CN104320965A - Screening method of space LMCCD surveying and mapping camera imaging circuit - Google Patents
Screening method of space LMCCD surveying and mapping camera imaging circuit Download PDFInfo
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- CN104320965A CN104320965A CN201410531654.7A CN201410531654A CN104320965A CN 104320965 A CN104320965 A CN 104320965A CN 201410531654 A CN201410531654 A CN 201410531654A CN 104320965 A CN104320965 A CN 104320965A
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Abstract
The invention provides a screening method of a space LMCCD surveying and mapping camera imaging circuit and relates to a space CCD (Charge Coupled Device) imaging technology. The problems that the focal plane structure of a three linear array surveying and mapping camera of an LMCCD is compact and accordingly an additional connector is difficult to be placed to connect with an industrial CCD device for circuit board screening are solved. The circuit board screening is performed through the industrial CCD after a socket is welded at the position of a CCD of a circuit board, the CCD socket is detached after the screening is achieved, and a space CCD device is welded finally. A CCD pin is divided into two types according to a fault model of the CCD socket detachment process and the comparison is performed on static resistance values and level values before and after the socket is detached to determine whether the welding of the space CCD can be performed or not. According to the screening method of the space LMCCD surveying and mapping camera imaging circuit, defective circuit boards are eliminated through a plurality of screening test steps and accordingly the production cost is reduced and the development cycle is shortened.
Description
Technical field
The present invention relates to the imaging technique of a kind of space flight CCD, be specifically related to a kind of screening technique of space flight LMCCD mapping camera imaging circuit.
Background technology
As the LMCCD tridimensional mapping camera of the main load of moonlet, its volume and weight has harsh requirement, usually adopts the dioptric system of long lens barrel.For focal plane wiring board, in order to focus convenient and meet stereo mapping application requirement, the band of scratching that focal plane wiring board is contained in by rigid-flex board in lens barrel is connected with post processing electric circuit, and therefore the size of focal plane wiring board is less than lens barrel size.Particularly for facing camera, there are five CCD device in undersized focal plane, because space flight level CCD device is expensive, adopt the wiring board reliability of rigid-flex board structure lower, require harsh to the placement-and-routing of wiring board, be difficult to place extra connector again and carry out wiring board screening to the CCD device connecting technical grade.Therefore after the CCD position of wiring board welding socket, adopt technical grade CCD to carry out wiring board screening, to be screened pass through after pull down CCD socket, the upper space flight level CCD device of final welding.Damage risk owing to there is wiring board in dismounting CCD socket process, whole process need carefully detect.
Summary of the invention
The present invention is the focal plane compact dimensions solving the existing three line scanner mapping camera due to LMCCD, be difficult to place extra connector to go forward side by side to the CCD device connecting technical grade the problem of row line plate screening difficulty, a kind of screening technique of space flight LMCCD mapping camera imaging circuit is provided.
The screening technique of space flight LMCCD mapping camera imaging circuit, the method is realized by following steps:
Step one, Design PCB wiring board and add test point to without drawing the driving pin of signal;
Step 2, to step one design PCB carry out production and processing, the connectedness of scratching band in the rigid-flex board then to each PCB detects, if testing result does not find defect, then performs step 3, if testing result finds defect, then repeated execution of steps two;
Step 3, welding procedure and assembly is carried out to each PCB described in step 2, then imaging test is carried out, record CCD under veneer simultaneously respectively and drive the connection resistance of pin and the resistance to earth of non-driven pin, and the waveform of each pin of CCD under recording each PCB connection status; If test result occurs abnormal, carry out keeping in repair until imaging test is normal; Perform step 4, if test result is normal, perform step 4;
Step 4, dismounting CCD socket, and the CCD driving connection resistance of pin and the resistance to earth of non-driven pin is tested under temperature is less than or equal to-25 environment of spending, waveform testing is carried out after again carrying out each PCB assembling, record the waveform of each pin of CCD under each PCB connection status, test result is compared with the test result in step 3, if two times result change difference is less than or equal to 5%, then complete the detection of PCB and each pin of CCD, realize the screening of space flight LMCCD mapping camera imaging circuit; Otherwise, return step one.
Beneficial effect of the present invention: one, the present invention adopts multiple filler test step to reject defectiveness wiring board, reduces production cost and shortens the lead time;
Two, according to test connectivity modeling, the pin of CCD be divided into test resistance to earth and be communicated with resistance two class, with the addition of test point in the position of inconvenience test connection resistance during PCB design, avoid the destruction of later stage test to three anti-paints;
Three, low temperature after dismounting CCD socket is adopted as-25 degree tested static resistance values, can to check out that solder joint rosin joint is communicated with N/R problem at normal temperatures; Test each pin waveform after dismounting CCD socket and can check that whether the state of wiring board remainder is normal further.
