CN104246989A - Chemical processing apparatus - Google Patents
Chemical processing apparatus Download PDFInfo
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- CN104246989A CN104246989A CN201380019952.1A CN201380019952A CN104246989A CN 104246989 A CN104246989 A CN 104246989A CN 201380019952 A CN201380019952 A CN 201380019952A CN 104246989 A CN104246989 A CN 104246989A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A chemical processing apparatus (S) is configured in such a manner that, in a process involving sending a chemical (L) to a shower nozzle (14) via a shower pipe (16) from a chemical tank (12), an additive solution (L2) is supplied to the chemical (L), which flows through the shower pipe (16), via an additive solution pipe (26) from an additive solution tank (25), and, after being supplied to the surface of a substrate being processed (W) from the shower nozzle (14), the chemical (L) is recovered in the chemical tank (12).
Description
Technical field
The present invention relates to display floater, the chemical solution treating device forming the surface enforcement liquid process of the handled object such as substrate, semiconductor wafer of display floater, particularly for the cost degradation of product and the technology of rate of finished products raising.
Background technology
Being subject to the rapid deterioration of the display floater in market in recent years, being strongly required the countermeasure of the cost in the manufacture for cutting down semiconductor wafer, display floater, for improving the countermeasure of rate of finished products.Particularly along with the maximization of display floater, the manufacturing cost brought by the breakage of often opening panel constantly increases, and the requirement for the breakage reducing display floater becomes strict.
In the manufacture of display floater, in the operation such as etch processes, clean as the active-matrix substrate of panel member of formation, colored filter substrate, carry out as follows: the liquid process that the liquid sprayed from spray nozzle implements to specify is sprayed to this substrate surface.
The chemical solution treating device carrying out this liquid process is formed for following: main liquid and annex solution are imported medicine liquid tank and is stirred rear mixing with mixer, the liquid generated like this is delivered to spray nozzle and carries out liquid process, again being recovered in medicine liquid tank by the liquid be finished makes it circulate, above-mentioned main liquid comprises and is difficult to the characteristic variations owing to causing processing reaction, time lapse and the composition due to the change in concentration caused of volatilizing occur, and above-mentioned annex solution comprises the composition being easy to this characteristic variations, change in concentration occur.
In chemical solution treating device as above, generally predetermine the life-span using liquid according to operation etc.Such as have to discard when reaching prespecified access times (life counter) this liquid be replaced by new liquid life counter mode, discard when have passed through prespecified service time (life-span) way of life that this liquid is replaced by new liquid.
In order to reduce the manufacturing cost of display floater, except being reduced in the liquid unit price used in above-mentioned liquid process, also need to cut down liquid use amount, the life-span extending liquid or life counter (hereinafter referred to as the liquid life-span), with the maximization of above-mentioned display floater, process the increase of number correspondingly, particularly cut down liquid use amount and can carry out long-term plant produced with the prolongation liquid life-span, and very affect product cost.
Thus, in the past, in order to prevent the deterioration because the characteristic variations of liquid, change in concentration cause and extend the liquid life-span, in the way of liquid process, in medicine liquid tank, in liquid, suitably supplement annex solution, carry out the control of the concentration of the annex solution composition in liquid thus.In the constituent concentration of liquid controls, in the way of liquid process, originally carry out the interpolation of the right amount of annex solution exactly, therefore how can fast and equably to liquid mixing annex solution be very important.
By etch processes device for during for example, if carrying out etch processes in the stage not mixing annex solution (such as hydrochloric acid, nitric acid, sulfuric acid etc.) equably to the etching solution as liquid with this etching solution, then the reason of the residue become pattern broken string that the etching due to surplus causes, causing due to undercut.
Therefore, such as in chemical solution treating device disclosed in patent documentation 1, liquid mixing unit is set mixing and supply in the liquid supply pipe of different liquid, and this liquid mixing unit possesses the ultrasonic irradiation unit making liquid carry out ultrasonic vibration, utilize this ultrasonic irradiation unit to make the liquid in pipe arrangement carry out ultrasonic vibration, promote the mixing of 2 kinds of liquid thus.
Prior art document
patent documentation
Patent documentation 1: JP 2007-173367 publication
Summary of the invention
the problem that invention will solve
In the chemical solution treating device of existing formation, with mixer, liquid and annex solution are mixed in medicine liquid tank, but stirring capacity is not enough, concentration to the annex solution composition in the liquid kept equably in flow container is more time-consuming, thus, the processing speed of liquid process is limited, and therefore treatment effeciency worsens.
In addition, in the chemical solution treating device of patent documentation 1, except general device is formed, also possess ultrasonic irradiation unit, therefore this part makes device form and becomes complicated, and the price of device itself is high.
