CN204114666U - Led - Google Patents
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- CN204114666U CN204114666U CN201420594766.2U CN201420594766U CN204114666U CN 204114666 U CN204114666 U CN 204114666U CN 201420594766 U CN201420594766 U CN 201420594766U CN 204114666 U CN204114666 U CN 204114666U
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- heat transfer
- fin
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- heat
- piezoelectric vibration
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Abstract
A kind of LED, comprise connect successively LED luminescence unit, for installing the wiring board of LED luminescence unit, heat transfer plate, semiconductor chilling plate and the fin for transferring heat, also comprise and be arranged on wiring board closely and have the heat transfer pole being provided with a projection in the middle of the heat transfer sheet of the one side of LED luminescence unit, heat transfer sheet, the place of the corresponding heat transfer pole of wiring board has a via hole, heat transfer pole is connected to heat transfer plate through via hole, heat transfer sheet edge extends many heat transfer bars, and heat transfer bar is connected with heat transfer plate.Fin comprises substrate and is installed on several fins of substrate, several fins are located on substrate, form a cavity, there is gap between adjacent two fins, be arranged with several piezoelectric vibration pieces in parallel with fin vertical direction in the cavities, piezoelectric vibration piece is connected with several fins.Piezoelectric vibration piece vibration after energising and extrude empty chamber air, make in cavity with hot-air discharge rapidly from gap, thus take away heat, be conducive to the radiating efficiency improving LED.
Description
Technical field
The utility model relates to a kind of light source, especially relates to a kind of LED.
Background technology
LED (Light Emitting Diode), i.e. semi-conductor electricity light source, light emitting diode, also referred to as semiconductor lamp, is a kind of electric light source without filament, is directly luminous energy electric energy conversion.
LED, as a kind of solid light source, becomes the revolution that the mankind are thrown light in history because it has advantages such as using mission is long, light efficiency is high, photochromic many, volume is little, safety and environmental protection.In theory, the luminous efficiency of L ED lamp is very high, but due in current LED, the heat that the luminescence of LED luminescence unit produces is passed to semiconductor chilling plate by heat transfer plate, fin is transferred heat to again by semiconductor chilling plate, by fin, heat is distributed in air, thus reduces the temperature of LED.In the LED course of work, a large amount of heat accumulations is in LED, if radiating efficiency does not improve, then LED chip temperature can be made too high, thus badly influence luminous efficiency and the life-span of LED.
Utility model content
Based on this, be necessary the LED providing a kind of radiating efficiency higher.
A kind of LED, comprises the LED luminescence unit, wiring board, heat transfer plate, semiconductor chilling plate and the fin for transferring heat that connect successively.Semiconductor chilling plate comprises hot junction and cold junction, and cold junction is connected with heat transfer plate, and hot junction is connected with fin and also comprises heat transfer sheet.Heat transfer sheet installs the one side be connected with LED luminescence unit in the circuit board closely, is provided with the heat transfer pole of a projection in the middle of heat transfer sheet.The corresponding heat transfer pole place of wiring board has a via hole, and heat transfer pole is connected to heat transfer plate through via hole.Heat transfer sheet edge extends many heat transfer bars, and heat transfer bar is connected with heat transfer plate.Fin comprises substrate and is installed on several fins on substrate, and hot junction is connected with substrate, and several fins to be located on substrate and to form a cavity, and there is gap between adjacent two fins, cavity is communicated with gap.Be provided with several piezoelectric vibration pieces abreast with fin vertical direction in cavity, piezoelectric vibration piece is connected with several fins.
Wherein in an embodiment, piezoelectric vibration piece is connected with flexible sheet.
Wherein in an embodiment, piezoelectric vibration piece is bonding with flexible sheet, and the edge of piezoelectric vibration piece is bonding with fin.
Wherein in an embodiment, the hot junction of semiconductor chilling plate and the joint face of substrate scribble Heat Conduction Material.
Wherein in an embodiment, fin surface scribbles heat radiation paint and fin is provided with several passages.
Wherein in an embodiment, heat transfer sheet and wiring board are bolted to connection.
Wherein in an embodiment, the joint face of heat transfer pole and heat transfer plate scribbles Heat Conduction Material.
Wherein in an embodiment, heat transfer sheet is provided with trepanning at corresponding LED luminescence unit place.
Wherein in an embodiment, semiconductor chilling plate outer surface is coated with heat-insulating material.
Above-mentioned LED, be close to and be arranged on wiring board and have the heat transfer sheet of the one side of LED luminescence unit to be conducive to more closely collecting from wiring board front the heat of LED, can rapidly heat be delivered in heat transfer plate by the heat transfer pole on described heat transfer sheet and heat transfer bar, heat transfer plate can also receive the heat from wiring board, the cold junction of semiconductor chilling plate can directly cool to heat transfer plate, thus LED luminescence unit is cooled rapidly, then by connecting fin, heat is delivered in fin in the hot junction of semiconductor chilling plate, avoid semiconductor chilling plate hot-side temperature too high and lower the refrigeration of cooling piece.Be arranged on several the spaced fins on substrate and be conducive to strengthening the contact area of fin and air, accelerate exchange rate, improve radiating efficiency, meanwhile, vertically with fin in cavity be provided with piezoelectric vibration piece, piezoelectric vibration piece is connected with several fins simultaneously, by the vibrations of piezoelectric vibration piece, drive fin vibrations, and extrude the air in cavity, air with high heat in cavity is discharged rapidly from cavity, improves radiating efficiency.
Meanwhile, piezoelectric vibration piece is connected with flexible sheet, flexible sheet is connected with each fin simultaneously, flexible sheet the amplitude that can expand piezoelectric vibration piece is set.The joint face of semiconductor chilling plate and fin scribbles Heat Conduction Material, reduces thermal resistance, improves radiating efficiency.Further, the heat radiation paint on fin, the radiation that can strengthen heat sheds, and the passage on fin then strengthens fin further and amasss, to improve radiating efficiency with air contact surfaces.Semiconductor chilling plate appearance surface cover has heat-insulating material, can prevent the heat in semiconductor chilling plate hot junction from passing back to cold junction and reducing the radiating effect of semiconductor chilling plate, thus improve the radiating efficiency of LED.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED of the utility model one embodiment;
Fig. 2 is the front view of LED described in Fig. 1;
The A-A sectional view that Fig. 3 is LED described in Fig. 2;
The implication of attached number in the figure is as follows:
100-LED lamp, 110-LED luminescence unit, 120-wiring board, 130-heat transfer plate;
140-semiconductor chilling plate, 141-hot junction, 142-cold junction,
150-fin, several 152-fins on 151-substrate, 153-cavity, 154-gap;
155-piezoelectric vibration piece, 156-flexible sheet, 157-passage;
160-heat transfer sheet, 161-heat transfer pole, 162-conducts heat bar, 163-trepanning, 170-bolt.
Detailed description of the invention
As shown in Figure 1-Figure 3, Fig. 1 is the structural representation of the utility model one embodiment LED 100, and Fig. 2 is the front view of LED 100 in Fig. 1, and Fig. 3 is the A-A sectional view of LED 100 in Fig. 2.
This LED 100 comprises: the LED luminescence unit 110 connected successively, wiring board 120, heat transfer plate 130, semiconductor chilling plate 140 and fin 150 for transferring heat.Semiconductor chilling plate 140 comprises hot junction 141 and cold junction 142, and cold junction 142 is connected with heat transfer plate 130, and hot junction 141 is connected with fin 150.Also comprise heat transfer sheet 160, heat transfer sheet 160 is arranged on the one side that wiring board 120 is connected with LED luminescence unit 110 closely.In the present embodiment, heat transfer sheet 160 is provided with trepanning 163 at corresponding LED luminescence unit 110 place, can press close to the heat sink to absorb heat sooner of LED luminescence unit 110 so better.Heat transfer sheet 160 is fixedly connected with by bolt 170 with wiring board 120.The heat transfer pole 161 of a projection is provided with in the middle of heat transfer sheet 160.Wiring board 120 corresponding heat transfer pole 161 place has a via hole 121, and heat transfer pole 161 is connected to heat transfer plate 130 through via hole 121.Heat transfer pole 161 scribbles Heat Conduction Material with the joint face of heat transfer plate 130.Heat transfer sheet 160 edge also extends many heat transfer bars 162, and this heat transfer bar 162 is connected to be delivered in heat transfer plate 130 by the heat of heat transfer sheet 160 with heat transfer plate 130.
