CN104300075A - White-light LED light source device and manufacturing method - Google Patents
White-light LED light source device and manufacturing method Download PDFInfo
- Publication number
- CN104300075A CN104300075A CN201310319715.9A CN201310319715A CN104300075A CN 104300075 A CN104300075 A CN 104300075A CN 201310319715 A CN201310319715 A CN 201310319715A CN 104300075 A CN104300075 A CN 104300075A
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- transparent support
- led chip
- powder layer
- phosphor powder
- light source
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
A white-light LED light source device and a manufacturing method especially relate to the technical field of LEDs. Metal electrodes (2) are respectively arranged at the two sides of a first transparent supporting member (1). A second transparent supporting member (3) is fixed to the upper end of the first transparent supporting member (1). A plurality of LED chips (4) are arranged at the upper end of the second transparent supporting member (3). The LED chips (4) and the metal electrodes (2) are connected via metal lead wires (5). The upper ends of the first supporting member (1), the second transparent supporting member (3) and the LED chips (4) are respectively coated with a second phosphor powder layer (7). The white-light LED light source device can achieve a 360-degree light emitting effect, and adhesion between the LED chips and the supporting members is firm and reliable. Phenomena such as LED chip upwarp, shift and separation from the supporting members cannot be generated easily during the wire welding process.
Description
Technical field:
The present invention relates to LED technology field, be specifically related to a kind of white LED light source device and manufacture method.
Background technology:
LED light source component is the feature such as luminous efficiency is high, pollution-free, rich color owing to having, and is just being widely used in the fields such as TV backlight, graphic display screen, decorative lighting, commercial lighting.Along with the reduction of cost and improving constantly of heat dispersion, LED light source component enters general illumination field rapidly, and white LED light source just progressively substitutes the conventional illumination sources such as incandescent lamp, fluorescent lamp.At present, white LED light source is generally adopt the mode of blue-light LED chip fluorescence excitation material to obtain.The common practices of white LED light source device is fixed on by LED chip on a strutting piece, fluorescent material covers on LED chip, LED chip is sealed, form half encapsulating structure, the shortcoming of this kind of way is because strutting piece is non-transparent material, the lighting angle of device is limited, can not form the illumination effect of 360 degree.
In order to obtain the illumination effect that lighting angle is 360 degree, existing a kind of white LED light source device adopts transparent material as strutting piece, with the die bond glue having admixed fluorescent material, LED chip is adhesively fixed on strutting piece, LED chip is covered again with fluorescent material, this structure makes LED chip surrounding have fluorescent material to surround, therefore the light that LED chip is launched in any direction can both fluorescence excitation material, and because strutting piece is that transparent material is made, light can penetrate strutting piece, therefore each direction there is light to penetrate, define the illumination effect that lighting angle is 360 degree.But the shortcoming that this structure exists is, because the cementability of the die bond glue after having admixed fluorescent material can reduce, therefore the bonding force of LED chip and strutting piece is lower, be bonded in the wire bonding process after on strutting piece at LED chip, Bonding pressure easily causes LED chip to tilt, skew, depart from the phenomenons such as strutting piece, difficulty is caused to production operation, and light source device is being lighted in application process, because different materials coefficient of thermal expansion is different, the high heat of device inside accumulation more easily causes the phenomenon of die bond glue and strutting piece disengaging or LED chip and the disengaging of die bond glue, thus it is abnormal to cause device to be electrically connected, the disabled status such as dead lamp.
Summary of the invention:
The object of this invention is to provide a kind of white LED light source device and manufacture method, it not only can have the illumination effect that lighting angle is 360 degree, and bonding solid and reliable between LED chip and strutting piece, the phenomenon that LED chip tilts, offsets, departs from strutting piece is less likely to occur in wire bonding process, more be applicable to production operation, significantly reduce simultaneously and lighting in application process the probability occurring the situations such as abnormal, the dead lamp of electrical connection.
In order to solve the problem existing for background technology, the present invention is by the following technical solutions: its manufacture method: 1, with fluorescent material and glue mixed preparing fluorescent glue, second transparent support being bonded in the fluorescent glue prepared is provided with in the first transparent support of metal electrode, and fluorescent glue is solidified, form the first phosphor powder layer; 2, LED chip to be bonded in the second transparent support with transparent glue and to make glue curing; 3, with plain conductor, LED chip is connected with metal electrode with LED chip, LED chip, forms the electrical connection between LED chip, between LED chip and metal electrode.4, in the first transparent support, cover the second phosphor powder layer, the second transparent support and LED chip are surrounded by the encirclement structure that the first phosphor powder layer and the second phosphor powder layer are formed.
Described white LED light source device, it comprises the first transparent support 1, metal electrode 2, second transparent support 3, LED chip 4, metal lead wire 5, first phosphor powder layer 6, second phosphor powder layer 7, the arranged outside of the first described transparent support 1 has metal electrode 2, the upper end of the first transparent support 1 is adhesively fixed with the second transparent support 3 by the first phosphor powder layer 6, LED chip 4 is adhesively fixed in the second transparent support 3, the upper end of the second transparent support 3 is provided with several LED chip 4, LED chip 4 is connected by metal lead wire 5 with metal electrode 2, first transparent support 1, second transparent support 3, LED chip 4 upper end is provided with the second phosphor powder layer 7.
The second described transparent support 3 is provided with metallic circuit 8, between LED chip by metallic circuit 8 for medium complexed metal lead-in wire 5 is interconnected.
The first described transparent support 1, second transparent support 3 is glass transparent support.
The first described transparent support 1, second transparent support 3 is pottery transparent support processed.
Described LED chip 4 adopts the transparent glue without blending fluorescent material to be adhesively fixed.
The present invention has following beneficial effect: because the second transparent support and LED chip sealing are surrounded by the first phosphor powder layer and the second phosphor powder layer, therefore the light that LED chip is launched in any direction can both excitated fluorescent powder, and light can pass the second transparent support and the first transparent support, each direction there is light to penetrate, define the illumination effect that lighting angle is 360 degree, and LED chip relies on the transparent glue without blending fluorescent material to be adhesively fixed in the second transparent support, therefore the bonding force between LED chip and strutting piece is strong, be less likely to occur LED chip in wire bonding process to tilt, skew, depart from the phenomenon of strutting piece, more be applicable to production operation, significantly reduce simultaneously and lighting appearance electrical connection exception in application process, the probability of the situations such as dead lamp.
Accompanying drawing illustrates:
Fig. 1 is structural representation of the present invention;
Fig. 2 is vertical view of the present invention;
Fig. 3 is that the present invention specifically implements two structural representations;
Fig. 4 is the specific embodiment of the invention two vertical view.
Embodiment:
Embodiment one:
Referring to Fig. 1-2, this embodiment is by the following technical solutions: its manufacture method: 1, with fluorescent material and glue mixed preparing fluorescent glue, second transparent support being bonded in the fluorescent glue prepared is provided with in the first transparent support of metal electrode, and fluorescent glue is solidified, form the first phosphor powder layer; 2, LED chip to be bonded in the second transparent support with transparent glue and to make glue curing; 3, with plain conductor, LED chip is connected with metal electrode with LED chip, LED chip, forms the electrical connection between LED chip, between LED chip and metal electrode.4, in the first transparent support, cover the second phosphor powder layer, the second transparent support and LED chip are surrounded by the encirclement structure that the first phosphor powder layer and the second phosphor powder layer are formed.
Described white LED light source device, it comprises the first transparent support 1, metal electrode 2, second transparent support 3, LED chip 4, metal lead wire 5, first phosphor powder layer 6, second phosphor powder layer 7, the arranged outside of the first described transparent support 1 has metal electrode 2, the upper end of the first transparent support 1 is adhesively fixed with the second transparent support 3 by the first phosphor powder layer 6, LED chip 4 is adhesively fixed in the second transparent support 3, the upper end of the second transparent support 3 is provided with several LED chip 4, LED chip 4 is connected by metal lead wire 5 with metal electrode 2, first transparent support 1, second transparent support 3, LED chip 4 upper end is provided with the second phosphor powder layer 7.
The first described transparent support 1, second transparent support 3 is glass transparent support.
The first described transparent support 1, second transparent support 3 is pottery transparent support processed.
Described LED chip 4 adopts the transparent glue without blending fluorescent material to be adhesively fixed.
This embodiment has following beneficial effect: because the second transparent support and LED chip sealing are surrounded by the first phosphor powder layer and the second phosphor powder layer, therefore the light that LED chip is launched in any direction can both excitated fluorescent powder, and light can pass the second transparent support and the first transparent support, each direction there is light to penetrate, define the illumination effect that lighting angle is 360 degree, and LED chip relies on the transparent glue without blending fluorescent material to be adhesively fixed in the second transparent support, therefore the bonding force between LED chip and strutting piece is strong, be less likely to occur LED chip in wire bonding process to tilt, skew, depart from the phenomenon of strutting piece, more be applicable to production operation, significantly reduce simultaneously and lighting appearance electrical connection exception in application process, the probability of the situations such as dead lamp.
Embodiment two:
Referring to Fig. 3-4, the difference of this embodiment and concrete embodiment one is: between adjacent LED chip, be provided with metallic circuit 8, between adjacent LED chip by metallic circuit 8 for medium complexed metal lead-in wire 5 is interconnected, other compositions are identical with embodiment one with annexation.
Claims (6)
1. a white LED light source device and manufacture method, it is characterized in that its manufacture method: 1, with fluorescent material and glue mixed preparing fluorescent glue, second transparent support being bonded in the fluorescent glue prepared is provided with in the first transparent support of metal electrode, and fluorescent glue is solidified, form the first phosphor powder layer; 2, LED chip to be bonded in the second transparent support with transparent glue and to make glue curing; 3, with plain conductor, LED chip is connected with metal electrode with LED chip, LED chip, forms the electrical connection between LED chip, between LED chip and metal electrode.4, in the first transparent support, cover the second phosphor powder layer, the second transparent support and LED chip are surrounded by the encirclement structure that the first phosphor powder layer and the second phosphor powder layer are formed.
