CN104251795B - 平面视图样品制备 - Google Patents

平面视图样品制备 Download PDF

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Publication number
CN104251795B
CN104251795B CN201410302659.2A CN201410302659A CN104251795B CN 104251795 B CN104251795 B CN 104251795B CN 201410302659 A CN201410302659 A CN 201410302659A CN 104251795 B CN104251795 B CN 104251795B
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CN
China
Prior art keywords
sample
workpiece
ion beam
attached
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410302659.2A
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English (en)
Chinese (zh)
Other versions
CN104251795A (zh
Inventor
R.J.杨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FEI Co
Original Assignee
FEI Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FEI Co filed Critical FEI Co
Publication of CN104251795A publication Critical patent/CN104251795A/zh
Application granted granted Critical
Publication of CN104251795B publication Critical patent/CN104251795B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32—Polishing; Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/302—Controlling tubes by external information, e.g. programme control
    • H01J37/3023—Programme control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3178—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for applying thin layers on objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2802—Transmission microscopes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3174—Etching microareas
    • H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31749—Focused ion beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Plasma & Fusion (AREA)
  • Engineering & Computer Science (AREA)
  • Sampling And Sample Adjustment (AREA)
CN201410302659.2A 2013-06-28 2014-06-27 平面视图样品制备 Active CN104251795B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/930,911 US9040908B2 (en) 2013-06-28 2013-06-28 Plan view sample preparation
US13/930911 2013-06-28

Publications (2)

Publication Number Publication Date
CN104251795A CN104251795A (zh) 2014-12-31
CN104251795B true CN104251795B (zh) 2019-04-16

Family

ID=50979660

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410302659.2A Active CN104251795B (zh) 2013-06-28 2014-06-27 平面视图样品制备

Country Status (4)

Country Link
US (2) US9040908B2 (enExample)
EP (1) EP2818844A1 (enExample)
JP (1) JP6359351B2 (enExample)
CN (1) CN104251795B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9040908B2 (en) 2013-06-28 2015-05-26 Fei Company Plan view sample preparation
CN105158516B (zh) * 2015-08-20 2018-10-16 上海华力微电子有限公司 一种集成电路分析中透射电镜平面样品的制备方法
US10546719B2 (en) * 2017-06-02 2020-01-28 Fei Company Face-on, gas-assisted etching for plan-view lamellae preparation
US10801926B2 (en) * 2017-07-17 2020-10-13 Expresslo Llc Probe with solid beveled tip and method for using same for specimen extraction
DE102018108974B3 (de) * 2018-04-16 2019-05-09 Carl Zeiss Microscopy Gmbh Verfahren zum Herstellen einer TEM-Probe
CN109374663B (zh) * 2018-12-29 2021-05-04 中国工程物理研究院材料研究所 一种柔性高原子序数材料透射电镜样品的制备方法
KR102760504B1 (ko) * 2020-05-01 2025-02-03 주식회사 히타치하이테크 핀셋, 반송 장치 및 시료편의 반송 방법
CN115148568A (zh) * 2021-03-30 2022-10-04 台湾积体电路制造股份有限公司 样品载台及修饰样品的系统及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0927880A1 (en) * 1997-07-22 1999-07-07 Hitachi, Ltd. Method and apparatus for preparing samples

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435755Y2 (enExample) * 1975-11-29 1979-10-30
US5435850A (en) 1993-09-17 1995-07-25 Fei Company Gas injection system
US5851413A (en) 1996-06-19 1998-12-22 Micrion Corporation Gas delivery systems for particle beam processing
NL1022426C2 (nl) 2003-01-17 2004-07-26 Fei Co Werkwijze voor het vervaardigen en transmissief bestralen van een preparaat alsmede deeltjes optisch systeem.
US20060085978A1 (en) 2004-10-21 2006-04-27 Milidantri Thomas H Jr Turbine component fixture for manufacture or repair
WO2007082380A1 (en) 2006-01-19 2007-07-26 Fibics Incorporated Redeposition technique for membrane attachment
US7423263B2 (en) * 2006-06-23 2008-09-09 Fei Company Planar view sample preparation
CN101105430B (zh) 2006-07-10 2011-11-16 Fei公司 用于从工件上分离微型样品的方法
US8455821B2 (en) * 2006-10-20 2013-06-04 Fei Company Method for S/TEM sample analysis
EP2095134B1 (en) * 2006-10-20 2017-02-22 FEI Company Method and apparatus for sample extraction and handling
JP2009216534A (ja) * 2008-03-11 2009-09-24 Jeol Ltd 薄膜試料作製方法
US9040908B2 (en) 2013-06-28 2015-05-26 Fei Company Plan view sample preparation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0927880A1 (en) * 1997-07-22 1999-07-07 Hitachi, Ltd. Method and apparatus for preparing samples

Also Published As

Publication number Publication date
CN104251795A (zh) 2014-12-31
JP6359351B2 (ja) 2018-07-18
EP2818844A1 (en) 2014-12-31
US20150325409A1 (en) 2015-11-12
US20150001176A1 (en) 2015-01-01
JP2015038469A (ja) 2015-02-26
US9368325B2 (en) 2016-06-14
US9040908B2 (en) 2015-05-26

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