The present invention completes in view of this point, its object is to be formed with simple device make annex solution in liquid fast and mix fully, suppresses to occur due to cause bad of liquid process and improves the treatment effeciency of this process.
for the scheme of dealing with problems
In order to achieve the above object, in the present invention, the middle part of the pipe arrangement to liquid feeding unit conveying liquids such as spray nozzles is utilized to supplement annex solution.
Particularly, the chemical solution treating device surface of handled object being implemented to liquid process is proposed following Xie Decision scheme as object by the present invention.
That is, the feature of the 1st invention is,
Possess:
Medical liquor treating trough, handled object is moved to above-mentioned medical liquor treating trough;
Add flow container, it stores annex solution;
Liquid feeding unit, it is located at the inside of above-mentioned medical liquor treating trough, sends the liquid of the composition comprising above-mentioned annex solution, this liquid is fed to the surface of above-mentioned handled object from top;
Medicine liquid tank, it is located at the below of above-mentioned liquid feeding unit, stores the liquid being fed to handled object from above-mentioned liquid feeding unit;
1st pipe arrangement, it connects above-mentioned medicine liquid tank and above-mentioned liquid feeding unit, and the liquid of above-mentioned medicine liquid tank is transported to above-mentioned liquid feeding unit; And
2nd pipe arrangement, it connects above-mentioned interpolation flow container and above-mentioned 1st pipe arrangement, the annex solution of above-mentioned interpolation flow container is added to the liquid flowed in above-mentioned 1st pipe arrangement.
According to the 1st invention, carrying in the process of liquid via the 1st pipe arrangement to liquid feeding unit from medicine liquid tank, supplement annex solution to the liquid flowed in the 1st pipe arrangement, therefore this annex solution supplemented is stirred rapidly at the flow velocity of the inner utilization liquid of the 1st pipe arrangement.Thus, annex solution can be made in liquid fast and mix fully.Like this, even if the present invention does not possess the agitating unit of Te Do as ultrasonic irradiation unit disclosed in patent documentation 1, also can be formed in liquid with simple device and make annex solution fast and mix fully, can suppress to occur due to cause bad of liquid process and improve the treatment effeciency of this process.
According to the chemical solution treating device of the 1st invention, the feature of the 2nd invention is,
Also possess detecting unit, above-mentioned detecting unit detects the existence of above-mentioned handled object in the scope being sent liquid by above-mentioned liquid feeding unit,
Utilize above-mentioned detecting unit do not detect above-mentioned handled object time, above-mentioned annex solution is supplemented to the liquid flowed in above-mentioned 1st pipe arrangement, when utilizing above-mentioned detecting unit existing of above-mentioned handled object to be detected, the liquid to flowing in above-mentioned 1st pipe arrangement is stopped to supplement above-mentioned annex solution.
According to the 2nd invention, when only there is not handled object in the scope being sent liquid by liquid feeding unit, annex solution is supplemented to liquid selectively to the 1st pipe arrangement conveying annex solution, therefore the liquid being just added annex solution can not be fed to the surface of handled object, and be temporarily recycled to medicine liquid tank, be then again transported to liquid feeding unit via the 1st pipe arrangement.In this process, liquid can be made and the annex solution that it supplements is mixed fully.Therefore, though annex solution be difficult in liquid mixing, also can suppress well occur due to liquid process cause bad.
According to the chemical solution treating device of the 1st or the 2nd invention, the feature of the 3rd invention is,
Also possess cleaning fluid tank, cleaning fluid is deposited in above-mentioned washing lotion tank storage,
Above-mentioned cleaning fluid tank is connected with above-mentioned 2nd pipe arrangement, carries above-mentioned cleaning fluid to above-mentioned 1st pipe arrangement.
According to the 3rd invention, via the 2nd pipe arrangement from cleaning fluid tank to the 1st pipe arrangement transport cleaning liquid, cleaning fluid is circulated at the appointed time in liquid feeding unit, medical liquor treating trough, medicine liquid tank and the 1st pipe arrangement, can chemical solution treating device be cleaned thus.And the 2nd pipe arrangement is also used as the pipe arrangement also cleaning fluid being transported to the 1st pipe arrangement except annex solution from cleaning fluid tank, the formation of the cleaning for carrying out chemical solution treating device therefore can be simplified.
invention effect
According to the present invention, the middle part of the liquor charging pipe arrangement to liquid feeding unit conveying liquid is utilized to supplement annex solution to liquid, can be formed with simple device thus and be made annex solution in liquid fast and mix fully, suppress to occur due to cause bad of liquid process and improve the treatment effeciency of this process.Consequently, the breakage of handled object can be reduced, realize the cost degradation of the product that this handled object is formed and improve rate of finished products.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the schematic configuration of the etch processes device that execution mode 1 is shown.
