CN111403320B - Cooling plate body and preparation method thereof - Google Patents
Cooling plate body and preparation method thereof Download PDFInfo
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- CN111403320B CN111403320B CN202010214149.5A CN202010214149A CN111403320B CN 111403320 B CN111403320 B CN 111403320B CN 202010214149 A CN202010214149 A CN 202010214149A CN 111403320 B CN111403320 B CN 111403320B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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Abstract
The invention provides a cooling disc body and a preparation method thereof. The cooling disc body improves the circulation speed of cooling water and increases the cooling speed of the cooling disc body through the structural optimization of the internal water tank.
Description
Technical Field
The invention belongs to the field of cooling equipment, and relates to a cooling disc body and a preparation method thereof.
Background
In the fabrication of integrated circuits, etching is the process of selectively removing unwanted material from the surface of a silicon wafer by chemical or physical means. The etching can be classified into wet etching and dry etching, which are distinguished from each other in terms of process. The former is mainly characterized by isotropic etching; the latter is anisotropic etching using plasma, and the longitudinal and transverse etching can be strictly controlled.
In the semiconductor dry etching process, metal etching, dielectric etching and silicon etching can be divided according to different materials to be etched. The metal etching can be further classified into metal aluminum etching, metal tungsten etching, titanium nitride etching, and the like. At present, metal aluminum is still widely used as a wiring material in memories such as DRAM and flash, and logic products with a thickness of 0.13um or more.
After the aluminum etching is completed, cl remaining on the surface of the silicon wafer, the sidewall of the pattern and the surface of the photoresist reacts with aluminum to generate AlCl3, and then reacts with moisture in the air in a self-circulation manner, so that severe corrosion (corrosion) to aluminum is caused. Therefore, after the etching process is completed, the chlorine and photoresist are typically removed with a plasma of H2O and O2, and aluminum oxide is formed on the aluminum surface to protect the aluminum.
After the wafer (wafer) is stripped in the stripping chamber, the wafer temperature is as high as 250-300 ℃, and the wafer cassette is damaged if the wafer is directly conveyed to the wafer cassette, so that the wafer temperature needs to be reduced to below 70 ℃ before being conveyed to the wafer cassette so as to avoid damaging the wafer cassette. The main function of the cooling cavity is to realize the rapid cooling of the wafer so as to protect the wafer box from being damaged by the high-temperature wafer. The most important component in the cooling chamber is the cooling disc, in which the cooling disc package is fixed.
The prior art has the following disadvantages:
1. the structure of single sealing ring sealing is adopted, the sealing between the grooves on the bottom surface of the cooling disc is poor, water is easy to leak between the grooves, and the cooling efficiency is reduced due to the mixing of cold water and hot water;
2. in order to obtain a better sealing effect, the diameter of the sealing ring which needs to be adopted is larger, so that the distribution area of the water tank is more concentrated at the middle part of the cooling disc, the edge of the cooling disc is cooled at a low speed, and the surface of the wafer is cooled unevenly;
3. the upper cooling disc is of a concave structure, so that the upper cooling disc is inconvenient to process, and the positions of the connecting bolt, the water inlet and the water outlet are all positioned in the concave parts, so that the upper cooling disc is inconvenient for mounting and fastening parts such as bolts, water pipe joints and the like.
CN 207338314U discloses a cooling pan assembly, which comprises a cooling pan and a cooling pan bottom plate, wherein the cooling pan and the cooling pan bottom plate are oppositely fastened and fixed; a coolant groove and a first sealing groove are formed in one surface, opposite to the cooling disc bottom plate, of the cooling disc, and a second sealing groove is formed in one surface, opposite to the cooling disc, of the cooling disc bottom plate; and a sealing gasket is arranged between the cooling disc and the cooling disc bottom plate and covers the coolant groove, the first sealing groove and the second sealing groove and is used for preventing the coolant in the coolant groove from leaking. The second surface of the cooling disc, which is used for placing the wafer, is provided with an auxiliary cooling groove, and the longitudinal sections of the first sealing groove and the second sealing groove are both triangular and are arranged in a staggered manner.
