CN115725247A - Conductive backboard for photovoltaic module and preparation method thereof - Google Patents
Conductive backboard for photovoltaic module and preparation method thereof Download PDFInfo
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- CN115725247A CN115725247A CN202211369870.7A CN202211369870A CN115725247A CN 115725247 A CN115725247 A CN 115725247A CN 202211369870 A CN202211369870 A CN 202211369870A CN 115725247 A CN115725247 A CN 115725247A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 38
- 230000001070 adhesive effect Effects 0.000 claims abstract description 38
- 239000004952 Polyamide Substances 0.000 claims abstract description 35
- 229920002647 polyamide Polymers 0.000 claims abstract description 35
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000002904 solvent Substances 0.000 claims abstract description 17
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims description 54
- 238000002156 mixing Methods 0.000 claims description 53
- 239000004594 Masterbatch (MB) Substances 0.000 claims description 35
- 238000003756 stirring Methods 0.000 claims description 28
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 22
- 238000001125 extrusion Methods 0.000 claims description 22
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 21
- 229920002292 Nylon 6 Polymers 0.000 claims description 20
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 17
- 238000001035 drying Methods 0.000 claims description 17
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 238000000465 moulding Methods 0.000 claims description 16
- 229920002635 polyurethane Polymers 0.000 claims description 15
- 239000004814 polyurethane Substances 0.000 claims description 15
- 238000002390 rotary evaporation Methods 0.000 claims description 14
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 12
- 230000007062 hydrolysis Effects 0.000 claims description 12
- 238000006460 hydrolysis reaction Methods 0.000 claims description 12
- 235000011037 adipic acid Nutrition 0.000 claims description 11
- 239000001361 adipic acid Substances 0.000 claims description 11
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 claims description 10
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N salicylic acid phenyl ester Natural products OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 claims description 10
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 9
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 9
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical group O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 claims description 8
- 229920000147 Styrene maleic anhydride Polymers 0.000 claims description 8
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 8
- 239000003963 antioxidant agent Substances 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 8
- 239000012752 auxiliary agent Substances 0.000 claims description 8
- 239000005457 ice water Substances 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- 230000004224 protection Effects 0.000 claims description 7
- 238000010992 reflux Methods 0.000 claims description 7
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 7
- 239000012498 ultrapure water Substances 0.000 claims description 7
- 238000001291 vacuum drying Methods 0.000 claims description 7
- 238000005406 washing Methods 0.000 claims description 7
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000003381 stabilizer Substances 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 239000000326 ultraviolet stabilizing agent Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 9
- 230000001965 increasing effect Effects 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract description 3
- 230000003628 erosive effect Effects 0.000 abstract description 3
- 238000010248 power generation Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000005286 illumination Methods 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000002994 raw material Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920003188 Nylon 3 Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 150000001408 amides Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Photovoltaic Devices (AREA)
Abstract
The invention relates to the technical field of photovoltaics, in particular to a conductive back plate for a photovoltaic module and a preparation method thereof; the invention uses polyamide as a base material, prepares the branched modified polyamide with a branched structure on the basis, utilizes a spherical-like structure to reduce the viscosity of a polyamide system and increase the fluidity, thereby increasing the dispersion of substances such as titanium dioxide and the like, and avoiding the addition of a solvent, thereby enhancing the resistance of the polyamide system to water vapor erosion; on the basis, the conductive circuit is further prepared by using the conductive adhesive, so that the electrode of the photovoltaic module can be led into the back, the illumination area of the front is further increased, and the power generation efficiency is improved.
Description
Technical Field
The invention relates to the technical field of photovoltaics, in particular to a conductive back plate for a photovoltaic module and a preparation method thereof.
Background
In recent years, with the development of the photovoltaic industry, the photovoltaic module industry in China is also rapidly developed. The electric conduction is an important component in a photovoltaic power generation system, and has the functions of reducing the shading area of the front side of the photovoltaic and improving the photovoltaic efficiency, but the existing conductive back plate for the photovoltaic module is usually made of fluorine-containing raw materials, the preparation process is accompanied by great environmental hazard, and different back plate films are laminated and combined by adopting an adhesive, so that the deformation resistance is low.
Disclosure of Invention
In order to solve the technical problems, the invention provides the following technical scheme: a photovoltaic module is with electrically conductive backplate, has following technical characterstic: the conductive back plate for the photovoltaic module comprises a wear-resistant weather-resistant layer, a supporting layer and a conductive layer from outside to inside;
the wear-resistant weather-resistant layer and the supporting layer are prepared by coextrusion, and the supporting layer and the conducting layer are connected by polyurethane adhesive;
the conducting layer consists of a conducting circuit area and an insulating area, wherein the conducting circuit area consists of conducting adhesive, and the insulating area consists of polyurethane adhesive after drying and curing;
the end point of the conductive circuit area is provided with a protruding conductive interface which can be combined with a photovoltaic module;
wherein the thickness of the wear-resistant weather-resistant layer is 30-80 μm; the thickness of the supporting layer is 90-200 μm; the thickness of the conductive layer is 30-100 μm.
Further, the wear-resistant weather-resistant layer comprises the following components in parts by weight: 18-26 parts of branched modified polyamide, 25-40 parts of polyamide 6, 10-15 parts of polyamide 66, 10-20 parts of titanium dioxide, 1-2.5 parts of ultraviolet-resistant stabilizer, 0.7-1.2 parts of antioxidant and 1-1.5 parts of hydrolysis-resistant additive;
the support layer comprises the following components: 15-25 parts of polyamide 6, 30-54 parts of polyamide 66 and 1.5-3 parts of a compatilizer. Further, the anti-ultraviolet stabilizer is phenyl o-hydroxybenzoate; the antioxidant is one or more of antioxidant 1010 and antioxidant S9228.
Further, the compatilizer is styrene-maleic anhydride copolymer; the hydrolysis-resistant auxiliary agent is polycarbodiimide.
A preparation method of a conductive back plate for a photovoltaic module comprises the following steps:
s1, preparing a wear-resistant weather-resistant layer;
s11, dissolving 4 parts of p-phenylenediamine in N-methyl pyrrolidone by mole, carrying out ice water bath treatment, uniformly mixing, adding an N-methyl pyrrolidone solution dissolved with ditrimethylolpropane tetraacrylate, stirring and mixing for 15-30min, heating to 35-40 ℃, stirring and reacting for 4-6h, and carrying out rotary evaporation to remove redundant solvent to obtain an amino-terminated prepolymer;
s12, dissolving the amino-terminated prepolymer prepared in the step S11 in N-methylpyrrolidone in a molar ratio, adding adipic acid, uniformly stirring, adding dibutyltin dilaurate, heating to 60-80 ℃, carrying out reflux stirring reaction for 3-5 hours, heating to 120-140 ℃, continuing the reaction for 10-12 hours, carrying out rotary evaporation to remove redundant solvent after the reaction is finished, washing with ultrapure water, and carrying out vacuum drying to constant weight to obtain branched modified polyamide;
s13, mixing titanium dioxide, an ultraviolet-resistant stabilizer, an antioxidant, a hydrolysis-resistant auxiliary agent and branched modified polyamide, blending at 200-220 ℃ for 30-45min, adding polyamide 6 and polyamide 66, heating to 230-240 ℃, continuing blending for 30-45min, performing extrusion molding, and cooling to room temperature to obtain wear-resistant and weather-resistant master batches; (ii) a
S2, blending polyamide 6, polyamide 66 and a compatilizer, heating to 240-260 ℃, blending for 45-60min, extruding for molding, and cooling to room temperature to obtain support layer master batches;
s3, co-extruding and molding the wear-resistant and weather-resistant layer master batch prepared in the step S1 and the support layer master batch prepared in the step S2, preparing a wear-resistant and weather-resistant layer by using the wear-resistant and weather-resistant layer master batch, preparing a support layer by using the support layer master batch, and co-extruding to prepare the wear-resistant and weather-resistant layer and the support layer which are combined together;
s4, preparing a conductive layer
Processing the conductive adhesive into a graphic circuit, coating the graphic circuit on the surface of the support layer, arranging a conductive port at the end point of the conductive circuit, heating to 100-110 ℃, drying for 2-3min, coating a polyurethane adhesive on the surface of the conductive circuit, heating to 110-120 ℃, drying for 2-4min, and removing dry adhesive at the conductive port to obtain the conductive backboard for the photovoltaic module.
In step S1, the molar ratio of p-phenylenediamine, ditrimethylolpropane tetraacrylate, adipic acid, and dibutyltin dilaurate is (3-5): 1: (3-5): (0.05-0.08).
Further, in step S13, the extrusion temperature is 240-250 ℃.
Further, in step S2, the extrusion temperature is 250-260 ℃.
In the step S3, the co-extrusion temperature is 250-255 ℃.
The existing photovoltaic back plate is usually prepared by adopting a fluorine-containing raw material film to enhance the uvioresistant performance of the photovoltaic back plate, but the fluorine-containing raw material often causes great environmental hazard in the preparation process, so that the photovoltaic conductive back plate taking polyamide as a base material is prepared, and more titanium dioxide materials are added into the photovoltaic conductive back plate as an inorganic uvioresistant agent and play a role in strengthening; however, the polyamide material has poor water vapor insulation performance, so in order to reduce water vapor erosion, when the wear-resistant weather-resistant layer on the outer side is prepared, a solvent is not added to reduce the material viscosity, and the branched modified polyamide material with a branched structure is prepared; according to the invention, p-phenylenediamine is used as a raw material to carry out graft modification on ditrimethylolpropane tetraacrylate, so that an amino-terminated prepolymer with an end group having 8 amino groups is prepared, and then the amino-terminated prepolymer is reacted with adipic acid to finally prepare branched modified polyamide with an amide structure, wherein the branched modified polyamide has a sphere-like structure, can effectively reduce the viscosity of a polyamide system, and increase the fluidity, so that the dispersion of titanium dioxide in the polyamide system is enhanced; meanwhile, one of the raw materials of the polyamide material prepared by the method is p-phenylenediamine, contains more nitrogen elements, has good flame retardant property, introduces a rigid benzene ring, can effectively improve the surface rigidity and wear resistance, has high carbon element ratio, is an excellent char forming agent, and has excellent flame retardant property.
On this basis, this application further has increased ultraviolet resistance stabilizer and hydrolytic resistance agent to improve polyamide material's performance, and utilize multilayer crowded mode altogether, combine wear-resisting resistant layer and supporting layer together, compare in the mode that the lamination combines, the backplate film that multilayer crowded preparation was altogether has better bonding performance, faces cold and hot circulation and has stronger performance.
The present application then further prepares the pattern lines using the conductive paste and uses the existing polyurethane adhesive coating as an insulating layer to form the conductive lines.
Compared with the prior art, the invention has the following beneficial effects: according to the invention, polyamide is used as a base material, the branched modified polyamide with a branched structure is prepared on the basis, and the viscosity of a polyamide system is reduced by utilizing a spherical structure, so that the fluidity is increased, the dispersion of substances such as titanium dioxide and the like is increased, the addition of a solvent is avoided, and the resistance of the polyamide system to water vapor erosion is enhanced; on the basis, the conductive circuit is further prepared by using the conductive adhesive, so that the electrode of the photovoltaic module can be led into the back, the front illumination area is further increased, and the power generation efficiency is improved.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the embodiment and the comparative example of the application, the conductive adhesive is conductive silver adhesive sold by the Feiteng science and technology and with the model number of TH-7260; the used titanium dioxide is sold by the Law chemical industry with the model of R-930 titanium dioxide; the polyurethane adhesive used was a CR600 series two-component polyurethane adhesive sold by shanghai shouxing industries ltd.
Example 1.
A preparation method of a conductive back plate for a photovoltaic module comprises the following steps:
s1, preparing a wear-resistant weather-resistant layer;
s11, dissolving 3 mol parts of p-phenylenediamine in N-methyl pyrrolidone, carrying out ice-water bath treatment, uniformly mixing, adding an N-methyl pyrrolidone solution dissolved with 1 mol part of ditrimethylolpropane tetraacrylate, stirring and mixing for 15min, heating to 35 ℃, stirring and reacting for 4h, and carrying out rotary evaporation to remove redundant solvent to obtain an amino-terminated prepolymer;
s12, dissolving the amino-terminated prepolymer prepared in the step S11 in N-methyl pyrrolidone, adding 3 mol parts of adipic acid under protection of nitrogen atmosphere, uniformly stirring, adding 0.05 mol part of dibutyltin dilaurate, heating to 60 ℃, carrying out reflux stirring reaction for 3 hours, heating to 120 ℃, continuing to react for 10 hours, carrying out rotary evaporation to remove redundant solvent after the reaction is finished, washing with ultrapure water, and carrying out vacuum drying to constant weight to obtain branched modified polyamide;
s13, mixing 10 parts by weight of titanium dioxide, 1 part by weight of phenyl ortho-hydroxybenzoate, 0.7 part by weight of antioxidant 1010, 1 part by weight of polycarbodiimide hydrolysis-resistant assistant and 18 parts by weight of branched modified polyamide, blending for 30min at 200 ℃, adding 25 parts by weight of polyamide 6 and 10 parts by weight of polyamide 66, heating to 240 ℃, continuing blending for 30min, performing extrusion molding at 240 ℃, and cooling to room temperature to obtain wear-resistant and weather-resistant layer master batches;
s2, blending 15 parts of polyamide 6, 30 parts of polyamide 66 and 1.5 parts of styrene-maleic anhydride copolymer in parts by weight, heating to 240 ℃, blending for 45min, extruding and molding at 250 ℃, and cooling to room temperature to obtain support layer master batches;
s3, co-extruding and molding the wear-resistant weather-resistant layer master batch prepared in the step S1 and the supporting layer master batch prepared in the step S2, preparing a wear-resistant weather-resistant layer by using the wear-resistant weather-resistant layer master batch, preparing a supporting layer by using the supporting layer master batch, and co-extruding to prepare a wear-resistant weather-resistant layer and a supporting layer which are combined together, wherein the co-extrusion temperature is 250 ℃;
s4, preparing a conductive layer
Processing the conductive adhesive into a graphic circuit, coating the graphic circuit on the surface of the supporting layer, arranging a conductive port at the end position of the conductive circuit, heating to 100 ℃, drying for 2min, coating a polyurethane adhesive on the surface of the conductive circuit, heating to 110 ℃, drying for 2min, and removing dry adhesive at the conductive port to obtain the conductive backboard for the photovoltaic module.
