CN104310973A - 高导热功能陶瓷薄板及其制备方法 - Google Patents
高导热功能陶瓷薄板及其制备方法 Download PDFInfo
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Abstract
本发明涉及一种建筑陶瓷用品,具体涉及一种高导热功能陶瓷薄板及其制备方法。所述高导热功能陶瓷薄板由以下重量百分比的原料制成:石英5~10%、铝矾土50~60%、氧化铝1~5%、高岭土5~10%、长石5~15%、滑石1~5%、工业废料5~10%、成核剂6~10%。将原料与水混合后进行球磨制得浆料,过筛除铁后,再将浆料通过干燥塔喷雾造粒制得粉料,经压制成型制得陶瓷薄板生坯,生坯经过干燥、煅烧、降温,得到高导热功能陶瓷薄板。其厚度为3~5mm,仅为普通陶瓷砖厚度的1/3~1/4,不仅原材料用量减少,烧成温度、烧成时间也随之缩短,节约资源、能源的同时也减少了污水、废弃物的排放,具有耐磨、重量低、强度高、美观大方等优点,应用于地暖供暖,大大提高了地暖热效率,减少了能源消耗。
Description
技术领域
本发明涉及一种建筑陶瓷用品,具体涉及一种高导热功能陶瓷薄板及其制备方法。
背景技术
随着经济的高速发展,建筑陶瓷行业也随之迅速崛起,在国民经济中发挥着不可忽视的作用。但是建筑陶瓷行业作为高能耗污染行业,存在着发展与资源、能源的过度消耗等问题,严重制约了建筑陶瓷行业的快速可持续发展。因此,陶瓷薄型化、功能化、减量化生产是建筑陶瓷行业实现节约资源、节能减排的重要途径。
刘西民(《陶瓷》2009(9)20-21)从陶瓷薄板生产过程中节约能源、资源消耗,改善环境污染方面论述了陶瓷薄板的应用前景,该文没有谈及陶瓷薄板在使用过程中的能源节约及陶瓷薄板的高导热性。在《陶瓷薄板与生产技术发展现状与前景》中,黄惠宁柯善军等人指出提高陶瓷薄板强度措施之一是增加瓷胚的晶相含量,减少玻璃相具体措施,也没有涉及陶瓷薄板的高导热性。
发明内容
本发明的目的是提供一种厚度小、重量轻且导热系数大的高导热功能陶瓷薄板;本发明同时提供其制备方法。
本发明所述的高导热功能陶瓷薄板,是以石英、滑石、氧化铝、长石等为主要原料,加入一定量导热系数较大的工业废料和成核剂,通过压制成型、煅烧、降温制得。
本发明所述的高导热功能陶瓷薄板,由以下重量百分比的原料制成:
石英5~10%、铝矾土50~60%、氧化铝1~5%、高岭土5~10%、长石5~15%、滑石1~5%、工业废料5~10%、成核剂6~10%。
所述的工业废料优选堇青石,堇青石的导热系数较高。同时,配方中选用氧化铝及氧化铝含量较高的矿物原料,氧化铝的常温导热系数为30W/(m·k)。因此,当在配方中加入一定量的堇青石等工业废料,可以生成氧化铝-堇青石复合相,提高了陶瓷薄板的高温热稳定性和导热系数。
所述的成核剂优选磷酸钙。本发明通过加入成核剂以提高玻璃相的晶化效率,达到提高晶化程度的目的,从而提高导热系数。
所述的高导热功能陶瓷薄板的制备方法包括以下步骤:
将原料与水混合后进行球磨制得浆料,过筛除铁后,再将浆料通过干燥塔喷雾造粒制得粉料,经压制成型制得陶瓷薄板生坯,生坯经过干燥、煅烧、降温,得到高导热功能陶瓷薄板。
球磨时,在球磨机连续球磨8~10小时。
所述的干燥温度500~700℃,干燥时间1~3小时。
对坯体的煅烧温度为1150~1300℃,煅烧时间1~2小时;降温阶段,在1100~900℃温度范围内的降温速率为1~2℃/min,通过控制降温速度,改善胚体显微结构,制备得到高导热功能陶瓷薄板,其厚度为3~5mm,导热系数为4~6W/m·k。
由于晶体的导热系数远远大于玻璃相的导热系数,因此通过适当延长时间保温时间或降低玻璃相析晶温度范围内(900~1100℃)的降温速度的方法来提高玻璃相的晶化程度,也可以起到提高导热系数的作用。
本发明为提高功能陶瓷薄板的导热系数,首先在原料选择和配方设计时考虑添加导热系数高和具有促进玻璃相晶化作用的原料。其次,在制备工艺过程中,通过控制煅烧温度、降温速度,提高玻璃相晶化程度。对于导热系数的提高,采取以下几种措施:
第一、选用导热系数高的材料。配方中选用氧化铝含量较高的矿物原料,氧化铝的常温导热系数为30W/(m.k)。同时,在配方中含有一定量的堇青石等工业废料,生成氧化铝-堇青石复合相,提高陶瓷薄板的高温热稳定性和导热系数。
第二、适当降低降温速度。由于晶体的导热系数远远大于玻璃相的导热系数,因此通过适当延长时间保温时间或降低玻璃相析晶温度范围内(900-1100℃)的降温速度的方法来提高玻璃相的晶化程度,也可以起到提高导热系数的作用。
第三、加入成核剂提高玻璃的晶化效率。通过加入成核剂以提高玻璃相的晶化效率,达到提高晶化程度的目的,从而提高导热系数。
本发明具有以下有益效果:
本发明提供的高导热功能陶瓷薄板的厚度为3~5mm,为普通陶瓷砖厚度的1/3~1/4,不仅原材料用量减少,烧成温度、烧成时间也随之缩短,节约资源、能源的同时也减少了污水、废弃物的排放,具有耐磨、重量低、强度高、美观大方等优点。
从地暖供暖热效率方面来说,传统的瓷砖厚度较大,地暖热利用率低。而高导热功能陶瓷薄板由于厚度较小,导热系数大,提高了热能利用效率,采用超薄陶瓷板砖的地暖系统采暖与传统的对流供暖方式相比较节能幅度约为30%。本发明应用于地暖供暖,大大提高了地暖热效率,减少了能源消耗。从重量方面来说,高导热功能陶瓷薄板每平方米的重量不到普通陶瓷板砖重量的一半。不仅节约了物流运输成本,减轻建筑物的荷载,更是直接降低了物流、建筑施工的碳排放。
具体实施方式
以下结合实施例对本发明作进一步描述。
本发明陶瓷砖的性能测试方法如下:
采用导热系数测试仪对制备产品进行导热系数测试,采用陶瓷砖数显抗析仪对制备产品进行抗折强度测试。
实施例1
所述高导热功能陶瓷薄板原料组成如下,以重量百分比计:
石英6%、铝矾土52%、氧化铝5%、高岭土10%、长石11%、滑石4%、堇青石6%、磷酸钙6%。
将原料和水加入连续球磨机球磨10小时制得浆料,经过筛除铁;再将浆料通过干燥塔喷雾造粒制得粉料;粉料经7200吨压机压制成型,得到陶瓷薄板生坯;生坯经过500℃干燥3小时,再经输送带进入窑炉,于1150℃煅烧2小时烧制成型,并且在1100℃到900℃温度范围内的降温速率为1℃/min,得到厚度为3mm高导热功能陶瓷薄板成品,导热系数为5.4W/m·k,抗折强度64.5MPa。
实施例2
所述高导热功能陶瓷薄板原料组成如下,以重量百分比计:
石英6%、铝矾土52%、氧化铝4%、高岭土10%、长石11%、滑石4%、堇青石6%、磷酸钙7%。
将原料和水加入连续球磨机球磨8小时制得浆料,经过筛除铁;再将浆料通过干燥塔喷雾造粒制得粉料;粉料经7200吨压机压制成型,得到陶瓷薄板生坯;生坯经过600℃干燥2.5小时,再经输送带进入窑炉,于1200℃煅烧1.5小时烧制成型,并且在1100℃到900℃温度范围内的降温速率为1.5℃/min,得到厚度为5mm高导热功能陶瓷薄板成品,导热系数为5.6W/m·k,抗折强度65.0MPa。
