CN104296100B - Led lamp - Google Patents
Led lamp Download PDFInfo
- Publication number
- CN104296100B CN104296100B CN201410543451.XA CN201410543451A CN104296100B CN 104296100 B CN104296100 B CN 104296100B CN 201410543451 A CN201410543451 A CN 201410543451A CN 104296100 B CN104296100 B CN 104296100B
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- CN
- China
- Prior art keywords
- heat transfer
- fin
- led
- heat
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
An LED lamp comprises LED luminous units, a circuit board, a heat transfer board, a semiconductor refrigerating plate, a heat sink, a heat transfer plate and a heat transfer post. The LED luminous units, the circuit board, the heat transfer board, the semiconductor refrigerating plate and the heat sink are connected in sequence; the circuit board is used for mounting of the LED luminous units; the heat transfer board is used for transferring heat; the heat transfer plate is closely mounted to one sides of the LED luminous units; the heat transfer post which is protruded is arranged in the middle of the heat transfer plate; the circuit board is provided with a via hole corresponding to the heat transfer post, and the heat transfer post penetrates the via hole to be connected with the heat transfer board. Further, the heat sink comprises a base plate and a plurality of fins mounted on the base plate; the fins on the base plate encircle to form a cavity; a gap is formed between every two adjacent fins; and the cavity is communicated with the gaps. A plurality of piezoelectric oscillator plates are parallelly arranged in the cavity along a direction perpendicular to the fins and are connected with the fins. After power on, the piezoelectric oscillator plates bound in the cavity oscillate to compress air in the cavity to exhaust high-heat air in the cavity rapidly from the gaps, so that heat is dissipated and radiating efficiency of the LED lamp is improved.
Description
Technical field
The present invention relates to a kind of light source, especially relate to a kind of LED.
Background technology
LED (Light Emitting Diode), i.e. semi-conductor electricity light source, light emitting diode, also referred to as semiconductor lamp, be
A kind of electric light source of no filament, is directly converted into luminous energy electric energy.
LED as a kind of solid light source, have using mission length, light efficiency be high due to it, photochromic many, small volume,
The advantages such as safety and environmental protection and become the mankind illuminate history on a revolution.In theory, the luminous efficiency of LED is very high, but due to
In current LED, heat transfer plate by LED luminescence unit light generation heat transfer to semiconductor chilling plate, then by semiconductor
Cooling piece transfers heat to fin, is distributed heat in the air by fin, thus reducing the temperature of LED.?
In the LED course of work, substantial amounts of heat is gathered in LED, if radiating efficiency does not improve, can make LED chip temperature
Too high, thus badly influencing luminous efficiency and the life-span of LED.
Content of the invention
Based on this it is necessary to provide a kind of radiating efficiency higher LED.
A kind of LED, including the LED luminescence unit being sequentially connected, wiring board, is used for transmitting the heat transfer plate of heat, partly leading
Body cooling piece and fin.Semiconductor chilling plate includes hot junction and cold end, and cold end is connected with heat transfer plate, hot junction and fin phase
Even.Also include being snugly mounted to wiring board having and be provided with a projection in the middle of the heat transfer sheet of one side of LED luminescence unit, heat transfer sheet
Heat transfer pole.The place of the corresponding heat transfer pole of wiring board has a via, and heat transfer pole is connected to heat transfer plate through via, and fin includes
Substrate and several fins being installed on substrate, hot junction is connected with substrate, and several fins enclose on substrate and form one
, there is gap in cavity, cavity is connected with gap between two neighboring fin.Abreast it is provided with fin vertical direction in cavity
Several piezoelectric vibration pieces, piezoelectric vibration piece is connected with several fins.
In one of embodiment, piezoelectric vibration piece is connected with flexible sheet.
In one of embodiment, piezoelectric vibration piece is bonding with flexible sheet, and the edge of piezoelectric vibration piece is bonding with fin.
In one of embodiment, the hot junction of semiconductor chilling plate and the joint face of substrate scribble Heat Conduction Material.
In one of embodiment, fin scribbles radiating paint.
In one of embodiment, heat transfer sheet and wiring board are bolted to connection.
In one of embodiment, heat transfer pole, the joint face of heat transfer plate scribbles Heat Conduction Material.
In one of embodiment, semiconductor chilling plate outer surface is coated with heat-insulating material.
In one of embodiment, fin is provided with several passages.
In one of embodiment, the material of fin is magnadure.
Above-mentioned LED, the heat transfer sheet that being close to setting assist side has the one side of LED luminescence unit from wiring board is just conducive to
The heat of LED is more closely collected in face, can rapidly transfer heat to conduct heat by the heat transfer pole on described heat transfer sheet
In plate, heat transfer plate may also receive from the heat of wiring board, and the cold end of semiconductor chilling plate can directly cool down to heat transfer plate
Cooling, thus rapidly cooling to LED luminescence unit, then passes through to connect fin by heat in the hot junction of semiconductor chilling plate
Amount is delivered in fin, it is to avoid semiconductor chilling plate hot-side temperature is too high and the refrigeration that lowers cooling piece.It is being arranged on
Several spaced fins on substrate are conducive to increasing the contact area of fin and air, accelerate exchange rate,
Improve radiating efficiency, meanwhile, vertical with fin in cavity be provided with piezoelectric vibration piece, piezoelectric vibration piece simultaneously with several fins
It is connected, by the vibrations of piezoelectric vibration piece, drive fin vibrations, and extrude the air in cavity, make to carry hyperpyrexia in cavity
The air of amount is rapidly discharged from cavity, improves radiating efficiency.
Meanwhile, piezoelectric vibration piece is connected with flexible sheet, flexible sheet is connected with each fin simultaneously, flexible sheet
Setting can expand the amplitude of piezoelectric vibration piece.Joint face scribbles Heat Conduction Material, accelerates heat transfer speed, improves radiating efficiency.
Radiating paint on fin, the radiation that can increase heat sheds, and the passage on fin then increases fin further with air
Contact area, to improve radiating efficiency.Semiconductor chilling plate outer surface is coated with heat-insulating material, can prevent semiconductor chilling plate
The heat in hot junction passes back to cold end and reduces the radiating effect of semiconductor chilling plate, thus improve the radiating efficiency of LED.This
Outward, the material of fin is magnadure, because magnadure density is low, reduces the weight of fin, thus reduce propping up
The load-bearing of frame, improves the security of LED.
Brief description
Fig. 1 is the structural representation of the LED of one embodiment of the invention；
Fig. 2 is the front view of LED described in Fig. 1；
Fig. 3 is the A-A sectional view of LED described in Fig. 2.
Specific embodiment
As shown in Figure 1-Figure 3, Fig. 1 is the structural representation of one embodiment of the invention LED, and Fig. 2 is LED in Fig. 1
Front view, Fig. 3 is the A-A sectional view of LED in Fig. 2.
This LED 100 includes：The LED luminescence unit 110 that is sequentially connected, wiring board 120, the heat transfer for transmitting heat
Plate 130, semiconductor chilling plate 140 and fin 150.This LED 100 also includes heat transfer sheet 160, and heat transfer sheet 160 is closely pacified
Being contained in wiring board 120 has the one side of LED luminescence unit 110.In the present embodiment, heat transfer sheet 160 is in corresponding LED luminescence unit
Be provided with 110 set hole 163, so can preferably press close to LED luminescence unit 110 heat sink faster to absorb heat.Heat transfer sheet 160
It is fixedly connected by bolt 170 with wiring board 120.It is provided with the heat transfer pole 161 of a projection, wiring board 120 is right in the middle of heat transfer sheet 160
The place answering heat transfer pole 161 has a via 121, and heat transfer pole 161 is connected to heat transfer plate 130, heat transfer pole 161 through via 121
Scribble Heat Conduction Material with the joint face of heat transfer plate 130.
Fin 150 includes substrate 151 and several fins 152 being installed on substrate 151, semiconductor chilling plate 140
Hot junction 141 be connected with substrate 151.Hot junction 141 scribbles Heat Conduction Material to reduce thermal resistance with the joint face of substrate 151.Several
Fin 152 encloses on substrate 151 and is formed a cavity 153, and preferred fin 152 is along the radially uniform interval row of substrate 151
Row.There is gap 154, cavity 153 is connected with gap 154 between two neighboring fin 152.Fin 152 surface scribbles radiating oil
Paint and fin 152 is provided with several passages 157, to improve area of dissipation and to accelerate air circulation.In cavity 153 and fin
152 vertical direction are abreast provided with several piezoelectric vibration pieces 155, and piezoelectric vibration piece 155 is connected with several fins 152.
In the present embodiment, the edge of piezoelectric vibration piece 155 is bonding with fin 152.
Flexible sheet 156 is connected with piezoelectric vibration piece 155, in other embodiments, flexible sheet 156 simultaneously can be also
Mutually bonding with each fin 152.
Semiconductor chilling plate 140 outer surface is coated with certain thickness heat-insulating material, and this heat-insulating material can be plastics.
The sinking path of above-mentioned LED has two kinds：
The first approach is that heat starts to pass to heat transfer sheet 160 from LED luminescence unit 110, then passes to through heat transfer pole 161
In heat transfer plate 130.Semiconductor chilling plate 140 actively can be lowered the temperature to heat transfer plate 130, then the hot junction through semiconductor chilling plate 140
141 are connected with fin 150 passes in fin 150, finally multiple fins 152 and the piezoelectric vibration piece with fin 152 bonding
Heat is quickly shed by 155.
Second approach is that heat passes to wiring board 120 from LED luminescence unit 110, and wiring board 120 passes to heat transfer plate again
In 130.Semiconductor chilling plate 140 actively can be lowered the temperature to heat transfer plate 130, then the hot junction 141 through semiconductor chilling plate 140 with dissipate
Backing 150 is connected and passes in fin 150, finally multiple fins 152 and with the piezoelectric vibration piece 155 of fin 152 bonding by heat
Amount quickly sheds.
Above-mentioned LED, on substrate 151, spaced fin 152 is conducive to increasing the contact with air for the fin 150
Area, accelerates exchange rate, improves radiating efficiency.Meanwhile, each and every one piezoelectric vibration pieces 155 many setting in cavity 153, by pressure
The vibrations of electric oscillation piece 155, and extrude the air in cavity 153, make to carry the air of high heat in cavity 153 from cavity 153
In rapidly discharge, radiating efficiency can be improved.
On piezoelectric vibration piece 155, the flexible sheet 156 of bonding can expand the amplitude of piezoelectric vibration piece 155, make simultaneously
Piezoelectric vibration piece 155 bonding more firm.
The Heat Conduction Material that the joint face of semiconductor chilling plate 140 and fin 150 scribbles, heat transfer pole 161 and heat transfer plate 130
Joint face scribble Heat Conduction Material, the Heat Conduction Material at two can be heat conductive silica gel.Heat Conduction Material can reduce thermal resistance, accelerates
Heat transfer speed, improves radiating efficiency.
The radiating paint scribbling on fin 152, the radiation that can increase heat sheds, and the passage 157 on fin 152 then enters
One step increases fin 150 with air contact area, to improve radiating efficiency.
The plastics that semiconductor chilling plate 140 outer surface covers, can prevent the heat in semiconductor chilling plate 140 hot junction 141
Pass back to cold end 142, thus improve the radiating efficiency of LED.
Additionally, the material of fin 150 is magnadure, because magnadure density is low, reduce the weight of fin,
Thus reducing the load-bearing of support, improve the security of LED.
Embodiment described above only have expressed the several embodiments of the present invention, and its description is more concrete and detailed, but simultaneously
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, some deformation can also be made and improve, these broadly fall into the guarantor of the present invention
Shield scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (10)
1. a kind of LED, including the LED luminescence unit (110) being sequentially connected, wiring board (120), the heat transfer for transmitting heat
Plate (130), semiconductor chilling plate (140) and fin (150), described semiconductor chilling plate (140) includes hot junction (141) and cold
End (142), described cold end (142) is connected with described heat transfer plate (130), described hot junction (141) and described fin (150) phase
Even it is characterised in that：Also including being snugly mounted to described wiring board (120) has the one side of described LED luminescence unit (110)
It is provided with the heat transfer pole (161) of a projection, described wiring board (120) corresponds to institute in the middle of heat transfer sheet (160), described heat transfer sheet (160)
State heat transfer pole (161) place and have a via (121), described heat transfer pole (161) is connected to described heat transfer through described via (121)
Plate (130), described fin (150) includes substrate (151) and several fins (152) being installed on described substrate (151),
Described hot junction (141) is connected with described substrate (151), and several described fins (152) enclose simultaneously shape upper located at described substrate (151)
Become a cavity (153), between two neighboring described fin (152), there is gap (154), described cavity (153) and described gap
(154) connect, in described cavity (153), be abreast provided with several piezoelectric vibration pieces with described fin (152) vertical direction
(155), described piezoelectric vibration piece (155) is connected with fin several described (152).
2. LED according to claim 1 it is characterised in that：It is connected with flexible sheet on described piezoelectric vibration piece (155)
(156).
3. LED according to claim 2 it is characterised in that：Described piezoelectric vibration piece (155) and described flexible sheet
(156) bonding, the edge of described piezoelectric vibration piece (155) is bonding with described fin (152).
4. LED according to claim 1 it is characterised in that：The hot junction (141) of described semiconductor chilling plate (140) with
The joint face of described substrate (151) scribbles Heat Conduction Material.
5. LED according to claim 1 it is characterised in that：Described fin (152) surface scribbles radiating and paints and described
Fin (152) is provided with several passages (157).