Example 2.
Compared with the embodiment 1, the embodiment increases the addition amount of the p-phenylenediamine;
a preparation method of a conductive back plate for a photovoltaic module comprises the following steps:
s1, preparing a wear-resistant weather-resistant layer;
s11, dissolving 5 mol parts of p-phenylenediamine in N-methyl pyrrolidone, carrying out ice-water bath treatment, uniformly mixing, adding an N-methyl pyrrolidone solution dissolved with 1 mol part of ditrimethylolpropane tetraacrylate, stirring and mixing for 15min, heating to 35 ℃, stirring and reacting for 4h, and carrying out rotary evaporation to remove redundant solvent to obtain an amino-terminated prepolymer;
s12, dissolving the amino-terminated prepolymer prepared in the step S11 in N-methyl pyrrolidone, adding 3 mol parts of adipic acid under protection of nitrogen atmosphere, uniformly stirring, adding 0.05 mol part of dibutyltin dilaurate, heating to 60 ℃, carrying out reflux stirring reaction for 3 hours, heating to 120 ℃, continuing to react for 10 hours, carrying out rotary evaporation to remove redundant solvent after the reaction is finished, washing with ultrapure water, and carrying out vacuum drying to constant weight to obtain branched modified polyamide;
s13, mixing 10 parts by weight of titanium dioxide, 1 part by weight of phenyl ortho-hydroxybenzoate, 0.7 part by weight of antioxidant 1010, 1 part by weight of polycarbodiimide hydrolysis-resistant auxiliary agent and 18 parts by weight of branched modified polyamide, blending for 30min at 200 ℃, adding 25 parts by weight of polyamide 6 and 10 parts by weight of polyamide 66, heating to 240 ℃, continuing blending for 30min, performing extrusion molding at 240 ℃, and cooling to room temperature to obtain wear-resistant and weather-resistant layer master batches;
s2, blending 15 parts of polyamide 6, 30 parts of polyamide 66 and 1.5 parts of styrene-maleic anhydride copolymer in parts by weight, heating to 240 ℃, blending for 45min, extruding and molding at 250 ℃, and cooling to room temperature to obtain support layer master batches;
s3, co-extruding and molding the wear-resistant weather-resistant layer master batch prepared in the step S1 and the supporting layer master batch prepared in the step S2, preparing a wear-resistant weather-resistant layer by using the wear-resistant weather-resistant layer master batch, preparing a supporting layer by using the supporting layer master batch, and co-extruding to prepare a wear-resistant weather-resistant layer and a supporting layer which are combined together, wherein the co-extrusion temperature is 250 ℃;
s4, preparing a conductive layer
Processing the conductive adhesive into a graphic circuit, coating the graphic circuit on the surface of the supporting layer, arranging a conductive port at the end position of the conductive circuit, heating to 100 ℃, drying for 2min, coating a polyurethane adhesive on the surface of the conductive circuit, heating to 110 ℃, drying for 2min, and removing dry adhesive at the conductive port to obtain the conductive backboard for the photovoltaic module.
Example 3.
