CN104332436B - A kind of water cooling chuck structure inside etching machine - Google Patents
A kind of water cooling chuck structure inside etching machine Download PDFInfo
- Publication number
- CN104332436B CN104332436B CN201410666275.9A CN201410666275A CN104332436B CN 104332436 B CN104332436 B CN 104332436B CN 201410666275 A CN201410666275 A CN 201410666275A CN 104332436 B CN104332436 B CN 104332436B
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- China
- Prior art keywords
- helium
- distribution grid
- water
- water channel
- seal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of water cooling chuck structure inside etching machine, including helium distribution grid, water channel distribution grid, seal plate for water passage, corresponding avoidance hole through hole is all uniformly arranged on helium distribution grid, water channel distribution grid and seal plate for water passage surface, is passed through for pallet charging crane；Corresponding helium bullport is additionally provided with described water channel distribution grid, seal plate for water passage surface；Described helium distribution grid, water channel distribution grid and seal plate for water passage is combined as a whole in the presence of vacuum brazing successively, two groups of different inputs of composition, output gas and water passage.The present invention designs a cyclic water channel, a circulation air passage structure by the different internal structure design of three ply board, non-interference, realizes two kinds of coolings, function of temperature control.Ensure the quality of operating temperature control in sapphire sheet and etch chamber in etching process, substantially prolongs the service life of equipment.
Description
Technical field
The present invention relates to semiconductor technology processing equipment-LED ICP etching machines, more particularly to a kind of LED ICP etching machines
Internal water cooling chuck structure.
Background technology
LED etching machines are integrated with high-density plasma source, the full-automatic matching radio system of quick response, accurate chamber
Temperature control system, stable high-precision pressure control system, advanced central nozzle gas handling system and unique chamber surfaces
The multinomial advanced technologies such as processing, the etching of LED field higher performance is realized with IC etching technics more accurate design requirement
Technique, is adapted to the different size pattern piece requirement of different clients, obtains excellent etching technics result.Water cooling chuck is chamber
The core component of room temperature control.Helium enters pallet from the stomata on water cooling chuck upper strata, realizes the cooling of sapphire sheet；Simultaneously
The current passed through out of cooling chuck lower floor water channel take away the heat in etch chamber, realize temperature control.The upper strata of water cooling chuck
The structures of helium passages, lower floor's water channel distribution directly affect operating temperature control in sapphire sheet and etch chamber in etching process
Quality.
The content of the invention
It is an object of the invention to provide the water cooling chuck structure inside a kind of LED etching machines.The present invention passes through following skill
What art scheme was realized：
A kind of water cooling chuck structure inside etching machine, including helium distribution grid, water channel distribution grid, seal plate for water passage, its
It is characterised by：Corresponding avoidance hole is all uniformly arranged on helium distribution grid, water channel distribution grid and seal plate for water passage surface to lead to
Hole, passes through for pallet charging crane；Corresponding helium is additionally provided with described water channel distribution grid, seal plate for water passage surface
Bullport；Described helium distribution grid, water channel distribution grid and seal plate for water passage is combined into one in the presence of vacuum brazing successively
Body, two groups of different inputs of composition, output gas and water passage.
Three distribution circles are provided with described helium distribution plate surface, is each distributed on round week and has been uniformly arranged helium
Outmost turns are additionally provided with sealed groove on hole, surface；Radial direction spacing between three described distribution circles is equal；Described helium
Hole is communicated with the helium guiding groove that the back side is set.
The two helium bullports set in described water channel distribution plate surface are used to guide helium to enter helium distribution grid
On helium guiding groove, uniformly 12 U-shaped breach counterbores are designed with the step of outer ring, for water cooling chuck to be arranged on etch chamber
On；The back side is designed with the channel structure for covering big region.
Described seal plate for water passage appearance and size is identical with water channel distribution grid, outer ring uniform 12 through holes and water on surface
U-shaped breach counterbore is corresponding on road distribution grid, and two helium bullports are corresponding with the helium bullport on water channel distribution grid；Two
Individual current bullport is corresponding with the channel structure two-end-point on water channel distribution grid, for flowing into and out for cooling water.
Described helium distribution grid, water channel distribution grid and seal plate for water passage material is 6061-T6 aluminium alloys.
The sealed groove that outmost turns are set in described helium distribution plate surface, for installing sealing ring, prevent helium to
Revealed in etch chamber.
Helium distribution grid, water channel distribution grid and seal plate for water passage are combined into one by the present invention in the presence of vacuum brazing
Body.By the different internal structure design of three ply board, a cyclic water channel, a circulation air passage structure are designed, it is non-interference,
Realize two kinds of coolings, function of temperature control.Ensure the quality of operating temperature control in sapphire sheet and etch chamber in etching process, significantly
Extend the service life of equipment.
Brief description of the drawings
Fig. 1 is the front view in helium distributing plate structure schematic diagram of the present invention；
Fig. 2 is Figure 1A-A directions sectional view；
Fig. 3 is the rearview in helium distributing plate structure schematic diagram of the present invention；
Fig. 4 is the front view in water channel distributing plate structure schematic diagram of the present invention；
Fig. 5 is Fig. 4 A-A directions sectional view；
Fig. 6 is the rearview in water channel distributing plate structure schematic diagram of the present invention；
Fig. 7 is the front view in seal plate for water passage structural representation of the present invention；
Fig. 8 is Fig. 7 A-A directions sectional view；
Fig. 9 is the rearview in seal plate for water passage structural representation of the present invention；
Figure 10 is the front view in the general assembly structural representation of water cooling chuck of the present invention；
Figure 11 is Figure 10 A-A directions sectional view；
Figure 12 is the rearview in the general assembly structural representation of water cooling chuck of the present invention；
1. helium hole, 2. avoidance holes, 3. sealed grooves, 4. helium guiding grooves, 5. helium bullports, 6.U v notch v counterbores,
7. channel structure, 8. current are led the way hole, 9. positioning holes, 10. through holes.
Embodiment
The invention will be further described below in conjunction with the accompanying drawings；
A kind of water cooling chuck structure inside etching machine, including helium distribution grid, water channel distribution grid, seal plate for water passage, its
It is characterised by：Corresponding avoidance hole 2 is all uniformly arranged on helium distribution grid, water channel distribution grid and seal plate for water passage surface to lead to
Hole, passes through for pallet charging crane；Corresponding helium is additionally provided with described water channel distribution grid, seal plate for water passage surface
Bullport 5；Described helium distribution grid, water channel distribution grid and seal plate for water passage is combined into one in the presence of vacuum brazing successively
Body, two groups of different inputs of composition, output gas and water passage.
Three distribution circles are provided with described helium distribution plate surface, is each distributed on round week and has been uniformly arranged helium
Outmost turns are additionally provided with sealed groove 3 on hole 1, surface；Radial direction spacing between three described distribution circles is equal；Described helium
The helium guiding groove 4 that stomata 1 is set with the back side is communicated.
The two helium bullports 5 set in described water channel distribution plate surface are used to guide helium to enter helium distribution grid
On helium guiding groove 4, uniformly 12 U-shaped breach counterbores 6 are designed with the step of outer ring, for water cooling chuck to be arranged on etching
On chamber；The back side is designed with the channel structure 7 for covering big region.
Described seal plate for water passage appearance and size is identical with water channel distribution grid, outer ring uniform 12 through holes and water on surface
U-shaped breach counterbore 6 is corresponding on road distribution grid, and two helium bullports 5 are relative with the helium bullport 5 on water channel distribution grid
Should；Two current bullports 8 are corresponding with the two-end-point of channel structure 7 on water channel distribution grid, entrance and stream for cooling water
Go out.
Described helium distribution grid, water channel distribution grid and seal plate for water passage material is 6061-T6 aluminium alloys.
The sealed groove 3 that outmost turns are set in described helium distribution plate surface, for installing sealing ring, prevent helium to
Revealed in etch chamber.
When it is implemented, cooling water of the present invention from the back side current of seal plate for water passage lead the way one of hole inlet opening it is defeated
It is defeated from seal plate for water passage back side current hole delivery port of leading the way again after being circulated along channel structure in the channel structure for entering water channel distribution grid
Go out, the heat in etch chamber is taken away in process of production, the control of cavity temperature is etched by controlling the size of current to realize；Helium
Gas, through the helium bullport on water channel distribution grid, enters from the air admission hole of one of the back side helium bullport of seal plate for water passage
Helium guiding groove in helium distribution grid is communicated with helium hole, and the helium of input is contacted with the sapphire sheet on pallet, due to helium
Outmost turns are additionally provided with sealed groove in gas distribution plate surface, for installing sealing ring, prevent helium from being revealed into etch chamber.Helium
Gas takes away the heat produced in etching process, is exported through another helium bullport on water channel distribution grid, seal plate for water passage, real
The temperature control of existing sapphire sheet；The charging crane of pallet passes through out of water cooling chuck, rises and landing operation realizes pallet
Handling.
Claims (1)
1. the water cooling chuck structure inside a kind of etching machine, including helium distribution grid, water channel distribution grid, seal plate for water passage, it is special
Levy and be：Corresponding avoidance hole (2) is all uniformly arranged on helium distribution grid, water channel distribution grid and seal plate for water passage surface to lead to
Hole, passes through for pallet charging crane；Corresponding helium is additionally provided with described water channel distribution grid, seal plate for water passage surface
Bullport (5)；Described helium distribution grid, water channel distribution grid and seal plate for water passage is combined into the presence of vacuum brazing successively
One, two groups of different inputs of composition, output gas and water passage；Three distribution circles are provided with described helium distribution plate surface,
Each it is distributed on round week and has been uniformly arranged outmost turns on helium hole (1), surface and is additionally provided with sealed groove (3)；Described three
Radial direction spacing between individual distribution circle is equal；Described helium hole (1) is communicated with the helium guiding groove (4) that the back side is set；It is described
Water channel distribution plate surface on two helium bullports (5) setting helium for being used to guide helium to enter on helium distribution grid draw
12 U-shaped breach counterbores (6) uniformly are designed with guide groove (4), outer ring step, for water cooling chuck to be arranged on etch chamber；
The back side is designed with the channel structure (7) for covering big region；Described seal plate for water passage appearance and size is identical with water channel distribution grid, table
12 uniform through holes of outer ring are corresponding with U-shaped breach counterbore (6) on water channel distribution grid on face, two helium bullports (5) and
Helium bullport (5) on water channel distribution grid is corresponding；Two current bullports (8) and the channel structure on water channel distribution grid
(7) two-end-point is corresponding, for flowing into and out for cooling water；The sealing that outmost turns are set in described helium distribution plate surface
Groove (3), for installing sealing ring, prevents helium from being revealed into etch chamber；Described helium distribution grid, water channel distribution grid and water
Road sealing plate material is 6061-T6 aluminium alloys；When it is implemented, back side current bullport (8) of the cooling water from seal plate for water passage
In the channel structure (7) of the inlet opening input water channel distribution grid of one of them, sealed again from water channel after being circulated along channel structure (7)
Back current bullport (8) delivery port is exported, and the heat in etch chamber is taken away in process of production, by controlling the big of current
The small control for realizing etching cavity temperature；Air admission hole of the helium from one of the back side helium bullport (5) of seal plate for water passage
Through the helium bullport (5) on water channel distribution grid, communicated into the helium guiding groove (4) in helium distribution grid with helium hole (1),
The helium of input is contacted with the sapphire sheet on pallet, because outmost turns are additionally provided with sealed groove in helium distribution plate surface
(3), for installing sealing ring, helium is prevented to be revealed into etch chamber；Helium takes away the heat produced in etching process, through water channel
Another helium bullport (5) output on distribution grid, seal plate for water passage, realizes the temperature control of sapphire sheet；The dress of pallet
Release mechanism passes through out of water cooling chuck, rises the handling that pallet is realized with landing operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410666275.9A CN104332436B (en) | 2014-11-20 | 2014-11-20 | A kind of water cooling chuck structure inside etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410666275.9A CN104332436B (en) | 2014-11-20 | 2014-11-20 | A kind of water cooling chuck structure inside etching machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104332436A CN104332436A (en) | 2015-02-04 |
| CN104332436B true CN104332436B (en) | 2017-09-01 |
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ID=52407141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410666275.9A Active CN104332436B (en) | 2014-11-20 | 2014-11-20 | A kind of water cooling chuck structure inside etching machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN104332436B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428276A (en) * | 2015-11-11 | 2016-03-23 | 中国电子科技集团公司第四十八研究所 | Indirect water cooling planetary transmission working stage |
| CN106449344B (en) * | 2016-10-28 | 2018-08-28 | 湘能华磊光电股份有限公司 | A kind of lower tray and method improving 4 inch patterned substrate dry etching consistency |
| CN111403320B (en) * | 2020-03-24 | 2023-04-07 | 宁波江丰电子材料股份有限公司 | Cooling plate body and preparation method thereof |
| CN111816604B (en) * | 2020-08-18 | 2021-03-12 | 北京智创芯源科技有限公司 | Wafer etching method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1377568A (en) * | 1999-09-29 | 2002-10-30 | 东京电子株式会社 | Multi-zone resistance heater |
| KR101272013B1 (en) * | 2011-01-25 | 2013-06-07 | 로체 시스템즈(주) | Electrostatic chuck and wafer processing apparatus having the electrostatic chuck |
| CN204464243U (en) * | 2014-11-20 | 2015-07-08 | 靖江先锋半导体科技有限公司 | The water-cooled chuck structure of etching machine inside |
-
2014
- 2014-11-20 CN CN201410666275.9A patent/CN104332436B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1377568A (en) * | 1999-09-29 | 2002-10-30 | 东京电子株式会社 | Multi-zone resistance heater |
| KR101272013B1 (en) * | 2011-01-25 | 2013-06-07 | 로체 시스템즈(주) | Electrostatic chuck and wafer processing apparatus having the electrostatic chuck |
| CN204464243U (en) * | 2014-11-20 | 2015-07-08 | 靖江先锋半导体科技有限公司 | The water-cooled chuck structure of etching machine inside |
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| Publication number | Publication date |
|---|---|
| CN104332436A (en) | 2015-02-04 |
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Address after: 214500 No. 195, Xingang Avenue, Jingjiang Economic Development Zone, Taizhou City, Jiangsu Province Patentee after: Jiangsu Xianfeng Precision Technology Co.,Ltd. Address before: No. 8, Deyu Road, Chengnan Development Zone, Jingjiang City, Taizhou City, Jiangsu Province, 214500 Patentee before: JINGJIANG XIANFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD. |