2. a white LED light source device, it is characterized in that it comprises the first transparent support (1), metal electrode (2), second transparent support (3), LED chip (4), metal lead wire (5), first phosphor powder layer (6), second phosphor powder layer (7), the arranged outside of described the first transparent support (1) has metal electrode (2), the upper end of the first transparent support (1) is adhesively fixed with the second transparent support (3) by the first phosphor powder layer (6), LED chip (4) is adhesively fixed in the second transparent support (3), the upper end of the second transparent support (3) is provided with several LED chip (4), LED chip (4) is connected by metal lead wire (5) with metal electrode (2), first transparent support (1), second transparent support (3), LED chip (4) upper end is provided with the second phosphor powder layer (7).
3. a kind of white LED light source device according to claim 2, it is characterized in that described the second transparent support (3) is provided with metallic circuit (8), between LED chip by metallic circuit (8) for medium complexed metal lead-in wire (5) be interconnected.
4. a kind of white LED light source device according to claim 2, is characterized in that described the first transparent support (1), the second transparent support (3) is glass transparent support.
5. a kind of white LED light source device according to claim 2, is characterized in that described the first transparent support (1), the second transparent support (3) are for pottery transparent support processed.
6., according to a kind of white LED light source device according to claim 2, it is characterized in that described LED chip (4) adopts the transparent glue without blending fluorescent material to be adhesively fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310319715.9A CN104300075B (en) | 2013-07-18 | 2013-07-18 | White-light LED light source device and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310319715.9A CN104300075B (en) | 2013-07-18 | 2013-07-18 | White-light LED light source device and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104300075A true CN104300075A (en) | 2015-01-21 |
| CN104300075B CN104300075B (en) | 2017-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310319715.9A Active CN104300075B (en) | 2013-07-18 | 2013-07-18 | White-light LED light source device and manufacturing method |
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| Country | Link |
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| CN (1) | CN104300075B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105449082A (en) * | 2015-11-18 | 2016-03-30 | 深圳市鸿兆实业发展有限公司 | Manufacturing method of 360 degree luminescence LED light source |
| DE102017130764A1 (en) * | 2017-12-20 | 2019-06-27 | Osram Opto Semiconductors Gmbh | Device with semiconductor chips on a primary carrier |
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| CN1340864A (en) * | 2000-09-01 | 2002-03-20 | 西铁城电子股份有限公司 | Surface assembled luminescent diode and its manufacture method |
| CN1510766A (en) * | 2002-12-24 | 2004-07-07 | 斯坦雷电气株式会社 | Surface installation white light emitting diodes |
| KR20110094543A (en) * | 2010-02-17 | 2011-08-24 | 일진반도체 주식회사 | Light emitting diode package |
| CN102664229A (en) * | 2012-06-05 | 2012-09-12 | 泉州万明光电有限公司 | Light emitting diode light source structure |
| CN203367278U (en) * | 2013-07-18 | 2013-12-25 | 深圳市斯迈得光电子有限公司 | White light LED light source device |
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2013
- 2013-07-18 CN CN201310319715.9A patent/CN104300075B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1340864A (en) * | 2000-09-01 | 2002-03-20 | 西铁城电子股份有限公司 | Surface assembled luminescent diode and its manufacture method |
| CN1510766A (en) * | 2002-12-24 | 2004-07-07 | 斯坦雷电气株式会社 | Surface installation white light emitting diodes |
| KR20110094543A (en) * | 2010-02-17 | 2011-08-24 | 일진반도체 주식회사 | Light emitting diode package |
| CN102664229A (en) * | 2012-06-05 | 2012-09-12 | 泉州万明光电有限公司 | Light emitting diode light source structure |
| CN203367278U (en) * | 2013-07-18 | 2013-12-25 | 深圳市斯迈得光电子有限公司 | White light LED light source device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105449082A (en) * | 2015-11-18 | 2016-03-30 | 深圳市鸿兆实业发展有限公司 | Manufacturing method of 360 degree luminescence LED light source |
| DE102017130764A1 (en) * | 2017-12-20 | 2019-06-27 | Osram Opto Semiconductors Gmbh | Device with semiconductor chips on a primary carrier |
| CN110010748A (en) * | 2017-12-20 | 2019-07-12 | 欧司朗光电半导体有限公司 | The method of equipment and manufacturing equipment with the semiconductor chip on main carrier |
| US10727384B2 (en) | 2017-12-20 | 2020-07-28 | Osram Oled Gmbh | Device with semiconductor chips on a primary carrier |
| DE102017130764B4 (en) | 2017-12-20 | 2024-01-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Device with semiconductor chips on a primary carrier and method for producing such a device |
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| CN104300075B (en) | 2017-03-22 |
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Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor Applicant after: SHENZHEN SMALITE OPTO-ELECTRONIC CO., LTD. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor Applicant before: Shenzhen Smalite Optoelectronics Co., Ltd. |
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