CN104268335A - Vibration fatigue life predication method and system for micro-packaging assembly - Google Patents

Vibration fatigue life predication method and system for micro-packaging assembly Download PDF

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Publication number
CN104268335A
CN104268335A CN201410491538.7A CN201410491538A CN104268335A CN 104268335 A CN104268335 A CN 104268335A CN 201410491538 A CN201410491538 A CN 201410491538A CN 104268335 A CN104268335 A CN 104268335A
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micro
assembled components
vibrating fatigue
vibration
dangerous point
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CN201410491538.7A
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CN104268335B (en
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何小琦
恩云飞
周斌
李勋平
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Fifth Electronics Research Institute of Ministry of Industry and Information Technology
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Fifth Electronics Research Institute of Ministry of Industry and Information Technology
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Abstract

The invention provides a vibration fatigue life predication method and system for a micro-packaging assembly. The method comprises the following steps: creating a vibration simulating finite element model according to the structures of the micro-packaging assembly and a fixing part; extracting the verification characteristics parameters; modifying the vibration simulating finite element model according to the verification characteristics parameters and the experimental characteristics parameters of the micro-packaging assembly to obtain a vibration simulating model; performing random vibration stress response simulation analysis for the micro-packaging assembly according to the vibration simulation model to obtain a dangerous vibration fatigue point; extracting equivalent stress power spectrum density of the dangerous vibration fatigue point under the random vibration load; converting the equivalent stress power spectrum density to obtain cyclic stress time domain data; calculating the vibration fatigue life of the dangerous vibration fatigue point under the random vibration load according to an S-N curve and the cyclic stress time domain data of the dangerous vibration fatigue point; predicating the vibration fatigue life of the micro-packaging assembly by the method of synchronously extracting the response data of the fixing part and the micro-packaging assembly. With the adoption of the method and system, the testing accuracy is improved.

Description

Micro-assembled components vibrating fatigue life-span prediction method and system
Technical field
The present invention relates to electron device forecasting technique in life span field, particularly relate to a kind of micro-assembled components vibrating fatigue life-span prediction method and system.
Background technology
Along with scientific development and social progress, more and more higher to the integration level necessitates of electronic product.Micro-assembled components refers to the superintegrated function element being carried out by the materials such as electronic devices and components metal encapsulating, and electronic devices and components wherein can be protected to avoid atmosphere vapour to corrode.
Because micro-assembled components needs to be arranged on as PCB (Printed Circuit Board in actual applications usually, printed circuit board (PCB)) on the fixture such as plate, and fixture is nonrigid material and size is larger, the synchronous resonant of micro-assembled components may be caused because of fixture resonance, the weak seal link of micro-assembled components is made to produce fatigue of materials, finally cause structural damage to ftracture, therefore need to predict the electronic package vibrating fatigue life-span of Metal Packaging.At present not about the method for micro-assembled components vibrating fatigue prediction, existing document is about device BGA on pcb board (Ball Grid Array Package BGA Package) solder joint vibrating fatigue life-span prediction method, for adopting finite element simulation, pcb board vibration characteristics is emulated, by to after the characteristics of mode Verification of finite element model, solder joint stress response data is utilized to predict the device BGA solder joint vibrating fatigue life-span on pcb board.
Due to the vibrating fatigue life prediction of device BGA solder joint on pcb board, only need to consider that pcb board mode of resonance becomes the stress applied plastic device BGA solder joint, if for predicting the life-span being installed on micro-assembled components of fixture bearing two kinds of resonant excitations, there is the shortcoming that accuracy is low, be not suitable for the test of micro-assembled components.
Summary of the invention
Based on this, be necessary for the problems referred to above, provide a kind of and be applicable to micro-assembled components, can improve micro-assembled components vibrating fatigue life-span prediction method and the system of test accuracy.
A kind of micro-assembled components vibrating fatigue life-span prediction method, comprises the following steps:
According to the structure of micro-assembled components with the fixture of the described micro-assembled components of installation, set up Vibration Simulation finite element model, and extract the checking characterisitic parameter of described Vibration Simulation finite element model;
Obtain the experimental features parameter of described micro-assembled components, and according to described experimental features parameter and checking characterisitic parameter, described Vibration Simulation finite element model is revised, obtain Vibration Simulation model;
According to described Vibration Simulation model, Random vibration response simulation analysis is carried out to described micro-assembled components, obtain the vibrating fatigue dangerous point of described micro-assembled components;
Extract the equivalent stress power spectrum density of described vibrating fatigue dangerous point under Random Vibration Load (Power Spectral Density, PSD);
Described equivalent stress power spectrum density is changed, obtains pulsating stress time domain data;
Obtain the S-N curve of described vibrating fatigue dangerous point material, and calculate the vibrating fatigue life-span of described vibrating fatigue dangerous point under Random Vibration Load according to described S-N curve and pulsating stress time domain data.
A kind of micro-assembled components vibrating fatigue life prediction system, comprising:
MBM, for according to the structure of micro-assembled components with the fixture of the described micro-assembled components of installation, sets up Vibration Simulation finite element model, and extracts the checking characterisitic parameter of described Vibration Simulation finite element model;
Correcting module, for obtaining the experimental features parameter of described micro-assembled components, and revising described Vibration Simulation finite element model according to described experimental features parameter and checking characterisitic parameter, obtaining Vibration Simulation model;
Emulation module, for carrying out Random vibration response simulation analysis according to described Vibration Simulation model to described micro-assembled components, obtains the vibrating fatigue dangerous point of described micro-assembled components;
Extraction module, for extracting the equivalent stress power spectrum density of described vibrating fatigue dangerous point under Random Vibration Load;
Modular converter, for changing described equivalent stress power spectrum density, obtains pulsating stress time domain data;
Processing module, for obtaining the S-N curve of described vibrating fatigue dangerous point material, and calculates the vibrating fatigue life-span of described vibrating fatigue dangerous point under Random Vibration Load according to described S-N curve and pulsating stress time domain data.
Above-mentioned micro-assembled components vibrating fatigue life-span prediction method and system, after checking obtains Vibration Simulation model, carry out Random vibration response simulation analysis according to Vibration Simulation model to micro-assembled components, obtain the vibrating fatigue dangerous point of micro-assembled components.Extract the equivalent stress power spectrum density frequency domain data of vibrating fatigue dangerous point under Random Vibration Load.Equivalent stress power spectrum density is changed, obtains pulsating stress time domain data.Obtain the S-N curve of vibrating fatigue dangerous point material, and calculate the vibrating fatigue vibrating fatigue life-span of dangerous point under Random Vibration Load according to S-N curve and pulsating stress time domain data.Utilize frequency domain method to extract dangerous point data, be then converted to time domain data and carry out vibrating fatigue life prediction, avoid and utilize time domain method to extract difficulty data and the huge problem of data processing amount; Adopt fixture and micro-assembled components synchronization simulation simplation verification simultaneously and extract the method for response data, efficiently solving fixture vibration, micro-assembled components is vibration integrated affects problem.Compared with GBA solder joint vibrating fatigue life-span prediction method on pcb board, this method adopts fixture and micro-assembled components synchronously to extract the method for response data, solve and be installed on micro-assembled components on fixture under two kinds of source of resonant excitation effects, predict a difficult problem for its vibrating fatigue life prediction, improve test accuracy.
Accompanying drawing explanation
Fig. 1 is the process flow diagram of micro-assembled components vibrating fatigue life-span prediction method in an embodiment;
Fig. 2 is random vibration power spectrum schematic diagram in an embodiment;
Fig. 3 is the equivalent stress power spectrum density schematic diagram of vibrating fatigue dangerous point under Random Vibration Load in an embodiment;
Fig. 4 is the equivalent stress time history schematic diagram data of vibrating fatigue dangerous point response in an embodiment;
Fig. 5 is the structural drawing of micro-assembled components vibrating fatigue life prediction system in an embodiment.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the present invention.But the present invention can be much different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar improvement when intension of the present invention, therefore the present invention is by the restriction of following public specific embodiment.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe specific embodiment, is not intended to be restriction the present invention.
A kind of micro-assembled components vibrating fatigue life-span prediction method, as shown in Figure 1, comprises the following steps:
Step S110: according to the structure of micro-assembled components with the fixture of the micro-assembled components of installation, set up Vibration Simulation finite element model, and extract the checking characterisitic parameter of Vibration Simulation finite element model.
Micro-assembled components can be specifically HIC (hybrid integrated circuit, hydrid integrated circuit), microwave hybrid integrated circuit, microwave components or SiP (System In a Package, system in package) assembly etc., encapsulating material can be metal or plastics etc., fixture, for installing micro-assembled components, can be pcb board etc.
Wherein in an embodiment, checking characterisitic parameter comprises the first eight rank Mode Shape of micro-assembled components, the first eight rank natural frequency and PSD response root mean square acceleration.PSD response root mean square acceleration refer to 20 ~ 2000Hz frequency range specify power spectrum density load under root mean square accekeration.Step S110 specifically can comprise step 11 and step 12.
Step 11: set up corresponding solid model according to micro-assembled components with the structure of the fixture installing micro-assembled components, and set up Vibration Simulation finite element model according to solid model.
Step 12: emulate the modal parameter of micro-assembled components and Random Vibration Responses Characteristics according to Vibration Simulation finite element model, extracts the first eight rank Mode Shape of micro-assembled components, the first eight rank natural frequency and PSD response root mean square acceleration.
The natural frequency of micro-assembled components meets secular equation
|[K]-ω 2[M]|=0,
Wherein, [K] is the global stiffness matrix of micro-assembled components, the gross mass matrix that [M] is micro-assembled components, ω 2for the resonance frequency of micro-assembled components.
Under Random Vibration Load, micro-assembled components motion meets fundamental equation
[ M ] { x · · } + [ K ] { x } + [ C ] { x · } = { p } ,
Wherein, the total damping matrix that [C] is micro-assembled components, { p} is the random vibration power acted in micro-assembled components, and { x} is the dynamic respond of micro-assembled components.
Namely be extract micro-assembled components to be installed on Constrained mode characterisitic parameter under the condition of fixture and Random Vibration Responses Characteristics parameter, as the checking characterisitic parameter of Vibration Simulation finite element model in the present embodiment.Wherein, Constrained mode characterisitic parameter specifically comprises the first eight rank Mode Shape and the first eight rank natural frequency of micro-assembled components, and Random Vibration Responses Characteristics parameter specifically comprises PSD response root mean square acceleration.Be appreciated that the concrete data verifying characterisitic parameter are not unique, can adjust according to actual conditions.
Step S120: the experimental features parameter obtaining micro-assembled components, and experimentally characterisitic parameter and checking characterisitic parameter are revised Vibration Simulation finite element model, obtain Vibration Simulation model.
Accordingly, wherein in an embodiment, experimental features parameter also comprises Constrained mode characterisitic parameter and Random Vibration Responses Characteristics parameter.Wherein, Constrained mode characterisitic parameter comprises the first eight rank Mode Shape and the first eight rank natural frequency of micro-assembled components, and Random Vibration Responses Characteristics parameter comprises PSD response root mean square acceleration.Step S120 can comprise step 21 to step 28.
Step 21: simulate the constraint condition that micro-assembled components is installed on fixture.
Specifically by being with the elastic restraint vibration test fixture of heat abstractor to fix micro-assembled components, simulating micro-assembled components and being arranged on constraint condition on fixture, to carry out Constrained mode test and random vibration test to micro-assembled components.Elastic restraint vibration test fixture with heat abstractor specifically can comprise clamp base, constraint element support and elastic restraint unit.Clamp base is used for jockey and vibration table and fixed constraint unit rack.Constraint element support comprises 2, for supporting elastic restraint unit.Elastic restraint unit is made up of removable pcb board and heat radiator, for retraining outer pin and the metallic cavity of micro-assembled components.Adopt pcb board and heat radiator to realize elastic restraint, both can simulate the structural rigidity of micro-assembled components realistic application conditions in complete machine and clamped condition well, can meet again and the condition of contact of vibration table and fastening requirements.
Step 22: the vibrating fatigue damage sensitizing range obtaining micro-assembled components according to checking characterisitic parameter.
Checking characterisitic parameter according to obtaining in step S110 is analyzed, and each parameter is damaged sensitizing range lower than the region of threshold value as the vibrating fatigue of micro-assembled components.The setting of threshold value can according to actual conditions adjustment such as the materials of corresponding position.
Step 23: the continuous hammering preset times of hammer point preset micro-assembled components, gathers the frequency response function of micro-assembled components.
Equidistant displacing force specifically can be adopted to hammer method into shape, modal test is carried out to the micro-assembled components be arranged on elastic restraint vibration test fixture.The quantity of the hammer point preset can according to micro-assembled components surface size adjustment, and the spacing distance in the present embodiment between each hammer point is below 10mm, repeats the same hammer point of hammering continuous 5 times.For the feature of micro-assembled components flat packages, adopt equidistant displacing force to hammer method into shape and carry out mode experiment, be convenient to the Constrained mode characterisitic parameter obtaining micro-assembled components in subsequent step more accurately.
