CN104312034A - 一种聚氯乙烯防伪薄膜及其制备方法 - Google Patents
一种聚氯乙烯防伪薄膜及其制备方法 Download PDFInfo
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- CN104312034A CN104312034A CN201410481982.0A CN201410481982A CN104312034A CN 104312034 A CN104312034 A CN 104312034A CN 201410481982 A CN201410481982 A CN 201410481982A CN 104312034 A CN104312034 A CN 104312034A
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- Prior art keywords
- polyvinyl chloride
- counterfeiting
- false proof
- counterfeiting film
- film
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- 239000004800 polyvinyl chloride Substances 0.000 title claims abstract description 64
- 229920000915 polyvinyl chloride Polymers 0.000 title claims abstract description 64
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 29
- 239000004594 Masterbatch (MB) Substances 0.000 claims abstract description 28
- 239000006057 Non-nutritive feed additive Substances 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims abstract description 6
- 238000001125 extrusion Methods 0.000 claims abstract description 5
- 238000005096 rolling process Methods 0.000 claims abstract description 4
- 239000003112 inhibitor Substances 0.000 claims description 20
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 12
- 230000005284 excitation Effects 0.000 claims description 11
- 239000000314 lubricant Substances 0.000 claims description 10
- 230000003647 oxidation Effects 0.000 claims description 10
- 238000007254 oxidation reaction Methods 0.000 claims description 10
- 230000003068 static effect Effects 0.000 claims description 10
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 9
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical group CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 9
- 239000012752 auxiliary agent Substances 0.000 claims description 8
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical group CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 6
- 235000021355 Stearic acid Nutrition 0.000 claims description 6
- 235000010354 butylated hydroxytoluene Nutrition 0.000 claims description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 6
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical group CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 6
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 6
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 claims description 6
- 239000008117 stearic acid Substances 0.000 claims description 6
- 239000004902 Softening Agent Substances 0.000 claims description 5
- 239000007822 coupling agent Substances 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical group CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 3
- 235000019253 formic acid Nutrition 0.000 claims description 3
