CN104260009B - A kind of substrate binding clamping and positioning device - Google Patents
A kind of substrate binding clamping and positioning device Download PDFInfo
- Publication number
- CN104260009B CN104260009B CN201410417289.7A CN201410417289A CN104260009B CN 104260009 B CN104260009 B CN 104260009B CN 201410417289 A CN201410417289 A CN 201410417289A CN 104260009 B CN104260009 B CN 104260009B
- Authority
- CN
- China
- Prior art keywords
- substrate
- pressing plate
- locating dowel
- metal shell
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Connection Of Plates (AREA)
Abstract
The present invention discloses a kind of substrate binding clamping and positioning device, comprise the pedestal (1) of bearing metal shell (4) and the pressing plate (7) that substrate (6) is exerted pressure, the outer pin (5) of biserial of metal shell (4) is distributed in the both sides of pedestal (1) downwards, pedestal (1) top is provided with locating dowel (2) pressing plate plate face and is provided with the locating hole (8) cooperatively interacting with locating dowel, and pressing plate plate face is provided with the one group of pressure head (9) that is pressed in substrate end face; The cylinder of locating dowel is provided with external screw thread, locating dowel (2) is arranged with the adjusting nut (11) with its threaded engagement, and the locating dowel (2) between adjusting nut (11) and pressing plate (7) is arranged with spring (12); Metal shell is placed on pedestal, and spacing with coordinating pressing plate of locating hole by locating dowel, can avoid substrate and metal shell in bonding process, to produce relative displacement, externally pin does not impact; Can adjust pressing plate by adjusting bolt and be applied to the pressure on substrate, reach the object that regulates bonding pressure, ensure the adhesive strength of substrate and metal shell.
Description
Technical field
The present invention relates to electronic product and manufacture field, specifically a kind of bonding clamping and positioning device for microelectronic product substrate and shell.
Background technology
Known, substrate binding technique refers to the mode by adopting specific adhesives, and substrate and metal shell base are firmly linked together, and reaches the object of highly reliable interconnection assembling, is one of basic packaging technology of microelectronic product. For guaranteeing compactness, the fastness of substrate binding interconnection, in bonding solidification process, generally need between substrate and shell, apply fixing pressure, with reach solidify after bonding interface smooth, even, without reliability requirements such as cavities. At present, generally by the method for clamping of spring clip, substrate and metal shell are exerted pressure, complete bonding, but this method of clamping can cause bonded adhesives between substrate and metal shell, relativity shift can occur in curing process, cause the outer pin length of bonding between substrate and metal shell stem inconsistent, in the time that outer pin is long, also easily there is toppling over phenomenon, in addition, because the spring degree of spring clip can change along with the increase of life cycle, thereby cause bonding pressure inconsistent, have a strong impact on the adhesive strength after bonded adhesives solidifies.
Summary of the invention
The object of the present invention is to provide a kind of substrate binding clamping and positioning device, this device can avoid substrate and metal shell in bonding process, to produce relative displacement, and externally pin does not impact; And can regulate bonding pressure, ensure the adhesive strength of substrate and metal shell.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of substrate binding clamping and positioning device, substrate binding is in metal shell, described device comprises the pedestal of bearing metal shell and to the stressed pressing plate of undercoat, the outer pin of the biserial of metal shell is distributed in the both sides of pedestal downwards, and pedestal top is provided with locating dowel; Described pressing plate plate face is provided with the locating hole cooperatively interacting with locating dowel, and pressing plate plate face is provided with the one group of pressure head that is pressed in substrate end face.
Further, described pressure head comprises by four jiaos of four of distributing of rectangle.
Further, described pressure head is stepped cylindrical.
Further, the cylinder of described locating dowel is provided with external screw thread, and locating dowel is arranged with the adjusting nut with its threaded engagement, and the locating dowel between adjusting nut and pressing plate is arranged with spring.
Further, the plate face of described pressing plate is provided with peep hole.