Compared with example 1, this example increases the amount of adipic acid added in step S12;
a preparation method of a conductive back plate for a photovoltaic module comprises the following steps:
s1, preparing a wear-resistant weather-resistant layer;
s11, dissolving 3 molar parts of p-phenylenediamine in N-methyl pyrrolidone, carrying out ice-water bath treatment, uniformly mixing, adding an N-methyl pyrrolidone solution in which 1 molar part of ditrimethylolpropane tetraacrylate is dissolved, stirring and mixing for 15min, heating to 35 ℃, stirring and reacting for 4h, and carrying out rotary evaporation to remove excess solvent to obtain an amino-terminated prepolymer;
s12, dissolving the amino-terminated prepolymer prepared in the step S11 in N-methyl pyrrolidone, adding 5 mol parts of adipic acid under protection of nitrogen atmosphere, uniformly stirring, adding 0.05 mol part of dibutyltin dilaurate, heating to 60 ℃, carrying out reflux stirring reaction for 3 hours, heating to 120 ℃, continuing to react for 10 hours, carrying out rotary evaporation to remove redundant solvent after the reaction is finished, washing with ultrapure water, and carrying out vacuum drying to constant weight to obtain branched modified polyamide;
s13, mixing 10 parts by weight of titanium dioxide, 1 part by weight of phenyl ortho-hydroxybenzoate, 0.7 part by weight of antioxidant 1010, 1 part by weight of polycarbodiimide hydrolysis-resistant auxiliary agent and 18 parts by weight of branched modified polyamide, blending for 30min at 200 ℃, adding 25 parts by weight of polyamide 6 and 10 parts by weight of polyamide 66, heating to 240 ℃, continuing blending for 30min, performing extrusion molding at 240 ℃, and cooling to room temperature to obtain wear-resistant and weather-resistant layer master batches;
s2, blending 15 parts of polyamide 6 and 30 parts of polyamide 66 with 1.5 parts of styrene-maleic anhydride copolymer in parts by weight, heating to 240 ℃, blending for 45min, extruding and molding at 250 ℃, and cooling to room temperature to obtain supporting layer master batches;
s3, co-extruding and molding the wear-resistant weather-resistant layer master batch prepared in the step S1 and the supporting layer master batch prepared in the step S2, preparing a wear-resistant weather-resistant layer by using the wear-resistant weather-resistant layer master batch, preparing a supporting layer by using the supporting layer master batch, and co-extruding to prepare a wear-resistant weather-resistant layer and a supporting layer which are combined together, wherein the co-extrusion temperature is 250 ℃;
s4, preparing a conductive layer
Processing the conductive adhesive into a graphic circuit, coating the graphic circuit on the surface of the supporting layer, arranging a conductive port at the end point position of the conductive circuit, heating to 100 ℃, drying for 2min, coating a polyurethane adhesive on the surface of the conductive circuit, heating to 110 ℃, drying for 2min, and removing dry adhesive at the conductive port to obtain the conductive back plate for the photovoltaic module.
Example 4.
This example increased the amount of addition of the branched modified polyamide in step S13 compared to example 1;
a preparation method of a conductive back plate for a photovoltaic module comprises the following steps:
s1, preparing a wear-resistant weather-resistant layer;
s11, dissolving 3 mol parts of p-phenylenediamine in N-methyl pyrrolidone, carrying out ice-water bath treatment, uniformly mixing, adding an N-methyl pyrrolidone solution dissolved with 1 mol part of ditrimethylolpropane tetraacrylate, stirring and mixing for 15min, heating to 35 ℃, stirring and reacting for 4h, and carrying out rotary evaporation to remove redundant solvent to obtain an amino-terminated prepolymer;
s12, dissolving the amino-terminated prepolymer prepared in the step S11 in N-methyl pyrrolidone, protecting the nitrogen atmosphere, adding 3 mol parts of adipic acid, uniformly stirring, adding 0.05 mol part of dibutyltin dilaurate, heating to 60 ℃, carrying out reflux stirring reaction for 3 hours, heating to 120 ℃, continuing the reaction for 10 hours, carrying out rotary evaporation to remove redundant solvent after the reaction is finished, washing with ultrapure water, and carrying out vacuum drying to constant weight to obtain branched modified polyamide;
