CN107266864A - It is a kind of for insulating materials of LED package and preparation method thereof - Google Patents
It is a kind of for insulating materials of LED package and preparation method thereof Download PDFInfo
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- CN107266864A CN107266864A CN201710620234.XA CN201710620234A CN107266864A CN 107266864 A CN107266864 A CN 107266864A CN 201710620234 A CN201710620234 A CN 201710620234A CN 107266864 A CN107266864 A CN 107266864A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/305—Polyamides or polyesteramides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
- H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C08L2201/02—Flame or fire retardant/resistant
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- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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Abstract
The invention discloses a kind of insulating materials for LED package, include the raw material of following parts by weight：30~50 parts of epoxy resin, 15~25 parts of vinylsiloxane rubber, 10~15 parts of polyamide, 3~6 parts of nano silicon, 4~5 parts of precipitated silica, 10~15 parts of polytetrafluoroethylene (PTFE), 12~17 parts of nanoscale hydrated alumina particles, 4~7 parts of triethyl group hexyl phosphoric acid, 6~10 parts of carborundum, 4~7 parts of carbon fiber, 3~7 parts of antimony oxide, 5~10 parts of curing agent, 2~3 parts of antioxidant, 3~6 parts of silane coupler, 7~15 parts of tackifier.The insulating materials for LED package improves the combination property of matrix while encapsulating material basic performance is met, and extends the service life of element.
Description
Technical field
The invention belongs to insulating materials technical field, and in particular to a kind of insulating materials for LED package and
Its preparation method.
Background technology
In electronics, information industry, many function element also need to be encapsulated into an entirety after finishing assembly, to carry
Its high performance and used life.As encapsulating material, the performance of element can neither be influenceed, also to play a part of protection.At present,
With the development of electronics, information industry and science and technology, people propose heat conduction, insulation, necessary mechanical property to encapsulating material
Can be with the requirement in terms of chemically-resistant environment.It can not be met simultaneously however, metal material and high polymer material are used alone
State performance.In the prior art, often both is used cooperatively, uses metal or inorganic filler to be filled into high magnification numbe low viscous
In degree, heat stable resin, encapsulating material mechanical property prepared by this method is not good, and material is firmly crisp, and slightly vibrations are easy for occurring
Crackle, and then influence the service life of element.
The content of the invention
The invention provides a kind of for insulating materials of LED package and preparation method thereof, the above-mentioned back of the body is solved
The problem of in scape technology, the insulating materials for LED package while encapsulating material basic performance is met,
The combination property of matrix is improved, extends the service life of element.
In order to solve the problem of prior art is present, adopt the following technical scheme that：
A kind of insulating materials for LED package, includes the raw material of following parts by weight：30~50 parts of epoxy resin, second
15~25 parts of alkenyl silicon rubber, 10~15 parts of polyamide, 3~6 parts of nano silicon, 4~5 parts of precipitated silica, poly- four
10~15 parts of PVF, 12~17 parts of nanoscale hydrated alumina particles, 4~7 parts of triethyl group hexyl phosphoric acid, carborundum 6~10
Part, 4~7 parts of carbon fiber, 3~7 parts of antimony oxide, 5~10 parts of curing agent, 2~3 parts of antioxidant, 3~6 parts of silane coupler,
7~15 parts of tackifier.
It is preferred that, the insulating materials for LED package includes the raw material of following parts by weight：Epoxy resin
32~47 parts, 18~24 parts of vinylsiloxane rubber, 11~13 parts of polyamide, 3.6~4.2 parts of nano silicon, the precipitation method it is white
4.2~4.8 parts of carbon black, 11~14 parts of polytetrafluoroethylene (PTFE), 14~16 parts of nanoscale hydrated alumina particles, triethyl group hexyl phosphoric acid
5~6 parts, 7~9 parts of carborundum, 5~6 parts of carbon fiber, 4~6 parts of antimony oxide, 7~9 parts of curing agent, antioxidant 2.1~2.7
Part, 4~5 parts of silane coupler, 9~11 parts of tackifier.