Degree of will speed up sensor is arranged on the preset reference point of vibrating fatigue damage sensitizing range of micro-assembled components, when displacing force hammer knocks the hammer point of micro-assembled components, gathers force signal and the signal for faster of reference point, and then obtains corresponding frequency response function.
Step 24: extract the first eight rank Mode Shape of micro-assembled components and the first eight rank natural frequency according to frequency response function analysis.
The frequency response function that test obtains is imported in model analysis software, carries out modal idenlification, after rejecting false mode, obtain the first eight rank eigenfrequncies and vibration models of micro-assembled components.According to Kind of Modal Confidence Factor MAC value and the natural frequency value of eight first order modes, when the first eight first order mode is orthogonal, utilize the first eight first order mode matching frequency response function.
By gathering and the interference of linear average Removing Random No of calculated frequency response function, modal idenlification technology also can be utilized to remove the natural frequency of fixture to the frequency response function after filtering, also by adopting displacing force hammer method to knock fixture, obtain corresponding frequency response function and determine the natural frequency of fixture, analyzed the modal parameter of micro-assembled components by the frequency response function obtained after finally removing the natural frequency of fixture, improve data accuracy.
Step 25: the acceleration responsive time-domain signal obtaining the monitoring point that vibrating fatigue damage sensitizing range is preset.
Adopt acceleration responsive Simultaneous Monitoring method, random vibration test is carried out to the micro-assembled components be arranged on elastic restraint vibration test fixture, obtains the acceleration responsive time-domain signal of each monitoring point.Can micro-assembled components be fixed on random vibration platform by vibration tong, arrange the vibratory response of each monitoring point of acceierometer sensor Simultaneous Monitoring, apply typical random oscillation power spectral density and carry out random vibration test, also monitor the vibratory response of fixture simultaneously.The vibrating fatigue damage sensitizing range that the position of monitoring point can be determined in step 22 is arranged, and the concrete quantity of monitoring point equally also can adjust according to the size of micro-assembled components.
Step 26: the root mean square acceleration power spectral density calculating corresponding monitoring point according to acceleration responsive time-domain signal.
Specifically first can carry out filtering to the acceleration responsive time-domain signal obtained, then calculate the root mean square acceleration power spectral density of each monitoring point.
Step 27: the random vibration root mean square acceleration calculating corresponding monitoring point according to root mean square acceleration power spectral density.
Calculate the random vibration root mean square acceleration of each monitoring point according to the root mean square acceleration power spectral density obtained, so far just obtain the experimental features parameter of micro-assembled components.
Step 28: judge whether checking characterisitic parameter is less than or equal to default corresponding error threshold with the relative error of experimental features parameter; If not, then Vibration Simulation finite element model is revised, and acquisition checking characterisitic parameter judges again again; If so, Vibration Simulation model is then obtained.
Corresponding error threshold also can adjust according to actual conditions.Criterion concrete in the present embodiment is, the every fundamental frequency relative error s of the first eight rank natural frequency of micro-assembled components 1≤ 5%, every single order Mode Shape is identical, and the random vibration root mean square acceleration of each monitoring point is to relative error s 2≤ 6.5%.
If checking characterisitic parameter is greater than corresponding error threshold with the relative error of experimental features parameter, explanation model accuracy is low, according to parameter error, model is revised, model is revised and specifically can comprise: finite element grid type and density correction, border degree of freedom constraint condition correction, the correction of interracial contact mode, mechanical parameters correction.Adopt the Mode Shape of Mode Shape pairing comparision to model one by one to revise, take into account corresponding natural frequency result in makeover process, to ensure that Mode Shape and natural frequency are all consistent with measured result simultaneously.
Relative error analysis can be carried out at least 6 monitoring points of vibrating fatigue sensitizing range, if relative error is greater than 6.5%, model being carried out to the correction of random vibration root mean square acceleration, also can be specifically comprise the modes such as stress and strain model, constraint condition and interface processing.Take into account corresponding characteristics of mode parameter, to ensure that Mode Shape, natural frequency are all consistent with measured result with random vibration root mean square acceleration in makeover process simultaneously.
Again obtain checking characterisitic parameter after correction again to compare with experimental features parameter, until relative error is all less than or equal to corresponding error threshold, the model finally obtained is Vibration Simulation model.
Adopt Constrained mode parameter and oscillating load response parameter to verify Vibration Simulation finite element model simultaneously, because the oscillating load response characteristic adding magnitude load identical with life prediction random vibration is verified, the Vibration Simulation model that checking is obtained is closer to real use state, improve the accuracy of modelling verification, when model utilize checking in subsequent step after carries out life prediction, also can further improve test accuracy.
Be appreciated that in other embodiments, in modeling and when verifying in step S110 and step S120, checking characterisitic parameter and experimental features parameter also can only include Constrained mode characterisitic parameter, do not comprise Random Vibration Responses Characteristics parameter.
Step S130: according to Vibration Simulation model, Random vibration response simulation analysis is carried out to micro-assembled components, obtain the vibrating fatigue dangerous point of micro-assembled components.
Wherein in an embodiment, step S130 specifically comprises step 31 to step 33.
Step 31: the stress response distribution of micro-assembled components under Random Vibration Load is emulated, obtains simulation result.
Stress response simulating analysis specifically can be utilized to emulate the stress response distribution of micro-assembled components under Random Vibration Load, obtain simulation result.Simulation result specifically can comprise the equivalent stress etc. of each position of micro-assembled components under Random Vibration Load.
Step 32: the history fail data extracting the micro-assembled components vibration cracking being installed on fixture.
History fail data refers to that the identical micro-assembled components being installed on identical fixture is at the vibration crack data used or in test examination, comprises the information such as the cracking position of each identical micro-assembled components.
Step 33: the vibrating fatigue dangerous point obtaining micro-assembled components according to simulation result and history fail data.
By position the highest for the equivalent stress of micro-assembled components under Random Vibration Load in the present embodiment, and in history fail data the cracking position of micro-assembled components as vibrating fatigue dangerous point.
Step 31 carries out emulating the simulation result obtained to step 33 according to the stress response distribution of micro-assembled components under Random Vibration Load, and history fail data determines the vibrating fatigue dangerous point of micro-assembled components, more accurately located the vibrating fatigue dangerous point affecting micro-assembled components vibrating fatigue life-span, can further improve test accuracy equally.Be appreciated that in other embodiments, in step S130, also can not extract history fail data, only according to simulation result determination vibrating fatigue dangerous point.
Step S140: extract the equivalent stress power spectrum density of vibrating fatigue dangerous point under Random Vibration Load.
According to the vibrating fatigue dangerous point determined in step S130, extract the equivalent stress power spectrum density accordingly result of micro-assembled components vibrating fatigue dangerous point under Random Vibration Load, the i.e. equivalent stress power spectrum density frequency domain data of vibrating fatigue dangerous point, as the loading stress basic data of micro-assembled components vibrating fatigue life prediction.
Step S150: change equivalent stress power spectrum density, obtains pulsating stress time domain data.
Step S150 comprises step 51 and step 52.
Step 51: carry out inverse fourier transform to equivalent stress power spectrum density, obtains the equivalent stress time history data of vibrating fatigue dangerous point response.
Utilize and according to inverse fourier transform principle, the equivalent stress power spectrum density obtained in step S140 is changed, realize the conversion of vibrating fatigue dangerous point equivalent stress power spectrum degrees of data from frequency domain to time domain, obtain the equivalent stress time history data of vibrating fatigue dangerous point response.
Step 52: equivalent stress time history data are sorted, obtains pulsating stress time domain data.
Rain flow method can be utilized the equivalent stress time history data of vibrating fatigue dangerous point to be sorted from irregular, random load-time history, transform into and a series ofly meet the pulsating stress and cycle index that distribute just very much, as the loading stress immediate data of micro-assembled components vibrating fatigue life prediction.
Utilize frequency domain method acquisition data to be then converted to time domain data and carry out vibrating fatigue life prediction, avoid and utilize time domain method to extract the large problem of data processing amount, reduce testing cost.
Step S160: the S-N curve obtaining vibrating fatigue dangerous point material, and calculate the vibrating fatigue vibrating fatigue life-span of dangerous point under Random Vibration Load according to S-N curve and pulsating stress time domain data.
S-N curve is for ordinate with material standard test specimen fatigue strength, with the logarithm value of fatigue lifetime for horizontal ordinate, represent fatigue strength and the curve of relation between fatigue lifetime of standard specimen under certain cycle specificity, the S-N curve of the standard specimen of different materials is different.According to the pulsating stress time domain data obtained in step S150, and S-N curve corresponding to vibrating fatigue dangerous point can calculate the vibrating fatigue life-span of vibrating fatigue dangerous point under Random Vibration Load.
Wherein in an embodiment, step S160 comprises step 61 to step 63.
Step 61: the S-N curve obtaining vibrating fatigue dangerous point material.
Because micro-assembled components is known at the material at vibrating fatigue dangerous point place, corresponding S-N curve directly can be obtained according to the material of vibrating fatigue dangerous point.
Step 62: according to the damage increment of vibrating fatigue dangerous point under pulsating stress time domain data and S-N curve calculating simple subprogram stress.
Suppose that material is at single cycle stress S 1under effect, cycle life number of times is N 1(S 1and N 1relation and S-N curve); At single cycle stress S 2under effect, cycle life number of times is N 2.Material is at stress S 1circulate under effect n 1secondary (n 1< N 1), be transferred to again at stress S 2circulate under effect n 2secondary (n 2< N 2) ..., so constantly more varying stress grade.
Under simple subprogram stress, the concrete account form of the damage increment of vibrating fatigue dangerous point is:
&Delta;D i = 1 N i = 1 c [ ( 1 / 2 ) &Delta; S i 1 - S mi / S u ] b
Wherein, △ S ithe stress range of simple subprogram stress, S mibe the stress average of simple subprogram stress, finite element numerical method can be adopted to calculate and obtain.S ube the ultimate strength of vibrating fatigue dangerous point material, b and c is constant, all can obtain from S-N curve.
Step 63: calculate dangerous point accumulated damage index according to the damage increment of vibrating fatigue dangerous point under each simple subprogram stress, and when dangerous point accumulated damage index judges Data Matching with the inefficacy preset, obtain the vibrating fatigue vibrating fatigue life-span of dangerous point under Random Vibration Load.
Dangerous point accumulated damage index account form is:
CDI = &Sigma; i = 1 n &Delta;D i = &Sigma; i = 1 m n i N i
Wherein, N ifor vibrating fatigue dangerous point is at simple subprogram stress S icycle life number of times under effect, n ifor vibrating fatigue dangerous point is at simple subprogram stress S icycle index under effect.
The inefficacy preset in the present embodiment judges that data are 1, and the damage recruitment of the tired dangerous point of single pulsating stress effect after vibration is when total amount of damage i.e. accumulated damage index time, material fatigue life is ended.Calculate all pulsating stress effect number of times sums of vibrating fatigue dangerous point within the material fatigue life cycle, just obtain the vibrating fatigue life-span of vibrating fatigue dangerous point under Random Vibration Load.
Above-mentioned micro-assembled components vibrating fatigue life-span prediction method, after checking obtains Vibration Simulation model, carries out Random vibration response simulation analysis according to Vibration Simulation model to micro-assembled components, obtains the vibrating fatigue dangerous point of micro-assembled components.Extract the equivalent stress power spectrum density of vibrating fatigue dangerous point under Random Vibration Load.Equivalent stress power spectrum density is changed, obtains pulsating stress time domain data.Obtain the S-N curve of vibrating fatigue dangerous point, and calculate the vibrating fatigue vibrating fatigue life-span of dangerous point under Random Vibration Load according to S-N curve and pulsating stress time domain data.Utilize frequency domain method to obtain data, be then converted to time domain data and carry out vibrating fatigue life prediction, avoid and utilize time domain method to extract the large problem of data processing amount.Adopt fixture and micro-assembled components synchronously to extract the method for response data, solve a difficult problem for micro-assembled components vibrating fatigue life prediction under two kinds of source of resonant excitation effects, improve test accuracy.
For ease of the beneficial effect understanding technical scheme better and bring, carry out detailed explanation explanation below in conjunction with specific embodiment.To carry out vibrating fatigue life prediction for case to the two pieces of HIC being installed on pcb board, two HIC are Metal Packaging, be bolted on pcb board, enclosure cavity is 10# steel (Fe-C7% ~ 13%), cavity cover plate is that 4J29 can cut down material (Fe54-Co17-Ni29).
