CN116936154A - Flame-resistant waterproof high-strength bus duct - Google Patents
Flame-resistant waterproof high-strength bus duct Download PDFInfo
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- CN116936154A CN116936154A CN202310845040.5A CN202310845040A CN116936154A CN 116936154 A CN116936154 A CN 116936154A CN 202310845040 A CN202310845040 A CN 202310845040A CN 116936154 A CN116936154 A CN 116936154A
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- aluminum nitride
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical group Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 61
- 239000011256 inorganic filler Substances 0.000 claims abstract description 30
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 30
- 239000004020 conductor Substances 0.000 claims abstract description 23
- 239000002131 composite material Substances 0.000 claims abstract description 19
- 239000003822 epoxy resin Substances 0.000 claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 18
- 229920000642 polymer Polymers 0.000 claims abstract description 18
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910000861 Mg alloy Inorganic materials 0.000 claims abstract description 16
- OWXLRKWPEIAGAT-UHFFFAOYSA-N [Mg].[Cu] Chemical group [Mg].[Cu] OWXLRKWPEIAGAT-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000003063 flame retardant Substances 0.000 claims abstract description 16
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims description 21
- 229910010272 inorganic material Inorganic materials 0.000 claims description 15
- 239000011147 inorganic material Substances 0.000 claims description 15
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 9
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 9
- 229920001568 phenolic resin Polymers 0.000 claims description 9
- 239000005011 phenolic resin Substances 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 claims description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 230000009970 fire resistant effect Effects 0.000 claims description 7
- 229910000077 silane Inorganic materials 0.000 claims description 7
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000292 calcium oxide Substances 0.000 claims description 6
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000000395 magnesium oxide Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 230000004048 modification Effects 0.000 claims description 6
- 238000012986 modification Methods 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 239000004594 Masterbatch (MB) Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 239000000314 lubricant Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 230000009467 reduction Effects 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims description 3
- 239000012745 toughening agent Substances 0.000 claims description 3
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 3
- 238000001291 vacuum drying Methods 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 230000002411 adverse Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000026058 directional locomotion Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
- H01B7/282—Preventing penetration of fluid, e.g. water or humidity, into conductor or cable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/29—Protection against damage caused by extremes of temperature or by flame
- H01B7/295—Protection against damage caused by extremes of temperature or by flame using material resistant to flame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/42—Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction
- H01B7/428—Heat conduction
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/14—Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The application discloses a flame-resistant waterproof high-strength bus duct, which comprises at least one bus duct unit, wherein each bus duct unit comprises at least one conductor core, an insulating layer is correspondingly arranged on the outer wall of each conductor core, a waterproof layer is correspondingly arranged on the outer wall of each insulating layer, flame-resistant layers are correspondingly arranged on the outer sides of all conductor cores of each bus duct unit, the conductor cores are made of high-strength copper alloy, and the thickness of the conductor cores is between 0.6 and 1.5 millimeters; the insulating layer is modified aluminum nitride filled high-heat-conductivity epoxy resin, the flame-retardant layer is modified inorganic filler polymer composite material, and the high-strength copper alloy is copper-magnesium alloy. The conductor core of the flame-resistant waterproof high-strength bus duct is made of high-strength copper alloy, has the advantages of high tensile strength and high conductivity, and also has the advantage of low production cost, the strength of the bus duct can be remarkably improved, the waterproof layer can improve the waterproof performance, and adverse effects of water vapor on the conductor core can be effectively prevented.
Description
Technical Field
The application relates to the field of bus ducts, in particular to a flame-retardant waterproof high-strength bus duct.
Background
With the rapid development of cities, high-rise buildings are more and more, the electricity load of the buildings is increased sharply, and the original electric wires and cables are gradually replaced by bus ducts with large capacity, convenient branching, convenient bundling management and the like due to small capacity, inconvenient branching, inconvenient bundling management and the like. The bus duct is widely used for heavy-point projects such as electric power transmission main lines of fire-fighting equipment and main lines of fire-fighting emergency equipment, for example, important projects such as hotels, airports, subways and the like, so that the safety and stability of the bus duct product are of great importance. However, the bus duct has some drawbacks, for example, because the cluster arrangement between the bus ducts generally generates larger heat, the problem of heat dissipation of the bus duct is a big problem which has been bothered to the developer of the bus duct, if the bus duct does not have the necessary heat dissipation performance, once the high temperature generated by the connection conductive bars in the bus duct cannot be dissipated in time, the fire prevention potential safety hazard is likely to be brought. Some materials of the bus duct are easy to absorb water and wet, so that good insulating performance cannot be ensured. Some bus ducts have insufficient strength of conductor cores, which affects the application range, and therefore, a flame-retardant waterproof high-strength bus duct needs to be designed.
Disclosure of Invention
In order to overcome the defects in the prior art, the flame-retardant waterproof high-strength bus duct is provided.
The application is realized by the following scheme:
the utility model provides a fire-resistant waterproof high strength bus duct, includes at least one bus duct unit, includes at least one conductor core in each bus duct unit, is equipped with the insulating layer in the outer wall of conductor core corresponds, is equipped with the waterproof layer in the outer wall of insulating layer corresponds, is equipped with the fire-resistant layer in the outside of all conductor cores of each bus duct unit corresponds, the conductor core is high strength copper alloy, and its thickness is between 0.6-1.5 millimeter;
the insulating layer is modified aluminum nitride filled high-heat-conductivity epoxy resin, the mass percentage of modified aluminum nitride in the modified aluminum nitride filled high-heat-conductivity epoxy resin is 40-60%, and the modified aluminum nitride in the modified aluminum nitride filled high-heat-conductivity epoxy resin is modified by adopting silane coupling on the surface of aluminum nitride;
the flame-retardant layer is a modified inorganic filler polymer composite material, the modified inorganic filler in the modified inorganic filler polymer composite material is an inorganic material surface modified, the inorganic material comprises alumina, silica, calcium oxide and magnesia, and the polymer material in the modified inorganic filler polymer composite material is phenolic resin.
The high-strength copper alloy is copper-magnesium alloy, the content of magnesium element in the copper-magnesium alloy is 15-20wt%, the tensile strength reduction rate of the copper-magnesium alloy is within 8% when the use temperature is below 300 ℃, the tensile strength of the copper-magnesium alloy is more than 580MPa, and the conductivity of the copper-magnesium alloy is more than 82% IACS.
The specific steps of silane coupling modification of the aluminum nitride surface are as follows: dispersing aluminum nitride in absolute ethyl alcohol, stirring for 20-30 minutes to obtain an aluminum nitride absolute ethyl alcohol solution, adding a silane coupling agent into the aluminum nitride absolute ethyl alcohol solution, heating to 60-70 ℃ for stirring reaction for 5-6 hours, standing for 12-18 hours at room temperature, flushing, suction-filtering, placing into a vacuum drying oven at 70 ℃, and crushing to obtain modified aluminum nitride.
The aluminum nitride is nano-sized aluminum nitride particles, and the mass ratio of the silane coupling agent to the aluminum nitride absolute ethyl alcohol solution is 1:8-12.
The preparation method of the modified aluminum nitride filled high-heat-conductivity epoxy resin comprises the following steps: epoxy A, B component was prepared according to 5:3, adding the dried modified aluminum nitride into the mixture, fully and uniformly stirring the mixture, and carrying out ultrasonic dispersion treatment for 30 minutes to obtain the modified aluminum nitride filled high-heat-conductivity epoxy resin.
The preparation method of the modified inorganic filler polymer composite material comprises the following steps: heating phenolic resin to 70 ℃, and adding a stabilizer; continuously heating to 80 ℃, and adding a toughening agent; continuously heating to 90 ℃, and adding modified inorganic filler; continuously heating to 110 ℃, and adding a lubricant; and continuously heating to 120 ℃, discharging to a cooler, and cooling to obtain the master batch of the modified inorganic filler polymer composite material.
