CN104260521A - 一种柔性电路板基材用双向拉伸聚丙烯保护膜及其制备方法 - Google Patents
一种柔性电路板基材用双向拉伸聚丙烯保护膜及其制备方法 Download PDFInfo
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Abstract
本发明公开了一种柔性电路板基材用双向拉伸聚丙烯保护膜及其制备方法,所述保护膜是由内表层、中间层和外表层组成的三层结构,所述中间层是由抗静电母料、柔软母料、均聚聚丙烯组成;内表层是由抗粘连母料、柔软母料、抗静电母料、均聚聚丙烯组成;外表层是由抗粘连母料、柔软母料、均聚聚丙烯组成;所述柔软母料是由乙烯丙烯共聚物、乙烯丁烯共聚物、丙烯丁烯共聚物、低密度聚乙烯、线性低密度聚乙烯组成。本发明的保护膜具有很好的柔软度,并且物理性能、光学性能、印刷性能优异,抗撕裂性能好,静电小,最大限度的保护基材,加工工艺简单等优点。
Description
技术领域
本发明涉及一种薄膜,具体涉及一种柔性电路板基材用双向拉伸聚丙烯保护膜及其制备方法。
背景技术
柔性电路板多以聚酰亚胺膜片为基材经过一系列复杂工序制成的一种具有高度可靠性、绝佳的可挠性印刷电路板,其具有配线密度高、重量轻、厚度薄的特点。
聚酰亚胺作为一种特种工程材料,是综合性能最佳的有机高分子材料之一,使用聚酰亚胺基材制作柔性电路板,需要聚酰亚胺基材表面平整、光洁且无杂质,这就需要生产聚酰亚胺基材后,使用保护膜对其保护。
目前用于聚酰亚胺基材的保护膜主要是聚乙烯膜,其在使用中存在以下缺点:
1、聚乙烯保护膜在使用一段时间以后两端易翅起,出现这种现象的主要原因是聚乙烯保护膜的耐热性较差,在与所保护型材在粘贴过程中,其拉伸程度较大,在粘附以后,遇高温环境,出现了不必要的回缩现象;
2、聚乙烯保护膜剥离困难,在进行剥离时,保护膜无法有效剥离,这是让用户非常头痛的问题,究其原因就是聚乙烯保护膜母带所使用的材质太软,强度较低,无法承受剥离时的拉力,在剥离时出现断裂现象,导致撕破或部分未剥离。
另外除了聚乙烯薄膜,还有少量的双向拉伸聚酯薄膜或普通双向拉伸聚丙烯薄膜也被用于保护膜领域,但是由于双向拉伸聚酯薄膜和普通双向拉伸聚丙烯薄膜的挺度高,薄膜不柔软,与被保护的基材的服帖性不好,且在粘附于基材表面后,对基材的卷绕有一定的影响,卷绕后基材不平整。
发明内容
为避免上述现有技术所存在的不足之处,本发明的目的在于提供一种晶点、杂质少,透明度高,印刷性能和抗撕裂性优异的柔性电路板基材用双向拉伸聚丙烯保护薄膜及其制备方法。其具有普通双向拉伸聚丙烯薄膜优异的物理机械性能以及光学性能,并且使用过程中不会产生翘曲、回缩等现象,其拉伸强度大,抗撕裂性能优异,不会产生剥离和卷绕困难。
本发明为实现其目的采用如下技术方案:
一种柔性电路板基材用双向拉伸聚丙烯保护膜,所述保护膜是由内表层、中间层和外表层组成的三层结构,其特征在于:所述中间层是由下述组分按质量百分比组成:抗静电母料1%~3%、柔软母料10%~30%、均聚聚丙烯为余量;
所述内表层是由下述组分按质量百分比组成:抗粘连母料3%~5%、柔软母料5% ~10%、抗静电母料1%~3%、均聚聚丙烯为余量;
所述外表层是由下述组分按质量百分比组成:抗粘连母料3%~5%、柔软母料5% ~10%、均聚聚丙烯为余量;
所述柔软母料是由下述组分按质量百分比组成: 乙烯丙烯共聚物3%~15%、乙烯丁烯共聚物3%~15%、丙烯丁烯共聚物3%~15%、低密度聚乙烯10%~25%、线性低密度聚乙烯为余量。
进一步,所述外表层与内表层的厚度均为1~2μm,内表层为电晕处理层,外表层与柔性电路板基材贴附、分离。
进一步,所述的抗静电母料为单硬酸甘油脂、N,N-二羟乙基十八胺、脂肪醇聚醚酰胺或均聚聚丙烯混炼物。
进一步,所述的抗粘连母料是由二氧化硅和载体均聚聚丙烯组成,其中二氧化硅的质量占抗粘连母料总质量百分比为10-50%,所述二氧化硅的粒径为3.2um。
本发明的另一目的是提供柔性电路板基材用双向拉伸聚丙烯保护膜的制备方法,其步骤如下:
a、将中间层原料抗静电母料1%~3%、柔软母料10%~30%、均聚聚丙烯为余量进行混合、干燥后送到主挤出机中加热成熔融状态;将外表层原料抗粘连母料3%~5%、柔软母料5% ~10%、均聚聚丙烯为余量进行混合后在一台辅助挤出机中加热熔融;将内表层原料抗粘连母料3%~5%、柔软母料5% ~10%、抗静电母料1%~3%、均聚聚丙烯为余量进行混合后在另一台辅助挤出机中加热熔融;然后将上述三层原料的熔体分别经过400目过滤网过滤后,在三层结构模头中汇合挤出成膜片,其模头温度为242℃;
b、将模片用压缩空气将其贴附到20℃激冷辊上急冷形成铸片,之后进入水浴冷却,用压缩空气对冷却后的铸片进行除水;
c、铸片经过120℃~140℃预热,在120℃~130℃下纵向拉伸,拉伸倍率为4.5~5.0;
d、再以170℃~180℃进行预热,在153~160℃下进行横向拉伸,拉伸倍率为8.0~9.0,并于155℃~165℃热定型成薄膜;
e、薄膜经过风冷进入牵引系统展平,并对其内表面进行电晕处理,电晕处理后薄膜表面张力达到42达因,最终收卷即为双向拉伸聚丙烯保护膜。
本发明的有益效果:
1、本发明制备的薄膜,由于柔软母料的添加,使得薄膜晶点少、杂质少,柔软度好,抗撕裂性优异等特点;
2、由于模片在激冷辊上的骤冷使薄膜结晶度,透明度高;
3、由于对薄膜的内表面进行电晕处理,从而使薄膜表面具有42达因表面张力,薄膜具有良好的印刷效果。
4、本发明工艺制作的薄膜能使被保护的产品在生产加工、运输、贮存和使用过程中不受污染、腐蚀、划伤、保护原有的光洁亮泽的表面,从而提高产品的质量及市场竞争力。
5、本发明制备的薄膜主要是由柔软母料和均聚聚丙烯构成的三层共挤而成,其耐热性好,在与所保护型材在粘贴过程中遇高温环境,不会产生回缩现象;
6、由于本发明采用三层共挤而成,并通过双向拉伸形成,薄膜的强度高,在剥离时则不会出现断裂现象。
具体实施方法
以下结合实施例对本发明作进一步详细说明,并不因此将本发明限制在所述的实施例范围中。
下面实施例中没有特别说明的均为质量百分比。
实施例一:
a、将乙烯丙烯共聚物3%、乙烯丁烯共聚物3%、丙烯丁烯共聚物5%、低密度聚乙烯25%、线性低密度聚乙烯为余量进行混合得柔软母料;
将二氧化硅15%和余量为载体均聚聚丙烯进行混合得抗粘连母料。
b、将中间层原料抗静电母料单硬酸甘油脂1%、柔软母料30%、均聚聚丙烯为余量进行混合、干燥后送到主挤出机中加热成熔融状态;将外表层原料抗粘连母料3%、柔软母料5%、均聚聚丙烯为余量进行混合后在一台辅助挤出机中加热熔融;将内表层原料抗粘连母料3%、柔软母料10%、抗静电母料单硬酸甘油脂3%、均聚聚丙烯为余量进行混合后在另一台辅助挤出机中加热熔融;然后将上述三层原料的熔体分别经过400目过滤网过滤后,在三层结构模头中汇合挤出成膜片,其模头温度为242℃;
c、将模片用压缩空气将其贴附到20℃激冷辊上急冷形成铸片,之后进入水浴冷却,用压缩空气对冷却后的铸片进行除水;
d、铸片经过120℃预热,在120℃下纵向拉伸,拉伸倍率为4.5;
e、再以170℃进行预热,在153下进行横向拉伸,拉伸倍率为8.0,并于155℃热定型成薄膜;
g、薄膜经过风冷进入牵引系统展平,并对其内表面进行电晕处理和收卷,即为双向拉伸聚丙烯保护膜。
实施例二:
a、将乙烯丙烯共聚物15%、乙烯丁烯共聚物15%、丙烯丁烯共聚物3%、低密度聚乙烯10%、线性低密度聚乙烯为余量进行混合得柔软母料;
将二氧化20%和余量为载体均聚聚丙烯进行混合得抗粘连母料。
b、将中间层原料抗静电母料N,N-二羟乙基十八胺3%、柔软母料10%、均聚聚丙烯为余量进行混合、干燥后送到主挤出机中加热成熔融状态;将外表层原料抗粘连母料5%、柔软母料5%、均聚聚丙烯为余量进行混合后在一台辅助挤出机中加热熔融;将内表层原料抗粘连母料5%、柔软母料5%、抗静电母料N,N-二羟乙基十八胺1%、均聚聚丙烯为余量进行混合后在另一台辅助挤出机中加热熔融;然后将上述三层原料的熔体分别经过400目过滤网过滤后,在三层结构模头中汇合挤出成膜片,其模头温度为242℃;
c、将模片用压缩空气将其贴附到20℃激冷辊上急冷形成铸片,之后进入水浴冷却,用压缩空气对冷却后的铸片进行除水;
d、铸片经过140℃预热,在130℃下纵向拉伸,拉伸倍率为5.0;
e、再以180℃进行预热,在160℃下进行横向拉伸,拉伸倍率为9.0,并于165℃热定型成薄膜;
g、薄膜经过风冷进入牵引系统展平,并对其内表面进行电晕处理和收卷,即为双向拉伸聚丙烯保护膜。
实施例三:
a、将乙烯丙烯共聚物10%、乙烯丁烯共聚物10%、丙烯丁烯共聚物10%、低密度聚乙烯15%、线性低密度聚乙烯为余量进行混合得柔软母料;
将二氧化硅30%和余量为载体均聚聚丙烯进行混合得抗粘连母料。
b、将中间层原料抗静电母料脂肪醇聚醚酰胺2%、柔软母料20%、均聚聚丙烯为余量进行混合、干燥后送到主挤出机中加热成熔融状态;将外表层原料抗粘连母料4%、柔软母料8%、均聚聚丙烯为余量进行混合后在一台辅助挤出机中加热熔融;将内表层原料抗粘连母料4%、柔软母料7%、抗静电母料脂肪醇聚醚酰胺2%、均聚聚丙烯为余量进行混合后在另一台辅助挤出机中加热熔融;然后将上述三层原料的熔体分别经过400目过滤网过滤后,在三层结构模头中汇合挤出成膜片,其模头温度为242℃;
c、将模片用压缩空气将其贴附到20℃激冷辊上急冷形成铸片,之后进入水浴冷却,用压缩空气对冷却后的铸片进行除水;
d、铸片经过130℃预热,在125℃下纵向拉伸,拉伸倍率为4.5;
e、再175℃进行预热,在160℃下进行横向拉伸,拉伸倍率为8.5,并于160℃热定型成薄膜;
g、薄膜经过风冷进入牵引系统展平,并对其内表面进行电晕处理和收卷,即为双向拉伸聚丙烯保护膜。
将上述实施例1-3制成的双向拉伸聚丙烯保护膜,沿纵向取长250mm、宽100mm试样,将试样两表面及长400mm、宽200mm不锈钢平板上均匀撒布一层滑石粉,将试样沿纵向对折,首端重叠在一起(形成一个扁环状),在此状态下停放3min,用分度值为1mm的刻度尺测量试样两边相对于平板的最大高度,此高度即表征了薄膜的柔软度。实施例1-3制成的薄膜柔软度测试数值分别为表1、表2、表3。
表1:实施例1生产的柔性电路板基材用双向拉伸聚丙烯保护膜柔软度数值
厚度d,μm | 柔软度,mm |
15.0 | 12.0 |
18.0 | 16.0 |
25.0 | 25.0 |
35.0 | 32.0 |
表2:实施例2生产的柔性电路板基材用双向拉伸聚丙烯保护膜柔软度数值
厚度d,μm | 柔软度,mm |
15.0 | 13.0 |
18.0 | 15.0 |
25.0 | 22.0 |
35.0 | 30.0 |
表3:实施例3生产的柔性电路板基材用双向拉伸聚丙烯保护膜柔软度数值
厚度d,μm | 柔软度,mm |
15.0 | 12.0 |
18.0 | 14.0 |
25.0 | 20.0 |
35.0 | 28.0 |
以上实施例并非仅限于本发明的保护范围,所有基于本发明的基本思想而进行修改或变动的都属于本发明的保护范围。
Claims (5)
1.一种柔性电路板基材用双向拉伸聚丙烯保护膜,所述保护膜是由内表层、中间层和外表层组成的三层结构,其特征在于:所述中间层是由下述组分按质量百分比组成:抗静电母料1%~3%、柔软母料10%~30%、均聚聚丙烯为余量;
所述内表层是由下述组分按质量百分比组成:抗粘连母料3%~5%、柔软母料5% ~10%、抗静电母料1%~3%、均聚聚丙烯为余量;
所述外表层是由下述组分按质量百分比组成:抗粘连母料3%~5%、柔软母料5% ~10%、均聚聚丙烯为余量;
所述柔软母料是由下述组分按质量百分比组成: 乙烯丙烯共聚物3%~15%、乙烯丁烯共聚物3%~15%、丙烯丁烯共聚物3%~15%、低密度聚乙烯10%~25%、线性低密度聚乙烯为余量。
2.根据权利要求1所述的柔性电路板基材用双向拉伸聚丙烯保护膜,其特征在于:所述外表层与内表层的厚度均为1~2μm,内表层为电晕处理层,外表层与柔性电路板基材贴附、分离。
3.根据权利要求1所述的柔性电路板基材用双向拉伸聚丙烯保护膜,其特征在于:所述的抗静电母料为单硬酸甘油脂、N,N-二羟乙基十八胺、脂肪醇聚醚酰胺或均聚聚丙烯混炼物。
4.根据权利要求1所述的柔性电路板基材用双向拉伸聚丙烯保护膜,其特征在于:所述的抗粘连母料是由二氧化硅和载体均聚聚丙烯组成,其中二氧化硅的质量占抗粘连母料总质量百分比为10-50%,所述二氧化硅的粒径为3.2um。
5.一种制备如权利要求1所述的柔性电路板基材用双向拉伸聚丙烯保护膜的方法,其特征在于:步骤如下:
a、将中间层原料抗静电母料1%~3%、柔软母料10%~30%、均聚聚丙烯为余量进行混合、干燥后送到主挤出机中加热成熔融状态;将外表层原料抗粘连母料3%~5%、柔软母料5% ~10%、均聚聚丙烯为余量进行混合后在一台辅助挤出机中加热熔融;将内表层原料抗粘连母料3%~5%、柔软母料5% ~10%、抗静电母料1%~3%、均聚聚丙烯为余量进行混合后在另一台辅助挤出机中加热熔融;然后将上述三层原料的熔体分别经过400目过滤网过滤后,在三层结构模头中汇合挤出成膜片,其模头温度为242℃;
b、将模片用压缩空气将其贴附到20℃激冷辊上急冷形成铸片,之后进入水浴冷却,用压缩空气对冷却后的铸片进行除水;
c、铸片经过120℃~140℃预热,在120℃~130℃下纵向拉伸,拉伸倍率为4.5~5.0;
d、再以170℃~180℃进行预热,在153~160℃下进行横向拉伸,拉伸倍率为8.0~9.0,并于155℃~165℃热定型成薄膜;
e、薄膜经过风冷进入牵引系统展平,并对其内表面进行电晕处理和收卷,即为双向拉伸聚丙烯保护膜。
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