- -1 formic acid diimide derivative Chemical class 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000005453 pelletization Methods 0.000 claims description 3
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims description 3
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 claims description 3
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 3
- 150000002910 rare earth metals Chemical class 0.000 claims description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 2
- 229910052691 Erbium Inorganic materials 0.000 claims description 2
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052689 Holmium Inorganic materials 0.000 claims description 2
- 229910052765 Lutetium Inorganic materials 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052779 Neodymium Inorganic materials 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 2
- 229910052772 Samarium Inorganic materials 0.000 claims description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052775 Thulium Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052788 barium Inorganic materials 0.000 claims description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 239000011575 calcium Substances 0.000 claims description 2
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 claims description 2
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 claims description 2
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052746 lanthanum Inorganic materials 0.000 claims description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 2
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 claims description 2
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 claims description 2
- 229910052706 scandium Inorganic materials 0.000 claims description 2
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052711 selenium Inorganic materials 0.000 claims description 2
- 239000011669 selenium Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052712 strontium Inorganic materials 0.000 claims description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052714 tellurium Inorganic materials 0.000 claims description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 claims description 2
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000010096 film blowing Methods 0.000 abstract description 3
- 238000007664 blowing Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 229940088710 antibiotic agent Drugs 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000002189 fluorescence spectrum Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08L27/06—Homopolymers or copolymers of vinyl chloride
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/92—Measuring, controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
- C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/92704—Temperature
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08J2327/06—Homopolymers or copolymers of vinyl chloride