Several fins 152 that fin 150 comprises substrate 151 and is installed on substrate 151, the hot junction 141 of semiconductor chilling plate 140 is connected with substrate 151.Hot junction 141 scribbles Heat Conduction Material to reduce thermal resistance with the joint face of substrate 151.Several fins 152 to be located on substrate 151 and to form a cavity 153, and preferred fin 152 is spaced uniformly along substrate 151 radial direction.There is gap 154 between adjacent two fins 152, cavity 153 is communicated with gap 154.Fin 152 surface scribbles heat radiation paint and fin 152 is provided with several passages 157, to improve area of dissipation and to accelerate air circulation.Be provided with several piezoelectric vibration pieces 155 abreast with fin 152 vertical direction in cavity 153, piezoelectric vibration piece 155 is connected with several fins 152.In the present embodiment, the edge of piezoelectric vibration piece 155 is bonding with fin 152.
Piezoelectric vibration piece 155 is connected with flexible sheet 156, in other embodiments, flexible sheet 156 simultaneously can be also mutually bonding with each fin 152.
Semiconductor chilling plate 140 outer surface is coated with certain thickness heat-insulating material, and this heat-insulating material can be plastics.
The sinking path of above-mentioned LED has two kinds:
The first approach is that heat passes to heat transfer sheet 160 from LED luminescence unit 110, then passes in heat transfer plate 130 through heat transfer pole 161 and heat transfer bar 162.Semiconductor chilling plate 140 can to heat transfer plate 130 initiatively cooling, then is connected with fin 150 through the hot junction 141 of semiconductor chilling plate 140 and passes in fin 150, last multiple fin 152 and being shed fast by heat with the piezoelectric vibration piece 155 that fin 152 bonds.
In the first, heat transfer sheet 160 can be close to bottom LED luminescence unit 110 and wiring board 120, is passed in heat transfer plate 130 by heat transfer pole 161 and heat transfer bar 162 to collect more heat.
The second approach is that heat passes to wiring board 120 from LED luminescence unit 110, and wiring board 120 passes in heat transfer plate 130 again.Semiconductor chilling plate 140 can to heat transfer plate 130 initiatively cooling, then is connected with fin 150 through the hot junction 141 of semiconductor chilling plate 140 and passes in fin 150, last multiple fin 152 and being shed fast by heat with the piezoelectric vibration piece 155 that fin 152 bonds.
Above-mentioned LED, on substrate 151, spaced fin 152 is conducive to strengthening fin 150 and the contact area of air, accelerates exchange rate, improves radiating efficiency.Meanwhile, multiple the piezoelectric vibration pieces 155 established in cavity 153.By the vibrations of piezoelectric vibration piece 155, and extrude the air in cavity 153, make to discharge rapidly from cavity 153 with the air of high heat in cavity 153, can radiating efficiency be improved.
Flexible sheet 156 bonding on piezoelectric vibration piece 155 can expand the amplitude of piezoelectric vibration piece 155, makes bonding more firm of piezoelectric vibration piece 155 simultaneously.
The Heat Conduction Material that semiconductor chilling plate 140 scribbles with the joint face of fin 150, heat transfer pole 161 scribbles Heat Conduction Material with the joint face of heat transfer plate 130, and the Heat Conduction Material at two places can be heat conductive silica gel.Heat Conduction Material can reduce thermal resistance, accelerates heat transfer speed, improves radiating efficiency.
The heat radiation paint that fin 152 scribbles, the radiation that can strengthen heat sheds, and the passage on fin 152 157 strengthens fin 150 further and amasss, to improve radiating efficiency with air contact surfaces.
The plastics that semiconductor chilling plate 140 outer surface covers, can prevent the heat in semiconductor chilling plate 140 hot junction 141 from passing back to cold junction 142, thus improve the radiating efficiency of LED.
