CN104262901A - Epoxy resin material with nano aluminum nitride filler and manufacturing method thereof - Google Patents
Epoxy resin material with nano aluminum nitride filler and manufacturing method thereof Download PDFInfo
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- CN104262901A CN104262901A CN201410432924.9A CN201410432924A CN104262901A CN 104262901 A CN104262901 A CN 104262901A CN 201410432924 A CN201410432924 A CN 201410432924A CN 104262901 A CN104262901 A CN 104262901A
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Abstract
The invention discloses an epoxy resin material with a nano aluminum nitride filler and a manufacturing method thereof. The material is prepared from the following raw materials in parts by weight: 15-25 parts of micron-sized aluminum nitride powder, 1-3 parts of nano aluminum nitride powder, 1-4 parts of silane coupling agent, 68-83 parts of epoxy resin, ethanol, reactive diluent and curing agent. The weight ratio of the silane coupling agent to the ethanol is 1:4; and the weight ratio of the reactive diluent to the epoxy resin is 1:5.
Description
Technical field
The present invention relates to electric material, particularly relate to and a kind ofly add epoxide resin material of nano silicon nitride Al filler and preparation method thereof.
Background technology
In the technical field of electrical industry, the material with heat conduction and insulation function often plays an important role, along with the development of electrical industry is also more and more higher for the thermal conductivity of material and insulation function, usually adopts insulating polymeric material as main body and make material have thermal conductivity and insulativity concurrently by some conduction materials of interpolation as filler.
It is 102408663A that Chinese patent 2012.04.11 discloses publication number, theme as the patent of invention of " the insulating heat-conductive ABS composite material of doped aluminum nitride and preparation thereof ", this patent is based on ABS material and add aluminium nitride powder and make material have insulating heat-conductive function as filler.But, aluminium nitride powder can be divided into nano level and micron order according to its mean particle size, have about the impact of micron order aluminium nitride filler on material conducts heat, insulation and disruptive strength in existing technical publications, when micron order aluminium nitride filler adds in pure epoxy resin, the heat conductivility of material significantly improves, but disruptive strength obviously declines, affect the security of electric installation, especially for the higher equipment of this voltage of transformer, guarantee the insulation shape of material and resistance to disruptive strength particularly important.
Summary of the invention
The object of the invention is to for the problems referred to above, provide have thermal conductive resin simultaneously again a kind of of higher resistance to disruptive strength add epoxide resin material of nano silicon nitride Al filler and preparation method thereof.
In order to realize above object, the technical solution used in the present invention is: a kind of epoxide resin material adding nano silicon nitride Al filler, and the raw material of this material comprises: micron order aluminium nitride powder, nano level aluminium nitride powder, silane coupling agent, epoxy resin, ethanol, reactive thinner, solidifying agent; Wherein, the weight part of micron order aluminium nitride powder is 15-25 part, the weight part of nano level aluminium nitride powder is 1-3 part, the weight part of silane coupling agent is 1-4 part, the weight part of epoxy resin is 68-83 part, silane coupling agent and ethanol ratio 1:4 by weight, reactive thinner and ring resin ratio 1:5 by weight.
Further, the mean particle size of described micron order aluminium nitride powder is at 5-20 micron.
Further, the mean particle size of described nano level aluminium nitride powder is in 20-50 nanometer.
A kind of preparation method adding the epoxide resin material of nano silicon nitride Al filler, the method comprises the following steps: a. is by after silane coupling agent and ethanol 1:4 dilution by weight proportion, add micron order aluminium nitride powder and nano level aluminium nitride powder and stir 5 hours, carry out ultrasonic wave subsequently and disperse 30 minutes, filter, for subsequent use after drying in 100 DEG C; B. by reactive thinner and ring resin by weight proportion 1:5 carry out agitation and dilution to mixing; C. the mixture obtained final in step a and the mixture obtained final in step b are stirred well to and carry out ultrasonic wave after mixing and disperse 30 minutes; D. add solidifying agent to continue to stir, present room temperature Procuring has solidified a kind of epoxide resin material adding nano silicon nitride Al filler described in rear acquisition again at 100 DEG C of solidification 2-4 hour in 1-2 hour.
Further, in steps d, the material before solidification can be put into mould be cured, a kind of dry type transformer material with high strength of shaping after solidification, can be obtained.
The beneficial effect of patent of the present invention is, its a kind of epoxide resin material adding nano silicon nitride Al filler provided adds aluminium nitride powder improves epoxide resin material thermal conductivity as filler, and divides into nano level aluminium nitride powder and micron order aluminium nitride powder to aluminium nitride powder with its mean particle size; The basis of adding 15-25 part micron order aluminium nitride is added the nano level aluminium nitride of 1-3 part again, and the thermal conductivity that the aluminium nitride powder of this mixing can improve epoxide resin material can also make its disruptive strength than adding pure micron order aluminium nitride powder and increase.
Embodiment
Now in conjunction with specific embodiments the present invention's technical scheme required for protection is described in further detail.