The mass ratio of the modified inorganic filler to the phenolic resin is 2-3:10.
the preparation method of the modified inorganic filler comprises the following steps: drying the inorganic material, crushing and grinding to 800 meshes, adding a silane coupling agent, stirring uniformly, heating to 130-150 ℃, and keeping the temperature for reaction for 0.5-1 hour.
The mass ratio of the aluminum oxide, the silicon dioxide, the calcium oxide and the magnesium oxide in the inorganic material is 4:4:2:2.
the mass ratio of the silane coupling agent to the inorganic material is 1-3:100.
the beneficial effects of the application are as follows:
1. the conductor core of the flame-resistant waterproof high-strength bus duct is made of high-strength copper alloy, has the advantages of high tensile strength and high conductivity, and also has the advantage of low production cost, the strength of the bus duct can be remarkably improved, the waterproof layer can improve the waterproof performance, and adverse effects of water vapor on the conductor core can be effectively prevented.
2. According to the flame-resistant waterproof high-strength bus duct, the flame-resistant layer is the modified inorganic filler polymer composite material, so that the thermal stability of the material can be improved, and the combustion risk can be effectively reduced on the basis of keeping other properties of the material.
3. The insulating layer of the flame-retardant waterproof high-strength bus duct can improve the insulating performance of the bus duct, has higher heat conductivity than conventional materials, and can ensure heat dissipation and the insulativity of the whole bus duct.
Detailed Description
The preferred embodiments of the present application are further described below:
the utility model provides a fire-resistant waterproof high strength bus duct, includes at least one bus duct unit, includes at least one conductor core in each bus duct unit, is equipped with the insulating layer in the outer wall of conductor core corresponds, is equipped with the waterproof layer in the outer wall of insulating layer corresponds, is equipped with the fire-resistant layer in the outside of all conductor cores of each bus duct unit corresponds, the conductor core is high strength copper alloy, and its thickness is between 0.6-1.5 millimeter;
the insulating layer is modified aluminum nitride filled high-heat-conductivity epoxy resin, the mass percentage of modified aluminum nitride in the modified aluminum nitride filled high-heat-conductivity epoxy resin is 40-60%, and the modified aluminum nitride in the modified aluminum nitride filled high-heat-conductivity epoxy resin is modified by adopting silane coupling on the surface of aluminum nitride;
the flame-retardant layer is a modified inorganic filler polymer composite material, the modified inorganic filler in the modified inorganic filler polymer composite material is an inorganic material surface modified, the inorganic material comprises alumina, silica, calcium oxide and magnesia, and the polymer material in the modified inorganic filler polymer composite material is phenolic resin.
The high-strength copper alloy is copper-magnesium alloy, the content of magnesium element in the copper-magnesium alloy is 15-20wt%, the tensile strength reduction rate of the copper-magnesium alloy is within 8% when the use temperature is below 300 ℃, the tensile strength of the copper-magnesium alloy is more than 580MPa, and the conductivity of the copper-magnesium alloy is more than 82% IACS.
The specific steps of silane coupling modification of the aluminum nitride surface are as follows: dispersing aluminum nitride in absolute ethyl alcohol, stirring for 20-30 minutes to obtain an aluminum nitride absolute ethyl alcohol solution, adding a silane coupling agent into the aluminum nitride absolute ethyl alcohol solution, heating to 60-70 ℃ for stirring reaction for 5-6 hours, standing for 12-18 hours at room temperature, flushing, suction-filtering, placing into a vacuum drying oven at 70 ℃, and crushing to obtain modified aluminum nitride. The aluminum nitride is nano-sized aluminum nitride particles, and the mass ratio of the silane coupling agent to the aluminum nitride absolute ethyl alcohol solution is 1:8-12. The preparation method of the modified aluminum nitride filled high-heat-conductivity epoxy resin comprises the following steps: epoxy A, B component was prepared according to 5:3, adding the dried modified aluminum nitride into the mixture, fully and uniformly stirring the mixture, and carrying out ultrasonic dispersion treatment for 30 minutes to obtain the modified aluminum nitride filled high-heat-conductivity epoxy resin.