Fig. 2 is the schematic diagram of the etch processes groove that execution mode 1 is shown and the formation associated with it.
Fig. 3 is the schematic diagram of the formation of the etch processes groove inside that execution mode 1 is shown.
Fig. 4 is the schematic diagram of the formation of the etching spray thrower that execution mode 1 is shown from downside.
Fig. 5 is the schematic diagram of the formation of the etch processes groove inside that execution mode 2 is shown.
Embodiment
Below, embodiments of the present invention are explained based on accompanying drawing.In addition, the invention is not restricted to following each execution mode.
" working of an invention mode 1 "
Preferably in 1, the example as chemical solution treating device of the present invention illustrates etch processes device S.
The etch processes device S of present embodiment is for such as forming the patterns such as distribution, electrode, semiconductor layer when making the active-matrix substrate of the display floater forming liquid crystal indicator etc. as in the insulative substrate of substrate.
Processed substrate (handled object) W as the handling object of this etch processes device S is such as while the glass substrate of rectangular flat shape of size for 1000mm ~ 3200mm degree.In addition, this processed substrate W can be the size of a display floater, also can be the size of the mother substrate of multiple display floaters.
the formation of etch processes device S
Fig. 1 is the schematic diagram of the schematic configuration that etch processes device S is shown.
Etch processes device S is the device surface of processed substrate W being implemented to wet etching process.This etch processes device S as shown in Figure 1, possesses: as the etch processes groove 10 of the medical liquor treating trough arranged continuously, rinse bath 30 and dry slot 35; And as the transfer line 40 of handling unit, the processed substrate W of its carrying makes it in this each groove 10,30,35 and moves between each groove 10,30,35.Below by the carrying direction 100 of processed substrate W referred to as board carrying direction 100.
Etch processes groove 10 is configured to: supply etching solution L as liquid to implement etch processes to the surface of the processed substrate W be moved in groove 10.Rinse bath 30 is configured to: with the adjacent configuration in downstream in the board carrying direction 100 of etch processes groove 10, the surface of the processed substrate W having carried out etch processes is placed in the rinse water such as pure water and cleans.In addition, dry slot 35 is configured to: with the adjacent configuration in downstream in the board carrying direction 100 of rinse bath 30, utilize air knife, hot blast etc. to make to residue in the moisture rapid draing on the surface of the processed substrate W having carried out clean.
Transfer line 40 is configured to: roller unit 43 is arranged side by side multiple (shown in Fig. 2 and Fig. 3 of reference below) in the horizontal direction.The plurality of roller unit 43 comprises the multiple transport rollers 42 as rotary body supported by rotating shaft 41 axle, processed substrate W, carries with the posture level of its processed surface towards the top of etch processes groove 10 along board carrying direction 100 by horizontal arrangement mutually at equal intervals by the mode becoming the direction orthogonal with board carrying direction 100 with the axis of rotating shaft 41.
In addition, transfer line 40 can be configured to: the transport roller as the rotary body of elongated cylindrical replaces roller unit 43 to be arranged side by side multiple in the horizontal direction, as long as can carry the device of processed substrate W, is not particularly limited.
Above-mentioned transfer line 40 is with through being formed at moving into mouth and taking out of mouth (not shown) and the mode of through etch processes device S is arranged of above-mentioned each groove 10,30,35, processed substrate W is moved to inside from the outside of etch processes device S, and after making it carry via etch processes groove 10, rinse bath 30 and dry slot 35 in order, take out of the outside of this processing unit S.
Etch processes device S of the present invention has feature in above-mentioned etch processes groove 10, rinse bath 30 and dry slot 35, particularly on etch processes groove 10 and the formation that associates with it, and therefore following reference Fig. 2 ~ Fig. 4 is while describe their formation in detail.
Fig. 2 is the schematic diagram of formation etch processes groove 10 being shown and associating with it.Fig. 3 is the schematic diagram of the formation that etch processes groove 10 inside is shown.
In etch processes groove 10, as shown in Figure 3, be provided with at the upstream extremity in board carrying direction 100 respectively and move into a mouthful 10a, be provided with in the downstream in this direction 100 and take out of a mouthful 10b.Further, move into mouthful 10a and take out of between mouthful 10b at this, the multiple roller units 43 forming above-mentioned transfer line 40 have been arranged side by side multiple in the horizontal direction.
In the below of this etch processes groove 10, be provided with accumulator tank 11 as shown in Figures 2 and 3.Be provided with in the inside of this accumulator tank 11: medicine liquid tank 12, it stores the mixed etching solution L of main liquid L1 and annex solution L2; And access 11a, it makes this medicine liquid tank 12 be communicated with etch processes groove 10.