Set up the Vibration Simulation finite element model of 2 the HIC vibrating fatigue life prediction be installed on pcb board, and extract the Constrained mode vibration shape, natural frequency and random vibration root mean square acceleration.As shown in Figure 2, horizontal ordinate represents frequency to the random vibration power spectrum obtained, and unit is Hz, and ordinate is random vibration power spectrum density, and unit is g 2/ Hz, dB/OCT are decibel/octave.
Constrained mode test and random vibration test are carried out to the HIC being installed on vibration test fixture, is obtained the Constrained mode property verification parameter and Random Vibration Responses Characteristics certificate parameter that are used for modelling verification by actual measurement.Degree of will speed up sensor is arranged in the reference point of HIC vibrating fatigue damage sensitizing range, and displacing force hammer knocks the hammer point of HIC, gathers force signal and the signal for faster of reference point, and then obtains corresponding frequency response function.Utilize displacing force to hammer method into shape equally and knock fixture, obtain corresponding frequency response function and determine the natural frequency of fixture, analyzed the modal parameter of micro-assembled components by the frequency response function obtained after finally removing the natural frequency of fixture.
Vibration Simulation finite element model is verified, the simulation result of HIC Mode Shape, natural frequency and random vibration root mean square acceleration and experimental result is contrasted, and HIC Vibration Simulation model is revised.Table 1 is the relative error (single order ~ five rank) of HIC part natural frequency simulation value and measured value after Modifying model, and table 2 is the random vibration root mean square acceleration relative error of monitoring point, HIC vibrating fatigue sensitizing range after Modifying model.
Table 1
Table 2
From table 1 and table 2, the simulation value (namely verifying characterisitic parameter) of revised model and the relative error of measured value (i.e. experimental features parameter), all in allowed band, finally obtain Vibration Simulation model.
The position the highest according to Vibration Simulation model extraction equivalent stress, and to its in the past vibration failur sample analyze, confirm the cavity side edge thereof of a vibrating fatigue dangerous point HIC wherein.
The equivalent stress power spectrum density of the vibrating fatigue dangerous point that extraction confirms above under Random Vibration Load, as shown in Figure 3, horizontal ordinate represents frequency (unit is Hz), and ordinate represents corresponding equivalent stress (unit is MPa).
Inverse fourier transform is carried out to the equivalent stress power spectrum density shown in Fig. 3, obtains the equivalent stress time history data of vibrating fatigue dangerous point response as shown in Figure 4.Then utilize the equivalent stress time history data of rain flow method to vibrating fatigue dangerous point to sort, obtain HIC vibrating fatigue dangerous point pulsating stress time domain data.
Vibrating fatigue dangerous point pulsating stress time domain data according to obtaining can cut down metal material S-N curve in conjunction with HIC cavity cover plate, calculates cover plate vibrating fatigue dangerous point and can cut down metal material and exist finish-time in vibrating fatigue life-span under condition is 70.3 hours, i.e. the vibrating fatigue life-span t=70.3 hour of HIC under Random Vibration Load in the present embodiment.
Present invention also offers a kind of micro-assembled components vibrating fatigue life prediction system, as shown in Figure 5, comprise MBM 110, correcting module 120, emulation module 130, extraction module 140, modular converter 150 and processing module 160.
MBM 110, for according to the structure of micro-assembled components with the fixture of the micro-assembled components of installation, is set up Vibration Simulation finite element model, and is extracted the checking characterisitic parameter of Vibration Simulation finite element model.
Micro-assembled components can be specifically HIC, microwave hybrid integrated circuit, microwave components or SiP assembly etc., and encapsulating material can be metal or plastics etc., and fixture, for installing micro-assembled components, can be pcb board etc.
Wherein in an embodiment, checking characterisitic parameter comprises the first eight rank Mode Shape of micro-assembled components, the first eight rank natural frequency and PSD response root mean square acceleration.MBM 110 comprises modeling unit and extraction unit.
Modeling unit is used for setting up corresponding solid model according to micro-assembled components with the structure of the fixture installing micro-assembled components, and sets up Vibration Simulation finite element model according to solid model.
Extraction unit is used for emulating the modal parameter of micro-assembled components and Random Vibration Responses Characteristics according to Vibration Simulation finite element model, extracts the first eight rank Mode Shape of micro-assembled components, the first eight rank natural frequency and PSD response root mean square acceleration.
Namely be extract micro-assembled components to be installed on Constrained mode characterisitic parameter under the condition of fixture and Random Vibration Responses Characteristics parameter, as the checking characterisitic parameter of Vibration Simulation finite element model in the present embodiment.Wherein, Constrained mode characterisitic parameter specifically comprises the first eight rank Mode Shape and the first eight rank natural frequency of micro-assembled components, and Random Vibration Responses Characteristics parameter specifically comprises PSD response root mean square acceleration.Be appreciated that the concrete data verifying characterisitic parameter are not unique, can adjust according to actual conditions.
Correcting module 120 is for obtaining the experimental features parameter of micro-assembled components, and experimentally characterisitic parameter and checking characterisitic parameter are revised Vibration Simulation finite element model, obtain Vibration Simulation model.
Accordingly, wherein in an embodiment, experimental features parameter also comprises Constrained mode characterisitic parameter and Random Vibration Responses Characteristics parameter.Wherein, Constrained mode characterisitic parameter comprises the first eight rank Mode Shape and the first eight rank natural frequency of micro-assembled components, and Random Vibration Responses Characteristics parameter comprises PSD response root mean square acceleration.Correcting module 120 comprises analogue unit, collecting unit, the first acquiring unit, second acquisition unit, the 3rd acquiring unit, the first computing unit, the second computing unit and judging unit.
Analogue unit is installed on the constraint condition of fixture for simulating micro-assembled components.Specifically fix micro-assembled components by elastic restraint vibration test fixture, simulate micro-assembled components and be arranged on constraint condition on fixture, to carry out Constrained mode test and random vibration test to micro-assembled components.
First acquiring unit is used for the vibrating fatigue damage sensitizing range obtaining micro-assembled components according to checking characterisitic parameter.Analyze according to the checking characterisitic parameter that MBM 110 obtains, each parameter is damaged sensitizing range lower than the region of threshold value as the vibrating fatigue of micro-assembled components.The setting of threshold value also can according to actual conditions adjustment such as the materials of corresponding position.