CN 110405474A discloses a surface treatment method of a water channel in a cooling disc body and a manufacturing method of the cooling disc body, relates to the technical field of water channel surface treatment, and solves the technical problem that the inner wall of the cooling water channel in a water cooling disc is easy to corrode in the prior art. The surface treatment method comprises the following steps: the liquid outlet of the container is aligned with the inlet of the water channel in the cooling plate body, and the passivation liquid in the container is injected into the water channel under the action of pressure until the passivation liquid flows out from the outlet of the water channel; completely passivating the water channel; blowing the passivation solution out of the water channel; and drying the passivated cooling disc body. A method for manufacturing a cooling disc body comprises a machining method for the cooling disc body and a surface treatment method for a water channel in the cooling disc body.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides the cooling disc body and the preparation method thereof, the cooling disc body improves the circulation speed of cooling water and the cooling speed of the cooling disc body by optimizing the structure of the internal water tank, and the preparation method improves the sealing performance of the cooling disc body, reduces the water leakage risk of the cooling disc body and prolongs the service life of the cooling disc body.
In order to achieve the purpose, the invention adopts the following technical scheme:
one purpose of the invention is to provide a cooling disc body, wherein a water channel in the cooling disc body is in a combined shape of an annular water channel and a rice-shaped water channel, the rice-shaped water channel is in the annular water channel, and each branch of the rice-shaped water channel is respectively and independently communicated with the annular water channel.
As a preferable technical scheme of the invention, the tail ends of three adjacent branch water channels of the water channel shaped like a Chinese character 'mi' are connected to form a first water channel group, the tail ends of the other three branch water channels are connected to form a second water channel group, and the first water channel group is communicated with the second water channel group through the annular water channel.
The tail ends of the first water channel group and the second water channel group are positioned in the middle of the shape of a Chinese character 'mi', but are not communicated with each other in the shape of the Chinese character 'mi'.
According to the invention, the connection mode of the water channels can ensure that the whole water channel space is fully filled with cooling water, the resistance of the cooling water in the water channel is small, the circulation speed is high, and the cooling efficiency of the cooling disc body is improved.
As a preferable technical scheme of the invention, the cooling disc body comprises a main plate and a cover plate, and the water channel is positioned in the main plate.
As the preferable technical scheme of the invention, the cover plate is provided with a cooling water inlet pipeline and a cooling water outlet pipeline.
As a preferable technical scheme, the cooling water liquid inlet pipeline comprises a first external connecting pipe, a first adapter, a liquid inlet pipe and a first adapter which are sequentially connected, and the cooling water liquid inlet pipeline is connected with the cover plate through the first adapter.
As a preferable technical scheme of the invention, the cooling water outlet pipeline comprises a second external connecting pipe, a second adapter, a liquid outlet pipe and a second connector which are sequentially connected, and the cooling water outlet pipeline is connected with the cover plate through the second connector.
As a preferred technical solution of the present invention, the first adapter and the second adapter are respectively and independently provided with a first adapter seal and a second adapter seal.
In the invention, the connecting positions of the cooling water inlet pipeline and the cooling time liquid outlet pipeline and the cover plate are respectively and independently positioned above the first water channel group and the second water channel of the water channel shaped like a Chinese character mi. In order to cool water fast and fully fill the inside water course of cooling disk body, cooling water inlet pipe with the hookup location of play liquid pipeline and apron during the cooling is located the top at position between the rice style of calligraphy water course independently respectively, especially is located the top of first water course group end-to-end connection department and second water course end-to-end connection department.
The second objective of the present invention is to provide a method for preparing the cooling plate body, which comprises the following steps:
(1) Sequentially carrying out polarity machining turning, groove milling, polishing and vacuum brazing after assembly on the main plate and the plate covering machine to obtain a base material of the cooling disc body;
(2) And assembling the cooling water inlet pipeline and the cooling water outlet pipeline, then performing laser welding on the assembled cooling water inlet pipeline and the assembled cooling water outlet pipeline and the base material of the cooling disc body, and performing size inspection and helium leakage detection to obtain the cooling disc body.
According to the invention, through reasonable design of the main plate, the cover plate and the accessories, vacuum brazing between the main plate and the cover plate and laser welding between the accessories and the cover plate become possible, and the use of the vacuum brazing and the laser welding not only improves the production efficiency of the cooling disc body, but also increases the sealing performance of the cooling disc body, reduces the possibility of water leakage of the cooling disc body and improves the use instruction of the cooling disc body.
Compared with the prior art, the invention at least has the following beneficial effects:
(1) The invention provides a cooling disc body, which improves the circulation speed of cooling water and increases the cooling speed of the cooling disc body by optimizing the structure of an internal water tank;
(2) The invention provides a preparation method of a cooling disc body, which improves the sealing property of the cooling disc body, reduces the water leakage risk of the cooling disc body and prolongs the service life of the cooling disc body.
Drawings
FIG. 1 is a front view of a cooling plate body provided in accordance with an embodiment of the present invention;
FIG. 2 is a blister view of a cooling plate body provided in accordance with an embodiment of the present invention;
FIG. 3 is a front view of a cooling plate body provided by an embodiment of the present invention;
FIG. 4 is an assembled dimensional view of a cooling plate body provided by an embodiment of the present invention;
FIG. 5 is a water path size diagram for a cooling plate body according to an embodiment of the present invention;
in the figure: 1-cover plate, 2-main plate, 31-first external connecting pipe, 32-first adapter, 33-first adapter seal, 34-liquid inlet pipe, 35-first adapter, 41-second external connecting pipe, 42-second adapter, 43-second adapter seal, 44-liquid inlet pipe and 45-second adapter.
The present invention is described in further detail below. The following examples are merely illustrative of the present invention and do not represent or limit the scope of the claims, which are defined by the claims.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
To better illustrate the invention and to facilitate the understanding of the technical solutions thereof, typical but non-limiting examples of the invention are as follows:
example 1
The cooling disc body provided by the embodiment has the structure shown in fig. 1-3, and includes a main plate 2 and a cover plate 1, and the water channel is located inside the main plate 2.
The water channel in the cooling disc body is in a combined shape of an annular water channel and a water channel shaped like a Chinese character 'mi', the water channel shaped like a Chinese character 'mi' is in the annular water channel, and each branch of the water channel shaped like a Chinese character 'mi' is respectively and independently communicated with the annular water channel. The tail ends of three adjacent branch water channels of the water channel shaped like a Chinese character 'mi' are connected to form a first water channel group, the tail ends of the other three branch water channels are connected to form a second water channel group, and the first water channel group is communicated with the second water channel group through the annular water channel.
And the cover plate is provided with a cooling water inlet pipeline and a cooling water outlet pipeline. The cooling water inlet pipeline comprises a first external connecting pipe 31, a first adapter 32, a liquid inlet pipe 34 and a first adapter 35 which are sequentially connected, and the cooling water inlet pipeline is connected with the cover plate 1 through the first adapter 35. The cooling water outlet pipeline comprises a second external connecting pipe 41, a second adapter 42, a liquid outlet pipe 44 and a second connector 45 which are sequentially connected, and the cooling water outlet pipeline is connected with the cover plate 1 through the second connector 45. The first adapter 32 and the second adapter 42 are each independently provided with a first adapter seal 33 and a second adapter seal 43.
Example 2
This embodiment provides a method for manufacturing the cooling plate body of embodiment 1, including the following steps:
(1) Sequentially carrying out polarity machining turning, groove milling, polishing and vacuum brazing after assembly on the main plate and the plate covering machine to obtain a base material of the cooling plate body;
(2) And assembling the cooling water inlet pipeline and the cooling water outlet pipeline, then performing laser welding on the assembled cooling water inlet pipeline and the assembled cooling water outlet pipeline and the base material of the cooling disc body, and performing size inspection and helium leakage detection to obtain the cooling disc body.
The specific machining dimensions are shown in fig. 4 and 5.
Application example
The blockage of the water channel of the cooling disc body provided by the embodiment 1 is detected by using the C-SCAN.
The C-SCAN is a technology for extracting echo information vertical to a specified section (namely a transverse section image) of an acoustic beam by using an ultrasonic flaw detection principle to form a two-dimensional image, and the circulation condition of cooling water in a water channel can be known by using the technology to judge whether the circulation of the cooling water in the water channel is smooth or not. The test conditions are shown in Table 1.
Comparative example
This comparative example provides a cooling pan body which was identical to example 1 except that the water passage was spiral.
The test result shows that the internal water channel design of the cooling disc body provided by the embodiment of the invention has almost no resistance to cooling water, while the spiral water channel design in the comparative example is taken as a common design of the cooling disc body, and the resistance to the cooling water is obviously larger than that of the water channel design of the application. Under the condition that the lengths of the water channels are approximately the same, the cooling water is introduced at the same flow rate, and the time for the cooling water to flow through the cooling water channels in the cooling disc body provided by the embodiment is shorter.
TABLE 1
| Detection conditions | Standard sample |
| Probe head | 10MHz |
| Acoustic velocity of material | 6200 |
| Distance to water | 50～65mm |
| Distance between X-axis | 0.5mm |
| Distance between Y-axis | 0.5mm |
| Scanning speed | 450mm/s |
The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, additions of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that, in the above embodiments, the various features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, the present invention does not separately describe various possible combinations.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (7)
1. A cooling disc body is characterized in that a water channel in the cooling disc body is in a combined shape of an annular water channel and a rice-shaped water channel, the rice-shaped water channel is in the annular water channel, and branches of the rice-shaped water channel are respectively and independently communicated with the annular water channel;
the tail ends of three adjacent branch water channels of the water channel shaped like a Chinese character 'mi' are connected to form a first water channel group, the tail ends of the other three branch water channels are connected to form a second water channel group, the first water channel group is communicated with the second water channel group through the circular water channel, and the tail ends of the first water channel group and the second water channel group are not communicated with each other.
2. The cooling tray body of claim 1, wherein the cooling tray body includes a main plate and a cover plate, the water channel being located within the main plate.
3. The cooling plate body of claim 2 wherein the cover plate has a cooling water inlet line and a cooling water outlet line.
4. The cooling disc body of claim 3, wherein the cooling water inlet pipeline comprises a first external connecting pipe, a first adapter, a liquid inlet pipe and a first connector which are connected in sequence, and the cooling water inlet pipeline is connected with the cover plate through the first connector.
5. The cooling plate body of claim 4 wherein the coolant outlet conduit includes a second external connection pipe, a second adapter, a liquid outlet pipe, and a second connector connected in series, the coolant outlet conduit being connected to the cover plate by the second connector.
6. The cooling plate body of claim 5, wherein the first and second adapters are each independently provided with first and second adapter seals.
7. A method of making a cooling plate body as claimed in claim 3, characterized in that it comprises the following steps:
(1) Sequentially carrying out polarity machining turning, groove milling, polishing and vacuum brazing after assembly on the main plate and the plate covering machine to obtain a base material of the cooling disc body;
(2) And assembling the cooling water inlet pipeline and the cooling water outlet pipeline, then performing laser welding on the assembled cooling water inlet pipeline and the assembled cooling water outlet pipeline and the base material of the cooling disc body, and performing size inspection and helium leakage detection to obtain the cooling disc body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010214149.5A CN111403320B (en) | 2020-03-24 | 2020-03-24 | Cooling plate body and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010214149.5A CN111403320B (en) | 2020-03-24 | 2020-03-24 | Cooling plate body and preparation method thereof |
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| CN111403320A CN111403320A (en) | 2020-07-10 |
| CN111403320B true CN111403320B (en) | 2023-04-07 |
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| CN113369820A (en) * | 2021-06-28 | 2021-09-10 | 宁波江丰电子材料股份有限公司 | Preparation method of simple cooling arm |
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| CN103192325A (en) * | 2013-04-10 | 2013-07-10 | 大连理工大学 | Inner-cooling bonded abrasive grinding disc |
| CN204094637U (en) * | 2014-09-29 | 2015-01-14 | 江苏中科晶元信息材料有限公司 | The cooling device of lower polishing disk in a kind of glazing machine for crystal plate |
| CN104332436A (en) * | 2014-11-20 | 2015-02-04 | 靖江先锋半导体科技有限公司 | Water-cooling chuck structure inside etcher |
| CN110744440A (en) * | 2019-10-22 | 2020-02-04 | 西安奕斯伟硅片技术有限公司 | Double-side grinding device and method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9484190B2 (en) * | 2014-01-25 | 2016-11-01 | Yuri Glukhoy | Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area |
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2020
- 2020-03-24 CN CN202010214149.5A patent/CN111403320B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192325A (en) * | 2013-04-10 | 2013-07-10 | 大连理工大学 | Inner-cooling bonded abrasive grinding disc |
| CN204094637U (en) * | 2014-09-29 | 2015-01-14 | 江苏中科晶元信息材料有限公司 | The cooling device of lower polishing disk in a kind of glazing machine for crystal plate |
| CN104332436A (en) * | 2014-11-20 | 2015-02-04 | 靖江先锋半导体科技有限公司 | Water-cooling chuck structure inside etcher |
| CN110744440A (en) * | 2019-10-22 | 2020-02-04 | 西安奕斯伟硅片技术有限公司 | Double-side grinding device and method |
Non-Patent Citations (1)
| Title |
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| 吴建华.工程训练 金工实习.《工程训练 金工实习》.天津大学出版社,2016,第63-64页. * |
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