Access 11a extends at above-below direction, upper end is connected with the bottom of etch processes groove 10, on the other hand, lower end is connected with the top of medicine liquid tank 12, makes to spray and the etching solution L accumulating in the bottom surface of etch processes groove 10 utilizes deadweight to flow in medicine liquid tank 12 from etching spray thrower 13 described later.The etching solution L temporary reservoir that medicine liquid tank 12 will flow into through this access 11a.
When metal etching solution is used as above-mentioned etching solution L, use the various acid such as such as fluoric acid, nitric acid, phosphoric acid, hydrochloric acid, oxalic acid, hydrochloric acid, sulfuric acid as above-mentioned main liquid L1, as above-mentioned annex solution L2 use such as from the acid used in main liquid L1 for identical type but the mixed liquor of the stabilizer such as the different acid of concentration and organic substance.In addition, when the moisture of main liquid L1 is easy to gasification, preferably annex solution L2 is used as by comprising the more liquid of moisture.
In addition, be provided with etching spray thrower 13 above the transfer line 40 of etch processes groove 10 inside, etching spray thrower 13 sprays supply etching solution L to the surface of the processed substrate W utilizing roller unit 43 level to carry from top.
Fig. 4 is the schematic diagram of the formation that etching spray thrower 13 is shown from downside.
As shown in Figure 4, possess: as the spray pipe arrangement 16 of the 1st pipe arrangement, it is for supplying etching solution L for etching spray thrower 13; And as multiple spray nozzles 14 of liquid feeding unit, it sprays the etching solution L by the supply of this spray pipe arrangement 16.
Above-mentioned spray pipe arrangement 16 possesses: supervisor 16a, and it extends along board carrying direction 100 in the side at the position corresponding with board carrying position; And multiple branched pipe 16b, it links with this supervisor 16a respectively, outstanding to the direction orthogonal with board carrying direction 100 from this supervisor 16a.
As shown in Figure 2, supervisor 16a is connected with above-mentioned medicine liquid tank 12, and this medicine liquid tank 12 is communicated with each branched pipe 16b and then with each spray nozzle 14 being located at this branched pipe 16b.The end side of supervisor 16a is connected with medicine liquid tank 12, and links each branched pipe 16b in another side.
Be provided with in this supervisor 16a: solution feed pump 17, it is for carrying etching solution L from medicine liquid tank 12 to spray nozzle 14 via spray pipe arrangement 16; Flow control valve 18, it regulates the flow of the etching solution L flowed in supervisor 16a; And flowmeter 19, it measures the flow of the etching solution L flowed in supervisor 16a.Thus, etch processes device S can monitor the flow of the etching solution L utilizing solution feed pump 17 to carry in supervisor 16a with flowmeter 19, and can regulate the flow of the etching solution L carried in this pipe 16a as required with flow control valve 18.
Branched pipe 16b separates in the mode of the top being arranged in the processed substrate W of carrying and is equally spaced disposed in the position corresponding with board carrying position on board carrying direction 100, forms comb teeth-shaped relative to supervisor 16a.This each branched pipe 16b can be fixed on supervisor 16a, also can be configured to sway and to make spray nozzle 14 described later carry out wobbling action.
Spray nozzle 14 is arranged on the lower portion of this each branched pipe 16b in outstanding mode downwards, and with the mode arranged along the projected direction of branched pipe 16b to separate from the cardinal extremity of this pipe 16b to top be equally spaced provided with multiple.This each spray nozzle 14 is communicated with medicine liquid tank 12 via spray pipe arrangement 16, solution feed pump 17, flow control valve 18 and flowmeter 19.On the top of each spray nozzle 14, be provided with downward the ejiction opening of ejection etching solution L.
Above-mentioned each spray nozzle 14 to stagger half tooth pitch configuration in its orientation relative to the spray nozzle 14 being located at adjacent branched pipe 16b, forms sawtooth arrangement as a whole.As this spray nozzle 14, the spray pattern of such as etching solution L is preferably adopted to become the spray nozzle of circular full cone type.
In addition, in spray nozzle 14 except the spray nozzle of above-mentioned full cone type, also can adopt the spray nozzle etc. that the spray pattern of such as etching solution L becomes the spray nozzle of the square type of rectangle, the spray pattern of this etching solution L becomes the oval type of elliptical shape.
In addition, be provided with as shown in Figure 2 in the outside of etch processes groove 10: main flow container 20, it stores main liquid L1; And adding flow container 25, it stores annex solution L2.
Main flow container 20 is connected via main liquid pipe arrangement 21 with medicine liquid tank 12, and inside is each other communicated with by this main liquid pipe arrangement 21.The end side of main liquid pipe arrangement 21 is connected with main flow container 20, and another side is connected with medicine liquid tank 12.
