CN104252565A - Method for automatically adding gold-plated leads in jointed boards - Google Patents

Method for automatically adding gold-plated leads in jointed boards Download PDF

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Publication number
CN104252565A
CN104252565A CN201410500148.1A CN201410500148A CN104252565A CN 104252565 A CN104252565 A CN 104252565A CN 201410500148 A CN201410500148 A CN 201410500148A CN 104252565 A CN104252565 A CN 104252565A
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China
Prior art keywords
jigsaw
lead
leads
gold plated
jointed
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CN201410500148.1A
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Chinese (zh)
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CN104252565B (en
Inventor
钟利东
何欢
李志东
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Shenzhen Fastprint Circuit Tech Co Ltd
Yixing Silicon Valley Electronic Technology Co Ltd
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Shenzhen Fastprint Circuit Tech Co Ltd
Yixing Silicon Valley Electronic Technology Co Ltd
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Priority to CN201410500148.1A priority Critical patent/CN104252565B/en
Publication of CN104252565A publication Critical patent/CN104252565A/en
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses a method for automatically adding gold-plated leads in jointed boards. The method comprises the following steps of (A) determining the position of a jointed board unit and acquiring relevant parameter values of the jointed board unit; (B) calculating sizes of jointed board edges of the jointed boards required to be added with the gold-plated leads; (C) adding the gold-plated leads in the jointed board edges of the jointed boards on a production board as needed; and (D) performing avoidance treatment on the leads when the leads pass through board edge samples. By the method, the positions of the jointed boards can be automatically determined, corresponding parameters are acquired, the leads can be automatically added in the jointed boards after parameters are calculated, avoidance treatment can be performed on positions added with the leads, accurate positioning can be realized, the problems that the leads are added in the jointed boards excessively or some portions requiring the leads are not added with the leads during manual operation are solved, the projection production time is greatly saved due to the fact that the leads are added in the jointed boards automatically, and the work quality and the work efficiency are improved. The method for automatically adding the gold-plated leads in the jointed boards can be widely applied to the field of PCBs (printed circuit boards).