s13, mixing 10 parts by weight of titanium dioxide, 1 part by weight of phenyl ortho-hydroxybenzoate, 0.7 part by weight of antioxidant 1010, 1 part by weight of polycarbodiimide hydrolysis-resistant assistant and 26 parts by weight of branched modified polyamide, blending for 30min at 200 ℃, adding 25 parts by weight of polyamide 6 and 10 parts by weight of polyamide 66, heating to 240 ℃, continuing blending for 30min, performing extrusion molding at 240 ℃, and cooling to room temperature to obtain wear-resistant and weather-resistant layer master batch;
s2, blending 15 parts of polyamide 6 and 30 parts of polyamide 66 with 1.5 parts of styrene-maleic anhydride copolymer in parts by weight, heating to 240 ℃, blending for 45min, extruding and molding at 250 ℃, and cooling to room temperature to obtain supporting layer master batches;
s3, co-extruding and molding the wear-resistant weather-resistant layer master batch prepared in the step S1 and the supporting layer master batch prepared in the step S2, preparing a wear-resistant weather-resistant layer by using the wear-resistant weather-resistant layer master batch, preparing a supporting layer by using the supporting layer master batch, and co-extruding to prepare a wear-resistant weather-resistant layer and a supporting layer which are combined together, wherein the co-extrusion temperature is 250 ℃;
s4, preparing a conductive layer
Processing the conductive adhesive into a graphic circuit, coating the graphic circuit on the surface of the supporting layer, arranging a conductive port at the end position of the conductive circuit, heating to 100 ℃, drying for 2min, coating a polyurethane adhesive on the surface of the conductive circuit, heating to 110 ℃, drying for 2min, and removing dry adhesive at the conductive port to obtain the conductive backboard for the photovoltaic module.
Example 5.
A preparation method of a conductive back plate for a photovoltaic module comprises the following steps:
s11, dissolving 5 parts of p-phenylenediamine in N-methyl pyrrolidone by mole, carrying out ice water bath treatment, uniformly mixing, adding an N-methyl pyrrolidone solution dissolved with 1 part of ditrimethylolpropane tetraacrylate, stirring and mixing for 30min, heating to 40 ℃, stirring and reacting for 6h, and carrying out rotary evaporation to remove redundant solvent to obtain an amino-terminated prepolymer;
s12, dissolving the amino-terminated prepolymer prepared in the step S11 in N-methyl pyrrolidone, adding 5 parts of adipic acid under protection of nitrogen atmosphere, uniformly stirring, adding 0.08 part of dibutyltin dilaurate, heating to 80 ℃, carrying out reflux stirring reaction for 5 hours, heating to 140 ℃, continuing to react for 12 hours, carrying out rotary evaporation to remove redundant solvent after the reaction is finished, washing with ultrapure water, and carrying out vacuum drying to constant weight to obtain branched modified polyamide;
s13, mixing 20 parts by weight of titanium dioxide, 2.5 parts by weight of phenyl ortho-hydroxybenzoate, 1.2 parts by weight of antioxidant 1010, 1.5 parts by weight of polycarbodiimide hydrolysis-resistant auxiliary agent and 26 parts by weight of branched modified polyamide, blending for 45min at 220 ℃, adding 40 parts by weight of polyamide 6 and 15 parts by weight of polyamide 66, heating to 240 ℃, continuing blending for 45min, extruding and molding at 260 ℃, and cooling to room temperature to obtain wear-resistant and weather-resistant layer master batch;
s2, blending 25 parts of polyamide 6, 54 parts of polyamide 66 and 3 parts of styrene-maleic anhydride copolymer, heating to 260 ℃, blending for 60min, extruding and molding at 260 ℃, and cooling to room temperature to obtain support layer master batches;
s3, co-extruding and molding the wear-resistant weather-resistant layer master batch prepared in the step S1 and the supporting layer master batch prepared in the step S2, preparing a wear-resistant weather-resistant layer by using the wear-resistant weather-resistant layer master batch, preparing a supporting layer by using the supporting layer master batch, and co-extruding to prepare a wear-resistant weather-resistant layer and a supporting layer which are combined together, wherein the co-extrusion temperature is 255 ℃;
s4, preparing a conductive layer;
processing the conductive adhesive into a graphic circuit, coating the graphic circuit on the surface of the support layer, arranging a conductive port at the end point position of the conductive circuit, heating to 110 ℃, drying for 3min, coating a polyurethane adhesive on the surface of the conductive circuit, heating to 120 ℃, drying for 4min, and removing dry adhesive at the conductive port to obtain the conductive back plate for the photovoltaic module.
Comparative example 1.
In contrast to example 1, the present application will not prepare a branched modified polyamide;
a preparation method of a conductive back plate for a photovoltaic module comprises the following steps:
s1, preparing a wear-resistant weather-resistant layer;
mixing 10 parts of titanium dioxide, 1 part of phenyl ortho-hydroxybenzoate, 0.7 part of antioxidant 1010, 1 part of polycarbodiimide hydrolysis-resistant auxiliary agent, 25 parts of polyamide 6 and 10 parts of polyamide 66 in parts by weight, heating to 240 ℃, continuously blending for 30min, performing extrusion molding at 240 ℃, and cooling to room temperature to obtain wear-resistant and weather-resistant layer master batch;
s2, blending 15 parts of polyamide 6 and 30 parts of polyamide 66 with 1.5 parts of styrene-maleic anhydride copolymer in parts by weight, heating to 240 ℃, blending for 45min, extruding and molding at 250 ℃, and cooling to room temperature to obtain supporting layer master batches;
s3, carrying out co-extrusion molding on the wear-resistant weather-resistant layer master batch prepared in the step S1 and the supporting layer master batch prepared in the step S2, preparing a wear-resistant weather-resistant layer by using the wear-resistant weather-resistant layer master batch, preparing a supporting layer by using the supporting layer master batch, and carrying out co-extrusion to prepare the wear-resistant weather-resistant layer and the supporting layer which are combined together, wherein the co-extrusion temperature is 250 ℃;
s4, preparing a conductive layer
Processing the conductive adhesive into a graphic circuit, coating the graphic circuit on the surface of the supporting layer, arranging a conductive port at the end position of the conductive circuit, heating to 100 ℃, drying for 2min, coating a polyurethane adhesive on the surface of the conductive circuit, heating to 110 ℃, drying for 2min, and removing dry adhesive at the conductive port to obtain the conductive backboard for the photovoltaic module.
And (3) detection: neutral salt spray experiments were performed on examples 1-5 and comparative example 1; adding the samples prepared in the examples 1-5 and the comparative example 1 into a muffle furnace, heating to 150 ℃, keeping the temperature for 10 hours, taking out, rapidly cooling by using ice water, and detecting the external cracks of the samples after repeating for 5 times; a universal press is used for pressing the back plate until the appearance is cracked, and the maximum pressure resistance is detected; the results of the tests are shown in the following table;
finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The utility model provides a photovoltaic module is with electrically conductive backplate which characterized in that: the conductive backboard for the photovoltaic module comprises a wear-resistant weather-resistant layer, a supporting layer and a conductive layer from outside to inside;
the wear-resistant weather-resistant layer and the supporting layer are prepared by co-extrusion, and the supporting layer and the conducting layer are connected by polyurethane adhesive;
the conductive layer consists of a conductive circuit area and an insulating area, wherein the conductive circuit area consists of conductive adhesive, and the insulating area consists of dried and cured polyurethane adhesive;
the end point of the conductive circuit area is provided with a protruding conductive interface which can be combined with a photovoltaic module;
wherein the thickness of the wear-resistant weather-resistant layer is 30-80 μm; the thickness of the supporting layer is 90-200 μm; the thickness of the conductive layer is 30-100 μm.
2. The conductive backsheet for a photovoltaic module according to claim 1, characterized in that: the wear-resistant weather-resistant layer comprises the following components in parts by weight: 18-26 parts of branched modified polyamide, 25-40 parts of polyamide 6, 10-15 parts of polyamide 66, 10-20 parts of titanium dioxide, 1-2.5 parts of ultraviolet-resistant stabilizer, 0.7-1.2 parts of antioxidant and 1-1.5 parts of hydrolysis-resistant additive;
the support layer comprises the following components: 15-25 parts of polyamide 6, 30-54 parts of polyamide 66 and 1.5-3 parts of a compatilizer.
3. The conductive backsheet for photovoltaic modules according to claim 2, wherein: the anti-ultraviolet stabilizer is phenyl o-hydroxybenzoate; the antioxidant is one or more of antioxidant 1010 and antioxidant S9228.
4. The conductive backsheet for photovoltaic modules according to claim 2, wherein: the compatilizer is styrene-maleic anhydride copolymer; the hydrolysis-resistant auxiliary agent is polycarbodiimide.