6. LED according to claim 1 it is characterised in that：Described heat transfer sheet (160) and described wiring board (120) lead to
Cross bolt (170) to be fixedly connected.
7. LED according to claim 1 it is characterised in that：Described heat transfer pole (161) and described heat transfer plate (130)
Joint face scribbles Heat Conduction Material.
8. LED according to claim 1 it is characterised in that：Described heat transfer sheet (160) lights single in corresponding described LED
First (110) place is provided with set hole (162).
9. LED according to claim 1 it is characterised in that：Described semiconductor chilling plate (140) outer surface is coated with absolutely
Hot material.
10. LED according to claim 1 it is characterised in that：The material of described fin (150) is magnadure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410543451.XA CN104296100B (en) | 2014-10-14 | 2014-10-14 | Led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410543451.XA CN104296100B (en) | 2014-10-14 | 2014-10-14 | Led lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104296100A CN104296100A (en) | 2015-01-21 |
| CN104296100B true CN104296100B (en) | 2017-02-15 |
Family
ID=52315942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410543451.XA Active CN104296100B (en) | 2014-10-14 | 2014-10-14 | Led lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104296100B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104879729A (en) * | 2015-05-20 | 2015-09-02 | 绥阳县华丰电器有限公司 | Radiator for LED lamp |
| CN107339679A (en) * | 2017-06-30 | 2017-11-10 | 陈伟景 | A kind of radiator of adjustable focus LED projection lamp |
| CN107743353A (en) * | 2017-10-20 | 2018-02-27 | 成都美数科技有限公司 | The heat sink design of filter cavity |
| CN107517577A (en) * | 2017-10-20 | 2017-12-26 | 成都美数科技有限公司 | The heat sink compound of filter cavity |
| CN107883211B (en) * | 2017-12-20 | 2020-11-20 | 绍兴市柯桥区欣飞科技有限公司 | LED lamp structure |
| CN108361562B (en) * | 2018-02-13 | 2020-02-07 | 东莞市闻誉实业有限公司 | Lamp fitting |
Citations (7)
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|---|---|---|---|---|
| CN102606897A (en) * | 2011-01-25 | 2012-07-25 | 李翘英 | Light emitting diode (LED) lamp |
| CN202747075U (en) * | 2012-09-21 | 2013-02-20 | 成都君万科技有限公司 | Light emitting diode with heat dissipation system |
| CN103154608A (en) * | 2010-10-21 | 2013-06-12 | 通用电气公司 | Lighting system with thermal management system having point contact synthetic jets |
| CN103162279A (en) * | 2011-12-19 | 2013-06-19 | 陕西银星科技有限公司 | Light-emitting diode (LED) road lamp heat dissipater with synthetic jet |
| CN103307583A (en) * | 2013-06-28 | 2013-09-18 | 华南理工大学 | Synthetic jet heat dissipation base for LED lamp |
| CN203517392U (en) * | 2013-09-26 | 2014-04-02 | 东莞市盈通光电照明科技有限公司 | LED spherical lamp with integrally-arranged fan structure |
| CN203771360U (en) * | 2014-04-04 | 2014-08-13 | 烟台奥星电器设备有限公司 | Novel LED heat radiator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8651708B2 (en) * | 2010-06-25 | 2014-02-18 | General Electric Company | Heat transfer system for a light emitting diode (LED) lamp |
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2014
- 2014-10-14 CN CN201410543451.XA patent/CN104296100B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103154608A (en) * | 2010-10-21 | 2013-06-12 | 通用电气公司 | Lighting system with thermal management system having point contact synthetic jets |
| CN102606897A (en) * | 2011-01-25 | 2012-07-25 | 李翘英 | Light emitting diode (LED) lamp |
| CN103162279A (en) * | 2011-12-19 | 2013-06-19 | 陕西银星科技有限公司 | Light-emitting diode (LED) road lamp heat dissipater with synthetic jet |
| CN202747075U (en) * | 2012-09-21 | 2013-02-20 | 成都君万科技有限公司 | Light emitting diode with heat dissipation system |
| CN103307583A (en) * | 2013-06-28 | 2013-09-18 | 华南理工大学 | Synthetic jet heat dissipation base for LED lamp |
| CN203517392U (en) * | 2013-09-26 | 2014-04-02 | 东莞市盈通光电照明科技有限公司 | LED spherical lamp with integrally-arranged fan structure |
| CN203771360U (en) * | 2014-04-04 | 2014-08-13 | 烟台奥星电器设备有限公司 | Novel LED heat radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104296100A (en) | 2015-01-21 |
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