The invention has the beneficial effects as follows, metal shell is placed on pedestal, and spacing with coordinating pressing plate of locating hole by locating dowel, can avoid substrate and metal shell in bonding process, to produce relative displacement, externally pin does not impact; Can adjust pressing plate by adjusting bolt and be applied to the pressure on substrate, reach the object that regulates bonding pressure, ensure the adhesive strength of substrate and metal shell.
Brief description of the drawings
Below in conjunction with drawings and Examples, the present invention is further described:
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of pedestal in Fig. 1;
Fig. 3 is the top view of Fig. 2;
Fig. 4 is the assembling schematic diagram of pedestal in Fig. 1, metal shell and substrate;
Fig. 5 is the top view of Fig. 4;
Fig. 6 is the structural representation of center platen of the present invention;
Fig. 7 is the A-A cutaway view of Fig. 6.
Detailed description of the invention
As shown in Figure 1, the invention provides a kind of substrate binding clamping and positioning device, comprise the pedestal 1 of bearing metal shell 4 and the pressing plate 7 that substrate 6 is exerted pressure, shown in Fig. 2 and Fig. 3, the two ends at pedestal 1 top are respectively equipped with locating dowel 2, and the cylinder of locating dowel 2 is provided with external screw thread 3; Shown in Fig. 4 and Fig. 5, metal shell 4 is positioned on pedestal 1, and the outer pin 5 of the biserial of metal shell 4 is distributed in the both sides of pedestal 1 downwards, bonding by bonded adhesives between substrate 6 and metal shell 4; Shown in Fig. 6 and Fig. 7, the plate face of described pressing plate 7 is provided with the locating hole 8 cooperatively interacting with locating dowel 2, by coordinating spacing pressing plate 7 of locating dowel 8 and locating hole 2, can avoid substrate 6 and metal shell 4 in bonding process, to produce relative displacement, externally pin 5 does not impact, pressing plate 7 plate faces are provided with four pressure heads 9 for being pressed in substrate 6 end faces, pressure head 9 is stepped cylindrical, and form rectangular configuration at pressing plate plate face, pressing plate 7 is set on pedestal 1, and pressure head 9 is pressed on substrate 6; Locating dowel 2 is arranged with the adjusting nut 11 with its threaded engagement, and the locating dowel between adjusting nut 11 and pressing plate 7 is arranged with spring 12; The plate face of pressing plate 7 is also provided with peep hole 10.
When actual use, can check that the pressure head 9 of pressing plate 7 is pressed in the situation on substrate 6 by peep hole 10, after pressure head 9 is pressed on substrate 6 suitably, sheathed spring 12 in locating dowel 2, then the adjusting nut 11 of screwing on, according to the bonding requirements of different substrates and metal shell, by torque spanner, adjusting nut 11 is regulated, thereby can control exactly bonding pressure, the adhesive strength of substrate and metal shell is met the demands, spring 12 plays cushioning effect, avoids stress to directly act on substrate and causes damage.
The above, be only preferred embodiment of the present invention, not the present invention done to any pro forma restriction; Any those of ordinary skill in the art, do not departing from technical solution of the present invention scope situation, all can utilize method and the technology contents of above-mentioned announcement to make many possible variations and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations. Therefore, every content that does not depart from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, be equal to replacements, equivalence change and modify, all still belong to technical solution of the present invention protect scope in.