5. A preparation method of a conductive back plate for a photovoltaic module is characterized by comprising the following steps:
s1, preparing a wear-resistant weather-resistant layer;
s11, dissolving 4 parts of p-phenylenediamine in N-methyl pyrrolidone by mole, carrying out ice water bath treatment, uniformly mixing, adding an N-methyl pyrrolidone solution dissolved with ditrimethylolpropane tetraacrylate, stirring and mixing for 15-30min, heating to 35-40 ℃, stirring and reacting for 4-6h, and carrying out rotary evaporation to remove redundant solvent to obtain an amino-terminated prepolymer;
s12, dissolving the amino-terminated prepolymer prepared in the step S11 in N-methyl pyrrolidone, adding adipic acid under protection of nitrogen atmosphere, uniformly stirring, adding dibutyltin dilaurate, heating to 60-80 ℃, carrying out reflux stirring reaction for 3-5h, heating to 120-140 ℃, continuing to react for 10-12h, carrying out rotary evaporation to remove redundant solvent after the reaction is finished, washing with ultrapure water, and carrying out vacuum drying to constant weight to obtain branched modified polyamide;
s13, mixing titanium dioxide, an ultraviolet-resistant stabilizer, an antioxidant, a hydrolysis-resistant auxiliary agent and branched modified polyamide, blending at 200-220 ℃ for 30-45min, adding polyamide 6 and polyamide 66, heating to 230-240 ℃, continuing blending for 30-45min, performing extrusion molding, and cooling to room temperature to obtain wear-resistant and weather-resistant master batches; (ii) a
S2, blending polyamide 6, polyamide 66 and a compatilizer, heating to 240-260 ℃, blending for 45-60min, extruding for molding, and cooling to room temperature to obtain support layer master batches;
s3, co-extruding and molding the wear-resistant and weather-resistant layer master batch prepared in the step S1 and the support layer master batch prepared in the step S2, preparing a wear-resistant and weather-resistant layer by using the wear-resistant and weather-resistant layer master batch, preparing a support layer by using the support layer master batch, and co-extruding to prepare the wear-resistant and weather-resistant layer and the support layer which are combined together;
s4, preparing a conductive layer
Processing the conductive adhesive into a graphic circuit, coating the graphic circuit on the surface of the support layer, arranging a conductive port at the end point of the conductive circuit, heating to 100-110 ℃, drying for 2-3min, coating a polyurethane adhesive on the surface of the conductive circuit, heating to 110-120 ℃, drying for 2-4min, and removing dry adhesive at the conductive port to obtain the conductive backboard for the photovoltaic module.
6. The method for preparing the conductive backsheet for the photovoltaic module according to claim 5, wherein: in the step S1, the molar ratio of the p-phenylenediamine, the ditrimethylolpropane tetraacrylate, the adipic acid and the dibutyltin dilaurate is (3-5) in parts by mole: 1: (3-5): (0.05-0.08).
7. The method for preparing the conductive backsheet for the photovoltaic module according to claim 5, wherein: in step S13, the extrusion temperature is 240-250 ℃.
8. The method for preparing the conductive backsheet for the photovoltaic module according to claim 5, wherein: in step S2, the extrusion temperature is 250-260 ℃.
9. The method for preparing the conductive backsheet for the photovoltaic module according to claim 5, wherein: in the step S3, the co-extrusion temperature is 250-255 ℃.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104143578A (en) * | 2014-07-31 | 2014-11-12 | 苏州尚善新材料科技有限公司 | Solar energy backing plate and manufacturing method thereof |
| CN104332517A (en) * | 2014-11-17 | 2015-02-04 | 苏州尚善新材料科技有限公司 | Back contact type solar cell electric conduction backboard |
| CN111564502A (en) * | 2020-04-24 | 2020-08-21 | 泰州隆基乐叶光伏科技有限公司 | Conductive back plate and production method thereof, photovoltaic module and production method thereof |
| CN216902970U (en) * | 2021-10-13 | 2022-07-05 | 浙大宁波理工学院 | Photovoltaic module |
-
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- 2022-11-03 CN CN202211369870.7A patent/CN115725247A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104143578A (en) * | 2014-07-31 | 2014-11-12 | 苏州尚善新材料科技有限公司 | Solar energy backing plate and manufacturing method thereof |
| CN104332517A (en) * | 2014-11-17 | 2015-02-04 | 苏州尚善新材料科技有限公司 | Back contact type solar cell electric conduction backboard |
| CN107658354A (en) * | 2014-11-17 | 2018-02-02 | 帝斯曼尚善太阳能科技（苏州）有限公司 | A kind of back contact solar battery conductive backings |
| CN111564502A (en) * | 2020-04-24 | 2020-08-21 | 泰州隆基乐叶光伏科技有限公司 | Conductive back plate and production method thereof, photovoltaic module and production method thereof |
| CN216902970U (en) * | 2021-10-13 | 2022-07-05 | 浙大宁波理工学院 | Photovoltaic module |
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