Description

A kind of method of gold plated lead in automatic interpolation jigsaw
Technical field
The present invention relates to PCB field, the method for gold plated lead in especially a kind of automatic interpolation jigsaw.
Background technology
Add lead-in wire when graphic designs due to gold-plated product needed and carry out conducting, traditional method on production jigsaw, manually adds conducting lead-in wire after jigsaw, the lead-in wire added in plate surrounding equally is also manual operation, the method consuming time longer, add lead-in wire with All other routes graphs coincide, leak problems such as adding.
Summary of the invention
In order to solve the problems of the technologies described above, the object of the invention is: a kind of high efficiency smart is provided, reduces the method for gold plated lead in the automatic interpolation jigsaw of error rate.
The technical solution adopted in the present invention is: a kind of method of gold plated lead in automatic interpolation jigsaw, includes following steps:
A, judge the position of jigsaw unit, obtain the related parameter values of jigsaw unit;
B, the required size of adding gold plated lead distance jigsaw limit of calculating;
C, on request gold plated lead is increased to the jigsaw limit of each jigsaw producing plate;
D, when exist lead-in wire by edges of boards sample time, to lead-in wire avoid process.
Further, the related parameter values in described steps A includes the coordinate figure of four limit lead-in wires of jigsaw.
Further, the coordinate figure of four limit lead-in wires of jigsaw is utilized to calculate required size of adding gold plated lead distance jigsaw limit in described step B.
Further, described gold plated lead keeps there is certain distance with jigsaw limit.
Further, in described step C, add gold-plated rectangle copper billet for internal layer, skin adds copper bar.
Further, in described step C, also add lead-in wire and pad by command mode.
Further, in described step C, the process of interpolation pad includes the setting to pad size, shape, coordinate parameters.
Further, described step is all by InCAM software simulating.
Further, in described step D, clip_area order is utilized to avoid process to lead-in wire.
The invention has the beneficial effects as follows: this method goes out jigsaw position by automatic decision, obtain corresponding parameter, and automatically add lead-in wire after being calculated by parameter, and process can be avoided to the position of adding lead-in wire, accurate location can be realized, and when preventing manual hand manipulation, there is the problem of adding and leaking interpolation lead-in wire more, add lead-in wire by robotization simultaneously and the Production Time of each order was foreshortened to 1 ~ 2 minute from 10 ~ 15 minutes, greatly save engineering Production Time, improve work quality and efficiency.
Accompanying drawing explanation
Fig. 1 is the flow chart of steps of the inventive method.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described further:
With reference to Fig. 1, a kind of method of gold plated lead in automatic interpolation jigsaw, includes following steps:
A, judge the position of jigsaw unit, obtain the related parameter values of jigsaw unit;
B, the required size of adding gold plated lead distance jigsaw limit of calculating;
C, on request gold plated lead is increased to the jigsaw limit of each jigsaw producing plate;
D, when exist lead-in wire by edges of boards sample time, to lead-in wire avoid process.
Be further used as preferred embodiment, the related parameter values in described steps A includes the coordinate figure of four limit lead-in wires of jigsaw.
In InCAM software, first by DO_INFO order, judge the position of jigsaw unit, obtain the coordinate figure of each jigsaw unit of jigsaw, specific instructions is as follows:
DO_INFO -t step -e $JOB/pnl -d REPEAT,units=mm
Get following information:
set gREPEATstep = ('set' 'set' 'set' 'set' 'set' 'set' 'set' 'set' 'set' 'set' )
set gREPEATxa = ('18.50001' '18.50001' '94.500005' '94.500005' '170.5' '170.5' '246.5' '246.5' '322.5' '322.5')
set gREPEATya = ('254' '496' '254' '496' '254' '496' '254' '496' '254' '496')
set gREPEATangle = ('90' '90' '90' '90' '90' '90' '90' '90' '90' '90')
set gREPEATmirror = ('no' 'no' 'no' 'no' 'no' 'no' 'no' 'no' 'no' 'no')
set gREPEATflip = ('no' 'no' 'no' 'no' 'no' 'no' 'no' 'no' 'no' 'no')
set gREPEATxmin = ('18.50001' '18.50001' '94.500005' '94.500005' '170.5' '170.5' '246.5' '246.5' '322.5' '322.5')
set gREPEATymin = ('14' '256' '14' '256' '14' '256' '14' '256' '14' '256)
set gREPEATxmax = ('92.50001' '92.50001' '168.5' '168.5' '244.5' '244.5' '320.5' '320.5' '396.5' '396.5')
set gREPEATymax = ('254' '496' '254' '496' '254' '496' '254' '496' '254' '496' )
Be further used as preferred embodiment, utilize the coordinate figure (gREPEATxmin, gREPEATymin, gREPEATxmax, gREPEATymax) of four limit lead-in wires of jigsaw in described step B, calculate required size of adding gold plated lead distance jigsaw limit.
Be further used as preferred embodiment, described gold plated lead keeps there is certain distance with jigsaw limit by engineering discipline requirement, and account form can with reference to following expression:
set step_xmin1 = `echo "scale = 6; $gREPEATxmin[$i] - 0.75" | bc`
set step_xmax1 = `echo "scale = 6; $gREPEATxmax[$i] + 0.75" | bc`
set step_ymin1 = `echo "scale = 6; $gREPEATymin[$i] - 0.75" | bc`
set step_ymax1 = `echo "scale = 6; $gREPEATymax[$i] + 0.75" | bc`
Be further used as preferred embodiment, in described step C, add gold-plated rectangle copper billet for internal layer, skin adds copper bar.
Be further used as preferred embodiment, in described step C, also add lead-in wire and pad by command mode.
Be further used as preferred embodiment, in described step C, the process of interpolation pad includes the setting to pad size, shape, coordinate parameters, and concrete setting can refer to following expression:
COM add_line,symbol=s1000,polarity=positive,attributes=no,xs=$step_xmin1,ys=$step_ymin1,xe=$step_xmax1,ye= $step_ymin1,bus_num_lines=0, bus_dist_by=pitch,bus_distance=0,bus_reference=left
All to open figure when adding line and pad, working lining is set, such as so below program
COM display_layer,name=l02t,display=yes
COM work_layer,name=l02t
Be further used as preferred embodiment, in described step D, utilize clip_area order to avoid process to lead-in wire.
Whether the characteristic impedance that edges of boards sample (test coupon) is used to measure with TDR (Time Domain Reflectometer) pcb board produced meets design requirement.When existence lead-in wire is by needing during edges of boards sample to carry out avoiding process, make added figure can not have influence on the figure of sample; Be specially and use clip_area order to process:
COM clip_area_end,layers_mode=affected_layers,layer=,area=manual,area_type=rectangle,inout=inside,contour_cut=no,margin=0,feat_types=line\;pad\;surface\;arc\;text
More than that better enforcement of the present invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art can also make all equivalents or replacement under the prerequisite without prejudice to spirit of the present invention, and these equivalent distortion or replacement are all included in the application's claim limited range.