Be provided with in this main liquid pipe arrangement 21: solution feed pump 22, it is for carrying main liquid L1 via main liquid pipe arrangement 21 to medicine liquid tank 12 from main flow container 20; Flow control valve 23, it regulates the flow of the main liquid L1 of flowing in main liquid pipe arrangement 21; And flowmeter 24, it measures the flow of the main liquid L1 of flowing in main liquid pipe arrangement 21.Thus, the etching solution L in medicine liquid tank 12 all discards at liquid end-of-life by etch processes device S, when being replaced by new etching solution L, can to the main liquid L1 of supply ormal weight in medicine liquid tank 12.
Add flow container 25 to be connected via the annex solution pipe arrangement 26 as the 2nd pipe arrangement with the supervisor 16a of above-mentioned spray pipe arrangement 16, inside is each other communicated with by this annex solution pipe arrangement 26.The end side of annex solution pipe arrangement 26 is connected with interpolation flow container 25, and another side links with the middle part of supervisor 16a.
Be provided with in this annex solution pipe arrangement 26: solution feed pump 27, it is for carrying annex solution L2 via this pipe arrangement 26 to supervisor 16a from interpolation flow container 25; Flow control valve 28, it regulates the flow of the annex solution L2 of flowing in this pipe arrangement 26; And flowmeter 29, it measures the flow of the annex solution L2 of flowing in this pipe arrangement 26.Thus, etch processes device S can monitor the flow of the annex solution L2 utilizing solution feed pump 27 to carry in annex solution pipe arrangement 26 with flowmeter 29, and can regulate the flow of the annex solution L2 of conveying in this pipe arrangement 26 as required with flow control valve 28.
Above-mentioned solution feed pump 17,22,27, flow control valve 18,23,28 and flowmeter 19,24,29 be connected with control system (not shown), controls respective driving by this control system.
According to above-mentioned formation, in the etch processes device S of present embodiment, the etching solution L be stored in medicine liquid tank 12 is carried to each spray nozzle 14 via spray pipe arrangement 16, spray etching solution L from the ejiction opening on this each spray nozzle 14 top to the surface of the processed substrate W carrying, etch processes is implemented to this substrate W surface.The etching solution L sprayed from each spray nozzle 14 is recycled to medicine liquid tank 12 via the access 11a being positioned at etch processes groove 10 bottom, uses until liquid end-of-life at device S Inner eycle.
And, in the etch processes device S of present embodiment, etching solution L from medicine liquid tank 12 via spray pipe arrangement 16 to the process that each spray nozzle 14 carry, from add flow container 25 via annex solution pipe arrangement 26 to spray pipe arrangement 16 in flow etching solution L supplement annex solution L2.Thus, the flow velocity of etching solution L flowed in spray pipe arrangement 16 can be utilized to stir annex solution L2 rapidly, and make annex solution L2 in etching solution L fast and mix fully.
In addition, in the etch processes device S of present embodiment, when changing the etching solution L in medicine liquid tank 12 when liquid end-of-life, after the etching solution L that will up to the present use is all discarded, in medicine liquid tank 12, the main liquid L1 of ormal weight is supplied from main flow container 20, then, by the driving of solution feed pump 17, the main liquid L1 in medicine liquid tank 12 is carried to spray nozzle 14 via spray pipe arrangement 16, in this process, from adding flow container 25 via the main liquid L1 supply annex solution L2 of annex solution pipe arrangement 26 to flowing spray pipe arrangement 16, make this two kinds of liquid L1, L2 mixing.Further, after being sprayed in etch processes groove 10 from spray nozzle 14 by the mixed liquor of main liquid L1 and annex solution L2, the circulation being recycled to medicine liquid tank 12 after access 11a is performed at the appointed time.Thus, in medicine liquid tank 12, store the etching solution L of ormal weight, carry out the replacing of the etching solution L in medicine liquid tank 12.
In addition, also can by more bringing the replacing of the etching solution L carried out in this medicine liquid tank 12 after all being discarded by the etching solution L in medicine liquid tank 12 simply with pre-prepd new etching solution L.
etching processing method
The following describes etching processing method when using above-mentioned etch processes device S making active-matrix substrate.
First, carry being placed in transfer line 40 as the processed substrate W having carried out etch processes in etch processes device S of handling object, and be moved to etch processes groove 10 from moving into a mouthful 10a.At this, the processed substrate W being placed in transfer line 40 be implemented base-plate cleaning process, photoresist coating process, pre-bake treatment, pattern exposure process, development treatment and after cure process and the surperficial substrate being formed with film thereon.
When processed substrate W is moved to etch processes groove 10, control system action, starts to spray etching solution L by etching spray thrower 13.Further, during processed substrate W is transported to downstream from upstream extremity in etch processes groove 10, from etching spray thrower 13, etching solution L is sprayed to the upper surface of processed substrate W and perform wet etching process.
In addition, during performing etch processes, supplement annex solution L2 via annex solution pipe arrangement 26 to spray pipe arrangement 16 (supervisor 16a) from interpolation flow container 25.Thus, the characteristic variations of etching solution L (deterioration) can be suppressed and extend the liquid life-span.Now, the annex solution L2 that supplements be stirred rapidly at the flow velocity of the inner utilization etching solution L of spray pipe arrangement 16, therefore can make annex solution L2 in etching solution L fast and mix fully.
When above-mentioned etch processes complete and processed substrate W arrive take out of mouthful 10b time, processed substrate W takes out of mouthful 10b taken out of from etch processes groove 10 through this, is then moved to adjacent rinse bath 30.
When processed substrate W is moved to rinse bath 30, be located at the pure water spray nozzle work of rinse bath 30, spray pure water to the surface of processed substrate W, cleaning remains in the etching solution of this substrate W surface.Taken out of from rinse bath 30 by the processed substrate W cleaned like this, be then moved to adjacent dry slot 35.
When processed substrate W is moved to dry slot 35, be located at the air knife work of dry slot 35, utilize cold wind to scan the surface of processed substrate W, or the baking box work be located in this groove 35, utilize hot blast to scan the surface of processed substrate W, thus, this substrate W surface is quickly dried.
Afterwards, the dried processed substrate W in surface takes out of from dry slot 35, completes etch processes.
the effect of execution mode 1
According to this execution mode 1, supplement annex solution L2 to the etching solution L of flowing in spray pipe arrangement 16 carrying to spray nozzle 14 in the process of etching solution L via spray pipe arrangement 16 from medicine liquid tank 12, therefore can make annex solution L2 in etching solution L fast and mix fully.Thus, can with simple device form suppress to occur due to etch processes cause bad, and the treatment effeciency of this process can be improved.Consequently, the breakage of processed substrate W can be reduced, the cost degradation of the display floater that this substrate W is formed can be realized, and can rate of finished products be improved.
" working of an invention mode 2 "
Fig. 5 is the schematic diagram of the formation of etch processes groove 10 inside that this execution mode 2 is shown.In addition, in each execution mode afterwards, except part formation is different from above-mentioned execution mode 1, form in the same manner as above-mentioned execution mode 1 about etch processes device S, therefore only illustrate and form different parts, identical component part is transferred in the explanation based on the above-mentioned execution mode 1 of Fig. 1 ~ Fig. 4, omits its detailed description.
The etch processes groove 10 of present embodiment is configured to: respectively move into mouthful inner upper of 10a side be provided with to processed substrate W move into detect move into detecting sensor 50, in addition take out of mouthful inner upper of 10b side be provided with to processed substrate W take out of detect take out of detecting sensor 52, utilize these two detecting sensors 50,52 to detect processed substrate W moving into and taking out of relative to etch processes groove 10, and detect whether there is processed substrate W in the scope of supplying etching solution L from spray nozzle 14.
Move into detecting sensor 50 and take out of detecting sensor 52 and be connected with control system.No matter whether control system detect the processed substrate W of existence in etch processes groove 10 by these two detecting sensors 50,52, all makes solution feed pump 17 drive and spray etching solution L continuously from each spray nozzle 14.
And, control system makes solution feed pump 27 drive when utilizing two detecting sensors 50,52 processed substrate W in etch processes groove 10 not detected, annex solution L2 is carried to spray pipe arrangement 16 from interpolation flow container 25, on the other hand, when utilizing two detecting sensors 50,52 to detect and exist and be processed substrate W in etch processes groove 10, solution feed pump 27 is stopped, thus stop carrying annex solution L2 from interpolation flow container 25 to spray pipe arrangement 16.
Like this, in the etch processes device S of present embodiment, during carried processed substrate W continuously by transfer line 40, only when there is not processed substrate W in etch processes groove 10, annex solution L2 is carried selectively to spray pipe arrangement 16, etching solution L to flowing in this pipe arrangement 16 supplements annex solution L2, is sprayed by the etching solution L supplementing this annex solution L2 and make its former state turn back to medicine liquid tank 12 from spray nozzle 14.
the effect of execution mode 2
According to this execution mode 2, when only there is not processed substrate W in etch processes groove 10, annex solution L2 is carried selectively to spray pipe arrangement 16, annex solution L is supplemented to etching solution L, therefore the liquid L being just added annex solution L2 can not be fed to the surface of processed substrate W, is temporarily recycled to medicine liquid tank L, and then carries to each spray nozzle 14 via spray pipe arrangement 16, in this process, etching solution L and the annex solution L2 supplementary to it is mixed fully.Therefore, even etching solution L and annex solution L2 are difficult to the liquid mixed, also can suppress occur due to etch processes cause bad.
" working of an invention mode 3 "
The etch processes device S of this execution mode 3, except the formation of above-mentioned execution mode 1, also possesses the cleaning fluid tank (not shown) storing cleaning fluid.This cleaning fluid tank is configured to: replace adding flow container 25, or can be connected with annex solution pipe arrangement 26.As cleaning fluid, such as, use pure water, ionized water, comprise the solution of washing agent, by the acids lysate etc. of the dissolving crystallized of etching solution L composition.
Thus, when such as wishing to use the liquid different from the etching solution L up to the present used, when wishing to bring into use it when processing unit S being stopped, the tank be connected with annex solution pipe arrangement 26 is changed into being connected from adding flow container 25 with cleaning fluid tank, the driving of solution feed pump 27 is utilized to make cleaning fluid flow to spray pipe arrangement 16 from cleaning fluid tank via annex solution pipe arrangement 26, make the circulation in spray nozzle 14, etch processes groove 10, medicine liquid tank 12 and spray pipe arrangement 16 at the appointed time of this cleaning fluid, etch processes device S can be cleaned thus.
the effect of execution mode 3
According to this execution mode 3, annex solution pipe arrangement 26 is also also used as the pipe arrangement from cleaning fluid tank to spray pipe arrangement 16 transport cleaning liquid, therefore can simplify the formation of the cleaning for carrying out etch processes device S.
Be explained above the preferred embodiment of the present invention, but technical scope of the present invention is not limited to the scope described in the respective embodiments described above.It is illustrate that those skilled in the art can understand the respective embodiments described above, and can also have various variation in the combination of its each inscape, each processing step, in addition, this variation also within the scope of the invention.
Such as, in the respective embodiments described above, describe the etch processes device S of multiple spray nozzles 14 as liquid feeding unit adopting and processed substrate W is sprayed to etching solution L, but as liquid feeding unit, as long as be configured to send the liquids such as etching solution L and the liquid this sent is fed to processed substrate W from top, be not particularly limited.
In addition, in the respective embodiments described above, as chemical solution treating device of the present invention, etch processes device S is illustrated for for example, but the present invention is not limited thereto.Chemical solution treating device of the present invention is except such as etch processes device S, certainly chemical solution treating device washing agent or surface modifier, anticorrosive additive stripping liquid controlling, other acidic liquid, akaline liquid being used as liquid can also be applied, as long as while supplement annex solution while make this liquid at device Inner eycle and the processing unit of Reusability to liquid, just can apply widely.
industrial utilizability
As described above, the present invention is directed to while it is useful for suitably supplementing to liquid the chemical solution treating device that annex solution on one side implements liquid process to handled object, be particularly suitable for wishing forming with simple device making annex solution in liquid fast and mix fully, suppress the bad of generation liquid process and improve the chemical solution treating device of the treatment effeciency of this process.
description of reference numerals
S etch processes device (chemical solution treating device)
L etching solution (liquid)
The main liquid of L1
L2 annex solution
W is processed substrate (handled object)
10 etch processes grooves (medical liquor treating trough)
10a moves into mouth
10b takes out of mouth
11 accumulator tanks
11a access
12 medicine liquid tanks
13 etching spray throwers
14 spray nozzles (liquid feeding unit)
16 sprays pipe arrangement (the 1st pipe arrangement)
16a is responsible for
16b branched pipe
17,22,27 solution feed pumps
18,23,28 flow control valves
19,24,29 flowmeters
20 main flow containers
21 main liquid pipe arrangements
25 add flow container
26 annex solution pipe arrangements (the 2nd pipe arrangement)
30 rinse baths
35 dry slots
40 transfer lines
41 rotating shafts
42 transport rollers
43 roller units
50 move into detecting sensor (detecting unit)
52 take out of detecting sensor (detecting unit)
100 board carrying directions
Claims (3)
1. a chemical solution treating device, is characterized in that,
Possess:
Medical liquor treating trough, handled object is moved to above-mentioned medical liquor treating trough;
Add flow container, it stores annex solution;
Liquid feeding unit, it is located at the inside of above-mentioned medical liquor treating trough, sends the liquid of the composition comprising above-mentioned annex solution, this liquid is fed to the surface of above-mentioned handled object from top;
Medicine liquid tank, it is located at the below of above-mentioned liquid feeding unit, stores the liquid being fed to handled object from above-mentioned liquid feeding unit;
1st pipe arrangement, it connects above-mentioned medicine liquid tank and above-mentioned liquid feeding unit, and the liquid of above-mentioned medicine liquid tank is transported to above-mentioned liquid feeding unit; And
2nd pipe arrangement, it connects above-mentioned interpolation flow container and above-mentioned 1st pipe arrangement, the annex solution of above-mentioned interpolation flow container is added to the liquid flowed in above-mentioned 1st pipe arrangement.
2. chemical solution treating device according to claim 1, is characterized in that,
Also possess detecting unit, above-mentioned detecting unit detects the existence of above-mentioned handled object in the scope being sent liquid by above-mentioned liquid feeding unit,
Utilize above-mentioned detecting unit do not detect above-mentioned handled object time, above-mentioned annex solution is supplemented to the liquid flowed in above-mentioned 1st pipe arrangement, when utilizing above-mentioned detecting unit existing of above-mentioned handled object to be detected, the liquid to flowing in above-mentioned 1st pipe arrangement is stopped to supplement above-mentioned annex solution.
3. chemical solution treating device according to claim 1 and 2, is characterized in that,
Also possess cleaning fluid tank, cleaning fluid is deposited in above-mentioned washing lotion tank storage,
Above-mentioned cleaning fluid tank is connected with above-mentioned 2nd pipe arrangement, carries above-mentioned cleaning fluid to above-mentioned 1st pipe arrangement.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-134884 | 2012-06-14 | ||
| JP2012134884 | 2012-06-14 | ||
| PCT/JP2013/003611 WO2013187036A1 (en) | 2012-06-14 | 2013-06-07 | Chemical processing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104246989A true CN104246989A (en) | 2014-12-24 |
| CN104246989B CN104246989B (en) | 2016-08-17 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380019952.1A Expired - Fee Related CN104246989B (en) | 2012-06-14 | 2013-06-07 | Chemical solution treating device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5908078B2 (en) |
| CN (1) | CN104246989B (en) |
| WO (1) | WO2013187036A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015221646A1 (en) * | 2015-11-04 | 2017-05-04 | Gebr. Schmid Gmbh | Treatment fluid suction device and etching device containing the same |
| WO2018138836A1 (en) * | 2017-01-26 | 2018-08-02 | 株式会社 電硝エンジニアリング | Method for manufacturing electronic display board, and method and apparatus for polishing electronic display board |
| KR101864713B1 (en) * | 2017-05-02 | 2018-06-05 | 김문환 | Integral type washing machine |
| CN114447539A (en) * | 2022-01-27 | 2022-05-06 | 江苏龙恒新能源有限公司 | Automatic liquid supplementing device for secondary texturing of crystalline silicon battery piece |
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| JPS59110781A (en) * | 1982-12-15 | 1984-06-26 | Toshiba Corp | Apparatus for etching metal plate |
| US6302600B1 (en) * | 1999-05-26 | 2001-10-16 | Nagase & Co., Ltd. | Apparatus for treating surface of boards |
| CN101034660A (en) * | 2006-03-08 | 2007-09-12 | 住友精密工业株式会社 | Basal plate processing device |
| CN101312121A (en) * | 2007-05-24 | 2008-11-26 | 住友精密工业株式会社 | Base plate treating device |
| JP2009019877A (en) * | 2007-07-10 | 2009-01-29 | Dainippon Screen Mfg Co Ltd | Concentration measuring device and concentration measuring method of etching liquid component |
| CN102437050A (en) * | 2010-09-29 | 2012-05-02 | 大日本网屏制造株式会社 | Substrate processing apparatus and substrate processing method |
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2013
- 2013-06-07 WO PCT/JP2013/003611 patent/WO2013187036A1/en active Application Filing
- 2013-06-07 JP JP2014520917A patent/JP5908078B2/en active Active
- 2013-06-07 CN CN201380019952.1A patent/CN104246989B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59110781A (en) * | 1982-12-15 | 1984-06-26 | Toshiba Corp | Apparatus for etching metal plate |
| US6302600B1 (en) * | 1999-05-26 | 2001-10-16 | Nagase & Co., Ltd. | Apparatus for treating surface of boards |
| CN101034660A (en) * | 2006-03-08 | 2007-09-12 | 住友精密工业株式会社 | Basal plate processing device |
| CN101312121A (en) * | 2007-05-24 | 2008-11-26 | 住友精密工业株式会社 | Base plate treating device |
| JP2009019877A (en) * | 2007-07-10 | 2009-01-29 | Dainippon Screen Mfg Co Ltd | Concentration measuring device and concentration measuring method of etching liquid component |
| CN102437050A (en) * | 2010-09-29 | 2012-05-02 | 大日本网屏制造株式会社 | Substrate processing apparatus and substrate processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2013187036A1 (en) | 2016-02-04 |
| WO2013187036A1 (en) | 2013-12-19 |
| CN104246989B (en) | 2016-08-17 |
| JP5908078B2 (en) | 2016-04-26 |
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