Claims (1)
1. a substrate binding clamping and positioning device, substrate binding is in metal shell, it is characterized in that, described device comprises the pedestal (1) of bearing metal shell (4) and the pressing plate (7) that substrate (6) is exerted pressure, the outer pin (5) of biserial of metal shell (4) is distributed in the both sides of pedestal (1) downwards, and pedestal (1) top is provided with locating dowel (2); Described pressing plate (7) plate face is provided with the locating hole (8) cooperatively interacting with locating dowel (2), and pressing plate (7) plate face is provided with the one group of pressure head (9) that is pressed in substrate (6) end face; Described pressure head (9) comprises by four jiaos of four of distributing of rectangle; Described pressure head (9) is stepped cylindrical; The cylinder of described locating dowel (2) is provided with external screw thread, locating dowel (2) is arranged with the adjusting nut (11) with its threaded engagement, and the locating dowel (2) between adjusting nut (11) and pressing plate (7) is arranged with spring (12); The plate face of described pressing plate is provided with peep hole (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410417289.7A CN104260009B (en) | 2014-08-23 | 2014-08-23 | A kind of substrate binding clamping and positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410417289.7A CN104260009B (en) | 2014-08-23 | 2014-08-23 | A kind of substrate binding clamping and positioning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104260009A CN104260009A (en) | 2015-01-07 |
| CN104260009B true CN104260009B (en) | 2016-05-11 |
Family
ID=52151653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410417289.7A Active CN104260009B (en) | 2014-08-23 | 2014-08-23 | A kind of substrate binding clamping and positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104260009B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731572A (en) * | 2017-10-10 | 2018-02-23 | 中国振华（集团）新云电子元器件有限责任公司 | A kind of chip conducting polymer aluminum capacitor solidifies fixture |
| CN106048826B (en) * | 2016-08-10 | 2019-08-13 | 沈全松 | Combine expansion reed |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106763043B (en) * | 2017-03-09 | 2018-11-16 | 江西合力泰科技有限公司 | A kind of IFS class bio-identification scheme attaching tooling jig |
| CN107165914A (en) * | 2017-07-17 | 2017-09-15 | 青岛科技大学 | A kind of fixing device for installing suitable for various material and size bonding piece |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85106110A (en) * | 1984-10-19 | 1986-10-01 | 株式会社东芝 | The device that is used for producing the semiconductor devices |
| CN85108782A (en) * | 1984-12-05 | 1986-10-08 | 洛迦诺电子工业股份有限公司 | The spark erosion machine that stationary work-table and reducible electrolyte working container are arranged |
| CN87207075U (en) * | 1987-05-19 | 1988-02-03 | 金华铁路工务段劳动服务公司 | Rolling slat window with bearing guide |
| CN87107124A (en) * | 1986-11-14 | 1988-05-25 | 库特·赫尔德·法布里肯特 | Make the method and apparatus of composite wood sheet |
| CN1054334A (en) * | 1990-01-23 | 1991-09-04 | 菲利浦光灯制造公司 | The semiconductor device and the manufacture method thereof that contain pedestal |
| US5451284A (en) * | 1992-12-25 | 1995-09-19 | Nippon Kokan Koji Kabushiki Kaisha | Self-mobile work vehicle moveable through pipeline and method and apparatus for lining interconnecting branch pipe using the vehicle |
| US5620065A (en) * | 1994-08-01 | 1997-04-15 | Rexnord Corporation | Spring set brake |
| US5687464A (en) * | 1995-12-20 | 1997-11-18 | Marshall; Perry C. | Apparatus for pulling golf club shafts from club heads |
| US5695593A (en) * | 1995-10-04 | 1997-12-09 | Lsi Logic Corporation | Method of centering a high pressure lid seal |
| US5833109A (en) * | 1996-02-22 | 1998-11-10 | Lg Electronics, Inc. | Pinch roller driving device for video recording and reproducing system |
| CN202076242U (en) * | 2010-12-23 | 2011-12-14 | 大连艾科科技开发有限公司 | Clamp applicable to sealing cover of dual in-line package shell |
| CN203503624U (en) * | 2013-08-08 | 2014-03-26 | 昆明物理研究所 | Infrared detector wafer adhesive clamp |
-
2014
- 2014-08-23 CN CN201410417289.7A patent/CN104260009B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85106110A (en) * | 1984-10-19 | 1986-10-01 | 株式会社东芝 | The device that is used for producing the semiconductor devices |
| CN85108782A (en) * | 1984-12-05 | 1986-10-08 | 洛迦诺电子工业股份有限公司 | The spark erosion machine that stationary work-table and reducible electrolyte working container are arranged |
| CN87107124A (en) * | 1986-11-14 | 1988-05-25 | 库特·赫尔德·法布里肯特 | Make the method and apparatus of composite wood sheet |
| CN87207075U (en) * | 1987-05-19 | 1988-02-03 | 金华铁路工务段劳动服务公司 | Rolling slat window with bearing guide |
| CN1054334A (en) * | 1990-01-23 | 1991-09-04 | 菲利浦光灯制造公司 | The semiconductor device and the manufacture method thereof that contain pedestal |
| US5451284A (en) * | 1992-12-25 | 1995-09-19 | Nippon Kokan Koji Kabushiki Kaisha | Self-mobile work vehicle moveable through pipeline and method and apparatus for lining interconnecting branch pipe using the vehicle |
| US5620065A (en) * | 1994-08-01 | 1997-04-15 | Rexnord Corporation | Spring set brake |
| US5695593A (en) * | 1995-10-04 | 1997-12-09 | Lsi Logic Corporation | Method of centering a high pressure lid seal |
| US5687464A (en) * | 1995-12-20 | 1997-11-18 | Marshall; Perry C. | Apparatus for pulling golf club shafts from club heads |
| US5833109A (en) * | 1996-02-22 | 1998-11-10 | Lg Electronics, Inc. | Pinch roller driving device for video recording and reproducing system |
| CN202076242U (en) * | 2010-12-23 | 2011-12-14 | 大连艾科科技开发有限公司 | Clamp applicable to sealing cover of dual in-line package shell |
| CN203503624U (en) * | 2013-08-08 | 2014-03-26 | 昆明物理研究所 | Infrared detector wafer adhesive clamp |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106048826B (en) * | 2016-08-10 | 2019-08-13 | 沈全松 | Combine expansion reed |
| CN107731572A (en) * | 2017-10-10 | 2018-02-23 | 中国振华（集团）新云电子元器件有限责任公司 | A kind of chip conducting polymer aluminum capacitor solidifies fixture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104260009A (en) | 2015-01-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104260009B (en) | A kind of substrate binding clamping and positioning device | |
| EP1780587A4 (en) | Liquid crystal sealant and liquid crystal display cell utilizing the same | |
| WO2008136352A1 (en) | Method for bonding semiconductor wafers and method for manufacturing semiconductor device | |
| JP2015153811A5 (en) | ||
| JP2015224143A5 (en) | ||
| CN201925305U (en) | Prestressed indicating bolt | |
| CN204921618U (en) | Locking fastening combination screw | |
| CN103657952A (en) | Multi-point dispensing device combined to a dispenser | |
| SG11201909929UA (en) | Soldering device and method for producing a solder connection, using base and pressure plates and a stop device | |
| CN203297285U (en) | Fastening bolt | |
| KR200471380Y1 (en) | A dispenser fixing unit | |
| CN108356503B (en) | Pressing device | |
| JP3229362U (en) | Ultrasonic sensor | |
| WO2008140033A1 (en) | Lid or case for sealing package and method for manufacturing the lid or the case | |
| US20150373845A1 (en) | Electronic component mounting structure and method of manufacturing electronic component mounting structure | |
| CN209189133U (en) | Piezoelectric type glue dispensing valve actuating module and piezoelectric type glue dispensing valve | |
| CN201266265Y (en) | Apparatus for mounting component in cavity | |
| CN201863104U (en) | Core shift normal plane polishing clamp | |
| CN211359437U (en) | Glue supply device for hot melt glue adhesion label | |
| US20140053986A1 (en) | Stamping head used for pressing anisotropic conductive film onto ceramic substrate | |
| CN208315538U (en) | A kind of becket pressure maintaining solidification fixture of biological fingerprint class FPC | |
| CN106555796A (en) | A kind of torquer alinco assembled device and method | |
| CN206425182U (en) | A kind of point glue equipment | |
| JP2010118483A5 (en) | Substrate holding member, bonding apparatus and bonding method | |
| WO2015162406A3 (en) | Production of airframe components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |