CN104231964B - Grinding pad adhesive tape for fixing and grinding pad bonding structure - Google Patents
Grinding pad adhesive tape for fixing and grinding pad bonding structure Download PDFInfo
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- CN104231964B CN104231964B CN201410476784.5A CN201410476784A CN104231964B CN 104231964 B CN104231964 B CN 104231964B CN 201410476784 A CN201410476784 A CN 201410476784A CN 104231964 B CN104231964 B CN 104231964B
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Abstract
The present invention relates to tape technology field, particularly a kind of grinding pad adhesive tape for fixing and grinding pad bonding structure.This adhesive tape comprises the low adhesion adhesive layer of high temperature laminating high adhesion adhesive layer, core and removable, and the formula of high temperature laminating high adhesion adhesive layer is (by weight): polyacrylate adhesives 100 parts; Terpene phenolic resin 5 ~ 50 parts; Isocyanate curing agent 0.1 ~ 10 part; The low adhesion adhesive layer of removable is polyacrylate adhesives, and the molecular weight of this polyacrylate adhesives is about 50 ~ 2,500,000.A kind of grinding pad bonding structure, PU grinding pad is fitted by above-mentioned adhesive tape.The invention has the beneficial effects as follows: this adhesive tape and grinding pad are formed and adheres by force after fitting, excellent heat resistance, and shear strength is high, avoiding appearance wriggling in use procedure to be shifted and thermotolerance water tolerance low cause come unstuck; Simultaneously releasable is high, decreases the use of material because cleaning cull causes and manpower.
Description
Technical field
The present invention relates to tape technology field, particularly a kind of grinding pad adhesive tape for fixing and grinding pad bonding structure.
Background technology
Grinding pad for Silicon Wafer or glass thinning grinding is generally urethane resin (pu) and foams body piece, the common double sticky tape of current use as Japan amasss hydrochemical double sticky tape and shredder steel disk fit, not only the price of adhesive tape is very expensive, and stripping strength is low after laminating, easy wriggling displacement, thermotolerance poor water resistance, and when peeling off again, shredder steel disk can remain a large amount of cull of appearance, be difficult to cleaning and remove.
Summary of the invention
Technical problem to be solved by this invention is: the existing tape stripping intensity for grinding pad laminating is low, displacement of easily wriggling, thermotolerance poor water resistance, then there will be a large amount of cull when peeling off, and is difficult to cleaning and removes.
The technical solution adopted for the present invention to solve the technical problems is: a kind of grinding pad adhesive tape for fixing, comprise the low adhesion adhesive layer of high temperature laminating high adhesion adhesive layer, core and removable, high temperature laminating high adhesion adhesive layer and the low adhesion adhesive layer of removable lay respectively at the tow sides of core
The formula of high temperature laminating high adhesion adhesive layer is (by weight):
Polyacrylate adhesives 100 parts;
Terpene phenolic resin 5 ~ 50 parts;
Isocyanate curing agent 0.1 ~ 10 part;
Wherein, the molecular weight of polyacrylate adhesives is about 30 ~ 2,000,000,
The low adhesion adhesive layer of removable is polyacrylate adhesives, and the molecular weight of this polyacrylate adhesives is about 50 ~ 2,500,000.
Further restriction, core is polyethylene terephthalate (PET) film or polyolefin film or Kapton.
Further restriction, the thickness of core is 5 ~ 150 μm.
Further restriction, the thickness of high temperature laminating high adhesion adhesive layer is 30 ~ 150 μm.
Further restriction, the thickness of the low adhesion adhesive layer of removable is 10 ~ 100 μm.
A kind of grinding pad bonding structure, comprise PU grinding pad, grinding pad adhesive tape for fixing and shredder steel disk, the high temperature laminating high adhesion adhesive layer of grinding pad adhesive tape for fixing and PU grinding pad are fitted, the low adhesion adhesive layer of removable of grinding pad adhesive tape for fixing and shredder steel disk are fitted, the mode that high temperature laminating high adhesion adhesive layer and PU grinding pad are fitted by hot pressing is fitted, and hot pressing binding temperature is 90 ~ 200 DEG C.