Accompanying drawing explanation
Fig. 1 is that in the screening technique of space flight LMCCD mapping camera imaging circuit of the present invention, CCD drives connection pin schematic diagram;
Fig. 2 is that in the screening technique of space flight LMCCD mapping camera imaging circuit of the present invention, CCD is biased pin connection diagram;
Fig. 3 is CCD output pin connection diagram in the screening technique of space flight LMCCD mapping camera imaging circuit of the present invention;
Fig. 4 is the flow chart of the screening technique of space flight LMCCD mapping camera imaging circuit of the present invention.
Embodiment
Composition graphs 1 to Fig. 4 illustrates present embodiment, the screening technique of space flight LMCCD camera imaging circuit,
The circuit theory diagrams of composition graphs 1, carry out the connective logical process judged by the resistance testing solder joint, can regard each resistant series structural model as, when original resistance is low state R
lowtime, occur that solder joint ruptures, then all-in resistance presents high state R
high, by R
lowbecome R
high, easily can judge fault; As the state R that original resistance is high
hightime, occur that solder joint ruptures, all-in resistance still presents high state R
high, be difficult to judge whether to there is fault.Therefore in the original test resistance value that connective contrast test needs selective value lower.
The pin of composition graphs 2 and Fig. 3, CCD can be divided into the time dependent driving pin of input by functional characteristic, be input as the biased pin of fixed level and the output pin of outputting analog signal.Fig. 1 is that CCD drives connection pin schematic diagram, the fault model of CCD socket in unloading process is particularly at low temperatures for open circuit or resistance increase, due to driver and drive pin to signal ground () all present high-impedance state, therefore Test driver pin resistance to earth is difficult to judge that whether state is normal, the conduction resistance value of this pin and the signal that is connected can only be measured, owing to being difficult to measure after the anti-paint of circuit scrubbing brush three, therefore signal is not connected to when connecting upper, need the PCB design stage draw test point and at brush three anti-paint time relay testing point; Pin is biased for CCD, usually adopts externally fed power supply and voltage divider to provide constant DC level to it, due to externally fed power supply and voltage divider resistance to earth value lower, the resistance to earth directly can measuring this pin detects state after dismounting socket; For CCD output pin, owing to there is the lower external dc biasing circuit of resistance, therefore state after also directly can measuring the resistance to earth detection dismounting socket of this pin.
The detailed process of the screening technique of the space flight LMCCD camera imaging circuit described in present embodiment is:
One, carry out PCB design according to designing requirement, and add test point to without drawing drive singal.
Two, the production and processing of PCB is carried out in producer.
Three, before PCB welding, the continuity testing of scratching band in the detection of PCB, particularly rigid-flex board is carried out; If existing defects (the connection resistance of all detections is greater than 0.1 Europe), re-starts the production and processing of PCB.
If four tests do not find defect (the connection resistance of all detections is less than 0.1 Europe), carry out the welding procedure and assembly of PCB, then normal temperature and pressure imaging test is carried out respectively, the thermal cycle imaging test of normal pressure and vacuum, record CCD under veneer simultaneously respectively and drive the connection resistance of pin and the resistance to earth of non-driven pin, record the waveform of each pin of CCD under each wiring board connection status; If test occurs abnormal, carry out investigation maintenance, until each imaging test normally, otherwise scrap wiring board and again produce; Test occurs that abnormal situation refers to: drive the connection resistance of pin and the resistance to earth of non-driven pin, the DC level of biased pin, drive high level and the low level of pin, the situation when value of above-mentioned any one changes more than 5% compared with design load.
Five, three anti-process of wiring board are carried out, in the protection of three anti-process advance horizontal-drive signal leading points and connector;
Six, the assembling of three anti-laggard row line plates, carries out thermal cycle experiment under normal pressure and vacuum; If test occurs abnormal, carry out investigation maintenance, until each imaging test normally, otherwise scrap wiring board and again produce.
Seven, CCD socket is dismantled.
Eight, under low temperature is as-25 degree, test CCD and drive the connection resistance of pin and the resistance to earth of non-driven pin, after assembling wiring board, carry out waveform testing, and contrast with three anti-test records before treatment, be confirmed whether that existence is abnormal; If exist abnormal, unrepairable, scraps wiring board and again produces.
Nine, after confirmation is without exception, welding has been arranged on space flight level CCD mechanical-optical setup meeting and surveys and draws application and require.
Ten, wiring board and mechanical-optical setup assembling, carry out system test experiment.
In present embodiment, tested static resistance adopts universal instrument; The waveform of each pin of test CCD adopts the oscilloscope of band memory function, and CCD socket adopts single-row socket; CCD adopts the device of E2V company;
The present invention, according to test connectivity modeling, is divided into test resistance to earth the pin of CCD and is communicated with resistance two class, with the addition of test point during PCB design at the driving pin signal location of inconvenience test connection resistance; Adopt low temperature after dismounting CCD socket as-25 degree tested static resistance values, can check out that solder joint rosin joint is communicated with N/R problem at normal temperatures; Test each pin waveform after dismounting CCD socket and can check that whether the state of wiring board remainder is normal further.The present invention adopts multiple filler test step, rejects defectiveness wiring board early; Its filler test step mainly comprises that PCB before PCB design, production and processing, welding detects, thermal cycle experiment under the welding assembly of PCB and imaging test, three anti-process, normal pressure and vacuum, dismounting CCD socket, resistance and waveform testing, welding CCD, system test experiment.
Claims (5)
1. the screening technique of space flight LMCCD mapping camera imaging circuit, it is characterized in that, the method is realized by following steps:
Step one, Design PCB wiring board and to without draw signal CCD drive pin add test point;
Step 2, to step one design PCB carry out production and processing, the connectedness of scratching band in the rigid-flex board then to each PCB detects, if testing result does not find defect, then performs step 3, if testing result finds defect, then repeated execution of steps two;
Step 3, welding procedure and assembly is carried out to each PCB described in step 2, then imaging test is carried out, record CCD under veneer simultaneously respectively and drive the connection resistance of pin and the resistance to earth of non-driven pin, and the waveform of each pin of CCD under recording each PCB connection status; If test result occurs abnormal, carry out keeping in repair until imaging test is normal; Perform step 4, if test result is normal, perform step 4;
Step 4, dismounting CCD socket, and the CCD driving connection resistance of pin and the resistance to earth of non-driven pin is tested under temperature is less than or equal to-25 environment of spending, waveform testing is carried out after again carrying out each PCB assembling, record the waveform of each pin of CCD under each PCB connection status, test result is compared with the test result in step 3, if two times result change difference is less than or equal to 5%, then complete the detection of PCB and each pin of CCD, realize the screening of space flight LMCCD mapping camera imaging circuit; Otherwise, return step one.
2. the screening technique of space flight LMCCD mapping camera imaging circuit according to claim 1, it is characterized in that, under the veneer of record respectively described in step 3, CCD drives the connection resistance of pin and the resistance to earth of non-driven pin, and described non-driven pin is biased pin and the output pin of CCD.
3. the screening technique of space flight LMCCD mapping camera imaging circuit according to claim 1 and 2, it is characterized in that, if the test described in step 3 occurs that abnormal situation refers to: drive the connection resistance of pin and the resistance to earth of non-driven pin, the DC level of biased pin, drive high level and the low level of pin, the situation when value of above-mentioned any one changes more than 5% compared with design load.
4. the screening technique of space flight LMCCD mapping camera imaging circuit according to claim 1, it is characterized in that, also comprise between step 3 and step 4 and disconnecting between described each PCB, and carry out three anti-process respectively, in the protection of described three anti-process advance horizontal-drive signal leading points and connector; And then each PCB is assembled, carry out thermal cycle experiment under normal pressure and vacuum; If test occurs abnormal, carry out investigation maintenance, until each imaging test is normal, then perform step 4, if test result is normal, perform step 4.
5. the screening technique of space flight LMCCD mapping camera imaging circuit according to claim 1, it is characterized in that, in step 2, the connectedness of scratching band in the rigid-flex board of each PCB is detected, if it is the condition meeting detection that testing result does not find that connection resistance that defect refers to all detections is less than 0.1 Europe.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410531654.7A CN104320965B (en) | 2014-10-10 | 2014-10-10 | Screening method of space LMCCD surveying and mapping camera imaging circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410531654.7A CN104320965B (en) | 2014-10-10 | 2014-10-10 | Screening method of space LMCCD surveying and mapping camera imaging circuit |
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| CN104320965A true CN104320965A (en) | 2015-01-28 |
| CN104320965B CN104320965B (en) | 2017-01-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031197A (en) * | 2019-11-22 | 2020-04-17 | 中国科学院长春光学精密机械与物理研究所 | Low-interference-noise LMCCD imaging system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1197287A (en) * | 1996-12-11 | 1998-10-28 | 现代电子产业株式会社 | Circuit board for screening detection and mfg. method of known qualified tube core |
| CN102497575A (en) * | 2011-12-09 | 2012-06-13 | 中国科学院长春光学精密机械与物理研究所 | Multi-piece area array CCD (Charge Coupled Device) screening test system |
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2014
- 2014-10-10 CN CN201410531654.7A patent/CN104320965B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1197287A (en) * | 1996-12-11 | 1998-10-28 | 现代电子产业株式会社 | Circuit board for screening detection and mfg. method of known qualified tube core |
| CN102497575A (en) * | 2011-12-09 | 2012-06-13 | 中国科学院长春光学精密机械与物理研究所 | Multi-piece area array CCD (Charge Coupled Device) screening test system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031197A (en) * | 2019-11-22 | 2020-04-17 | 中国科学院长春光学精密机械与物理研究所 | Low-interference-noise LMCCD imaging system |
| CN111031197B (en) * | 2019-11-22 | 2021-06-01 | 中国科学院长春光学精密机械与物理研究所 | Low-interference-noise LMCCD imaging system |
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| CN104320965B (en) | 2017-01-25 |
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