CN104264137A - 一种胶体铜活化液的制备方法 - Google Patents

一种胶体铜活化液的制备方法 Download PDF

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Publication number
CN104264137A
CN104264137A CN201410534917.XA CN201410534917A CN104264137A CN 104264137 A CN104264137 A CN 104264137A CN 201410534917 A CN201410534917 A CN 201410534917A CN 104264137 A CN104264137 A CN 104264137A
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China
Prior art keywords
preparation
boric acid
colloidal copper
copper activator
copper
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CN201410534917.XA
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English (en)
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杨彦涛
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Wuxi Changhui Machinery & Electronics Technology Co Ltd
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Wuxi Changhui Machinery & Electronics Technology Co Ltd
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Priority to CN201410534917.XA priority Critical patent/CN104264137A/zh
Publication of CN104264137A publication Critical patent/CN104264137A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

本发明公开了一种胶体铜活化液的制备方法，包括以下成分按重量配比，氧化铜20g/L，硼酸5g/L，海藻酸钠2g/L，水合肼10ml/L,氧化钯1g/L；本发明提供了一种结晶细致、机械性能好、成本低的胶体铜活化液的制备方法。

Description

一种胶体铜活化液的制备方法
技术领域
本发明涉及一种化学镀铜工艺中的活化液的制备方法，尤其涉及一种胶体铜活化液的制备方法。
背景技术
 化学镀铜工艺中活化液在溶液中形成含有金属钯的胶体颗粒，在活化处理时利用物理吸附作用，在基体表面形成钯活化中心，因此，活化液中的贵金属不会与金属铜之间产生置换金属层，活化后在基体表面上产生的只是单分子层的催化质点，对提高镀层的结合力提供良好的表面状态，现有的活化液多采用酸基胶体钯活化液，由于活化液中含有浓度较高的盐酸，盐酸的活性很强，是一种渗透能力很强的酸，技艺侵蚀到多层板孔口周围和内层连接盘铜箔的氧化层上，产生“粉红圈”，不利于提高胶体钯的活化性能，又有损于化学沉铜层与基体铜箔结合力。
发明内容
发明目的：本发明解决了上述问题，提供了一种结晶细致、机械性能好、成本低的胶体铜活化液的制备方法。
技术方案：一种胶体铜活化液的制备方法，包括以下成分按重量配比，氧化铜20g/L，硼酸5g/L，海藻酸钠2g/L，水合肼10ML/L,氧化钯1g/L。
具体地，PH值为7。
具体地，所述硼酸浓度为25%。
有益效果：本发明与现有技术相比，其优点在于胶体铜颗粒表现带正电荷，可吸附在孔壁表面，覆盖力好，活化液中不含氯离子，减少了“粉红圈”的产生，使其结晶细致、机械性能好，且成本低。 
具体实施方式
下面结合具体实施方式，进一步阐明本发明。
一种胶体铜活化液的制备方法，包括以下成分按重量配比，氧化铜20g/L，硼酸5g/L，海藻酸钠2g/L，水合肼10ML/L,氧化钯1g/L。
实施例1
将氧化铜和硼酸混合，再用40℃去离子水溶解，称为溶液A；海藻酸钠用40℃去离子水溶解，称为溶液B，将溶液B加入溶液A中，用25%的硼酸将PH值调节到3，当温度为45℃，再将硼酸在搅拌条件下加入上述混合溶液中，并加去离子水稀释至1L，温度控制在40-50℃，持续搅拌7-10分钟，溶液颜色由蓝色变为绿色，放置24小时后，溶液颜色变为红黑色，加入水合肼，再放置24小时，此时PH值为7。
胶体铜颗粒表面带正电荷，靠自身的静电作用就能良好地吸附在孔壁表面上，胶体铜颗粒的直径很小，对孔壁的覆盖力较好，减少了孔空洞的现象，胶体铜的活化和预浸为碱性或者中性且不含氯离子，减少了“粉红圈”的产生，催化反应也较慢，使其结晶细致、机械性能好、成本较低。

Claims (3)

1. 一种胶体铜活化液的制备方法，其特征在于：包括以下成分按重量配比，氧化铜20g/L，硼酸5g/L，海藻酸钠2g/L，水合肼10ML/L,氧化钯1g/L。
2.根据权利要求1所述的一种胶体铜活化液的制备方法，其特征在于：PH值为7。
3.根据权利要求1所述的一种胶体铜活化液的制备方法，其特征在于：所述硼酸浓度为25%。
CN201410534917.XA 2014-10-13 2014-10-13 一种胶体铜活化液的制备方法 Pending CN104264137A (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4321832A (en) * 1980-03-07 1982-03-30 Rockwell International Corporation High accuracy measuring apparatus
EP0079975A1 (en) * 1981-11-20 1983-06-01 LeaRonal, Inc. Copper colloid and method of activating insulating surfaces for subsequent electroplating
US4681630A (en) * 1982-09-27 1987-07-21 Learonal, Inc. Method of making copper colloid for activating insulating surfaces

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4321832A (en) * 1980-03-07 1982-03-30 Rockwell International Corporation High accuracy measuring apparatus
EP0079975A1 (en) * 1981-11-20 1983-06-01 LeaRonal, Inc. Copper colloid and method of activating insulating surfaces for subsequent electroplating
US4681630A (en) * 1982-09-27 1987-07-21 Learonal, Inc. Method of making copper colloid for activating insulating surfaces

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