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2427/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2427/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2427/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08J2427/06—Homopolymers or copolymers of vinyl chloride
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
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- C08L2203/16—Applications used for films
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Extrusion Moulding Of Plastics Or The Like (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明公开了一种聚氯乙烯防伪薄膜及其制备方法，聚氯乙烯防伪薄膜，按重量份计，包括：100份聚氯乙烯；0.1～20份防伪母粒；25～35份加工助剂；所述防伪母粒按重量百分比计，包括：28～99.9%载体树脂；0.01～15%荧光粉；0.01～65%编码物质；0～3.25%助剂；载体树脂为聚氯乙烯；其制备方法：用大、小两台挤出机分别将聚氯乙烯、加工助剂和防伪母粒挤塑至共挤机头，聚氯乙烯和加工助剂混合均匀后从大挤出机中挤出，防伪母粒从小挤出机中挤出，挤出双色泡管后经吹胀、牵引、收卷，即得；通过采用特定共挤吹膜工艺，使得防伪条与聚氯乙烯薄膜融结为一体，具有良好的结合力；生产工艺简单，且防伪成本低，更容易加工成型和批量化生产；根据防伪条上的荧光特征和编码信息实现对产品的真伪鉴别和溯源。
Description
技术领域
本发明涉及包装防伪技术领域，特别涉及一种聚氯乙烯防伪薄膜及其制备方法。
背景技术
聚氯乙烯薄膜具有良好的力学性能、耐刺穿性能、透明性、水蒸气透过性、伸缩性、自黏性。广泛用于蔬菜、水果、面包、生熟鱼肉等各种食品的保鲜包装，也可用作化学物品、医药品瓶盖的包装以及各种工业包装膜。
然而其通常不具有防伪功能，用于某些需要防伪的领域时，需要在薄膜上另外设置专门的防伪标识，比如印刷防伪油墨，或粘贴防伪标签等，即影响了产品的外观，又增加了加工工序。而且由于这些防伪技术都是广泛使用的防伪技术，造假者很容易看出，从而仿制相应的防伪标识。
发明内容
为了克服现有技术的缺点与不足，本发明的首要目的在于提供一种防伪效果好、能实现真伪鉴别与溯源，且防伪成本低的聚氯乙烯防伪薄膜。
本发明的另一目的是提供上述聚氯乙烯防伪薄膜的制备方法。
本发明是通过以下技术方案实现的：
一种聚氯乙烯防伪薄膜，按重量份计，包括如下组分：
聚氯乙烯 100份；
防伪母粒 0.1~20份；
加工助剂 25~35份；
其中，所述防伪母粒，按重量百分比计，包括如下组分：
载体树脂 28~99.9%；
荧光粉 0.01~15%；
编码物质 0.01~65%；
助剂 0~3.25%；
所述载体树脂为聚氯乙烯。
本发明所述的防伪母粒的制备方法，包括如下步骤：
将载体树脂、荧光粉、编码物质和助剂按配比称量，倒入高混机中混合均匀，在双螺杆挤出机中200~300℃熔融，挤出造粒，得到防伪母粒。
本发明的防伪母粒加入量优选为0.1~20重量份；防伪母粒与聚氯乙烯的比例决定了防伪条在聚氯乙烯薄膜上的宽度，为了得到宽度为0.3~5cm的防伪条，需添加0.1~20份的防伪母粒；添加0.1~20份的防伪母粒可以节约成本，且能增强防伪效果，因为制备防伪母粒所用的荧光粉和编码物质组分，其原材料价格较聚氯乙烯贵，且添加量越少就越难以分析仿冒；而如果添加的防伪母粒超过20份，其原材料的成本高，且容易被分析仿冒。
其中，所述编码物质选自选自镁、钾、钙、钪、钛、钒、铬、锰、铁、钴、镍、 铜、锌、镓、锗、硒、锶、钇、锆、铌、钼、钯、银、铟、锡、锑、碲、钡、镧、铈、镨、钕、钐、钆、镝、钬、铒、铥、镱、镥、铋的化合物的一种或几种；所述编码物质具有易于被检测、区分和准确识别的特性，目的在于通过其组合形成一定数量的编码，捆绑相关的产品信息。
所述荧光粉选自紫外激发荧光粉和/或红外激发荧光粉；所述紫外激发荧光粉优选为激发波长为360nm的苝的甲酸二酰亚胺衍生物（1,7-二溴-3,4,9,10-苝四甲酸二酰亚胺），所述红外激发荧光粉优选为激发波长为980nm的无机稀土氟化物（YErYbF3）；所述荧光粉具有荧光的特性，使得防伪母粒能吸收紫外光或红外光，发出特征荧光，目的在于提供一种易于识别的防伪特征。
所述助剂为偶联剂、润滑剂、抗氧剂或抗静电剂中的一种或几种的混合；所述偶联剂优选为乙烯基三乙氧基硅烷，所述润滑剂优选为硬脂酸，所述抗氧剂优选为2,6-二叔丁基-4-甲基苯酚，所述抗静电剂优选为聚醚酯酰胺。
所述加工助剂选自增塑剂、润滑剂、抗氧剂或抗静电剂中的一种或几种的混合；所述增塑剂优选为邻苯二甲酸二辛酯（DOP）和/或邻苯二甲酸二丁酯(DBP)，所述润滑剂优选为硬脂酸，所述抗氧剂优选为2,6-二叔丁基-4-甲基苯酚，所述抗静电剂优选为聚醚酯酰胺。
本发明所述的聚氯乙烯防伪薄膜的制备方法，包括如下步骤：
用大、小两台挤出机分别将聚氯乙烯、加工助剂和防伪母粒挤塑至共挤机头，聚氯乙烯和加工助剂混合均匀后从大挤出机中挤出，防伪母粒从小挤出机中挤出，挤出双色泡管后经吹胀、牵引、收卷，得到带有防伪条的聚氯乙烯防伪薄膜。
所述大、小两台挤出机的料筒温度均分为3段控制，依次为加料段110~130℃、中段140~160℃、前段150~180℃，共挤机头温度150~180℃，吹胀比2.0～3.0。
所述聚氯乙烯防伪薄膜上的防伪条宽度为0.3~5.0cm，可以通过调节大、小两台挤出机的喂料量来控制吹胀后的防伪条的宽度。
本发明通过聚氯乙烯薄膜与防伪条结合，采用特定的共挤吹膜工艺制备得到带有防伪条的聚氯乙烯防伪薄膜，在吹膜的时候，即在聚氯乙烯薄膜上生成防伪条及防伪编码，防伪条的载体树脂采用与薄膜相同的聚氯乙烯材料，防伪条与聚氯乙烯薄膜融结为一体，具有良好的结合力，从而保持了聚氯乙烯薄膜的优异性能。将聚氯乙烯防伪薄膜用于产品包装时，能将防伪条的编码信息与所包装产品的生产、流通信息相互捆绑，建立防伪信息管理系统。对所包装的产品进行防伪检验时，截取小段防伪条，用快速精密分析检测仪检测其编码信息，通过防伪信息管理系统可以快速、准确地查询到所包装产品的生产、流通信息，从而实现真伪鉴别与溯源。
本发明与现有技术相比，具有如下有益效果：
1）本发明通过采用特定的共挤吹膜工艺，使得制备得到的防伪条与聚氯乙烯薄膜融结为一体，具有良好的结合力，以聚氯乙烯防伪薄膜自身的特性进行防伪，防伪效果难以被仿制。
2）本发明制备得到的聚氯乙烯防伪薄膜，与现有带防伪标识的防伪包装相比，不需要额外生产和粘贴防伪标识，生产工艺简单，且防伪成本低，更容易加工成型和批量化生产。
3）本发明制备得到的聚氯乙烯防伪薄膜，能够将编码信息与其所包装的产品的生产、流通绑定，根据防伪条上的荧光特征和编码信息实现对产品的真伪鉴别和溯源。
附图说明
图1为本发明聚氯乙烯防伪薄膜的挤出膜泡示意图；
图2为本发明聚氯乙烯防伪薄膜的A-A截面示意图；
图3 为本发明聚氯乙烯防伪薄膜成品示意图；
图中：1为聚氯乙烯薄膜，2为防伪条，3为共挤模头。
具体实施方式
下面通过具体实施方式来进一步说明本发明，以下实施例为本发明较佳的实施方式，但本发明的实施方式并不受下述实施例的限制。
以下实施例和对比例中：
所使用的聚氯乙烯：选用市售SG-3型PVC树脂。
所使用的荧光粉：紫外激发荧光粉选用苝的甲酸二酰亚胺衍生物（1,7-二溴-3,4,9,10-苝四甲酸二酰亚胺），激发波长360nm，发出绿色荧光；红外激发荧光粉选用无机稀土氟化物（YErYbF3），激发波长：980nm，发出绿色荧光。
所使用的助剂：偶联剂选用乙烯基三乙氧基硅烷，润滑剂选用硬脂酸，抗氧剂选用2,6-二叔丁基-4-甲基苯酚，抗静电剂选用聚醚酯酰胺。
所使用的加工助剂：增塑剂选用邻苯二甲酸二辛酯（DOP）和/或邻苯二甲酸二丁酯(DBP)，润滑剂选用硬脂酸，抗氧剂选用2,6-二叔丁基-4-甲基苯酚，抗静电剂选用聚醚酯酰胺。
实施例A1~A40及对比例B1~B4：防伪母粒的制备
将载体树脂、荧光粉、编码物质和助剂按表1~5所示配比称量，倒入高混机中混合均匀，在双螺杆挤出机中200~300℃熔融，挤出造粒，制备得到防伪母粒。
实施例1~40及对比例1~6：聚氯乙烯防伪薄膜的制备
一种聚氯乙烯防伪薄膜的制备方法，其原料配方如表6~10所示，其制备方法包括以下步骤：
按重量份称取好各组分，用大、小两台挤出机分别将聚氯乙烯、加工助剂和表1~5制备得到的防伪母粒挤塑至共挤机头，聚氯乙烯和加工助剂混合均匀后从大挤出机中挤出，防伪母粒从小挤出机中挤出，挤出双色泡管后经吹胀、牵引、收卷，得到带有防伪条的聚氯乙烯防伪薄膜；其中，所述大、小两台挤出机的料筒温度均分为3段控制，依次为加料段120℃、中段150℃、前段165℃，共挤机头温度165℃，吹胀比2.5。测定其防伪条的宽度、防伪条相对撕裂强度，防伪条荧光、防伪编码检测效果、防伪成本，具体数据列于表6~10中。
各性能指标的测试方法或标准如下：
防伪条相对撕裂强度测试按GB/T 16578.1-2008塑料薄膜和薄片耐撕裂性能的测定 第1部分：裤形撕裂法进行，分别测试防伪条和聚氯乙烯薄膜的撕裂强度，以二者的比值作为防伪条的相对撕裂强度。
防伪条荧光检测采用便携式紫外灯或红外灯，在遮光环境下照射防伪条表面，目测其荧光亮度。
防伪编码检测的检测方法：从防伪薄膜上截取一小段防伪条，采用专用精密XRF荧光光谱分析仪检测编码物质的种类和含量，从而准确检测出防伪编码。
防伪成本，是指生产防伪聚氯乙烯薄膜较生产普通聚氯乙烯薄膜增加的成本，主要是指防伪条较同等量的聚氯乙烯所增加的原材料成本，防伪母粒的加工成本以及防伪条的挤出成本这三部分占聚氯乙烯防伪薄膜的总成本的比例。
Claims (9)
1.一种聚氯乙烯防伪薄膜，其特征在于，按重量份计，包括如下组分：
聚氯乙烯 100份；
防伪母粒 0.1~20份；
加工助剂 25~35份；
其中，所述防伪母粒，按重量百分比计，包括如下组分：
载体树脂 28~99.9%；
荧光粉 0.01~15%；
编码物质 0.01~65%；
助剂 0~3.25%；
所述载体树脂为聚氯乙烯。
2.根据权利要求1所述的聚氯乙烯防伪薄膜，其特征在于，所述编码物质选自选自镁、钾、钙、钪、钛、钒、铬、锰、铁、钴、镍、 铜、锌、镓、锗、硒、锶、钇、锆、铌、钼、钯、银、铟、锡、锑、碲、钡、镧、铈、镨、钕、钐、钆、镝、钬、铒、铥、镱、镥、铋的化合物的一种或几种。
3.根据权利要求1所述的聚氯乙烯防伪薄膜，其特征在于，所述荧光粉选自紫外激发荧光粉和/或红外激发荧光粉；所述紫外激发荧光粉优选为激发波长为360nm的苝的甲酸二酰亚胺衍生物（1,7-二溴-3,4,9,10-苝四甲酸二酰亚胺），所述红外激发荧光粉优选为激发波长为980nm的无机稀土氟化物（YErYbF3）。
4.根据权利要求1所述的聚氯乙烯防伪薄膜，其特征在于，所述助剂为偶联剂、润滑剂、抗氧剂或抗静电剂中的一种或几种的混合；所述偶联剂优选为乙烯基三乙氧基硅烷，所述润滑剂优选为硬脂酸，所述抗氧剂优选为2,6-二叔丁基-4-甲基苯酚，所述抗静电剂优选为聚醚酯酰胺。
5.根据权利要求1所述的聚氯乙烯防伪薄膜，其特征在于，所述加工助剂选自增塑剂、润滑剂、抗氧剂或抗静电剂中的一种或几种的混合；所述增塑剂优选为邻苯二甲酸二辛酯（DOP）和/或邻苯二甲酸二丁酯(DBP)，所述润滑剂优选为硬脂酸，所述抗氧剂优选为2,6-二叔丁基-4-甲基苯酚，所述抗静电剂优选为聚醚酯酰胺。
6.根据权利要求1所述的聚氯乙烯防伪薄膜，其特征在于：所述防伪母粒的制备方法，包括如下步骤：将载体树脂、荧光粉、编码物质和助剂按配比称量，倒入高混机中混合均匀，在双螺杆挤出机中200~300℃熔融，挤出造粒，得到防伪母粒。
7.如权利要求1~6任一项所述的聚氯乙烯防伪薄膜的制备方法，包括如下步骤：
用大、小两台挤出机分别将聚氯乙烯、加工助剂和防伪母粒挤塑至共挤机头，聚氯乙烯和加工助剂混合均匀后从大挤出机中挤出，防伪母粒从小挤出机中挤出，挤出双色泡管后经吹胀、牵引、收卷，得到带有防伪条的聚氯乙烯防伪薄膜。
8.根据权利要求7所述的聚氯乙烯防伪薄膜的制备方法，所述大、小两台挤出机的料筒温度均分为3段控制，依次为加料段110~130℃、中段140~160℃、前段150~180℃，共挤机头温度150~180℃，吹胀比2.0～3.0。
9.根据权利要求7所述的聚氯乙烯防伪薄膜的制备方法，所述聚氯乙烯防伪薄膜上的防伪条宽度为0.3~5.0cm。
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