It is preferred that, the insulating materials for LED package includes the raw material of following parts by weight：Epoxy resin
39 parts, 21 parts of vinylsiloxane rubber, 12 parts of polyamide, 4 parts of nano silicon, 4.5 parts of precipitated silica, polytetrafluoroethylene (PTFE)
13 parts, 15 parts of nanoscale hydrated alumina particles, 5.7 parts of triethyl group hexyl phosphoric acid, 8 parts of carborundum, 5.2 parts of carbon fiber, three oxygen
Change 5 parts of two antimony, 8 parts of curing agent, 2.3 parts of antioxidant, 4.9 parts of silane coupler, 10 parts of tackifier.
It is preferred that, a diameter of 100~500nm of the nanoscale hydrated alumina particles.
It is preferred that, the tackifier are alkyl naphthalene resin, polyborosiloxane, the mixture of diphenyl silanediol.
It is preferred that, the length of the carbon fiber is 40~60mm, intensity 1500MPa, modulus 125GPa.
It is preferred that, the silicon carbide powder particle diameter is 50nm~40um.
A kind of method for preparing the insulating materials for LED package, comprises the following steps：
（1）By above-mentioned formula weigh epoxy resin, vinylsiloxane rubber, polyamide, nano silicon, precipitated silica,
Polytetrafluoroethylene (PTFE), nanoscale hydrated alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, solidification
Agent, antioxidant, silane coupler, tackifier, it is standby；
（2）Add to enter in banbury after epoxy resin, vinylsiloxane rubber, polyamide, polytetrafluoroethylene (PTFE) and tackifier are mixed
Row banburying, mixing temperature is 70 DEG C~80 DEG C, and mixing time is 15~25 minutes, obtains the first mixture；
（3）To step（2）Nano silicon, precipitated silica, nanoscale hydration oxygen are added in first mixture of gained
Change alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, curing agent, antioxidant, silane coupler, so
After be placed in reactor and carry out high-temperature stirring, heating-up temperature is 110~120 DEG C, and stir speed (S.S.) is 3000~4000r/min, is stirred
The time is mixed for 20~40min, the second mixture is obtained；
（4）By step（3）The second obtained mixture is discharged in double screw extruder, and injection is expressed into after batch mixing is melted completely
In machine, injection molding produces the insulating materials for LED package at 185 DEG C.
Compared with prior art, it has the advantages that the present invention：
（1）Insulating materials of the present invention for LED package with the addition of nanometer hydrated alumina particle, nanometer water
Close alumina particle and reduce the resistivity of material surface by pressing and being formed water adsorbed film, and then promote residual charge
Disappear, not only reduce resistivity, and with splendid fire resistance, not only ensure that the insulating materials higher use longevity
Life, and improve its safety in utilization；
（2）Insulating materials of the present invention for LED package, preparation method is easy, easily realizes, by adding
Enter carbon fiber, improve heat resistance, heat conductivility and the toughness of material, the prepared insulation for LED package
Material not only maintains original chemical environmental resistance energy, and with excellent mechanical property and heat conduction, insulating properties,
There is larger application prospect in Electronic Packaging field.
Embodiment
With reference to specific embodiment, the present invention is expanded on further.These embodiments be merely to illustrate the present invention and without
In limitation the scope of the present invention.
Embodiment 1
The present embodiment is related to a kind of insulating materials for LED package, includes the raw material of following parts by weight：Asphalt mixtures modified by epoxy resin
30 parts of fat, 15 parts of vinylsiloxane rubber, 10 parts of polyamide, 3 parts of nano silicon, 4 parts of precipitated silica, polytetrafluoroethylene (PTFE)
10 parts, 12 parts of nanoscale hydrated alumina particles, 4 parts of triethyl group hexyl phosphoric acid, 6 parts of carborundum, 4 parts of carbon fiber, three oxidation two
3 parts of antimony, 5 parts of curing agent, 2 parts of antioxidant, 3 parts of silane coupler, 7 parts of tackifier.
Wherein, a diameter of 100~500nm of the nanoscale hydrated alumina particles.
Wherein, the tackifier are alkyl naphthalene resin, polyborosiloxane, the mixture of diphenyl silanediol.
Wherein, the length of the carbon fiber is 40~60mm, intensity 1500MPa, modulus 125GPa.
Wherein, the silicon carbide powder particle diameter is 50nm~40um.
A kind of method for preparing the insulating materials for LED package, comprises the following steps：
（1）By above-mentioned formula weigh epoxy resin, vinylsiloxane rubber, polyamide, nano silicon, precipitated silica,
Polytetrafluoroethylene (PTFE), nanoscale hydrated alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, solidification
Agent, antioxidant, silane coupler, tackifier, it is standby；
（2）Add to enter in banbury after epoxy resin, vinylsiloxane rubber, polyamide, polytetrafluoroethylene (PTFE) and tackifier are mixed
Row banburying, mixing temperature is 70 DEG C DEG C, and mixing time is 15 minutes, obtains the first mixture；
（3）To step（2）Nano silicon, precipitated silica, nanoscale hydration oxygen are added in first mixture of gained
Change alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, curing agent, antioxidant, silane coupler, so
After be placed in reactor and carry out high-temperature stirring, heating-up temperature is 110 DEG C, and stir speed (S.S.) is 3000r/min, and mixing time is
20min, obtains the second mixture；
（4）By step（3）The second obtained mixture is discharged in double screw extruder, and injection is expressed into after batch mixing is melted completely
In machine, injection molding produces the insulating materials for LED package at 185 DEG C.
Embodiment 2
The present embodiment is related to a kind of insulating materials for LED package, includes the raw material of following parts by weight：Asphalt mixtures modified by epoxy resin
50 parts of fat, 25 parts of vinylsiloxane rubber, 15 parts of polyamide, 6 parts of nano silicon, 5 parts of precipitated silica, polytetrafluoroethylene (PTFE)
15 parts, 17 parts of nanoscale hydrated alumina particles, 7 parts of triethyl group hexyl phosphoric acid, 10 parts of carborundum, 7 parts of carbon fiber, three oxidation two
7 parts of antimony, 10 parts of curing agent, 3 parts of antioxidant, 6 parts of silane coupler, 15 parts of tackifier.
Wherein, a diameter of 100~500nm of the nanoscale hydrated alumina particles.
Wherein, the tackifier are alkyl naphthalene resin, polyborosiloxane, the mixture of diphenyl silanediol.
Wherein, the length of the carbon fiber is 40~60mm, intensity 1500MPa, modulus 125GPa.
Wherein, the silicon carbide powder particle diameter is 50nm~40um.
A kind of method for preparing the insulating materials for LED package, comprises the following steps：
（1）By above-mentioned formula weigh epoxy resin, vinylsiloxane rubber, polyamide, nano silicon, precipitated silica,
Polytetrafluoroethylene (PTFE), nanoscale hydrated alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, solidification
Agent, antioxidant, silane coupler, tackifier, it is standby；
（2）Add to enter in banbury after epoxy resin, vinylsiloxane rubber, polyamide, polytetrafluoroethylene (PTFE) and tackifier are mixed
Row banburying, mixing temperature is 80 DEG C, and mixing time is 25 minutes, obtains the first mixture；
（3）To step（2）Nano silicon, precipitated silica, nanoscale hydration oxygen are added in first mixture of gained
Change alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, curing agent, antioxidant, silane coupler, so
After be placed in reactor and carry out high-temperature stirring, heating-up temperature is 120 DEG C, and stir speed (S.S.) is 4000r/min, and mixing time is
40min, obtains the second mixture；
（4）By step（3）The second obtained mixture is discharged in double screw extruder, and injection is expressed into after batch mixing is melted completely
In machine, injection molding produces the insulating materials for LED package at 185 DEG C.
Embodiment 3
The present embodiment is related to a kind of insulating materials for LED package, includes the raw material of following parts by weight：Asphalt mixtures modified by epoxy resin
32 parts of fat, 18 parts of vinylsiloxane rubber, 11 parts of polyamide, 3.6 parts of nano silicon, 4.2 parts of precipitated silica, polytetrafluoro
11 parts of ethene, 14 parts of nanoscale hydrated alumina particles, 5 parts of triethyl group hexyl phosphoric acid, 7 parts of carborundum, 5 parts of carbon fiber, three oxygen
Change 4 parts of two antimony, 7 parts of curing agent, 2.1 parts of antioxidant, 4 parts of silane coupler, 9 parts of tackifier.
Wherein, a diameter of 100~500nm of the nanoscale hydrated alumina particles.
Wherein, the tackifier are alkyl naphthalene resin, polyborosiloxane, the mixture of diphenyl silanediol.
Wherein, the length of the carbon fiber is 40~60mm, intensity 1500MPa, modulus 125GPa.
Wherein, the silicon carbide powder particle diameter is 50nm~40um.
A kind of method for preparing the insulating materials for LED package, comprises the following steps：
（1）By above-mentioned formula weigh epoxy resin, vinylsiloxane rubber, polyamide, nano silicon, precipitated silica,
Polytetrafluoroethylene (PTFE), nanoscale hydrated alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, solidification
Agent, antioxidant, silane coupler, tackifier, it is standby；
（2）Add to enter in banbury after epoxy resin, vinylsiloxane rubber, polyamide, polytetrafluoroethylene (PTFE) and tackifier are mixed
Row banburying, mixing temperature is 73 DEG C, and mixing time is 18 minutes, obtains the first mixture；
（3）To step（2）Nano silicon, precipitated silica, nanoscale hydration oxygen are added in first mixture of gained
Change alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, curing agent, antioxidant, silane coupler, so
After be placed in reactor and carry out high-temperature stirring, heating-up temperature is 112 DEG C, and stir speed (S.S.) is 3200r/min, and mixing time is
25min, obtains the second mixture；
（4）By step（3）The second obtained mixture is discharged in double screw extruder, and injection is expressed into after batch mixing is melted completely
In machine, injection molding produces the insulating materials for LED package at 185 DEG C.
Embodiment 4
The present embodiment is related to a kind of insulating materials for LED package, includes the raw material of following parts by weight：Asphalt mixtures modified by epoxy resin
47 parts of fat, 24 parts of vinylsiloxane rubber, 13 parts of polyamide, 4.2 parts of nano silicon, 4.8 parts of precipitated silica, polytetrafluoro
14 parts of ethene, 16 parts of nanoscale hydrated alumina particles, 6 parts of triethyl group hexyl phosphoric acid, 9 parts of carborundum, 6 parts of carbon fiber, three oxygen
Change 6 parts of two antimony, 9 parts of curing agent, 2.7 parts of antioxidant, 5 parts of silane coupler, 11 parts of tackifier.
Wherein, a diameter of 100~500nm of the nanoscale hydrated alumina particles.
Wherein, the tackifier are alkyl naphthalene resin, polyborosiloxane, the mixture of diphenyl silanediol.
Wherein, the length of the carbon fiber is 40~60mm, intensity 1500MPa, modulus 125GPa.
Wherein, the silicon carbide powder particle diameter is 50nm~40um.
A kind of method for preparing the insulating materials for LED package, comprises the following steps：
（1）By above-mentioned formula weigh epoxy resin, vinylsiloxane rubber, polyamide, nano silicon, precipitated silica,
Polytetrafluoroethylene (PTFE), nanoscale hydrated alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, solidification
Agent, antioxidant, silane coupler, tackifier, it is standby；
（2）Add to enter in banbury after epoxy resin, vinylsiloxane rubber, polyamide, polytetrafluoroethylene (PTFE) and tackifier are mixed
Row banburying, mixing temperature is 75 DEG C, and mixing time is 20 minutes, obtains the first mixture；
（3）To step（2）Nano silicon, precipitated silica, nanoscale hydration oxygen are added in first mixture of gained
Change alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, curing agent, antioxidant, silane coupler, so
After be placed in reactor and carry out high-temperature stirring, heating-up temperature is 115 DEG C, and stir speed (S.S.) is 3500r/min, and mixing time is
30min, obtains the second mixture；
（4）By step（3）The second obtained mixture is discharged in double screw extruder, and injection is expressed into after batch mixing is melted completely
In machine, injection molding produces the insulating materials for LED package at 185 DEG C.
Embodiment 5
The present embodiment is related to a kind of insulating materials for LED package, includes the raw material of following parts by weight：Asphalt mixtures modified by epoxy resin
39 parts of fat, 21 parts of vinylsiloxane rubber, 12 parts of polyamide, 4 parts of nano silicon, 4.5 parts of precipitated silica, polytetrafluoroethyl-ne
13 parts of alkene, 15 parts of nanoscale hydrated alumina particles, 5.7 parts of triethyl group hexyl phosphoric acid, 8 parts of carborundum, 5.2 parts of carbon fiber, three
Aoxidize 5 parts of two antimony, 8 parts of curing agent, 2.3 parts of antioxidant, 4.9 parts of silane coupler, 10 parts of tackifier.
Wherein, a diameter of 100~500nm of the nanoscale hydrated alumina particles.
Wherein, the tackifier are alkyl naphthalene resin, polyborosiloxane, the mixture of diphenyl silanediol.
Wherein, the length of the carbon fiber is 40~60mm, intensity 1500MPa, modulus 125GPa.
Wherein, the silicon carbide powder particle diameter is 50nm~40um.
A kind of method for preparing the insulating materials for LED package, comprises the following steps：
（1）By above-mentioned formula weigh epoxy resin, vinylsiloxane rubber, polyamide, nano silicon, precipitated silica,
Polytetrafluoroethylene (PTFE), nanoscale hydrated alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, solidification
Agent, antioxidant, silane coupler, tackifier, it is standby；
（2）Add to enter in banbury after epoxy resin, vinylsiloxane rubber, polyamide, polytetrafluoroethylene (PTFE) and tackifier are mixed
Row banburying, mixing temperature is 77 DEG C, and mixing time is 22 minutes, obtains the first mixture；
（3）To step（2）Nano silicon, precipitated silica, nanoscale hydration oxygen are added in first mixture of gained
Change alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, curing agent, antioxidant, silane coupler, so
After be placed in reactor and carry out high-temperature stirring, heating-up temperature is 117 DEG C, and stir speed (S.S.) is 3800r/min, and mixing time is
35min, obtains the second mixture；
（4）By step（3）The second obtained mixture is discharged in double screw extruder, and injection is expressed into after batch mixing is melted completely
In machine, injection molding produces the insulating materials for LED package at 185 DEG C.
The specific embodiment of the present invention is described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring the substantive content of the present invention.
Claims (8)
1. a kind of insulating materials for LED package, it is characterised in that include the raw material of following parts by weight：Asphalt mixtures modified by epoxy resin
30~50 parts of fat, 15~25 parts of vinylsiloxane rubber, 10~15 parts of polyamide, 3~6 parts of nano silicon, precipitation method hard charcoal
Black 4~5 parts, 10~15 parts of polytetrafluoroethylene (PTFE), 12~17 parts of nanoscale hydrated alumina particles, triethyl group hexyl phosphoric acid 4~7
Part, 6~10 parts of carborundum, 4~7 parts of carbon fiber, 3~7 parts of antimony oxide, 5~10 parts of curing agent, 2~3 parts of antioxidant, silicon
3~6 parts of alkane coupling agent, 7~15 parts of tackifier.
2. the insulating materials according to claim 1 for LED package, it is characterised in that including following weight
The raw material of part：32~47 parts of epoxy resin, 18~24 parts of vinylsiloxane rubber, 11~13 parts of polyamide, nano silicon 3.6
~4.2 parts, 4.2~4.8 parts of precipitated silica, 11~14 parts of polytetrafluoroethylene (PTFE), nanoscale hydrated alumina particles 14~16
Part, 5~6 parts of triethyl group hexyl phosphoric acid, 7~9 parts of carborundum, 5~6 parts of carbon fiber, 4~6 parts of antimony oxide, curing agent 7~9
Part, 2.1~2.7 parts of antioxidant, 4~5 parts of silane coupler, 9~11 parts of tackifier.
3. the insulating materials according to claim 1 for LED package, it is characterised in that including following weight
The raw material of part：39 parts of epoxy resin, 21 parts of vinylsiloxane rubber, 12 parts of polyamide, 4 parts of nano silicon, precipitation method hard charcoal
Black 4.5 parts, 13 parts of polytetrafluoroethylene (PTFE), 15 parts of nanoscale hydrated alumina particles, 5.7 parts of triethyl group hexyl phosphoric acid, carborundum 8
Part, 5.2 parts of carbon fiber, 5 parts of antimony oxide, 8 parts of curing agent, 2.3 parts of antioxidant, 4.9 parts of silane coupler, tackifier 10
Part.
4. the insulating materials according to claim 1 for LED package, it is characterised in that the nanoscale water
Close a diameter of 100~500nm of alumina particle.
5. the insulating materials according to claim 1 for LED package, it is characterised in that the tackifier are
Alkyl naphthalene resin, polyborosiloxane, the mixture of diphenyl silanediol.
6. the insulating materials according to claim 1 for LED package, it is characterised in that the carbon fiber
Length is 40~60mm, intensity 1500MPa, modulus 125GPa.
7. the insulating materials according to claim 1 for LED package, it is characterised in that the carborundum powder
Last particle diameter is 50nm~40um.
8. a kind of method for preparing the insulating materials for being used for LED package described in any one of claim 1~7, its feature
It is, comprises the following steps：
（1）By above-mentioned formula weigh epoxy resin, vinylsiloxane rubber, polyamide, nano silicon, precipitated silica,
Polytetrafluoroethylene (PTFE), nanoscale hydrated alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, solidification
Agent, antioxidant, silane coupler, tackifier, it is standby；
（2）Add to enter in banbury after epoxy resin, vinylsiloxane rubber, polyamide, polytetrafluoroethylene (PTFE) and tackifier are mixed
Row banburying, mixing temperature is 70 DEG C~80 DEG C, and mixing time is 15~25 minutes, obtains the first mixture；
（3）To step（2）Nano silicon, precipitated silica, nanoscale hydration oxygen are added in first mixture of gained
Change alumina particles, triethyl group hexyl phosphoric acid, carborundum, carbon fiber, antimony oxide, curing agent, antioxidant, silane coupler, so
After be placed in reactor and carry out high-temperature stirring, heating-up temperature is 110~120 DEG C, and stir speed (S.S.) is 3000~4000r/min, is stirred
The time is mixed for 20~40min, the second mixture is obtained；
（4）By step（3）The second obtained mixture is discharged in double screw extruder, and injection is expressed into after batch mixing is melted completely
In machine, injection molding produces the insulating materials for LED package at 185 DEG C.
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| CN201710620234.XA CN107266864A (en) | 2017-07-26 | 2017-07-26 | It is a kind of for insulating materials of LED package and preparation method thereof |
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| CN201710620234.XA CN107266864A (en) | 2017-07-26 | 2017-07-26 | It is a kind of for insulating materials of LED package and preparation method thereof |
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| CN108219477A (en) * | 2018-01-23 | 2018-06-29 | 合肥峰腾节能科技有限公司 | A kind of new insulation material and preparation method thereof |
| CN108257924A (en) * | 2017-12-31 | 2018-07-06 | 安徽普发照明有限公司 | For the potting resin of high-cooling property semiconductor light emitting component |
| CN108912603A (en) * | 2018-06-13 | 2018-11-30 | 合肥市旺友门窗有限公司 | A kind of use for electronic products high-performance package material and preparation method thereof |
| CN109354828A (en) * | 2018-10-30 | 2019-02-19 | 徐州晶迪电子有限公司 | A kind of encapsulating material for light emitting diode |
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| CN101790563A (en) * | 2007-08-31 | 2010-07-28 | 道康宁东丽株式会社 | Curable epoxy resin composition and cured product thereof |
| CN102382422A (en) * | 2010-09-01 | 2012-03-21 | 北京科化新材料科技有限公司 | Epoxy resin composition with hydrated alumina |
| CN105860441A (en) * | 2016-06-20 | 2016-08-17 | 河南省亚安绝缘材料厂有限公司 | Thermally conductive insulation material and preparation method thereof |
| CN105924952A (en) * | 2016-05-16 | 2016-09-07 | 南通市东方塑胶有限公司 | Heat conductive and insulating composite material for LED and preparation method thereof |
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| CN101790563A (en) * | 2007-08-31 | 2010-07-28 | 道康宁东丽株式会社 | Curable epoxy resin composition and cured product thereof |
| CN102382422A (en) * | 2010-09-01 | 2012-03-21 | 北京科化新材料科技有限公司 | Epoxy resin composition with hydrated alumina |
| CN105924952A (en) * | 2016-05-16 | 2016-09-07 | 南通市东方塑胶有限公司 | Heat conductive and insulating composite material for LED and preparation method thereof |
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| CN108257924A (en) * | 2017-12-31 | 2018-07-06 | 安徽普发照明有限公司 | For the potting resin of high-cooling property semiconductor light emitting component |
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| CN108219477A (en) * | 2018-01-23 | 2018-06-29 | 合肥峰腾节能科技有限公司 | A kind of new insulation material and preparation method thereof |
| CN108912603A (en) * | 2018-06-13 | 2018-11-30 | 合肥市旺友门窗有限公司 | A kind of use for electronic products high-performance package material and preparation method thereof |
| CN109354828A (en) * | 2018-10-30 | 2019-02-19 | 徐州晶迪电子有限公司 | A kind of encapsulating material for light emitting diode |
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