In addition, the material of fin 150 is magnadure, because magnadure density is low, reduces the weight of fin, thus reduces the load-bearing of support, improve the security of LED.
The above embodiment only have expressed several preferred embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (9)
1. a LED, comprise the LED luminescence unit (110) connected successively, wiring board (120), for the heat transfer plate (130) of transferring heat, semiconductor chilling plate (140) and fin (150), described semiconductor chilling plate (140) comprises hot junction (141) and cold junction (142), described cold junction (142) is connected with described heat transfer plate (130), described hot junction (141) is connected with described fin (150), it is characterized in that: also comprise heat transfer sheet (160), described heat transfer sheet (160) is arranged on the upper one side be connected with described LED luminescence unit (110) of described wiring board (120) closely, the heat transfer pole (161) of a projection is provided with in the middle of described heat transfer sheet (160), described wiring board (120) corresponding described heat transfer pole (161) place has a via hole (121), described heat transfer pole (161) is connected to described heat transfer plate (130) through described via hole (121), described heat transfer sheet (160) edge extends many heat transfers bar (162), described heat transfer bar (162) is connected with described heat transfer plate (130), described fin (150) comprises substrate (151) and is installed on several fins (152) on described substrate (151), described hot junction (141) is connected with described substrate (151), fin described in several (152) is located in described substrate (151) and goes up and form a cavity (153), gap (154) is there is between adjacent two described fins (152), described cavity (153) is communicated with described cavity (153) gap (154), several piezoelectric vibration pieces (155) are provided with abreast with described fin (152) vertical direction in described cavity (153), described piezoelectric vibration piece (155) is connected with fin described in several (152).
2. LED according to claim 1, is characterized in that: described piezoelectric vibration piece (155) is connected with flexible sheet (156).
3. LED according to claim 2, it is characterized in that: described piezoelectric vibration piece (155) is bonding with described flexible sheet (156), the edge of described piezoelectric vibration piece (155) is bonding with described fin (152).
4. LED according to claim 1, is characterized in that: the hot junction (141) of described semiconductor chilling plate (140) and the joint face of described substrate (151) scribble Heat Conduction Material.
5. LED according to claim 1, is characterized in that: described fin (152) surface scribbles heat radiation paint and described fin (152) is provided with several passages (157).
6. LED according to claim 1, is characterized in that: described heat transfer sheet (160) is fixedly connected with by bolt (170) with described wiring board (120).
7. LED according to claim 1, is characterized in that: described heat transfer pole (161) scribbles Heat Conduction Material with the joint face of described heat transfer plate (130).
8. LED according to claim 1, is characterized in that: described heat transfer sheet (160) is provided with trepanning (163) at correspondence described LED luminescence unit (110) place.
9. LED according to claim 1, is characterized in that: described semiconductor chilling plate (140) outer surface is coated with heat-insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420594766.2U CN204114666U (en) | 2014-10-14 | 2014-10-14 | Led |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420594766.2U CN204114666U (en) | 2014-10-14 | 2014-10-14 | Led |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204114666U true CN204114666U (en) | 2015-01-21 |
Family
ID=52331976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420594766.2U Expired - Fee Related CN204114666U (en) | 2014-10-14 | 2014-10-14 | Led |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204114666U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104896380A (en) * | 2015-06-15 | 2015-09-09 | 遵义市义阳光电有限公司 | Powerful-cooling LED (light-emitting diode) lamp |
| CN116107119A (en) * | 2023-04-12 | 2023-05-12 | 永林电子股份有限公司 | LED light-emitting device for display module and display module |
-
2014
- 2014-10-14 CN CN201420594766.2U patent/CN204114666U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104896380A (en) * | 2015-06-15 | 2015-09-09 | 遵义市义阳光电有限公司 | Powerful-cooling LED (light-emitting diode) lamp |
| CN116107119A (en) * | 2023-04-12 | 2023-05-12 | 永林电子股份有限公司 | LED light-emitting device for display module and display module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150121 Termination date: 20181014 |