The formula of high temperature laminating high adhesion adhesive layer makes the softening point temperature of sizing agent high, rigidity is strong, wriggling is there will not be under higher temperature conditions, good heat resistance, to have excellent water-resistance, when heating is fitted with grinding pad, high temperature laminating high adhesion adhesive layer penetrates in the abscess of grinding pad, substantially increase contact area, improve bond strength, after being cooled to normal temperature again, high temperature laminating high adhesion adhesive layer is hardening, the sizing agent infiltrating the abscess of grinding pad is stuck in abscess, drastically increases stripping strength.
The invention has the beneficial effects as follows: the two sides of this grinding pad adhesive tape for fixing there are differences, high temperature laminating high adhesion adhesive layer and grinding pad are formed after fitting adheres by force, excellent heat resistance, shear strength is high, avoiding in use procedure occur wriggle displacement and thermotolerance water tolerance low cause come unstuck;
Meanwhile, the low adhesion adhesive layer of removable can ensure to fit reliably with shredder steel disk, and releasable is high, fits peel off without big area cull afterwards for 30 days with shredder steel disk, decreases the use because of the cleaning material that causes of cull and manpower;
Secondly, the adhesive layer of adhesive tape is all vinylformic acid sizing agent system, weathering resistance, good endurance, and stability is very good, can ensure normal temperature environment stock more than 1 year.
Accompanying drawing explanation
Below in conjunction with drawings and embodiments, the present invention is further described;
Fig. 1 is the structural representation of grinding pad adhesive tape for fixing of the present invention;
Fig. 2 is the structural representation of grinding pad bonding structure of the present invention;
In figure: 1. high temperature laminating high adhesion adhesive layer, 2. core, the 3. low adhesion adhesive layer of removable, 4. shredder steel disk, 5. separated type material, 6.PU grinding pad, 7. grinding pad adhesive tape for fixing.
Embodiment
As shown in Figure 1, a kind of grinding pad adhesive tape for fixing, comprise the low adhesion adhesive layer 3 of high temperature laminating high adhesion adhesive layer 1, core 2 and removable, high temperature laminating high adhesion adhesive layer 1 and the low adhesion adhesive layer 3 of removable lay respectively at the tow sides of core 2.
The formula of high temperature laminating high adhesion adhesive layer 1 is (by weight):
Polyacrylate adhesives 100 parts;
Terpene phenolic resin 5 ~ 50 parts, preferably 10 ~ 20 parts;
Isocyanate curing agent 0.1 ~ 10 part;
Wherein, the molecular weight of polyacrylate adhesives is about 30 ~ 2,000,000, solid content 45 ~ 50%.
The thickness of high temperature laminating high adhesion adhesive layer 1 is 30 ~ 150 μm, and more preferably thickness is 70 ~ 120 μm.The second-order transition temperature of high temperature laminating high adhesion adhesive layer 1 is about 0 ~ 50 DEG C, and conventional acrylate pressure-sensitive adhesive second-order transition temperature about-40 ~-10 DEG C.
The low adhesion adhesive layer 3 of removable is polyacrylate adhesives, and the molecular weight of this polyacrylate adhesives is about 50 ~ 2,500,000, solid content 30 ~ 60%.The thickness of the low adhesion adhesive layer 3 of removable is 10 ~ 100 μm, and more preferably thickness is 30 ~ 80 μm.This polyacrylate adhesives molecular weight is large, narrow molecular weight distribution, molecular arrangement is regular, glue-line cohesive strength is large, glue-line is not easy to occur wriggling, and thermotolerance, the uniform surface that has excellent water-resistance are stablized, constant steadily with the bonding force on affixed object surface, evenly, ensure that preferably do not occur coming unstuck, cull phenomenon.The method controlling this polyacrylate adhesives molecular weight and molecualr weight distribution is ordinary method, is not described in detail at this, mainly comprises control temperature of reaction, and initiator repeatedly adds or titration adds, and reaction monomers repeatedly adds or titration adds.
