CN104238824A - Manufacturing technology for touch screen of improved GFF structure - Google Patents
Manufacturing technology for touch screen of improved GFF structure Download PDFInfo
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- CN104238824A CN104238824A CN201410519571.6A CN201410519571A CN104238824A CN 104238824 A CN104238824 A CN 104238824A CN 201410519571 A CN201410519571 A CN 201410519571A CN 104238824 A CN104238824 A CN 104238824A
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Abstract
The invention relates to the technical field of touch screens, in particular to a manufacturing technology for a touch screen of an improved GFF structure. According to the manufacturing technology, the mode that 'conductive silver paste is overall printed, the conductive silver paste is subjected to laser etching to form a silver paste bridging circuit' and the mode that 'the conductive silver paste is directly subjected to silk screening to form a silver paste bridging circuit' are combined, on the basis that the problems that the silver paste bridging circuit is difficult to process and can be broken easily are solved, control is conducted from the aspects of staging etching liquid choosing, acid-proof ink choosing, conductive silver paste choosing of the etching mode, the yield of products is high, and the performance of the products is also greatly improved compared with similar products.
Description
Technical field
The present invention relates to touch screen technology field, be specifically related to a kind of manufacture craft of touch-screen of GFF structure of improvement.
Background technology
Touch-screen is a kind of remarkable input equipment improving man machine operation interface, have intuitively, simply, advantage efficiently.Touch-screen obtains a wide range of applications in many electronic products, such as mobile phone, PDA, multimedia, public information inquiry system etc.
Conventional touch technology adopts double glazing touch-screen, and it is not only thick and heavy, and can not make the touch-screen of narrow frame.The touch-screen of GFF structure is made up of ITO conducting film+tempered glass cover plate; the touch-screen of GFF structure is owing to only there being two-layer conductive film; its cost, thickness, weight are all obtained significantly improve; but in its manufacture craft can not handling factor many; as in etch process link; once the etching solution used or the improper use such as protecting glue, ITO cabling will go wrong, and causes that product yield is low, poor performance.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, the manufacture craft of the touch-screen of the GFF structure of the improvement that a kind of product yield is high, performance is good is provided.
To achieve these goals, the present invention adopts following technical scheme:
A manufacture craft for the touch-screen of the GFF structure of improvement, it comprises following operation:
A, reach the standard grade sensor, and it comprises the following steps successively:
Steps A 1, toasted by conductive film, this conductive film comprises substrate layer and is arranged at the ITO layer in substrate layer front;
Steps A 2, in the ITO layer of conductive film rim area, print acid-proof ink, first time etching is carried out to the first etching solution of the ITO layer in conductive film viewfinder area, carry out second time etching with the second etching solution, obtain the conductive film of ITO cabling, then remove acid-proof ink with alkali lye;
Steps A 3, in the not contaminated and scraping with protecting group sheet material layers of conductive film substrate layer printing protecting glue, then overall printing conductive silver paste in the ITO layer of conductive film rim area, carries out laser-induced thermal etching to form silver slurry bridging circuit to conductive silver paste;
Steps A 4, the conductive film opened greatly to be cut, obtain the sensor that reaches the standard grade;
B, roll off the production line sensor, and it comprises the following steps successively:
Step B1, toasted by conductive film, this conductive film comprises substrate layer and is arranged at the ITO layer in substrate layer front;
Step B2, in the ITO layer of conductive film rim area, print acid-proof ink, first time etching is carried out to the first etching solution of the ITO layer in conductive film viewfinder area, carry out second time etching with the second etching solution, obtain the conductive film of ITO cabling, then remove acid-proof ink with alkali lye;
Step B3, in the ITO layer of conductive film rim area silk-screened conductive silver slurry to form silver slurry bridging circuit;
Step B4, the conductive film opened greatly to be cut, obtain the sensor that rolls off the production line;
C, binding operation, it comprises the following steps successively:
After step C1, reach the standard grade sensor and the sensor test passes that rolls off the production line, there is the side laminating optical cement of ITO cabling at the sensor that rolls off the production line, carry out combination by the optical cement sensor that will reach the standard grade obtain film sensor, then deaeration with the sensor that rolls off the production line;
Step C2, conducting resinl ACF is fitted on FPC flexible PCB; ;
Step C3, finally FPC flexible PCB to be bound on film sensor, the touch-screen of the GFF structure be improved.