Embodiment one
A kind of epoxide resin material adding nano silicon nitride Al filler of the present embodiment, the weight percent of its each raw material is: micron order aluminium nitride powder 20 parts, nano level aluminium nitride powder 3 parts, silane coupling agent 2 parts, epoxy resin 75 parts; Wherein the mean particle size of micron machine aluminium nitride is 20 microns, and the mean particle size of nano level aluminium nitride is 50 nanometers.
The making method of this material is: first by after the 1:4 dilution by weight proportion of silane coupling agent and ethanol, adds micron order aluminium nitride powder and nano level aluminium nitride powder and stirs 5 hours, carrying out ultrasonic wave subsequently and disperse 30 minutes, filter, for subsequent use after drying in 100 DEG C; Again by reactive thinner and epoxy resin by weight proportion 1:5 carry out agitation and dilution to mixing; Last add in the epoxy resin diluted the aluminium nitride powder mixed carry out being stirred well to mix after carry out ultrasonic wave and disperse 30 minutes; Finally add solidifying agent and Procuring 1 hour at room temperature, again 100 DEG C of solidifications 3 hours, described a kind of epoxide resin material adding nano silicon nitride Al filler can be obtained after solidification, wherein the effect of solidifying agent is used to solidify material, as long as its consumption can allow material cured, the material before solidification can also be added in mould a kind of epoxide resin material adding nano silicon nitride Al filler being cured acquisition and being shaped.
Material for the present embodiment arranges a control group, and its difference is part micron order aluminium nitride of 20 in the present embodiment and 3 parts of nano level aluminium nitride to change 23 parts of micron order aluminium nitride into, and test two groups of materials, its test result is as follows:
The disruptive strength of control group material is about 45KV/mm; The disruptive strength of the present embodiment material is 54 KV/mm.
Embodiment two
A kind of epoxide resin material adding nano silicon nitride Al filler of the present embodiment, the weight percent of its each raw material is: micron order aluminium nitride powder 15 parts, nano level aluminium nitride powder 1 part, silane coupling agent 2 parts, epoxy resin 82 parts; Wherein the mean particle size of micron machine aluminium nitride is 5 microns, and the mean particle size of nano level aluminium nitride is 30 nanometers.
The making method of this material is: first by after the 1:4 dilution by weight proportion of silane coupling agent and ethanol, adds micron order aluminium nitride powder and nano level aluminium nitride powder and stirs 5 hours, carrying out ultrasonic wave subsequently and disperse 30 minutes, filter, for subsequent use after drying in 100 DEG C; Again by reactive thinner and epoxy resin by weight proportion 1:5 carry out agitation and dilution to mixing; Last add in the epoxy resin diluted the aluminium nitride powder mixed carry out being stirred well to mix after carry out ultrasonic wave and disperse 30 minutes; Finally add solidifying agent and Procuring 1 hour at room temperature, again 100 DEG C of solidifications 3 hours, described a kind of epoxide resin material adding nano silicon nitride Al filler can be obtained after solidification, wherein the effect of solidifying agent is used to solidify material, as long as its consumption can allow material cured, the material before solidification can also be added in mould a kind of epoxide resin material adding nano silicon nitride Al filler being cured acquisition and being shaped.
Material for the present embodiment arranges a control group, and its difference is part micron order aluminium nitride of 15 in the present embodiment and 3 parts of nano level aluminium nitride to change 18 micron order aluminium nitride into, and test two groups of materials, its test result is as follows:
The disruptive strength of control group material is about 57KV/mm; The disruptive strength of the present embodiment material is 60KV/mm.
The epoxy resin of pure micron order aluminium nitride is added from above two embodiments and test result visual contrast thereof, its disruptive strength of epoxy resin that the basis of adding micron order aluminium nitride is added nano level aluminium nitride is again obviously higher, more can be applicable to make transformer.
Above embodiment is only preferred implementations more of the present invention, but protection scope of the present invention is not limited in this.It should be appreciated by those skilled in the art that all any modification or partial replacements not deviating from spirit and scope of the invention are all within scope.
Claims (5)
1. add an epoxide resin material for nano silicon nitride Al filler, it is characterized in that; The raw material of this material comprises: micron order aluminium nitride powder, nano level aluminium nitride powder, silane coupling agent, epoxy resin, ethanol, reactive thinner, solidifying agent; Wherein, the weight part of micron order aluminium nitride powder is 15-25 part, the weight part of nano level aluminium nitride powder is 1-3 part, the weight part of silane coupling agent is 1-4 part, the weight part of epoxy resin is 68-83 part, silane coupling agent and ethanol ratio 1:4 by weight, reactive thinner and ring resin ratio 1:5 by weight.
2. a kind of epoxide resin material adding nano silicon nitride Al filler according to claim 1, is characterized in that; The mean particle size of described micron order aluminium nitride powder is at 5-20 micron.
3. a kind of epoxide resin material adding nano silicon nitride Al filler according to claim 1, is characterized in that; The mean particle size of described nano level aluminium nitride powder is in 20-50 nanometer.
4. add a preparation method for the epoxide resin material of nano silicon nitride Al filler, it is characterized in that; The method comprises the following steps: a., by after the 1:4 dilution by weight proportion of silane coupling agent and ethanol, adds micron order aluminium nitride powder and nano level aluminium nitride powder and stirs 5 hours, carrying out ultrasonic wave subsequently and disperse 30 minutes, filter, for subsequent use after drying in 100 DEG C; B. by reactive thinner and ring resin by weight proportion 1:5 carry out agitation and dilution to mixing; C. the mixture obtained final in step a and the mixture obtained final in step b are stirred well to and carry out ultrasonic wave after mixing and disperse 30 minutes; D. add solidifying agent to continue to stir, present room temperature Procuring has solidified a kind of material for making dry type transformer described in rear acquisition again at 100 DEG C of solidification 2-4 hour in 1-2 hour.
5. a kind of preparation method adding the epoxide resin material of nano silicon nitride Al filler according to claim 4, is characterized in that; In steps d, the material before solidification can be put into mould be cured, a kind of dry type transformer material with high strength of shaping after solidification, can be obtained.
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| CN201410432924.9A CN104262901A (en) | 2014-08-28 | 2014-08-28 | Epoxy resin material with nano aluminum nitride filler and manufacturing method thereof |
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| CN201410432924.9A CN104262901A (en) | 2014-08-28 | 2014-08-28 | Epoxy resin material with nano aluminum nitride filler and manufacturing method thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104693686A (en) * | 2015-03-19 | 2015-06-10 | 西安交通大学 | Preparation method for micro/nanostructure epoxy composite insulating material for GIS |
| CN105086364A (en) * | 2015-08-05 | 2015-11-25 | 苏州赛斯德工程设备有限公司 | Preparation method for epoxy-resin-based heat conduction and insulating material |
| CN105256256A (en) * | 2015-11-11 | 2016-01-20 | 江苏宇恒电气有限公司 | Production process of compression-resistant anti-corrosion expansion joint with thermally conductive insulating property |
| CN105733196A (en) * | 2016-05-06 | 2016-07-06 | 陈昌 | Heat conduction type composite material and preparation method thereof |
| CN105860437A (en) * | 2016-04-19 | 2016-08-17 | 西安思坦电气技术有限公司 | Micron-nano modified epoxy matrix temperature resisting, heat conducting and insulating composite and preparation method thereof |
| CN106589822A (en) * | 2016-12-13 | 2017-04-26 | 苏州赛斯德工程设备有限公司 | Flame-retardant and heat-conductive insulating material |
| CN106751506A (en) * | 2016-12-13 | 2017-05-31 | 苏州赛斯德工程设备有限公司 | A kind of high intensity heat-conducting insulation material |
| CN107121788A (en) * | 2017-06-27 | 2017-09-01 | 镇江万新光学眼镜有限公司 | A kind of refrigerant glasses of phase transformation and preparation method thereof |
| CN111777840A (en) * | 2020-07-14 | 2020-10-16 | 浙江大学 | Epoxy resin micro-nano blending composite material for packaging power electronic high-power device and preparation method thereof |
| CN116936154A (en) * | 2023-07-11 | 2023-10-24 | 镇江加勒智慧电力科技股份有限公司 | Flame-resistant waterproof high-strength bus duct |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104693686A (en) * | 2015-03-19 | 2015-06-10 | 西安交通大学 | Preparation method for micro/nanostructure epoxy composite insulating material for GIS |
| CN105086364A (en) * | 2015-08-05 | 2015-11-25 | 苏州赛斯德工程设备有限公司 | Preparation method for epoxy-resin-based heat conduction and insulating material |
| CN105256256A (en) * | 2015-11-11 | 2016-01-20 | 江苏宇恒电气有限公司 | Production process of compression-resistant anti-corrosion expansion joint with thermally conductive insulating property |
| CN105860437A (en) * | 2016-04-19 | 2016-08-17 | 西安思坦电气技术有限公司 | Micron-nano modified epoxy matrix temperature resisting, heat conducting and insulating composite and preparation method thereof |
| CN105733196A (en) * | 2016-05-06 | 2016-07-06 | 陈昌 | Heat conduction type composite material and preparation method thereof |
| CN106589822A (en) * | 2016-12-13 | 2017-04-26 | 苏州赛斯德工程设备有限公司 | Flame-retardant and heat-conductive insulating material |
| CN106751506A (en) * | 2016-12-13 | 2017-05-31 | 苏州赛斯德工程设备有限公司 | A kind of high intensity heat-conducting insulation material |
| CN107121788A (en) * | 2017-06-27 | 2017-09-01 | 镇江万新光学眼镜有限公司 | A kind of refrigerant glasses of phase transformation and preparation method thereof |
| CN111777840A (en) * | 2020-07-14 | 2020-10-16 | 浙江大学 | Epoxy resin micro-nano blending composite material for packaging power electronic high-power device and preparation method thereof |
| CN116936154A (en) * | 2023-07-11 | 2023-10-24 | 镇江加勒智慧电力科技股份有限公司 | Flame-resistant waterproof high-strength bus duct |
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