Core 2 is polyethylene terephthalate (PET) film or polyolefin film or Kapton, and the thickness of preferred core 2 is 5 ~ 150 μm, and more preferably thickness is 20 ~ 40 μm.Core 2 ensure that intensity and the deflection of adhesive tape.
Attached separated type material 5 on removable low adhesion adhesive layer 3, separated type material 5 preferably applies separate-type paper or release film, the more preferably two-sided PE film release paper coated with silicon of organosilicon parting agent.
As shown in Figure 2, a kind of grinding pad bonding structure, comprise PU grinding pad 6, grinding pad adhesive tape for fixing 7 and shredder steel disk 4, PU grinding pad 6 is hard perforate PU foam material, the high temperature laminating high adhesion adhesive layer 1 of grinding pad adhesive tape for fixing 7 is fitted with PU grinding pad 6, the low adhesion adhesive layer 3 of removable of grinding pad adhesive tape for fixing 7 is fitted with shredder steel disk 4, the mode that high temperature laminating high adhesion adhesive layer 1 and PU grinding pad 6 are fitted by hot pressing is fitted, hot pressing binding temperature is 90 ~ 200 DEG C, the hot pressing time is 1 ~ 200min, preferred hot pressing temperature is 100 ~ 130 DEG C, the hot pressing time is 10 ~ 30min.After hot pressing, peeling force >=5000g/25mm, 40 DEG C × 1hr × 1kg confining force≤5.0mm, 80 DEG C × 1hr × 1kg confining force≤10.0mm, testing method is with reference to JISZ0237-2000.The low adhesion adhesive layer 3 of removable fits on shredder steel disk 4, peels off without cull after 70 DEG C × 3d.
The actual grinding pad being undertaken fitting by this grinding pad adhesive tape for fixing 7 that uses carries out glass grinding, 30 days are used continuously in containing the aqueous polishing liquid of lapping powder, grinding pad without wriggling displacement and degumming phenomenon, during stripping tape on shredder steel disk 4 without obvious cull vestige.
Claims (6)
1. a grinding pad adhesive tape for fixing, it is characterized in that: comprise high temperature laminating high adhesion adhesive layer (1), core (2) and the low adhesion adhesive layer (3) of removable, high temperature laminating high adhesion adhesive layer (1) and the low adhesion adhesive layer (3) of removable lay respectively at the tow sides of core (2)
The formula of high temperature laminating high adhesion adhesive layer (1) is (by weight):
Polyacrylate adhesives 100 parts;
Terpene phenolic resin 5 ~ 50 parts;
Isocyanate curing agent 0.1 ~ 10 part;
Wherein, the molecular weight of polyacrylate adhesives is 30 ~ 2,000,000,
The low adhesion adhesive layer (3) of removable is polyacrylate adhesives, and the molecular weight of this polyacrylate adhesives is 50 ~ 2,500,000.
2. grinding pad adhesive tape for fixing according to claim 1, is characterized in that: described core (2) is pet film or polyolefin film or Kapton.
3. grinding pad adhesive tape for fixing according to claim 2, is characterized in that: the thickness of described core (2) is 5 ~ 150 μm.
4. grinding pad adhesive tape for fixing according to claim 1, is characterized in that: the thickness of high temperature laminating high adhesion adhesive layer (1) is 30 ~ 150 μm.
5. grinding pad adhesive tape for fixing according to claim 1, is characterized in that: the thickness of the low adhesion adhesive layer (3) of removable is 10 ~ 100 μm.
6. a grinding pad bonding structure, it is characterized in that: comprise PU grinding pad (6), claim 1 or 2 or 3 or the grinding pad adhesive tape for fixing (7) described in 4 or 5 and shredder steel disk (4), high temperature laminating high adhesion adhesive layer (1) and the PU grinding pad (6) of grinding pad adhesive tape for fixing (7) are fitted, the low adhesion adhesive layer (3) of removable and the shredder steel disk (4) of grinding pad adhesive tape for fixing (7) are fitted, the mode that high temperature laminating high adhesion adhesive layer (1) and PU grinding pad (6) are fitted by hot pressing is fitted, hot pressing binding temperature is 90 ~ 200 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410476784.5A CN104231964B (en) | 2014-09-17 | 2014-09-17 | Grinding pad adhesive tape for fixing and grinding pad bonding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410476784.5A CN104231964B (en) | 2014-09-17 | 2014-09-17 | Grinding pad adhesive tape for fixing and grinding pad bonding structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104231964A CN104231964A (en) | 2014-12-24 |
| CN104231964B true CN104231964B (en) | 2016-02-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410476784.5A Active CN104231964B (en) | 2014-09-17 | 2014-09-17 | Grinding pad adhesive tape for fixing and grinding pad bonding structure |
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| Country | Link |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106695538B (en) * | 2015-11-18 | 2019-07-05 | 富鼎电子科技(嘉善)有限公司 | Grind fixed device and the grinding method using the fixed device of the grinding |
| CN105563303A (en) * | 2016-02-15 | 2016-05-11 | 郭玉 | Automatic grinder for motor mirror plate |
| JP7403174B2 (en) * | 2019-03-20 | 2023-12-22 | 丸石産業株式会社 | Surface plate for polishing equipment, polishing equipment, and polishing method |
| CN110153885A (en) * | 2019-06-03 | 2019-08-23 | 西安奕斯伟硅片技术有限公司 | A kind of processing method of grinding pad and the processing unit of grinding pad |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1701106A (en) * | 2003-03-20 | 2005-11-23 | Lg化学株式会社 | Pressure sensitive adhesive composition for electro-magnetic shielding film and electro-magnetic shielding filter using the same |
| CN101343517A (en) * | 2007-07-13 | 2009-01-14 | 琳得科株式会社 | Adhesive, adhesive sheet and optical functional film with adhesive |
| CN202297446U (en) * | 2011-09-29 | 2012-07-04 | 宁波太古化学有限公司 | Grinding double-sided tape |
| CN103305143A (en) * | 2012-03-07 | 2013-09-18 | 日东电工株式会社 | Double-sided adhesive tape |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008111008A (en) * | 2006-10-30 | 2008-05-15 | Sekisui Chem Co Ltd | Double-sided pressure-sensitive adhesive tape for fixing abrasive |
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2014
- 2014-09-17 CN CN201410476784.5A patent/CN104231964B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1701106A (en) * | 2003-03-20 | 2005-11-23 | Lg化学株式会社 | Pressure sensitive adhesive composition for electro-magnetic shielding film and electro-magnetic shielding filter using the same |
| CN101343517A (en) * | 2007-07-13 | 2009-01-14 | 琳得科株式会社 | Adhesive, adhesive sheet and optical functional film with adhesive |
| CN202297446U (en) * | 2011-09-29 | 2012-07-04 | 宁波太古化学有限公司 | Grinding double-sided tape |
| CN103305143A (en) * | 2012-03-07 | 2013-09-18 | 日东电工株式会社 | Double-sided adhesive tape |
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| Publication number | Publication date |
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| CN104231964A (en) | 2014-12-24 |
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Address after: 213018 No. 576 Zhongwu Avenue, Changzhou City, Jiangsu Province Patentee after: Changzhou Haotian new Mstar Technology Ltd Address before: 213000 No. 1-45 Qinye West Road, Zhonglou Economic Development Zone, Changzhou City, Jiangsu Province Patentee before: CHANGZHOU HAOTIAN RUBBER TECHNOLOGY CO., LTD. |