Collecting unit is used for the continuous hammering preset times of hammer point preset micro-assembled components, gathers the frequency response function of micro-assembled components.Equidistant displacing force specifically can be adopted to hammer method into shape, modal test is carried out to the micro-assembled components be arranged on elastic restraint vibration test fixture.The quantity of the hammer point preset can according to micro-assembled components surface size adjustment, for the feature of micro-assembled components flat packages, adopt equidistant displacing force to hammer method into shape and carry out mode experiment, be convenient to the Constrained mode characterisitic parameter obtaining micro-assembled components in subsequent step more accurately.
Second acquisition unit is used for according to described frequency response function analysis and extracts the first eight rank Mode Shape of described micro-assembled components and the first eight rank natural frequency, similar in concrete grammar and step 24, does not repeat at this.By gathering and the interference of linear average Removing Random No of calculated frequency response function, modal idenlification technology also can be utilized to remove the natural frequency of fixture to the frequency response function after filtering, analyzed the modal parameter of micro-assembled components by the frequency response function finally obtained, improve data accuracy.
3rd acquiring unit damages the acceleration responsive time-domain signal of the monitoring point that sensitizing range is preset for obtaining vibrating fatigue.Adopt acceleration responsive Simultaneous Monitoring method, random vibration test is carried out to the micro-assembled components be arranged on elastic restraint vibration test fixture, obtains the acceleration responsive time-domain signal of each monitoring point.The concrete quantity of monitoring point equally also can adjust according to the size of micro-assembled components.
First computing unit is used for the root mean square acceleration power spectral density calculating corresponding monitoring point according to acceleration responsive time-domain signal.Specifically first can carry out filtering to the acceleration responsive time-domain signal obtained, then calculate the root mean square acceleration power spectral density of each monitoring point.
Second computing unit is used for the random vibration root mean square acceleration calculating corresponding monitoring point according to root mean square acceleration power spectral density.Calculate the random vibration root mean square acceleration of each monitoring point according to the root mean square acceleration power spectral density obtained, so far just obtain the experimental features parameter of micro-assembled components.
Judging unit is for judging whether checking characterisitic parameter is less than or equal to default corresponding error threshold with the relative error of experimental features parameter; If not, then Vibration Simulation finite element model is revised, and acquisition checking characterisitic parameter judges again again; If so, Vibration Simulation model is then obtained.
Corresponding error threshold also can adjust according to actual conditions.If checking characterisitic parameter is greater than corresponding error threshold with the relative error of experimental features parameter, explanation model accuracy is low, according to parameter error, model is revised, and acquisition checking characterisitic parameter compares with experimental features parameter again again, until relative error is all less than or equal to corresponding error threshold, the model finally obtained is Vibration Simulation model, similar in concrete mode and step 28, does not repeat at this.
Adopt Constrained mode parameter and oscillating load response parameter to verify Vibration Simulation finite element model simultaneously, because the oscillating load response characteristic adding magnitude load identical with life prediction random vibration is verified, the Vibration Simulation model that checking is obtained is closer to real use state, improve the accuracy of modelling verification, when model utilize checking in subsequent step after carries out life prediction, also can further improve test accuracy.
Be appreciated that in other embodiments, in modeling and when verifying, checking characterisitic parameter and experimental features parameter also can only include Constrained mode characterisitic parameter, do not comprise Random Vibration Responses Characteristics parameter.
Emulation module 130, for carrying out Random vibration response simulation analysis according to Vibration Simulation model to micro-assembled components, obtains the vibrating fatigue dangerous point of micro-assembled components.
Emulation module 130 specifically can comprise the first simulation unit, the second simulation unit and the 3rd simulation unit.
First simulation unit is used for emulating the stress response distribution of micro-assembled components under Random Vibration Load, obtains simulation result.Stress response simulating analysis specifically can be utilized to emulate the stress response distribution of micro-assembled components under Random Vibration Load, obtain simulation result.Simulation result specifically can comprise the equivalent stress etc. of each position of micro-assembled components under Random Vibration Load.
Second simulation unit is for extracting the history fail data of the micro-assembled components vibration cracking being installed on fixture.History fail data refers to the vibration crack data of the identical micro-assembled components being installed on identical fixture, comprises the information such as the cracking position of each identical micro-assembled components.
3rd simulation unit is used for the vibrating fatigue dangerous point obtaining micro-assembled components according to simulation result and history fail data.By position the highest for the equivalent stress of micro-assembled components under Random Vibration Load in the present embodiment, and in history fail data the cracking position of micro-assembled components as vibrating fatigue dangerous point.
Carry out emulating the simulation result obtained according to the stress response distribution of micro-assembled components under Random Vibration Load, and history fail data determines the vibrating fatigue dangerous point of micro-assembled components, more accurately located the vibrating fatigue dangerous point affecting micro-assembled components vibrating fatigue life-span, can further improve test accuracy equally.
Extraction module 140 is for extracting the equivalent stress power spectrum density of vibrating fatigue dangerous point under Random Vibration Load.
According to the vibrating fatigue dangerous point that emulation module 130 is determined, extract the equivalent stress power spectrum density accordingly result of micro-assembled components vibrating fatigue dangerous point under Random Vibration Load, the i.e. equivalent stress power spectrum density frequency domain data of vibrating fatigue dangerous point, as the loading stress basic data of micro-assembled components vibrating fatigue life prediction.
Modular converter 150, for changing equivalent stress power spectrum density, obtains pulsating stress time domain data.
Modular converter 150 specifically can comprise the first converting unit and the second converting unit.
First converting unit is used for carrying out inverse fourier transform to equivalent stress power spectrum density, obtains the equivalent stress time history data of vibrating fatigue dangerous point response.Utilize and according to inverse fourier transform principle, equivalent stress power spectrum density is changed, realize the conversion of vibrating fatigue dangerous point equivalent stress power spectrum degrees of data from frequency domain to time domain, obtain the equivalent stress time history data of vibrating fatigue dangerous point response.
Second converting unit is used for sorting to equivalent stress time history data, obtains pulsating stress time domain data.Rain flow method can be utilized the equivalent stress time history data of vibrating fatigue dangerous point to be sorted from irregular, random load-time history, transform into and a series ofly meet the pulsating stress and cycle index that distribute just very much, as the loading stress immediate data of micro-assembled components vibrating fatigue life prediction.
Utilize frequency domain method acquisition data to be then converted to time domain data and carry out vibrating fatigue life prediction, avoid and utilize time domain method to extract the large problem of data processing amount, reduce testing cost.
Processing module 160 for obtaining the S-N curve of vibrating fatigue dangerous point material, and calculates the vibrating fatigue vibrating fatigue life-span of dangerous point under Random Vibration Load according to S-N curve and pulsating stress time domain data.
S-N curve is for ordinate with material standard test specimen fatigue strength, with the logarithm value of fatigue lifetime for horizontal ordinate, represent fatigue strength and the curve of relation between fatigue lifetime of standard specimen under certain cycle specificity, the S-N curve of the standard specimen of different materials is different.According to pulsating stress time domain data, and S-N curve corresponding to vibrating fatigue dangerous point can calculate the vibrating fatigue life-span of vibrating fatigue dangerous point under Random Vibration Load.
Wherein in an embodiment, processing module 160 comprises the first processing unit, the second processing unit and the 3rd processing unit.
First processing unit is for obtaining the S-N curve of vibrating fatigue dangerous point material.
Because micro-assembled components is known at the material at vibrating fatigue dangerous point place, corresponding S-N curve directly can be obtained according to the material of vibrating fatigue dangerous point.
Second processing unit is used for the damage increment according to vibrating fatigue dangerous point under pulsating stress time domain data and S-N curve calculating simple subprogram stress.
Under simple subprogram stress, the concrete account form of the damage increment of vibrating fatigue dangerous point is:
&Delta;D i = 1 N i = 1 c [ ( 1 / 2 ) &Delta; S i 1 - S mi / S u ] b
Wherein, △ S ithe stress range of simple subprogram stress, S mibe the stress average of simple subprogram stress, finite element numerical method can be adopted to calculate and obtain.S ube the ultimate strength of vibrating fatigue dangerous point material, b and c is constant, all can obtain from S-N curve.
3rd processing unit is used for calculating dangerous point accumulated damage index according to the damage increment of vibrating fatigue dangerous point described under each simple subprogram stress, and when dangerous point accumulated damage index judges Data Matching with the inefficacy preset, obtain the vibrating fatigue vibrating fatigue life-span of dangerous point under Random Vibration Load.
Dangerous point accumulated damage index account form is:
CDI = &Sigma; i = 1 n &Delta;D i = &Sigma; i = 1 m n i N i
Wherein, N ifor vibrating fatigue dangerous point is at simple subprogram stress S icycle life number of times under effect, n ifor vibrating fatigue dangerous point is at simple subprogram stress S icycle index under effect.
The inefficacy preset in the present embodiment judges that data are 1, and the damage recruitment of the tired dangerous point of single pulsating stress effect after vibration is when total amount of damage i.e. accumulated damage index time, material fatigue life is ended.Calculate all pulsating stress effect number of times sums of vibrating fatigue dangerous point within the material fatigue life cycle, just obtain the vibrating fatigue life-span of vibrating fatigue dangerous point under Random Vibration Load.
Above-mentioned micro-assembled components vibrating fatigue life prediction system, after obtaining Vibration Simulation model by MBM 110 modeling and correcting module 120 checking, emulation module 130 carries out Random vibration response simulation analysis according to Vibration Simulation model to micro-assembled components, obtains the vibrating fatigue dangerous point of micro-assembled components.Extraction module 140 extracts the equivalent stress power spectrum density of vibrating fatigue dangerous point under Random Vibration Load.Modular converter 150 pairs of equivalent stress power spectrum densities are changed, and obtain pulsating stress time domain data.Processing module 160 obtains the S-N curve of vibrating fatigue dangerous point, and calculates the vibrating fatigue vibrating fatigue life-span of dangerous point under Random Vibration Load according to S-N curve and pulsating stress time domain data.Utilize frequency domain method to obtain data, be then converted to time domain data and carry out vibrating fatigue life test, avoid and utilize time domain method to extract the large problem of data processing amount.Adopt fixture and micro-assembled components synchronously to extract the method for response data, solve a difficult problem for micro-assembled components vibrating fatigue life prediction under two kinds of source of resonant excitation effects, improve test accuracy.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (10)

1. a micro-assembled components vibrating fatigue life-span prediction method, is characterized in that, comprise the following steps:
According to the structure of micro-assembled components with the fixture of the described micro-assembled components of installation, set up Vibration Simulation finite element model, and extract the checking characterisitic parameter of described Vibration Simulation finite element model;
Obtain the experimental features parameter of described micro-assembled components, and according to described experimental features parameter and checking characterisitic parameter, described Vibration Simulation finite element model is revised, obtain Vibration Simulation model;
According to described Vibration Simulation model, Random vibration response simulation analysis is carried out to described micro-assembled components, obtain the vibrating fatigue dangerous point of described micro-assembled components;
Extract the equivalent stress power spectrum density density of described vibrating fatigue dangerous point under Random Vibration Load;
Described equivalent stress power spectrum density is changed, obtains pulsating stress time domain data;
Obtain the S-N curve of described vibrating fatigue dangerous point material, and calculate the vibrating fatigue life-span of described vibrating fatigue dangerous point under Random Vibration Load according to described S-N curve and pulsating stress time domain data.
2. micro-assembled components vibrating fatigue life-span prediction method according to claim 1, is characterized in that, described checking characterisitic parameter comprises the first eight rank Mode Shape of described micro-assembled components, the first eight rank natural frequency and PSD response root mean square acceleration; Described according to the structure of micro-assembled components with the fixture of the described micro-assembled components of installation, set up Vibration Simulation finite element model, and extract the step of the checking characterisitic parameter of described Vibration Simulation finite element model, comprising:
Set up corresponding solid model according to described micro-assembled components with the structure of the fixture installing described micro-assembled components, and set up described Vibration Simulation finite element model according to described solid model;
According to described Vibration Simulation finite element model, the modal parameter of described micro-assembled components and Random Vibration Responses Characteristics are emulated, extract the first eight rank Mode Shape of described micro-assembled components, the first eight rank natural frequency and PSD response root mean square acceleration.
3. micro-assembled components vibrating fatigue life-span prediction method according to claim 2, is characterized in that, described experimental features parameter comprises the first eight rank Mode Shape of described micro-assembled components, the first eight rank natural frequency and PSD response root mean square acceleration; The experimental features parameter of the described micro-assembled components of described acquisition, and according to described experimental features parameter and checking characterisitic parameter, described Vibration Simulation finite element model is revised, obtain the step of Vibration Simulation model, comprising:
Simulate the constraint condition that described micro-assembled components is installed on described fixture;
The vibrating fatigue damage sensitizing range of described micro-assembled components is obtained according to described checking characterisitic parameter;
To the continuous hammering preset times of hammer point that described micro-assembled components is preset, gather the frequency response function of described micro-assembled components;
The first eight rank Mode Shape of described micro-assembled components and the first eight rank natural frequency is extracted according to described frequency response function analysis;
Obtain the acceleration responsive time-domain signal of the monitoring point that described vibrating fatigue damage sensitizing range is preset;
The root mean square acceleration power spectral density of corresponding described monitoring point is calculated according to described acceleration responsive time-domain signal;
The random vibration root mean square acceleration of corresponding described monitoring point is calculated according to described root mean square acceleration power spectral density;
Judge whether described checking characterisitic parameter is less than or equal to default corresponding error threshold with the relative error of experimental features parameter; If not, then described Vibration Simulation finite element model is revised, and again obtain described checking characterisitic parameter and again judge; If so, described Vibration Simulation model is then obtained.
4. micro-assembled components vibrating fatigue life-span prediction method according to claim 1, it is characterized in that, described according to described Vibration Simulation model to described micro-assembled components carry out Random vibration response simulation analysis, obtain the step of the vibrating fatigue dangerous point of described micro-assembled components, comprising:
The stress response distribution of described micro-assembled components under Random Vibration Load is emulated, obtains simulation result;
Extract the history fail data of the described micro-assembled components vibration cracking being installed on described fixture;
The vibrating fatigue dangerous point of described micro-assembled components is obtained according to described simulation result and history fail data.
5. micro-assembled components vibrating fatigue life-span prediction method according to claim 1, is characterized in that, describedly changes described equivalent stress power spectrum density, obtains the step of pulsating stress time domain data, comprising:
Inverse fourier transform is carried out to described equivalent stress power spectrum density, obtains the equivalent stress time history data of described vibrating fatigue dangerous point response;
Described equivalent stress time history data are sorted, obtains described pulsating stress time domain data.
6. micro-assembled components vibrating fatigue life-span prediction method according to claim 1, it is characterized in that, the S-N curve of described acquisition described vibrating fatigue dangerous point material, and the step in the vibrating fatigue life-span of described vibrating fatigue dangerous point under Random Vibration Load is calculated according to described S-N curve and pulsating stress time domain data, comprising:
Obtain the S-N curve of described vibrating fatigue dangerous point material;
According to the damage increment of described vibrating fatigue dangerous point under described pulsating stress time domain data and S-N curve calculating simple subprogram stress;
Dangerous point accumulated damage index is calculated according to the damage increment of vibrating fatigue dangerous point described under each simple subprogram stress, and when described dangerous point accumulated damage index judges Data Matching with the inefficacy preset, obtain the vibrating fatigue life-span of described vibrating fatigue dangerous point under Random Vibration Load.
7. a micro-assembled components vibrating fatigue life prediction system, is characterized in that, comprising:
MBM, for according to the structure of micro-assembled components with the fixture of the described micro-assembled components of installation, sets up Vibration Simulation finite element model, and extracts the checking characterisitic parameter of described Vibration Simulation finite element model;
Correcting module, for obtaining the experimental features parameter of described micro-assembled components, and revising described Vibration Simulation finite element model according to described experimental features parameter and checking characterisitic parameter, obtaining Vibration Simulation model;
Emulation module, for carrying out Random vibration response simulation analysis according to described Vibration Simulation model to described micro-assembled components, obtains the vibrating fatigue dangerous point of described micro-assembled components;
Extraction module, for extracting the equivalent stress power spectrum density of described vibrating fatigue dangerous point under Random Vibration Load;
Modular converter, for changing described equivalent stress power spectrum density, obtains pulsating stress time domain data;
Processing module, for obtaining the S-N curve of described vibrating fatigue dangerous point material, and calculates the vibrating fatigue life-span of described vibrating fatigue dangerous point under Random Vibration Load according to described S-N curve and pulsating stress time domain data.
8. micro-assembled components vibrating fatigue life prediction system according to claim 7, is characterized in that, described checking characterisitic parameter comprises the first eight rank Mode Shape of described micro-assembled components, the first eight rank natural frequency and PSD response root mean square acceleration; Described MBM comprises:
Modeling unit, for setting up corresponding solid model according to described micro-assembled components with the structure of the fixture installing described micro-assembled components, and sets up described Vibration Simulation finite element model according to described solid model;
Extraction unit, for emulating the modal parameter of described micro-assembled components and Random Vibration Responses Characteristics according to described Vibration Simulation finite element model, extract the first eight rank Mode Shape of described micro-assembled components, the first eight rank natural frequency and PSD response root mean square acceleration.
9. micro-assembled components vibrating fatigue life prediction system according to claim 8, is characterized in that, described experimental features parameter comprises the first eight rank Mode Shape of described micro-assembled components, the first eight rank natural frequency and PSD response root mean square acceleration; Described correcting module comprises:
Analogue unit, is installed on the constraint condition of described fixture for simulating described micro-assembled components;
First acquiring unit, for obtaining the vibrating fatigue damage sensitizing range of described micro-assembled components according to described checking characterisitic parameter;
Collecting unit, for the continuous hammering preset times of hammer point preset described micro-assembled components, gathers the frequency response function of described micro-assembled components;
Second acquisition unit, for extracting the first eight rank Mode Shape of described micro-assembled components and the first eight rank natural frequency according to described frequency response function analysis;
3rd acquiring unit, for obtaining the acceleration responsive time-domain signal of the monitoring point that described vibrating fatigue damage sensitizing range is preset;
First computing unit, for calculating the root mean square acceleration power spectral density of corresponding described monitoring point according to described acceleration responsive time-domain signal;
Second computing unit, for calculating the random vibration root mean square acceleration of corresponding described monitoring point according to described root mean square acceleration power spectral density;
Judging unit, for judging whether described checking characterisitic parameter is less than or equal to default corresponding error threshold with the relative error of experimental features parameter; If not, then described Vibration Simulation finite element model is revised, and again obtain described checking characterisitic parameter and again judge; If so, described Vibration Simulation model is then obtained.
10. micro-assembled components vibrating fatigue life prediction system according to claim 7, it is characterized in that, described processing module comprises:
First processing unit, for obtaining the S-N curve of described vibrating fatigue dangerous point material;
Second processing unit, for the damage increment according to described vibrating fatigue dangerous point under described pulsating stress time domain data and S-N curve calculating simple subprogram stress;
3rd processing unit, for calculating dangerous point accumulated damage index according to the damage increment of vibrating fatigue dangerous point described under each simple subprogram stress, and when described dangerous point accumulated damage index judges Data Matching with the inefficacy preset, obtain the vibrating fatigue life-span of described vibrating fatigue dangerous point under Random Vibration Load.
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