Because the compatibility between the inorganic particles and the organic resin is poor, the application adopts the silane coupling agent to carry out surface modification on the aluminum nitride, and can improve the interfacial binding force between the inorganic particles and the resin. The silane coupling modification reaction process of the aluminum nitride surface is stable, and the yield of the modified aluminum nitride is higher. The modified aluminum nitride filled high-heat-conductivity epoxy resin prepared by the preparation method has excellent insulating property and good heat conductivity, and the heat conductivity can reach 1.13W/(m.K) through testing. With the gradual increase of the filling amount of the modified aluminum nitride in the modified aluminum nitride filled high heat conduction epoxy resin, the volume resistivity and the surface resistivity are also gradually increased, and when the filling rate of the modified aluminum nitride reaches 60%, the volume resistivity is 6.1 x 10 12 Omega-m, surface resistivity of 7.9 x 10 13 Omega.m. In a pure resin matrix, the main source of the conductive carriers is the impurity ion conductance in the resin, and the conductive carriers are uniformly dispersed in the matrix resinThe modified aluminum nitride filler of (2) may hinder the directional movement of carriers in the resin matrix. With increasing aluminum nitride filler content, carrier migration is limited, resulting in an increase in the volume and surface resistivity of the composite.
The preparation method of the modified inorganic filler polymer composite material comprises the following steps: heating phenolic resin to 70 ℃, and adding a stabilizer; continuously heating to 80 ℃, and adding a toughening agent; continuously heating to 90 ℃, and adding modified inorganic filler; continuously heating to 110 ℃, and adding a lubricant; and continuously heating to 120 ℃, discharging to a cooler, and cooling to obtain the master batch of the modified inorganic filler polymer composite material. The mass ratio of the modified inorganic filler to the phenolic resin is 2-3:10. the preparation method of the modified inorganic filler comprises the following steps: drying the inorganic material, crushing and grinding to 800 meshes, adding a silane coupling agent, stirring uniformly, heating to 130-150 ℃, and keeping the temperature for reaction for 0.5-1 hour. The mass ratio of the aluminum oxide, the silicon dioxide, the calcium oxide and the magnesium oxide in the inorganic material is 4:4:2:2, the mass ratio of the silane coupling agent to the inorganic material is 1-3:100.
the modified inorganic filler polymer composite material prepared by the application not only has excellent thermal stability and effectively reduces fire risk, but also has good mechanical property, can provide good support for bus ducts, and has tensile yield strength, compression resistance, bending property and the like superior to those of related national standards.
While the application has been described and illustrated in considerable detail, it should be understood that modifications and equivalents to the above-described embodiments will become apparent to those skilled in the art, and that such modifications and improvements may be made without departing from the spirit of the application.
Claims (10)
1. The utility model provides a fire-resistant waterproof high strength bus duct, includes at least one bus duct unit, includes at least one conductor core in every bus duct unit the outer wall of conductor core corresponds and is equipped with the insulating layer the outer wall of insulating layer corresponds and is equipped with the waterproof layer all conductor core outsides of every bus duct unit correspond and are equipped with fire-resistant layer, its characterized in that: the conductor core is made of high-strength copper alloy, and the thickness of the conductor core is between 0.6 and 1.5 millimeters;
the insulating layer is modified aluminum nitride filled high-heat-conductivity epoxy resin, the mass percentage of modified aluminum nitride in the modified aluminum nitride filled high-heat-conductivity epoxy resin is 40-60%, and the modified aluminum nitride in the modified aluminum nitride filled high-heat-conductivity epoxy resin is modified by adopting silane coupling on the surface of aluminum nitride;
the flame-retardant layer is a modified inorganic filler polymer composite material, the modified inorganic filler in the modified inorganic filler polymer composite material is an inorganic material surface modified, the inorganic material comprises alumina, silica, calcium oxide and magnesia, and the polymer material in the modified inorganic filler polymer composite material is phenolic resin.
2. The flame-retardant and waterproof high-strength bus duct of claim 1, wherein: the high-strength copper alloy is copper-magnesium alloy, the content of magnesium element in the copper-magnesium alloy is 15-20wt%, the tensile strength reduction rate of the copper-magnesium alloy is within 8% when the use temperature is below 300 ℃, the tensile strength of the copper-magnesium alloy is more than 580MPa, and the conductivity of the copper-magnesium alloy is more than 82% IACS.
3. The flame-retardant waterproof high-strength bus duct of claim 1, wherein the specific steps of silane coupling modification of the aluminum nitride surface are as follows: dispersing aluminum nitride in absolute ethyl alcohol, stirring for 20-30 minutes to obtain an aluminum nitride absolute ethyl alcohol solution, adding a silane coupling agent into the aluminum nitride absolute ethyl alcohol solution, heating to 60-70 ℃ for stirring reaction for 5-6 hours, standing for 12-18 hours at room temperature, flushing, suction-filtering, placing into a vacuum drying oven at 70 ℃, and crushing to obtain modified aluminum nitride.
4. A fire-resistant and waterproof high-strength bus duct as set forth in claim 3, wherein: the aluminum nitride is nano-sized aluminum nitride particles, and the mass ratio of the silane coupling agent to the aluminum nitride absolute ethyl alcohol solution is 1:8-12.
5. The flame-retardant waterproof high-strength bus duct of claim 1, wherein the preparation method of the modified aluminum nitride filled high-heat-conductivity epoxy resin is as follows: epoxy A, B component was prepared according to 5:3, adding the dried modified aluminum nitride into the mixture, fully and uniformly stirring the mixture, and carrying out ultrasonic dispersion treatment for 30 minutes to obtain the modified aluminum nitride filled high-heat-conductivity epoxy resin.
6. The flame-retardant waterproof high-strength bus duct of claim 1, wherein the preparation method of the modified inorganic filler polymer composite material is as follows: heating phenolic resin to 70 ℃, and adding a stabilizer; continuously heating to 80 ℃, and adding a toughening agent; continuously heating to 90 ℃, and adding modified inorganic filler; continuously heating to 110 ℃, and adding a lubricant; and continuously heating to 120 ℃, discharging to a cooler, and cooling to obtain the master batch of the modified inorganic filler polymer composite material.
7. The flame-retardant and waterproof high-strength bus duct of claim 6, wherein: the mass ratio of the modified inorganic filler to the phenolic resin is 2-3:10.
8. the flame-retardant waterproof high-strength bus duct of claim 6, wherein the modified inorganic filler is prepared by the following steps: drying the inorganic material, crushing and grinding to 800 meshes, adding a silane coupling agent, stirring uniformly, heating to 130-150 ℃, and keeping the temperature for reaction for 0.5-1 hour.
9. The flame-retardant and waterproof high-strength bus duct of claim 8, wherein: the mass ratio of the aluminum oxide, the silicon dioxide, the calcium oxide and the magnesium oxide in the inorganic material is 4:4:2:2.
10. the flame-retardant and waterproof high-strength bus duct of claim 8, wherein: the mass ratio of the silane coupling agent to the inorganic material is 1-3:100.
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| US20100012375A1 (en) * | 2008-07-18 | 2010-01-21 | Jur Arthur J | Electrical busway and offset coupling assembly therefor |
| CN104262901A (en) * | 2014-08-28 | 2015-01-07 | 广东狮能电气股份有限公司 | Epoxy resin material with nano aluminum nitride filler and manufacturing method thereof |
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