Claims (9)

1. automatically add a method for gold plated lead in jigsaw, it is characterized in that: include following steps:
A, judge the position of jigsaw unit, obtain the related parameter values of jigsaw unit;
B, the required size of adding gold plated lead distance jigsaw limit of calculating;
C, on request gold plated lead is increased to the jigsaw limit of each jigsaw producing plate;
D, when exist lead-in wire by edges of boards sample time, to lead-in wire avoid process.
2. the method for gold plated lead in a kind of automatic interpolation jigsaw according to claim 1, is characterized in that: the related parameter values in described steps A includes the coordinate figure of four limits lead-in wires of jigsaw.
3. the method for gold plated lead in a kind of automatic interpolation jigsaw according to claim 2, is characterized in that: utilize the coordinate figure of four limits lead-in wires of jigsaw to calculate required size of adding gold plated lead distance jigsaw limit in described step B.
4. the method for gold plated lead in a kind of automatic interpolation jigsaw according to claim 3, is characterized in that: described gold plated lead keeps there is certain distance with jigsaw limit.
5. the method for gold plated lead in a kind of automatic interpolation jigsaw according to claim 1, it is characterized in that: in described step C, add gold-plated rectangle copper billet for internal layer, skin adds copper bar.
6. the method for gold plated lead in a kind of automatic interpolation jigsaw according to claim 5, is characterized in that: in described step C, also adds lead-in wire and pad by command mode.
7. the method for gold plated lead in a kind of automatic interpolation jigsaw according to claim 6, is characterized in that: in described step C, and the process of adding pad includes the setting to pad size, shape, coordinate parameters.
8. the method for gold plated lead in a kind of automatic interpolation jigsaw according to claim 1, is characterized in that: described step is all by InCAM software simulating.
9. the method for gold plated lead in a kind of automatic interpolation jigsaw according to claim 8, is characterized in that: in described step D, utilizes clip_area order to avoid process to lead-in wire.
CN201410500148.1A 2014-09-26 2014-09-26 A kind of method of gold plated lead in automatic addition jigsaw Active CN104252565B (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104797092A (en) * 2015-04-08 2015-07-22 广州杰赛科技股份有限公司 PCB (printed circuit board) jointing method and PCB jointing system
CN105960100A (en) * 2016-06-30 2016-09-21 广州兴森快捷电路科技有限公司 Gold-plating lead adding method for golden fingers
CN106469237A (en) * 2016-08-31 2017-03-01 中船黄埔文冲船舶有限公司 A kind of method and system of jigsaw figure automatic marking
CN106546905A (en) * 2016-11-01 2017-03-29 景旺电子科技(龙川)有限公司 A kind of method that addition golden finger tests PAD

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040089413A1 (en) * 2002-08-08 2004-05-13 Michael Murphy System and method for modifying electronic design data
CN101424706A (en) * 2008-11-28 2009-05-06 深圳华为通信技术有限公司 Test anchor point making method and test anchor point and veneer
CN102521431A (en) * 2011-11-18 2012-06-27 东莞生益电子有限公司 Method for processing lead wire in PCB (Printed Circuit Board) design data

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040089413A1 (en) * 2002-08-08 2004-05-13 Michael Murphy System and method for modifying electronic design data
CN101424706A (en) * 2008-11-28 2009-05-06 深圳华为通信技术有限公司 Test anchor point making method and test anchor point and veneer
CN102521431A (en) * 2011-11-18 2012-06-27 东莞生益电子有限公司 Method for processing lead wire in PCB (Printed Circuit Board) design data

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
青柳光昭等: "INCAM的实用化和冲模制作的高精度化·自动化", 《轻型汽车技术》 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104797092A (en) * 2015-04-08 2015-07-22 广州杰赛科技股份有限公司 PCB (printed circuit board) jointing method and PCB jointing system
CN104797092B (en) * 2015-04-08 2018-01-16 广州杰赛科技股份有限公司 The board joint method and system of pcb board
CN105960100A (en) * 2016-06-30 2016-09-21 广州兴森快捷电路科技有限公司 Gold-plating lead adding method for golden fingers
CN105960100B (en) * 2016-06-30 2018-06-22 广州兴森快捷电路科技有限公司 A kind of golden finger gold plated lead adding method
CN106469237A (en) * 2016-08-31 2017-03-01 中船黄埔文冲船舶有限公司 A kind of method and system of jigsaw figure automatic marking
CN106469237B (en) * 2016-08-31 2019-07-05 中船黄埔文冲船舶有限公司 A kind of method and system of jigsaw figure automatic marking
CN106546905A (en) * 2016-11-01 2017-03-29 景旺电子科技(龙川)有限公司 A kind of method that addition golden finger tests PAD

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Denomination of invention: Method for automatically adding gold-plated leads in jointed boards

Effective date of registration: 20200313

Granted publication date: 20170630

Pledgee: Shenzhen hi tech investment small loan Co., Ltd

Pledgor: SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd.

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