhesive layer 210 prevents the embrittlement of the backlight sheet 26 by laminating the ultraviolet ray-removing pigment 213 on the backlight sheet 26 in a state of being uniformly dispersed.
進一步針對本實施形態詳加說明。 This embodiment will be further described in detail.
於本實施形態中,能使用與第1實施形態同樣的透明基材、透明封裝材及封裝材。又,封裝材亦可為與電路片之著色接著層牢固地接著之可熱熔融的熱塑性樹脂等。又,於本實施形態中,能藉由與第1實施形態同樣的方法而形成封裝材。 In the present embodiment, the transparent base material, the transparent sealing material, and the packaging material similar to those of the first embodiment can be used. Further, the encapsulating material may be a thermoplastic resin which is thermally meltable next to the colored layer of the circuit board. Further, in the present embodiment, the package material can be formed by the same method as in the first embodiment.
針對附電路之背光片加以說明。 The backlight sheet with the circuit will be described.
附電路之背光片係由使已摻合具有紫外線濾除性之顏料的著色接著劑介於中間而積層金屬層與背光材的積層體所構成,使該金屬層圖案化而形成電路之層。 The backlight sheet with a circuit is formed by laminating a layered metal layer and a backlight material with a coloring adhesive having a pigment having ultraviolet-filtering properties interposed therebetween, and patterning the metal layer to form a circuit layer.
著色接著層能塗布至少包含具有紫外線濾除性之顏料、接著劑、溶劑之著色接著劑而形成。又,著色接著層亦能擠出成形已將具有紫外線濾除性之顏料摻入接著性樹脂中的混合樹脂而形成。 The colored adhesive layer can be formed by coating a coloring adhesive containing at least a pigment having a UV filter, an adhesive, and a solvent. Further, the colored adhesive layer can also be formed by extrusion molding a mixed resin in which a pigment having ultraviolet filter property is incorporated into an adhesive resin.
作為具有紫外線濾除性之顏料,能使用無機顏料、有機顏料等之各種顏料。從泛用性、價格、發色性能、或紫外線濾除性之觀點,作為黑色顏料,較佳為碳黑或鈦黑等,從發色、分散性或成本之觀點,平均粒徑較佳為0.01至0.5μm。又,作為白色顏料,較佳為氧化鈦或硫酸鋇等,從發色之觀點,關於氧化鈦,平均粒徑較佳為0.1至1.0μm。 As the pigment having ultraviolet ray repellency, various pigments such as inorganic pigments and organic pigments can be used. From the viewpoint of versatility, price, color development property, or ultraviolet filterability, as the black pigment, carbon black or titanium black is preferable, and the average particle diameter is preferably from the viewpoints of color development, dispersibility, or cost. 0.01 to 0.5 μm. Further, as the white pigment, titanium oxide or barium sulfate is preferable, and from the viewpoint of color development, the average particle diameter of the titanium oxide is preferably 0.1 to 1.0 μm.
又,例如黑色顏料之情形,相對於著色接著劑層之重量而言,顏料之摻合量較佳為1至4重量%之範圍。黑色顏料之摻合量低於1重量%之情形,會缺乏紫外線濾除性,長期曝露於屋外時,將有發生背光片劣化、黃變之情形。又,黑色顏料之摻合量超過4重量%之情形,由於顏料過多,將有移動至封裝材或使封裝材與著色接著層之緊貼性降低之虞。 Further, in the case of, for example, a black pigment, the blending amount of the pigment is preferably in the range of 1 to 4% by weight based on the weight of the colored adhesive layer. When the blending amount of the black pigment is less than 1% by weight, the ultraviolet filter property may be lacking, and when the film is exposed to the outside for a long period of time, the backlight sheet may be deteriorated or yellowed. Further, in the case where the blending amount of the black pigment exceeds 4% by weight, there is a possibility that the adhesion to the sealing material or the adhesion between the sealing material and the colored adhesive layer is lowered due to the excessive amount of the pigment.
白色顏料之情形,相對於著色接著層之重量而言,較佳為5至15重量%之範圍。白色顏料之摻合量低於5重量%之情形,會缺乏紫外線濾除性,長期曝露於屋外時,將有發生背光片劣化、黃變之情形。又,於白色顏料之摻合量超過15重量%之情形下,由於顏料過多,將有移動至封裝材或使封裝材與著色接著層之緊貼性降低之虞。 The case of the white pigment is preferably in the range of 5 to 15% by weight based on the weight of the colored back layer. When the blending amount of the white pigment is less than 5% by weight, the ultraviolet ray-removing property may be lacking, and when it is exposed to the outside for a long period of time, the backlight sheet may be deteriorated or yellowed. Further, when the blending amount of the white pigment exceeds 15% by weight, the amount of the pigment is too large, and the adhesion to the sealing material or the adhesion between the sealing material and the colored adhesive layer is lowered.
作為接著劑,能使用乾式積層用之接著劑。例如,可使用二液硬化型胺基甲酸酯系接著劑、聚酯胺基甲酸酯系接著劑、聚醚胺基甲酸酯系接著劑、丙烯酸系接著劑、聚酯系接著劑、聚醯胺系接著劑、環氧系接著劑等。 As the adhesive, an adhesive for dry lamination can be used. For example, a two-liquid curing type urethane-based adhesive, a polyester urethane-based adhesive, a polyether urethane-based adhesive, an acrylic adhesive, a polyester adhesive, or the like may be used. A polyamide-based adhesive, an epoxy-based adhesive, or the like.
作為溶劑,例如可舉出甲苯、二甲苯、乙酸乙酯、丙酮、甲基乙基酮、甲基異丁基酮、四氫呋喃、二甲基甲醯胺、二甲基乙醯胺、甲醇、乙醇及水等。著色接著劑可為乳化型及溶劑型中任一種。 Examples of the solvent include toluene, xylene, ethyl acetate, acetone, methyl ethyl ketone, methyl isobutyl ketone, tetrahydrofuran, dimethylformamide, dimethylacetamide, methanol, and ethanol. And water, etc. The coloring adhesive may be either an emulsion type or a solvent type.
又,於著色接著層中,必要時能使其含有紫外線吸收劑或光安定化劑等。 Further, in the colored adhesive layer, if necessary, an ultraviolet absorber, a light stabilizer, or the like can be contained.
著色接著層係使用著色接著劑,例如能利用照相凹板塗布、輥塗布、刮刀塗布、模頭塗布等之習知方法而形成。作為接著層之厚度,較佳為5至50μm之厚度。接著層之厚度為5至50μm之範圍內之情形,能使金屬層與背光片之接著強度牢固,及能效率佳地濾除紫外線。著色接著層之厚度低於5μm之情形,接著強度將會不足。一旦著色接著層之厚度超過50μm時,則有與成本提高有關之問題。 The coloring adhesive layer is formed using a coloring adhesive, for example, by a conventional method such as gravure coating, roll coating, blade coating, die coating, or the like. As the thickness of the adhesive layer, a thickness of 5 to 50 μm is preferable. When the thickness of the layer is in the range of 5 to 50 μm, the bonding strength between the metal layer and the backlight sheet can be made strong, and ultraviolet rays can be efficiently filtered. When the thickness of the colored back layer is less than 5 μm, the strength will be insufficient. When the thickness of the colored back layer exceeds 50 μm, there is a problem associated with an increase in cost.
金屬層與背光片係使上述著色接著層介於中間而予以貼合。貼合方法亦可為乾式積層法。又,貼合方法亦可為將具有紫外線濾除性之顏料摻入接著性樹脂中之後,擠出該接著性樹脂之擠出積層法。該接著性樹脂可舉出低密度聚乙烯、中密度聚乙烯、高密度聚乙烯、直鏈狀低密度聚乙烯、乙烯-甲基丙烯酸甲酯共聚物(EMMA)、乙烯-丙烯酸酯共聚物(EAA)等之樹脂。該情形係藉由預先作成已摻合接著性樹脂與顏料之母料,再將該母料摻入接著性樹脂中,進行擠出層積而能貼合。著色接著層之厚度較佳為15至50μm之範圍。著色接著層之厚度能根據接著強度及著色濃度等而決定。 The metal layer and the backlight sheet are bonded together with the above-mentioned colored adhesive layer interposed therebetween. The lamination method can also be a dry lamination method. Further, the bonding method may be an extrusion lamination method in which a pigment having ultraviolet absorbing property is incorporated into an adhesive resin and then extruded. Examples of the adhesive resin include low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, ethylene methyl methacrylate copolymer (EMMA), and ethylene acrylate copolymer ( EAA) and other resins. In this case, by preparing a masterbatch in which a binder resin and a pigment have been blended in advance, the master batch is incorporated into an adhesive resin, and extrusion lamination is carried out to bond them. The thickness of the colored back layer is preferably in the range of 15 to 50 μm. The thickness of the colored back layer can be determined according to the adhesion strength, the coloring density, and the like.
作為金屬層,從導電性、材料成本方面,較佳為銅箔、鋁箔等。作為金屬層之圖案化能使用蝕刻加工或穿孔加工等。 As the metal layer, copper foil, aluminum foil, or the like is preferable in terms of conductivity and material cost. As the patterning of the metal layer, etching processing, punching processing, or the like can be used.
背光片係在表面形成有電路之基材的同時,也必須具有作為太陽能電池模組背面保護之功能。能從聚對苯二甲酸乙二酯薄膜、聚對苯二甲酸丁二酯(PBT)、 聚萘二甲酸乙二酯薄膜、聚丙烯、聚乙烯等之聚烯烴薄膜;聚苯硫醚(PPS)等之薄膜或聚氟化乙烯酯(PVF)等適宜選擇。又,可以單層使用該等之薄膜,亦可作成背光片之層構造,可舉出氟樹脂/聚對苯二甲酸乙二酯薄膜/氟樹脂或聚對苯二甲酸乙二酯薄膜/氟樹脂等。必要時,為了賦予阻氣性,亦即水蒸氣阻障性、氧阻障性等,能使用將鋁箔貼合於該等薄膜者、蒸鍍無機氧化物之層。又,從設計性之觀點,亦可為著色成白色片或黑色片之層。 The backlight sheet is required to have a function as a back surface of the solar cell module while forming a substrate of a circuit on its surface. Can be from polyethylene terephthalate film, polybutylene terephthalate (PBT), A polyethylene naphthalate film, a polyolefin film such as polypropylene or polyethylene; a film such as polyphenylene sulfide (PPS) or a polyvinyl fluoride (PVF) is suitably selected. Further, the film may be used in a single layer or as a layer structure of the backlight sheet, and examples thereof include a fluororesin/polyethylene terephthalate film/fluororesin or a polyethylene terephthalate film/fluorine. Resin, etc. When necessary, in order to impart gas barrier properties, that is, water vapor barrier properties, oxygen barrier properties, and the like, a layer in which an aluminum foil is bonded to the film and a layer of the inorganic oxide is vapor-deposited can be used. Further, from the viewpoint of design, it may be a layer colored into a white sheet or a black sheet.
後觸點型太陽能電池模組係例如能利用在前面玻璃積層透明封裝材、太陽能電池、封裝材、附電路之背光片,接著抽真空而加熱壓黏的積層法等之通常成形法,經一體成形而製造。 The rear contact type solar cell module can be formed by, for example, a conventional forming method such as a front glass laminated transparent packaging material, a solar cell, a packaging material, a backlight sheet with a circuit, and a vacuum lamination method. It is formed and manufactured.
本發明之後觸點型太陽能電池模組即使不使用焊錫光阻,也能防止背光片之脆化。因而,使生產成本之減低成為可能,故能提高生產性。 The contact type solar cell module of the present invention can prevent embrittlement of the backlight sheet even without using solder resist. Therefore, it is possible to reduce the production cost, and it is possible to improve productivity.
以下,針對有關本發明之第1實施形態之實施例加以說明。 Hereinafter, an embodiment of the first embodiment of the present invention will be described.
使用二液硬化型胺基甲酸酯系接著劑,利用乾式積層法貼合厚度25μm之聚氟乙烯(PVF)樹脂薄膜(商品名、PV2111、Du Pont(股)製)、與厚度250μm之聚對苯二甲酸乙二酯醯胺(商品名、S-10、Toray(股)製)而形成積層體。 A two-liquid-curing urethane-based adhesive was used to bond a 25 μm-thick polyvinyl fluoride (PVF) resin film (trade name, PV 2111, manufactured by Du Pont) to a thickness of 250 μm by a dry lamination method. A polyethylene terephthalate (trade name, S-10, manufactured by Toray Co., Ltd.) was formed to form a laminate.
接著,使用二液硬化型胺基甲酸酯系接著劑,藉由乾式積層法而將厚度35μm之電解銅箔貼合於上述積體之聚乙烯苯二甲酸乙二酯薄膜面。之後,在60℃下進行7天之熟成。接著劑之厚度在12g/m2(乾)下進行。聚對苯二甲酸乙二酯薄膜與電解銅箔之接著強度為10N/cm。 Next, an electrolytic copper foil having a thickness of 35 μm was bonded to the surface of the above-mentioned polyethylene terephthalate film by a dry lamination method using a two-liquid curing type urethane-based adhesive. Thereafter, the ripening was carried out at 60 ° C for 7 days. The thickness of the subsequent agent was carried out at 12 g/m 2 (dry). The polyethylene terephthalate film and the electrolytic copper foil had a bonding strength of 10 N/cm.
還有,藉由蝕刻法而進行電解銅箔之圖案化,作成形成有連接由佈線部、非佈線部所構成之電路與電路間之佈線部的背光片。 In addition, patterning of the electrolytic copper foil is performed by an etching method, and a backlight sheet in which a wiring portion between a circuit composed of a wiring portion and a non-wiring portion and a circuit is formed is formed.
接著,為了形成著色絕緣層,將碳黑摻入紫外線硬化樹脂(商品名、UVR-150GR60、太陽油墨製造(股)製)中,相對於著色絕緣層之重量而言,使該碳黑之摻合比例成為3重量%的方式來形成著色絕緣劑。使用該著色絕緣劑,利用絲網板印刷而在上述背光片外圍邊緣之非佈線部形成著色絕緣層,作成附電路之背光片。還有,著色絕緣層係藉由1000mj/cm2之紫外線處理而使其硬化。著色絕緣層之厚度係20μm。 Next, in order to form a colored insulating layer, carbon black is incorporated into an ultraviolet curable resin (trade name, UVR-150GR60, manufactured by Sun Ink Co., Ltd.), and the carbon black is blended with respect to the weight of the colored insulating layer. The coloring insulating agent was formed in such a manner that the ratio became 3% by weight. Using the colored insulating agent, a colored insulating layer is formed on the non-wiring portion of the peripheral edge of the backlight sheet by screen printing, and a backlight sheet with a circuit is formed. Further, the colored insulating layer was cured by ultraviolet treatment at 1000 mj/cm 2 . The thickness of the colored insulating layer was 20 μm.
接著,作成200μm之封裝材的乙烯-乙酸乙烯酯共聚物(EVA)樹脂薄膜(不含紫外線吸收劑),在太陽能電池單元背面之連接電極與電路部分的部位開孔而重疊上述附電路之背光片,進一步依序配置太陽能電池單元、透明封裝材400μm、前面玻璃而進行模組積層,作成後觸點型太陽能電池模組。於重疊時,預先在連接電極與電路之接點部分塗部銀糊,以模組積層加熱予以接合的方式來進行。前面玻璃係使用厚度3mm之強化鈉 鈣玻璃。透明封裝材係使用EVA樹脂薄膜(不含紫外線吸收劑)。於模組積層中,在130℃下抽真空3分鐘,進一步在150℃下加熱30分鐘。 Next, an ethylene-vinyl acetate copolymer (EVA) resin film (without ultraviolet absorber) of a 200 μm package was formed, and a backlight of the above-mentioned circuit was superposed on a portion of the connection electrode and the circuit portion on the back surface of the solar cell. In the sheet, the solar cell unit, the transparent packaging material 400 μm, and the front glass were further sequentially laminated to form a rear contact type solar cell module. In the case of overlapping, the silver paste is applied to the contact portion between the connection electrode and the circuit in advance, and the module is laminated and heated to be bonded. The front glass is made of 3mm thick reinforced sodium. Calcium glass. The transparent encapsulant is an EVA resin film (without UV absorber). In the modular laminate, a vacuum was applied at 130 ° C for 3 minutes and further at 150 ° C for 30 minutes.
以下,針對本發明之比較例加以說明。 Hereinafter, a comparative example of the present invention will be described.
除了未形成實施例1之著色絕緣層之外,與實施例1同樣地作成後觸點型太陽能電池模組。 A rear contact type solar cell module was produced in the same manner as in Example 1 except that the colored insulating layer of Example 1 was not formed.
除了使用實施例1之著色絕緣層而在背光片整面形成之外,與實施例1同樣地作成後觸點型太陽能電池模組。著色絕緣層之厚度為20μm。 A rear contact type solar cell module was produced in the same manner as in Example 1 except that the colored insulating layer of Example 1 was used to form the entire surface of the backlight. The thickness of the colored insulating layer was 20 μm.
從所作成的後觸點型太陽能電池模組之前面玻璃側進行紫外線照射試驗。作為紫外線照射條件係以300至400nm之波長照射照度60W之光1000小時。於紫外線照射試驗後,進行聚對苯二甲酸乙二酯薄膜有無脆化之確認。作為評估方法,評估拉伸斷裂強度、接著強度分別是否符合下列之評估基準。 The ultraviolet irradiation test was performed from the glass side of the front side of the fabricated rear contact type solar cell module. As the ultraviolet irradiation condition, light having an illuminance of 60 W was irradiated for 1000 hours at a wavelength of 300 to 400 nm. After the ultraviolet irradiation test, the presence or absence of embrittlement of the polyethylene terephthalate film was confirmed. As an evaluation method, it was evaluated whether the tensile breaking strength and the subsequent strength respectively met the following evaluation criteria.
拉伸斷裂強度:300mm/分鐘之拉伸速度下,斷裂強度為3N/cm以上 Tensile breaking strength: at a tensile speed of 300 mm/min, the breaking strength is 3 N/cm or more.
接著強度:4N/cm以上 Then the strength: 4N/cm or more
將評估結果顯示於表1。 The evaluation results are shown in Table 1.
○:符合基準 ○: Compliance with the benchmark
×:未符合基準 ×: Not meeting the benchmark
於實施例1之背光片中,包含外圍邊緣之非佈線部,並未觀察到聚對苯二甲酸乙二酯薄膜之脆化。比較例2也同樣地,並未觀察到脆化。比較例1在外圍邊緣之非佈線部及背光片全體觀察到聚對苯二甲酸乙二酯薄膜之脆化。與著色絕緣層之接著也降低。可知藉由在附電路之背光片外圍邊緣的非佈線部形成著色絕緣層,能減少使用於絕緣層之絕緣樹脂,故能減低生產成本。 In the backlight of Example 1, the non-wiring portion including the peripheral edge was not observed, and embrittlement of the polyethylene terephthalate film was not observed. In the same manner as in Comparative Example 2, embrittlement was not observed. In Comparative Example 1, embrittlement of the polyethylene terephthalate film was observed in the non-wiring portion of the peripheral edge and the entire backlight sheet. The subsequent adhesion to the colored insulating layer is also reduced. It is understood that by forming a colored insulating layer on the non-wiring portion of the peripheral edge of the backlight of the circuit, the insulating resin used for the insulating layer can be reduced, so that the production cost can be reduced.
以下,針對有關本發明之第2實施形態之實施例加以說明。 Hereinafter, an embodiment of the second embodiment of the present invention will be described.
使用二液硬化型胺基甲酸酯系接著劑,利用乾式積層法貼合厚度25μm之氟樹脂的聚氟乙烯(PVF)樹脂薄膜(商品名、PV2111、Du Pont(股)製)、與厚度250μm之聚對苯二甲酸乙二酯醯胺(商品名、S-10、Toray(股)製)而形成積層體。 A polyvinyl fluoride (PVF) resin film (trade name, PV 2111, manufactured by Du Pont), and thickness of a fluororesin having a thickness of 25 μm is bonded by a dry lamination method using a two-liquid-curing urethane-based adhesive. 250 μm of polyethylene terephthalate decylamine (trade name, S-10, manufactured by Toray Co., Ltd.) to form a laminate.
接著,將相對於該接著劑為3重量%之碳黑摻入二液硬化型胺基甲酸酯系接著劑中而作成著色接著劑,使用該著色接著劑,藉由乾式積層法而將厚度35μm之電解銅箔貼合於上述積體之聚乙烯苯二甲酸乙二酯薄膜面。之後,在60℃下進行7天之熟成。著色接著劑之厚度為12g/m2(乾)。進一步,藉由蝕刻法而進行電解銅箔之圖案化,作成附電路之背光片。此時,聚對苯二甲酸乙二酯薄膜與電解銅箔之接著強度為10N/cm。 Next, carbon black of 3% by weight based on the adhesive is blended into a two-liquid curing type urethane-based adhesive to form a coloring adhesive, and the coloring adhesive is used to form a thickness by a dry lamination method. An electrolytic copper foil of 35 μm was attached to the surface of the above-mentioned polyethylene terephthalate film. Thereafter, the ripening was carried out at 60 ° C for 7 days. The thickness of the coloring adhesive was 12 g/m 2 (dry). Further, patterning of the electrolytic copper foil was carried out by an etching method to form a backlight sheet with a circuit. At this time, the bonding strength between the polyethylene terephthalate film and the electrolytic copper foil was 10 N/cm.
接著,作成200μm之封裝材的乙烯-乙酸乙烯酯共聚物(EVA)樹脂薄膜(不含紫外線吸收劑),在太陽能電池單元背面之連接電極與電路部分的部位開孔而重疊上述附電路之背光片,進一步依序配置太陽能電池單元、透明封裝材400μm、前面玻璃而進行模組積層,作成後觸點型太陽能電池模組。前面玻璃係使用厚度3mm之強化鈉鈣玻璃。透明封裝材係使用EVA樹脂薄膜(不含紫外線吸收劑)。 Next, an ethylene-vinyl acetate copolymer (EVA) resin film (without ultraviolet absorber) of a 200 μm package was formed, and a backlight of the above-mentioned circuit was superposed on a portion of the connection electrode and the circuit portion on the back surface of the solar cell. In the sheet, the solar cell unit, the transparent packaging material 400 μm, and the front glass were further sequentially laminated to form a rear contact type solar cell module. The front glass is made of reinforced soda lime glass with a thickness of 3 mm. The transparent encapsulant is an EVA resin film (without UV absorber).
使用將3重量%之碳黑摻入乙烯-甲基丙烯酸甲酯共聚物(EMMA)樹脂(商品名、Nucrel NC0809、三井Du Pont(股)製)中之著色接著性樹脂,利用擠出積層法貼合實施例3之積層體的聚對苯二甲酸乙二酯與電解銅箔35μm。著色接著性樹脂層之厚度為40μm。進一步藉由切削法而進行電解銅箔之圖案化,作成附電路之背光片。此時,聚對苯二甲酸乙二酯與銅箔之接著強度係10N/cm。其後,與實施例1同樣地進行而作成後觸點型太陽能電池模組。 Using a color-bonding resin in which 3% by weight of carbon black is incorporated into an ethylene-methyl methacrylate copolymer (EMMA) resin (trade name, Nucrel NC0809, manufactured by Mitsui Du Pont Co., Ltd.), using an extrusion lamination method The polyethylene terephthalate of the laminate of Example 3 and the electrolytic copper foil were 35 μm. The thickness of the colored adhesive resin layer was 40 μm. Further, patterning of the electrolytic copper foil was carried out by a cutting method to form a backlight sheet with a circuit. At this time, the adhesive strength of polyethylene terephthalate and copper foil was 10 N/cm. Thereafter, a post contact solar cell module was produced in the same manner as in the first embodiment.
以下,針對本發明之比較例加以說明。 Hereinafter, a comparative example of the present invention will be described.
除了不將碳黑添加於實施例2積層體之貼合聚對苯二甲酸乙二酯薄膜與電解銅箔的接著劑中之外,與實施例2同樣地作成附電路之背光片。聚對苯二甲酸乙二酯薄膜與電解銅箔之接著強度為11N/cm。其後,與實施例2同樣地進行而作成後觸點型太陽能電池模組。 A backlight sheet with a circuit was produced in the same manner as in Example 2 except that carbon black was not added to the adhesive of the polyethylene terephthalate film bonded to the laminate of Example 2 and the electrodeposited copper foil. The adhesive strength of the polyethylene terephthalate film and the electrolytic copper foil was 11 N/cm. Thereafter, a post-contact solar cell module was produced in the same manner as in Example 2.
除了不將碳黑摻入實施例3積層體之貼合聚對苯二甲酸乙二酯薄膜與電解銅箔的乙烯-甲基丙烯酸甲酯共聚物(EMMA)樹脂中之外,與實施例3同樣地作成附電路之背光片。聚對苯二甲酸乙二酯薄膜與電解銅箔之接著強度為18N/cm。其後,與實施例3同樣地進行而作成後觸點型太陽能電池模組。 Except that the carbon black was not incorporated into the ethylene-methyl methacrylate copolymer (EMMA) resin of the laminated polyethylene terephthalate film of the example 3 and the electrolytic copper foil, and Example 3 The backlight sheet with the circuit is also formed. The adhesive strength of the polyethylene terephthalate film and the electrolytic copper foil was 18 N/cm. Thereafter, a post contact solar cell module was produced in the same manner as in Example 3.
從所作成的後觸點型太陽能電池模組之受光側,亦即前面玻璃側進行紫外線照射試驗。於紫外線照射條件中,以300至400nm之波長照射照度60W之光1000小時。於紫外線照射試驗後,作為背光片-亦即聚對苯二甲酸乙二酯薄膜有無脆化之評估,測定拉伸斷裂伸度。 The ultraviolet irradiation test was performed from the light-receiving side of the formed rear contact type solar cell module, that is, the front glass side. In the ultraviolet irradiation condition, light having an illuminance of 60 W was irradiated at a wavelength of 300 to 400 nm for 1000 hours. After the ultraviolet irradiation test, the tensile elongation at break was measured as an evaluation of whether or not the backlight sheet, that is, the polyethylene terephthalate film, was embrittled.
於實施例2、3之已添加碳黑的太陽能電池模組中,並未觀察到聚對苯二甲酸乙二酯薄膜之脆化。但是,於比較例2、3未添加之碳黑的太陽能電池模組中,觀察到脆化。又,將碳黑添加於接著劑中,利用乾式積層法貼合之太陽能電池模組;或添加於接著性樹脂中,利用擠出積層法貼合之太陽能電池模組中任一種皆未觀察到脆化。得知藉由設置已摻合具有紫外線濾除性之顏料的著色接著層而能防止聚對苯二甲酸乙二酯薄膜-亦即背光片之脆化。 In the solar cell module to which carbon black was added in Examples 2 and 3, embrittlement of the polyethylene terephthalate film was not observed. However, embrittlement was observed in the solar cell module of carbon black which was not added in Comparative Examples 2 and 3. Further, the solar cell module in which the carbon black is added to the adhesive, bonded by the dry lamination method, or the solar cell module bonded to the adhesive resin by the extrusion lamination method is not observed. Embrittlement. It was found that the embrittlement of the polyethylene terephthalate film, that is, the backlight sheet, can be prevented by providing a colored adhesive layer which has been blended with the ultraviolet-filtering pigment.
1A‧‧‧紫外線 1A‧‧‧UV
11‧‧‧透明基材 11‧‧‧Transparent substrate
12‧‧‧透明封裝材 12‧‧‧Transparent packaging materials
13‧‧‧太陽電池單元 13‧‧‧Solar battery unit
14‧‧‧封裝材 14‧‧‧Package
16‧‧‧背光片 16‧‧‧Backlight
17‧‧‧附電路之背光片 17‧‧‧Backlit film with circuit
18‧‧‧連接電極 18‧‧‧Connecting electrode
19‧‧‧連接材 19‧‧‧Connecting materials
111‧‧‧著色絕緣層 111‧‧‧Colored insulation
112‧‧‧接著層 112‧‧‧Next layer
120‧‧‧電路 120‧‧‧ Circuitry
121‧‧‧佈線部 121‧‧‧Wiring Department
140‧‧‧外圍邊緣 140‧‧‧ peripheral edge
141‧‧‧非佈線部 141‧‧‧ Non-wiring department
150‧‧‧本發明之後觸點型太陽能電池模組 150‧‧‧Contact solar cell module after the invention
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