实施例3
所述高导热功能陶瓷薄板原料组成如下,以重量百分比计:
石英6%、铝矾土50%、氧化铝4%、高岭土10%、长石11%、滑石4%、堇青石7%、磷酸钙8%。
将原料和水加入连续球磨机球磨8小时制得浆料,经过筛除铁;再将浆料通过干燥塔喷雾造粒制得粉料;粉料经7200吨压机压制成型,得到陶瓷薄板生坯;生坯经过700℃干燥1小时,再经输送带进入窑炉,于1300℃煅烧1小时烧制成型,并且在1100℃到900℃温度范围内的降温速率为1℃/min,得到厚度为4mm高导热功能陶瓷薄板成品,导热系数为6W/m·k,抗折强度65.4MPa。
实施例4
所述高导热功能陶瓷薄板原料组成如下,以重量百分比计:
石英5%、铝矾土50%、氧化铝4%、高岭土10%、长石11%、滑石4%、堇青石7%、磷酸钙9%。
将原料和水加入连续球磨机球磨9小时制得浆料,经过筛除铁;再将浆料通过干燥塔喷雾造粒制得粉料;粉料经7200吨压机压制成型,得到陶瓷薄板生坯;生坯经过700℃干燥1小时,再经输送带进入窑炉,于1250℃煅烧1.5小时烧制成型,并且在1100℃到900℃温度范围内的降温速率为2℃/min,得到厚度为5mm高导热功能陶瓷薄板成品,导热系数为5.8W/m·k,抗折强度64.7MPa。
实施例5
所述高导热功能陶瓷薄板原料组成如下,以重量百分比计:
石英5%、铝矾土50%、氧化铝4%、高岭土8%、长石10%、滑石4%、堇青石9%、磷酸钙10%。
将原料和水加入连续球磨机球磨10小时制得浆料,经过筛除铁;再将浆料通过干燥塔喷雾造粒制得粉料;粉料经7200吨压机压制成型,得到陶瓷薄板生坯;生坯经过500℃干燥3小时,再经输送带进入窑炉,于1200℃煅烧1.5小时烧制成型,并且在1100℃到900℃温度范围内的降温速率为2℃/min,得到厚度为4mm高导热功能陶瓷薄板成品,导热系数为5.5W/m·k,抗折强度64.9MPa。
Claims (9)
1.一种高导热功能陶瓷薄板,其特征在于由以下重量百分比的原料制成:
石英5~10%、铝矾土50~60%、氧化铝1~5%、高岭土5~10%、长石5~15%、滑石1~5%、工业废料5~10%、成核剂6~10%。
2.根据权利要求1所述的高导热功能陶瓷薄板,其特征在于:工业废料为堇青石。
3.根据权利要求1所述的高导热功能陶瓷薄板,其特征在于:成核剂为磷酸钙。
4.一种权利要求1所述的高导热功能陶瓷薄板的制备方法,其特征在于包括以下步骤:
将原料与水混合后进行球磨制得浆料,过筛除铁后,再将浆料通过干燥塔喷雾造粒制得粉料,经压制成型制得陶瓷薄板生坯,生坯经过干燥、煅烧、降温,得到高导热功能陶瓷薄板。
5.根据权利要求4所述的高导热功能陶瓷薄板的制备方法,其特征在于:在球磨机连续球磨8~10小时。
6.根据权利要求4所述的高导热功能陶瓷薄板的制备方法,其特征在于:干燥温度500~700℃,干燥时间1~3小时。
7.根据权利要求4所述的高导热功能陶瓷薄板的制备方法,其特征在于:煅烧温度1150~1300℃,煅烧时间1~2小时。
8.根据权利要求4所述的高导热功能陶瓷薄板的制备方法,其特征在于:降温时,在1100~900℃内的降温速率为1~2℃/min。
9.根据权利要求4所述的高导热功能陶瓷薄板的制备方法,其特征在于:制备的高导热功能陶瓷薄板厚度为3~5mm,导热系数为4~6W/m·k。
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