Preferably, in steps A 2 and step B2, described often liter of first etching solution is made up of following raw material:
Hydrochloric acid 180-220 mL
Sodium dihydrogen phosphate 5-20g
Hydrofluoric Acid 70-90 mL
Hydrogen peroxide 40-50mL
Halogenated phosphates 0.1-1 mL
Surplus is water.
Preferably, in steps A 2 and step B2, described often liter of second etching solution is made up of following raw material:
Hydrochloric acid 160-200 mL
Nitric acid 60-80 mL
Oxalic acid 180-200 mL
Iron chloride 10-20g
APES 10-20ml
Surplus is water.
The present invention is by the mode of first time etching with second time etching, effectively control the speed of etching, add the compositions such as corrosion inhibiter in etching solution for etching for the first time and can slow down inhibition speed, carry out preliminary etching, be etched in for the second time on the basis etched for the first time and carry out, etching can be made more accurate, make the etching angle of formation between 40 ~ 60 degree, substantially without side etching phenomenon, product yield is substantially increased like this.
Preferably, in steps A 2 and step B2, described acid-proof ink is made up of the raw material of following weight portion:
Epoxy modified phenolic resin 10-15 part
Ethylene glycol ether acetate 20-30 part
Methyl methacrylate 15-20 part
Melamine formaldehyde resin 10-15 part
Chlorinated polypropylene 3-6 part
NPE 3-8 part
Tetrafluoroethene powder 5-8 part.
Above-mentioned several different resins cooperatively interacts; learn from other's strong points to offset one's weaknesses, obtained acid-proof ink has good toughness and acid resistance, and that can protect etch process in touch-screen manufacturing process carries out after etch process completes smoothly; easy stripping, does not have and remains in material surface or contaminated materials.
Preferably, in steps A 2 and step B2, alkali lye adopts mass percent concentration to be the sodium hydroxide solution of 4-8%.
Preferably, in steps A 2 and step B2, regularly detect the first etching solution and the second etching solution, with the NaOH solution titration of 0.5mol/L, when consuming this NaOH solution <14-17ml, add hydrochloric acid, control ph is between 3-5.
Preferably, the conductive silver paste in steps A 3 and step B3 is made up of the raw material of following weight portion:
Silver powder 55-70 %
Epoxy resin 5-15%
Vibrin 5-15%
Powdered graphite 0.1-1%
SiO 2 powder 1-2%
Diethylene glycol ether acetate 5-15%
Butyl acetate 5-15%,
Wherein, described epoxy resin is PU modified epoxy vinyl ester resin,
Wherein, described vibrin is acrylic type vibrin,
Wherein, described silver powder is micro-silver powder end and the Nano Silver powder constituent of 1:20-1:30 by mass ratio, and the particle diameter at described micro-silver powder end is 10-20 μm, and the particle diameter of described Nano Silver powder is 60-90nm.
PU modified epoxy vinyl ester resin in conductive silver paste and acrylic type vibrin can fully be dissolved in the dicyandiamide solution of butyl acetate and butyl acetate, form organic carrier, there is the silver powder of electric conductivity, can well be disperseed after powdered graphite adds, improve the electric conductivity of conductive silver paste, PU modified epoxy vinyl ester resin, acrylic type vibrin, pulp strength after the employing of SiO 2 powder also makes conductive silver paste sinter is high, good with the adhesion of substrate layer, the requirement that the live width of the electrocondution slurry of touch-screen circuit is more and more thinner can be met.
Preferably, described silver powder is micro-silver powder end and the Nano Silver powder constituent of 1:20-1:30 by mass ratio, and the particle diameter at described micro-silver powder end is 10-20 μm, and the particle diameter of described Nano Silver powder is 60-90nm.Micro-silver powder end in this particle diameter and ratio range and Nano Silver powder can coordinate better, both little quality and the high surface energy of Nano Silver powder can have been utilized, Nano Silver powder is made to be attached to surface, micro-silver powder end, formed core the composite structure of shell, make again in follow-up mixed process, Nano Silver powder is attached to the surface at micro-silver powder end along with moving together at micro-silver powder end, effectively prevent the agglomeration of Nano Silver powder; In addition because Nano Silver powder has high surface energy, the combination of the macromolecular chain in it and epoxy resin and vibrin is tightr, therefore micro-silver powder end can by being attached to the combination of the macromolecular chain in the Nano Silver powder on its surface and epoxy resin and vibrin, the Nano Silver powder not being attached to surface, micro-silver powder end will be filled into the various gaps of epoxy resin and vibrin, final all micro-silver powder ends and Nano Silver powder all obtain dispersed, improve electric conductivity of the present invention.
Preferably, in steps A 1 and step B1, the baking temperature of conductive film is 135-145 DEG C, and baking time is 55-65min, and substrate layer is PET base material layer.
Preferably, before the conductive film opened greatly being cut in steps A 4, be covered with one deck PE diaphragm, tear off when step C1 combines; Before the conductive film opened greatly being cut in step B4, be covered with one deck PE diaphragm, tear off when step C1 combines.
The present invention compared with prior art, beneficial effect is: the present invention is at employing " overall printing conductive silver paste, laser-induced thermal etching is carried out to form silver slurry bridging circuit to conductive silver paste " mode and the mode of " direct silk-screened conductive silver slurry is to form silver slurry bridging circuit " combine, on the basis of problem technique that effectively can prevent silver slurry bridging circuit difficult processing easy fracture, again from etching mode stage by stage, the selection of etching solution, the selection of acid-proof ink, the several aspect of selection of conductive silver paste controls, make the high and performance of product yield of the present invention comparatively like product also improve a lot.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.
embodiment 1.
A manufacture craft for the touch-screen of the GFF structure of improvement, it comprises following operation:
A, reach the standard grade sensor, and it comprises the following steps successively:
Steps A 1, toasted by conductive film, this conductive film comprises substrate layer and is arranged at the ITO layer in substrate layer front;
Steps A 2, in the ITO layer of conductive film rim area, print acid-proof ink, first time etching is carried out to the first etching solution of the ITO layer in conductive film viewfinder area, carry out second time etching with the second etching solution, obtain the conductive film of ITO cabling, then remove acid-proof ink with alkali lye;
Steps A 3, in the not contaminated and scraping with protecting group sheet material layers of conductive film substrate layer printing protecting glue, then overall printing conductive silver paste in the ITO layer of conductive film rim area, carries out laser-induced thermal etching to form silver slurry bridging circuit to conductive silver paste;
Steps A 4, the conductive film opened greatly to be cut, obtain the sensor that reaches the standard grade;
B, roll off the production line sensor, and it comprises the following steps successively:
Step B1, toasted by conductive film, this conductive film comprises substrate layer and is arranged at the ITO layer in substrate layer front;
Step B2, in the ITO layer of conductive film rim area, print acid-proof ink, first time etching is carried out to the first etching solution of the ITO layer in conductive film viewfinder area, carry out second time etching with the second etching solution, obtain the conductive film of ITO cabling, then remove acid-proof ink with alkali lye;
Step B3, in the ITO layer of conductive film rim area silk-screened conductive silver slurry to form silver slurry bridging circuit;
Step B4, the conductive film opened greatly to be cut, obtain the sensor that rolls off the production line;
C, binding operation, it comprises the following steps successively:
After step C1, reach the standard grade sensor and the sensor test passes that rolls off the production line, there is the side laminating optical cement of ITO cabling at the sensor that rolls off the production line, carry out combination by the optical cement sensor that will reach the standard grade obtain film sensor, then deaeration with the sensor that rolls off the production line;
Step C2, conducting resinl ACF is fitted on FPC flexible PCB; ;
Step C3, finally FPC flexible PCB to be bound on film sensor, the touch-screen of the GFF structure be improved.
In steps A 2 and step B2, described often liter of first etching solution is made up of following raw material:
Hydrochloric acid 180 mL
Sodium dihydrogen phosphate 5g
Hydrofluorite 90 mL
Hydrogen peroxide 50mL
Halogenated phosphates 1 mL
Surplus is water.
In steps A 2 and step B2, described often liter of second etching solution is made up of following raw material:
Hydrochloric acid 160mL
Nitric acid 60mL
Oxalic acid 180mL
Iron chloride 10g
APES 20ml
Surplus is water.
In steps A 2 and step B2, described acid-proof ink is made up of the raw material of following weight portion:
Epoxy modified phenolic resin 10 parts
Ethylene glycol ether acetate 30 parts
Methyl methacrylate 15 parts
Melamine formaldehyde resin 15 parts
Chlorinated polypropylene 3 parts
NPE 8 parts
8 parts, tetrafluoroethene powder.
In steps A 2 and step B2, alkali lye adopts mass percent concentration to be the sodium hydroxide solution of 4%.
In steps A 2 and step B2, regularly detect the first etching solution and the second etching solution, with the NaOH solution titration of 0.5mol/L, when consuming this NaOH solution <14ml, add hydrochloric acid, control ph is between 3-5.
Wherein, the conductive silver paste in steps A 3 and step B3 is made up of the raw material of following weight portion:
Silver powder 55%
Epoxy resin 10%
Vibrin 5%
Powdered graphite 1%
SiO 2 powder 2%
Diethylene glycol ether acetate 15%
Butyl acetate 12%,
Wherein, described epoxy resin is PU modified epoxy vinyl ester resin,
Wherein, described vibrin is acrylic type vibrin,
Wherein, described silver powder is micro-silver powder end and the Nano Silver powder constituent of 1:20 by mass ratio, and the particle diameter at described micro-silver powder end is 10 μm, and the particle diameter of described Nano Silver powder is 60nm.
In steps A 1 and step B1, the baking temperature of conductive film is 135 DEG C, and baking time is 55min, and substrate layer is PET base material layer.
Before the conductive film opened greatly being cut in steps A 4, be covered with one deck PE diaphragm, tear off when step C1 combines; Before the conductive film opened greatly being cut in step B4, be covered with one deck PE diaphragm, tear off when step C1 combines.
embodiment 2.
A manufacture craft for the touch-screen of the GFF structure of improvement, it comprises following operation:
A, reach the standard grade sensor, and it comprises the following steps successively:
Steps A 1, toasted by conductive film, this conductive film comprises substrate layer and is arranged at the ITO layer in substrate layer front;
Steps A 2, in the ITO layer of conductive film rim area, print acid-proof ink, first time etching is carried out to the first etching solution of the ITO layer in conductive film viewfinder area, carry out second time etching with the second etching solution, obtain the conductive film of ITO cabling, then remove acid-proof ink with alkali lye;
Steps A 3, in the not contaminated and scraping with protecting group sheet material layers of conductive film substrate layer printing protecting glue, then overall printing conductive silver paste in the ITO layer of conductive film rim area, carries out laser-induced thermal etching to form silver slurry bridging circuit to conductive silver paste;
Steps A 4, the conductive film opened greatly to be cut, obtain the sensor that reaches the standard grade;
B, roll off the production line sensor, and it comprises the following steps successively:
Step B1, toasted by conductive film, this conductive film comprises substrate layer and is arranged at the ITO layer in substrate layer front;
Step B2, in the ITO layer of conductive film rim area, print acid-proof ink, first time etching is carried out to the first etching solution of the ITO layer in conductive film viewfinder area, carry out second time etching with the second etching solution, obtain the conductive film of ITO cabling, then remove acid-proof ink with alkali lye;
Step B3, in the ITO layer of conductive film rim area silk-screened conductive silver slurry to form silver slurry bridging circuit;
Step B4, the conductive film opened greatly to be cut, obtain the sensor that rolls off the production line;
C, binding operation, it comprises the following steps successively:
After step C1, reach the standard grade sensor and the sensor test passes that rolls off the production line, there is the side laminating optical cement of ITO cabling at the sensor that rolls off the production line, carry out combination by the optical cement sensor that will reach the standard grade obtain film sensor, then deaeration with the sensor that rolls off the production line;
Step C2, conducting resinl ACF is fitted on FPC flexible PCB; ;
Step C3, finally FPC flexible PCB to be bound on film sensor, the touch-screen of the GFF structure be improved.
In steps A 2 and step B2, described often liter of first etching solution is made up of following raw material:
Hydrochloric acid 200 mL
Sodium dihydrogen phosphate 10g
Hydrofluorite 80 mL
Hydrogen peroxide 45mL
Halogenated phosphates 0.5mL
Surplus is water.
In steps A 2 and step B2, described often liter of second etching solution is made up of following raw material:
Hydrochloric acid 170 mL
Nitric acid 70 mL
Oxalic acid 190 mL
Iron chloride 15g
APES 15ml
Surplus is water.
In steps A 2 and step B2, described acid-proof ink is made up of the raw material of following weight portion:
Epoxy modified phenolic resin 13 parts
Ethylene glycol ether acetate 24 parts
Methyl methacrylate 18 parts
Melamine formaldehyde resin 13 parts
Chlorinated polypropylene 5 parts
NPE 4 parts
7 parts, tetrafluoroethene powder.
In steps A 2 and step B2, alkali lye adopts mass percent concentration to be the sodium hydroxide solution of 6%.
In steps A 2 and step B2, regularly detect the first etching solution and the second etching solution, with the NaOH solution titration of 0.5mol/L, when consuming this NaOH solution <16ml, add hydrochloric acid, control ph is between 3-5.
Wherein, the conductive silver paste in steps A 3 and step B3 is made up of the raw material of following weight portion:
Silver powder 70%
Epoxy resin 5%
Vibrin 5%
Powdered graphite 0.5%
SiO 2 powder 1.5%
Diethylene glycol ether acetate 10%
Butyl acetate 8%,
Wherein, described epoxy resin is PU modified epoxy vinyl ester resin,
Wherein, described vibrin is acrylic type vibrin,
Wherein, described silver powder is micro-silver powder end and the Nano Silver powder constituent of 1:25 by mass ratio, and the particle diameter at described micro-silver powder end is 15 μm, and the particle diameter of described Nano Silver powder is 75nm.
In steps A 1 and step B1, the baking temperature of conductive film is 140 DEG C, and baking time is 60min, and substrate layer is PET base material layer.
Before the conductive film opened greatly being cut in steps A 4, be covered with one deck PE diaphragm, tear off when step C1 combines; Before the conductive film opened greatly being cut in step B4, be covered with one deck PE diaphragm, tear off when step C1 combines.
embodiment 3.
A manufacture craft for the touch-screen of the GFF structure of improvement, it comprises following operation:
A, reach the standard grade sensor, and it comprises the following steps successively:
Steps A 1, toasted by conductive film, this conductive film comprises substrate layer and is arranged at the ITO layer in substrate layer front;
Steps A 2, in the ITO layer of conductive film rim area, print acid-proof ink, first time etching is carried out to the first etching solution of the ITO layer in conductive film viewfinder area, carry out second time etching with the second etching solution, obtain the conductive film of ITO cabling, then remove acid-proof ink with alkali lye;
Steps A 3, in the not contaminated and scraping with protecting group sheet material layers of conductive film substrate layer printing protecting glue, then overall printing conductive silver paste in the ITO layer of conductive film rim area, carries out laser-induced thermal etching to form silver slurry bridging circuit to conductive silver paste;
Steps A 4, the conductive film opened greatly to be cut, obtain the sensor that reaches the standard grade;
B, roll off the production line sensor, and it comprises the following steps successively:
Step B1, toasted by conductive film, this conductive film comprises substrate layer and is arranged at the ITO layer in substrate layer front;
Step B2, in the ITO layer of conductive film rim area, print acid-proof ink, first time etching is carried out to the first etching solution of the ITO layer in conductive film viewfinder area, carry out second time etching with the second etching solution, obtain the conductive film of ITO cabling, then remove acid-proof ink with alkali lye;
Step B3, in the ITO layer of conductive film rim area silk-screened conductive silver slurry to form silver slurry bridging circuit;
Step B4, the conductive film opened greatly to be cut, obtain the sensor that rolls off the production line;
C, binding operation, it comprises the following steps successively:
After step C1, reach the standard grade sensor and the sensor test passes that rolls off the production line, there is the side laminating optical cement of ITO cabling at the sensor that rolls off the production line, carry out combination by the optical cement sensor that will reach the standard grade obtain film sensor, then deaeration with the sensor that rolls off the production line;
Step C2, conducting resinl ACF is fitted on FPC flexible PCB; ;
Step C3, finally FPC flexible PCB to be bound on film sensor, the touch-screen of the GFF structure be improved.
In steps A 2 and step B2, described often liter of first etching solution is made up of following raw material:
Hydrochloric acid 210 mL
Sodium dihydrogen phosphate 13g
Hydrofluorite 85 mL
Hydrogen peroxide 48mL
Halogenated phosphates 0.8mL
Surplus is water.
In steps A 2 and step B2, described often liter of second etching solution is made up of following raw material:
Hydrochloric acid 190 mL
Nitric acid 75mL
Oxalic acid 190 mL
Iron chloride 12g
APES 13ml
Surplus is water.
In steps A 2 and step B2, described acid-proof ink is made up of the raw material of following weight portion:
Epoxy modified phenolic resin 13 parts
Ethylene glycol ether acetate 28 parts
Methyl methacrylate 17 parts
Melamine formaldehyde resin 13 parts
Chlorinated polypropylene 5 parts
NPE 6 parts
6 parts, tetrafluoroethene powder.
In steps A 2 and step B2, alkali lye adopts mass percent concentration to be the sodium hydroxide solution of 7%.
In steps A 2 and step B2, regularly detect the first etching solution and the second etching solution, with the NaOH solution titration of 0.5mol/L, when consuming this NaOH solution <15ml, add hydrochloric acid, control ph is between 3-5.
Conductive silver paste in steps A 3 and step B3 is made up of the raw material of following weight portion:
Silver powder 60%
Epoxy resin 8%
Vibrin 8%
Powdered graphite 0.1%
SiO 2 powder 1.9%
Diethylene glycol ether acetate 11%
Butyl acetate 11%,
Wherein, described epoxy resin is PU modified epoxy vinyl ester resin,
Wherein, described vibrin is acrylic type vibrin,
Wherein, described silver powder is micro-silver powder end and the Nano Silver powder constituent of 1:27 by mass ratio, and the particle diameter at described micro-silver powder end is 16 μm, and the particle diameter of described Nano Silver powder is 75nm.
In steps A 1 and step B1, the baking temperature of conductive film is 142 DEG C, and baking time is 58min, and substrate layer is PET base material layer.
Before the conductive film opened greatly being cut in steps A 4, be covered with one deck PE diaphragm, tear off when step C1 combines; Before the conductive film opened greatly being cut in step B4, be covered with one deck PE diaphragm, tear off when step C1 combines.
embodiment 4.
A manufacture craft for the touch-screen of the GFF structure of improvement, it comprises following operation:
A, reach the standard grade sensor, and it comprises the following steps successively:
Steps A 1, toasted by conductive film, this conductive film comprises substrate layer and is arranged at the ITO layer in substrate layer front;
Steps A 2, in the ITO layer of conductive film rim area, print acid-proof ink, first time etching is carried out to the first etching solution of the ITO layer in conductive film viewfinder area, carry out second time etching with the second etching solution, obtain the conductive film of ITO cabling, then remove acid-proof ink with alkali lye;
Steps A 3, in the not contaminated and scraping with protecting group sheet material layers of conductive film substrate layer printing protecting glue, then overall printing conductive silver paste in the ITO layer of conductive film rim area, carries out laser-induced thermal etching to form silver slurry bridging circuit to conductive silver paste;
Steps A 4, the conductive film opened greatly to be cut, obtain the sensor that reaches the standard grade;
B, roll off the production line sensor, and it comprises the following steps successively:
Step B1, toasted by conductive film, this conductive film comprises substrate layer and is arranged at the ITO layer in substrate layer front;
Step B2, in the ITO layer of conductive film rim area, print acid-proof ink, first time etching is carried out to the first etching solution of the ITO layer in conductive film viewfinder area, carry out second time etching with the second etching solution, obtain the conductive film of ITO cabling, then remove acid-proof ink with alkali lye;
Step B3, in the ITO layer of conductive film rim area silk-screened conductive silver slurry to form silver slurry bridging circuit;
Step B4, the conductive film opened greatly to be cut, obtain the sensor that rolls off the production line;
C, binding operation, it comprises the following steps successively:
After step C1, reach the standard grade sensor and the sensor test passes that rolls off the production line, there is the side laminating optical cement of ITO cabling at the sensor that rolls off the production line, carry out combination by the optical cement sensor that will reach the standard grade obtain film sensor, then deaeration with the sensor that rolls off the production line;
Step C2, conducting resinl ACF is fitted on FPC flexible PCB; ;
Step C3, finally FPC flexible PCB to be bound on film sensor, the touch-screen of the GFF structure be improved.
In steps A 2 and step B2, described often liter of first etching solution is made up of following raw material:
Hydrochloric acid 220 mL
Sodium dihydrogen phosphate 20g
Hydrofluoric Acid 70 mL
Hydrogen peroxide 40mL
Halogenated phosphates 0.1mL
Surplus is water.
In steps A 2 and step B2, described often liter of second etching solution is made up of following raw material:
Hydrochloric acid 200 mL
Nitric acid 80 mL
Oxalic acid 180 mL
Iron chloride 10g
APES 20ml
Surplus is water.
In steps A 2 and step B2, described acid-proof ink is made up of the raw material of following weight portion:
Epoxy modified phenolic resin 15 parts
Ethylene glycol ether acetate 30 parts
Methyl methacrylate 20 parts
Melamine formaldehyde resin 15 parts
Chlorinated polypropylene 3 parts
NPE 8 parts
8 parts, tetrafluoroethene powder.
In steps A 2 and step B2, alkali lye adopts mass percent concentration to be the sodium hydroxide solution of 8%.
In steps A 2 and step B2, regularly detect the first etching solution and the second etching solution, with the NaOH solution titration of 0.5mol/L, when consuming this NaOH solution <17ml, add hydrochloric acid, control ph is between 3-5.
Wherein, the conductive silver paste in steps A 3 and step B3 is made up of the raw material of following weight portion:
Silver powder 70%
Epoxy resin 5%
Vibrin 5%
Powdered graphite 1%
SiO 2 powder 2%
Diethylene glycol ether acetate 7%
Butyl acetate 10%,
Wherein, described epoxy resin is PU modified epoxy vinyl ester resin,
Wherein, described vibrin is acrylic type vibrin,
Wherein, described silver powder is micro-silver powder end and the Nano Silver powder constituent of 1:30 by mass ratio, and the particle diameter at described micro-silver powder end is 20 μm, and the particle diameter of described Nano Silver powder is 90nm.
In steps A 1 and step B1, the baking temperature of conductive film is 145 DEG C, and baking time is 65min, and substrate layer is PET base material layer.
Before the conductive film opened greatly being cut in steps A 4, be covered with one deck PE diaphragm, tear off when step C1 combines; Before the conductive film opened greatly being cut in step B4, be covered with one deck PE diaphragm, tear off when step C1 combines.
When above-described embodiment uses with touch-screen, the back side of indication and front are as the criterion.
The touch-screen of the GFF structure of the improvement obtained by embodiment 1-4 carries out following test, refers to table 1.
。
Can be found out by table 1 that the touch-screen product yield of the GFF structure of the improvement that the present invention obtains is high, transmittance thermal shock, hot and humid, high-temperature storage performance good, b value, haze value are low.
Finally should be noted that; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although done to explain to the present invention with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to technical scheme of the present invention or equivalent replacement, and not depart from essence and the scope of technical solution of the present invention.
Claims (9)
1. a manufacture craft for the touch-screen of the GFF structure improved, is characterized in that: it comprises following operation:
A, reach the standard grade sensor, and it comprises the following steps successively:
Steps A 1, toasted by conductive film, this conductive film comprises substrate layer and is arranged at the ITO layer in substrate layer front;
Steps A 2, in the ITO layer of conductive film rim area, print acid-proof ink, first time etching is carried out to the first etching solution of the ITO layer in conductive film viewfinder area, carry out second time etching with the second etching solution, obtain the conductive film of ITO cabling, then remove acid-proof ink with alkali lye;
Steps A 3, in the not contaminated and scraping with protecting group sheet material layers of conductive film substrate layer printing protecting glue, then overall printing conductive silver paste in the ITO layer of conductive film rim area, carries out laser-induced thermal etching to form silver slurry bridging circuit to conductive silver paste;
Steps A 4, the conductive film opened greatly to be cut, obtain the sensor that reaches the standard grade;
B, roll off the production line sensor, and it comprises the following steps successively:
Step B1, toasted by conductive film, this conductive film comprises substrate layer and is arranged at the ITO layer in substrate layer front;
Step B2, in the ITO layer of conductive film rim area, print acid-proof ink, first time etching is carried out to the first etching solution of the ITO layer in conductive film viewfinder area, carry out second time etching with the second etching solution, obtain the conductive film of ITO cabling, then remove acid-proof ink with alkali lye;
Step B3, in the ITO layer of conductive film rim area silk-screened conductive silver slurry to form silver slurry bridging circuit;
Step B4, the conductive film opened greatly to be cut, obtain the sensor that rolls off the production line;
C, binding operation, it comprises the following steps successively:
After step C1, reach the standard grade sensor and the sensor test passes that rolls off the production line, there is the side laminating optical cement of ITO cabling at the sensor that rolls off the production line, carry out combination by the optical cement sensor that will reach the standard grade obtain film sensor, then deaeration with the sensor that rolls off the production line;
Step C2, conducting resinl ACF is fitted on FPC flexible PCB; ;
Step C3, finally FPC flexible PCB to be bound on film sensor, the touch-screen of the GFF structure be improved.
2. the manufacture craft of the touch-screen of the GFF structure of a kind of improvement according to claim 1, is characterized in that: in steps A 2 and step B2, described often liter of first etching solution is made up of following raw material:
Hydrochloric acid 180-220 mL
Sodium dihydrogen phosphate 5-20g
Hydrofluoric Acid 70-90 mL
Hydrogen peroxide 40-50mL
Halogenated phosphates 0.1-1 mL
Surplus is water.
3. the manufacture craft of the touch-screen of the GFF structure of a kind of improvement according to claim 1, is characterized in that: in steps A 2 and step B2, described often liter of second etching solution is made up of following raw material:
Hydrochloric acid 160-200 mL
Nitric acid 60-80 mL
Oxalic acid 180-200 mL
Iron chloride 10-20g
APES 10-20ml
Surplus is water.
4. the manufacture craft of the touch-screen of the GFF structure of a kind of improvement according to claim 1, is characterized in that: in steps A 2 and step B2, described acid-proof ink is made up of the raw material of following weight portion:
Epoxy modified phenolic resin 10-15 part
Ethylene glycol ether acetate 20-30 part
Methyl methacrylate 15-20 part
Melamine formaldehyde resin 10-15 part
Chlorinated polypropylene 3-6 part
NPE 3-8 part
Tetrafluoroethene powder 5-8 part.
5. the manufacture craft of the touch-screen of the GFF structure of a kind of improvement according to claim 1, is characterized in that: in steps A 2 and step B2, and alkali lye adopts mass percent concentration to be the sodium hydroxide solution of 4-8%.
6. the manufacture craft of the touch-screen of the GFF structure of a kind of improvement according to claim 1, it is characterized in that: in steps A 2 and step B2, regularly the first etching solution and the second etching solution are detected, with the NaOH solution titration of 0.5mol/L, when consuming this NaOH solution <14-17ml, add hydrochloric acid, control ph is between 3-5.
7. the manufacture craft of the touch-screen of the GFF structure of a kind of improvement according to claim 1, is characterized in that: the conductive silver paste in steps A 3 and step B3 is made up of the raw material of following weight portion:
Silver powder 55-70 %
Epoxy resin 5-15%
Vibrin 5-15%
Powdered graphite 0.1-1%
SiO 2 powder 1-2%
Diethylene glycol ether acetate 5-15%
Butyl acetate 5-15%,
Wherein, described epoxy resin is PU modified epoxy vinyl ester resin,
Wherein, described vibrin is acrylic type vibrin,
Wherein, described silver powder is micro-silver powder end and the Nano Silver powder constituent of 1:20-1:30 by mass ratio, and the particle diameter at described micro-silver powder end is 10-20 μm, and the particle diameter of described Nano Silver powder is 60-90nm.
8. the manufacture craft of the touch-screen of the GFF structure of a kind of improvement according to claim 1, is characterized in that: in steps A 1 and step B1, the baking temperature of conductive film is 135-145 DEG C, and baking time is 55-65min, and substrate layer is PET base material layer.
9. the manufacture craft of the touch-screen of the GFF structure of a kind of improvement according to claim 1, is characterized in that: before being cut by the conductive film opened greatly in steps A 4, is covered with one deck PE diaphragm, tears off when step C1 combines; Before the conductive film opened greatly being cut in step B4, be covered with one deck PE diaphragm, tear off when step C1 combines.
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| CN201410519571.6A CN104238824A (en) | 2014-09-30 | 2014-09-30 | Manufacturing technology for touch screen of improved GFF structure |
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| CN201410519571.6A CN104238824A (en) | 2014-09-30 | 2014-09-30 | Manufacturing technology for touch screen of improved GFF structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108227992A (en) * | 2018-01-03 | 2018-06-29 | 京东方科技集团股份有限公司 | The method made for touch screen |
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