CN104275556B - 一种大直径硅抛光片回收切割切口加工装置及方法 - Google Patents
一种大直径硅抛光片回收切割切口加工装置及方法 Download PDFInfo
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- CN104275556B CN104275556B CN201310278097.8A CN201310278097A CN104275556B CN 104275556 B CN104275556 B CN 104275556B CN 201310278097 A CN201310278097 A CN 201310278097A CN 104275556 B CN104275556 B CN 104275556B
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- silicon polished
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
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CN201310278097.8A CN104275556B (zh) | 2013-07-04 | 2013-07-04 | 一种大直径硅抛光片回收切割切口加工装置及方法 |
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CN201310278097.8A CN104275556B (zh) | 2013-07-04 | 2013-07-04 | 一种大直径硅抛光片回收切割切口加工装置及方法 |
Publications (2)
Publication Number | Publication Date |
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CN104275556A CN104275556A (zh) | 2015-01-14 |
CN104275556B true CN104275556B (zh) | 2016-08-10 |
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CN201310278097.8A Active CN104275556B (zh) | 2013-07-04 | 2013-07-04 | 一种大直径硅抛光片回收切割切口加工装置及方法 |
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Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100628455B1 (ko) * | 2002-12-21 | 2006-09-28 | 주식회사 이오테크닉스 | 칩 스케일 마커 및 마킹방법 |
JP5340841B2 (ja) * | 2009-07-21 | 2013-11-13 | 株式会社ディスコ | 切削装置 |
CN202678288U (zh) * | 2012-03-28 | 2013-01-16 | 浙江工业大学 | 一种晶硅抛光片表面缺陷检测设备 |
CN202702410U (zh) * | 2012-06-26 | 2013-01-30 | 晋江市凯达石材机械有限公司 | 一种可旋转桥式切石机 |
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Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Free format text: FORMER OWNER: GRINM ADVANCED MATERIALS CO., LTD. Effective date: 20150611 |
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Effective date of registration: 20150611 Address after: 101300 Beijing city Shunyi District Shuanghe Linhe Industrial Development Zone on the south side of the road Applicant after: You Yan Semi Materials Co., Ltd. Address before: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Applicant before: YOUYAN NEW MATERIAL CO., LTD. |
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Address after: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee after: Youyan semiconductor silicon materials Co.,Ltd. Address before: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee before: GRINM SEMICONDUCTOR MATERIALS Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |