CN104284548B - 麦拉片 - Google Patents

麦拉片 Download PDF

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Publication number
CN104284548B
CN104284548B CN201310289808.1A CN201310289808A CN104284548B CN 104284548 B CN104284548 B CN 104284548B CN 201310289808 A CN201310289808 A CN 201310289808A CN 104284548 B CN104284548 B CN 104284548B
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mylar film
perforation
electronic component
width
group
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CN104284548A (zh
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黄致达
林孟娴
张耀廷
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Suzhou Wei You Intellectual Property Operation Co ltd
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Nanan Xin Xin Brand Operation Co Ltd
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Priority to CN201310289808.1A priority Critical patent/CN104284548B/zh
Priority to CN201710585122.5A priority patent/CN107393663B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

一种麦拉片，粘贴于一电子元件的表面，该麦拉片对应该电子元件的不共面的侧面之间形成的连接线设有若干组穿孔。本发明还提供使用该麦拉片的一电子元件组合。该麦拉片对应该电子元件的连接线开设若干穿孔，减少了麦拉片的弯折处的应力，使麦拉片能够平整地贴设于该电子元件。

Description

麦拉片
技术领域
本发明涉及一种电子元件组合和其麦拉片。
背景技术
电子元件常贴设麦拉片，防止该电子元件与电路板电性接触，导致该电子元件损毁。习知麦拉片于弯折处有一定应力，导致麦拉片不能完平整地贴合于电子元件，一旦受到系统内风流或者震动影响，麦拉片容易脱落。
发明内容
鉴于以上，有必要提供一种能够完全平整地贴合于电子元件的麦拉片和使用该麦拉片的电子元件组合。
一种麦拉片，粘贴于一电子元件的表面，该麦拉片对应该电子元件的不共面的侧面之间形成的连接线设有若干组穿孔。
一种电子元件组合，包括一电子元件和包覆并粘贴于该电子元件的表面的麦拉片，该麦拉片对应该电子元件的不共面的侧面之间形成的连接线设有若干组穿孔。
相较现有技术，该麦拉片对应该电子元件的连接线开设若干穿孔，减少了麦拉片的弯折处的应力，使麦拉片能够平整地贴设于该电子元件。
附图说明
图1是本发明电子元件组合的立体分解图。
图2是图1的立体组装图。
图3是图2于另一方向的视图。
主要元件符号说明
麦拉片 10
长边 100
穿孔 12
电子元件 20
侧面 200
底面 204
顶面 206
连接线 208
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参照图1，本发明麦拉片10能够粘贴于一电子元件20的表面。
电子元件20呈长方体状，包括互不共面的两侧面200、一顶面206和一底面204(如图3)。侧面200、顶面206和底面210之间形成四条连接线208。
本实施方式中，麦拉片10是一矩形片，包括两长边100和两短边。麦拉片10的宽度为w。麦拉片10沿宽度方向设四组穿孔12，分别对应电子元件20的四条连接线208。每组穿孔12包括n个穿孔12。每一组穿孔12的每一端距邻近的长边100的距离为D。每一穿孔12沿麦拉片10的宽度方向的长度为h。其中，D>w/10；h<w/5；nh不大于w/2。其它实施方式中，该麦拉片10无需同时满足以上三个条件。
本实施方式中，穿孔12为矩形孔，穿孔12的长边垂直麦拉片10的长边100。穿孔12沿麦拉片10的长边100的长度为穿孔12的宽度。其它实施方式中，穿孔12亦可为其它形状。
请参照图2和图3，使用时，将该麦拉片10贴设于该电子元件20，使该麦拉片10的四组穿孔12的中线分别正对该电子元件20的连接线208。该麦拉片10沿该等穿孔12的中线弯折。
由于麦拉片10的弯折处开设有穿孔12，减少了麦拉片10的弯折处的应力，使麦拉片10能够平整地贴设于电子元件20，不易脱落。

Claims (5)

1.一种麦拉片，粘贴于一电子元件的表面，该麦拉片是一矩形片，包括两长边和两短边，该麦拉片对应该电子元件的不共面的侧面之间形成的连接线设有若干组穿孔；该若干组穿孔位于麦拉片的弯折处，且该麦拉片的弯折处的折痕为每组穿孔的沿该麦拉片的宽度方向的中线。
2.如权利要求1所述的麦拉片，其特征在于：每组穿孔沿麦拉片的宽度方向设置，设麦拉片的宽度为w,每组穿孔的每一端距离麦拉片的邻近的长边的距离为D,D>w/10。
3.如权利要求1所述的麦拉片，其特征在于：该麦拉片是一矩形片，包括两长边和两短边,每组穿孔沿麦拉片的宽度方向设置，每一组穿孔包括n个穿孔，设麦拉片的宽度为w,每一穿孔的沿该麦拉片的宽度方向的长度为h,nh不大于w/2。
4.如权利要求1所述的麦拉片，其特征在于：该麦拉片是一矩形片，包括两长边和两短边,每组穿孔沿麦拉片的宽度方向设置，每一穿孔的沿该麦拉片的宽度方向的长度为h,h<w/5。
5.如权利要求1所述的麦拉片，其特征在于：该麦拉片的折痕为每组穿孔的沿该麦拉片的宽度方向的中线。
CN201310289808.1A 2013-07-11 2013-07-11 麦拉片 Active CN104284548B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201310289808.1A CN104284548B (zh) 2013-07-11 2013-07-11 麦拉片
CN201710585122.5A CN107393663B (zh) 2013-07-11 2013-07-11 电子元件组合

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Application Number Priority Date Filing Date Title
CN201310289808.1A CN104284548B (zh) 2013-07-11 2013-07-11 麦拉片

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105448512B (zh) * 2015-11-19 2019-05-03 深圳振华富电子有限公司 治具及组装方法
CN108258562A (zh) * 2018-01-11 2018-07-06 郑州云海信息技术有限公司 一种smd连接器自动贴片的方法
CN108449929A (zh) * 2018-04-09 2018-08-24 郑州云海信息技术有限公司 一种利用麦拉实现零件贴装的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200948254A (en) * 2008-05-09 2009-11-16 Asustek Comp Inc Mylar with specific shape
TW201224718A (en) * 2010-12-03 2012-06-16 Hon Hai Prec Ind Co Ltd Wind guiding cover and computer system with same
CN102918943A (zh) * 2010-06-03 2013-02-06 莱尔德技术股份有限公司 具有通孔闩锁机构的板级电磁干扰（emi）屏蔽件

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU7960200A (en) * 1999-11-01 2001-05-14 Bridgestone Corporation Sealing composition and sealing method
CN101360386B (zh) * 2007-08-03 2010-10-06 富葵精密组件(深圳)有限公司 电路板粘合胶层及包括该粘合胶层的电路板
CN102800444A (zh) * 2012-07-16 2012-11-28 苏州东福电子有限公司 一种带折线的麦拉片

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200948254A (en) * 2008-05-09 2009-11-16 Asustek Comp Inc Mylar with specific shape
CN102918943A (zh) * 2010-06-03 2013-02-06 莱尔德技术股份有限公司 具有通孔闩锁机构的板级电磁干扰（emi）屏蔽件
TW201224718A (en) * 2010-12-03 2012-06-16 Hon Hai Prec Ind Co Ltd Wind guiding cover and computer system with same

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CN107393663A (zh) 2017-11-24
CN107393663B (zh) 2019-08-06

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