CN106883793A - A kind of high temperature resistant peelable type pressure sensitive adhesive and the adhesive tape containing the pressure sensitive adhesive - Google Patents
A kind of high temperature resistant peelable type pressure sensitive adhesive and the adhesive tape containing the pressure sensitive adhesive Download PDFInfo
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- CN106883793A CN106883793A CN201710123184.4A CN201710123184A CN106883793A CN 106883793 A CN106883793 A CN 106883793A CN 201710123184 A CN201710123184 A CN 201710123184A CN 106883793 A CN106883793 A CN 106883793A
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- pressure sensitive
- sensitive adhesive
- high temperature
- temperature resistant
- type pressure
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Abstract
A kind of high temperature resistant peelable type pressure sensitive adhesive and the adhesive tape containing the pressure sensitive adhesive, the present invention relates to pressure sensitive adhesive technical field;High temperature resistant peelable type pressure sensitive adhesive is prepared from by the raw material of following parts by weight:100 parts of polyacrylate prepolymer, 1~20 part of epoxy resin, 0.5~15 part of epoxy hardener, 0.1~5 part of accelerator, 0~30 part of tackifier, 0~30 part of diluent.Its high temperature resistant and strippable property are significantly improved, the adhesive tape of 25 μm of 25 μm of PET bondline thickness being made, 180 ° of peeling force controllables are 3~10N/25mm, initial bonding strength (rolling ball method) is 12~18#, 180 DEG C of holding powers reach 1kg × 1hr and do not drop, stripping cold and hot to the 150 DEG C × 6hr of strippable property of standard SUS steel plates not cull.
Description
Technical field
The present invention relates to pressure sensitive adhesive technical field, and in particular to a kind of high temperature resistant peelable type pressure sensitive adhesive and pressure-sensitive containing this
The adhesive tape of glue.
Background technology
Pressure sensitive adhesive product is widely used in packaging, automobile, electric appliance and electronic, construction material, Aero-Space, health care and family
The industry-by-industries such as front yard daily necessities, play and the various bonding effects such as tie up, protect, seal, insulate, recognize and fix.Due to pressure
The industry that quick glue product is used is extremely wide, and whether its classification is also more complicated, but finally needed from bonded object surface by it
Strip down, pressure sensitive adhesive (band) can be divided into two major classes:Peelable type pressure sensitive adhesive (band) and persistent form pressure sensitive adhesive (band).Wherein,
The pressure sensitive adhesive (band) of peelable type is in medical treatment, automobile, household electrical appliance, construction material, LCD liquid crystal boards and some best bright finish materials
The attention of people, its demand and range of application are increasingly subject in material (such as mirror face stainless steel plate) surface temporary protective film field
All expanding, in continuous ascendant trend.
Peelable type pressure sensitive adhesive proposes requirement higher to the removability of pressure sensitive adhesive, and its main difficult technical is:
1. peeling force increases too fast, causes to peel off again difficult or is difficult to peel off;Especially out of doors or bar is being used when 2. peeling off again
Under part through being heated, after the effect such as ultraviolet light and moisture, cull or ghost are being left by protection materials surface, to by protection materials
Surface pollutes.
The Typical Representative of peelable type pressure sensitive adhesive product has Pressure-sensitive adhesive belt for surface protection, masking pressure sensitive adhesive tape and account
Patch.Only by taking surface protection pressure sensitive adhesive tape as an example, according to statistics, the annual requirement of domestic surface protection tape has reached 1,200,000,000 within 2005
m2.The 3M companies in such as U.S. of external producer, French Nuo Fansaier companies, the Pola Fei Mu companies of Germany and De Sha adhesive tapes are public
Department, the ponding chemical company of Japan and Dong electrician company, three sesame companies of South Korea and UTC adhesive tapes company etc. sell at home
Various surface protection tapes, some set up factory in Shanghai and nearby areas.The product of these foreign corporations is mainly concentrated
In fields such as automobile, electronics and optical precision instruments, product of China's Protection glue with manufacturer is relatively low due to technology content, main
The industries such as building materials, furniture and electrical equipment are concentrated on, the class gap with foreign corporation product is larger.
The content of the invention
Defect and deficiency it is an object of the invention to be directed to prior art, there is provided a kind of process is simple, it is reasonable in design, make
Adhesive tape with convenient high temperature resistant peelable type pressure sensitive adhesive and containing the pressure sensitive adhesive, its high temperature resistant and strippable property are significantly improved,
The adhesive tape of 25 μm of 25 μm of PET bondline thickness being made, 180 ° of peeling force controllables are 3~10N/25mm, initial bonding strength (rolling ball method)
It is 12~18#, 180 DEG C of holding powers reach 1kg × 1hr and do not drop, the strippable property cold and hot strippings of 150 DEG C × 6hr to standard SUS steel plates
Not cull.
To achieve the above object, the high temperature resistant peelable type pressure sensitive adhesive in the present invention is prepared by the raw material of following parts by weight
Form:100 parts of polyacrylate prepolymer, 1~20 part of epoxy resin, 0.5~15 part of epoxy hardener, accelerator 0.1~5
Part, 0~30 part of tackifier, 0~30 part of diluent.
Further, it is as follows that described high temperature resistant peelable type pressure sensitive adhesive obtains procedure of processing:
1st, add 60 DEG C~80 DEG C mixing of reactor equal polyacrylate prepolymer, epoxy resin, tackifier, diluent
It is even;
2nd, the 30~60% of accelerator total amount is added, and is warming up to 90~120 DEG C, reaction 2 hours, cooling down discharging;
3rd, in coating using preceding, remaining accelerator and curing agent are added, stirring at normal temperature is after 10~30 minutes, at 8 hours
Inside use.
Further, the glass transition temperature of described polyacrylate prepolymer is not higher than -30 DEG C, weight average molecular weight
It is 10000~50000, molecular weight distributing index is 1.5~2.5, and acid number is 30~90mgKOH/g, by acrylic acid, metering system
One or two monomers in acid, with the acrylic ester monomer such as butyl acrylate, Isooctyl acrylate monomer, hydroxy-ethyl acrylate,
One or more monomer copolymerization in vinylacetate, styrene is formed.
Further, the epoxide equivalent of described epoxy resin is 170~300g/eq, is glycidol ethers, shrinks sweet
One or more in grease class, glycidol amine, aliphatic category or alicyclic based epoxy resin.
Further, the solidification temperature of described epoxy hardener is less than 150 DEG C, and hardening time is less than 8 hours, is fat
One or more in the epoxy hardeners such as amine, aromatic amine, amide-type, modified amine, carboxylic acid and anhydrides.
Further, described accelerator be tertiary amines, quaternary ammonium salt, organic tin, organic phosphine, boron trifluoride and its
One or more in the accelerator such as complex compound.
Further, the softening point of described tackifier is more than or equal to 100 DEG C, is rosin and modified rosin class thickening tree
One or more in the tackifying resins such as fat, terpene resin, Petropols.
Further, described diluent is one or more in ethyl acetate, methyl alcohol, ethanol, toluene.
Further, the described adhesive tape containing the pressure sensitive adhesive is made up of base material and high temperature resistant peelable type pressure sensitive adhesive.
Further, the one side of described base material uses the release treatment of mould release, and another side sided corona treatment, layer upper surface is release
Power is 10~50g/25mm, and corona surface dyne value is not less than 48, and base material material is polyester film, Kapton, polyethylene
One kind in film, polypropylene film.
The present invention has the beneficial effect that:A kind of high temperature resistant peelable type pressure sensitive adhesive of the present invention and contain the pressure sensitive adhesive
Adhesive tape, its high temperature resistant and strippable property are significantly improved, the adhesive tape of 25 μm of 25 for being made μm PET bondline thickness, and 180 ° of peeling forces can
3~10N/25mm is regulated to, initial bonding strength (rolling ball method) is 12~18#, and 180 DEG C of holding powers reach 1kg × 1hr and do not drop, to mark
150 DEG C × the 6hr of strippable property of quasi- SUS steel plates is cold and hot to shell not cull.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
Other accompanying drawings are obtained with according to these accompanying drawings.
Fig. 1 is the structural representation of adhesive tape in the present invention.
Description of reference numerals:
Glue-line 1, PET base material 2, mould release 3.
Specific embodiment
The present invention is further illustrated below in conjunction with the accompanying drawings.
Referring to shown in Fig. 1, high temperature resistant peelable type pressure sensitive adhesive in this specific embodiment by following parts by weight original
Material is prepared from:100 parts of polyacrylate prepolymer, 10 parts of epoxy resin, 10 parts of epoxy hardener, 5 parts of accelerator, tackifier
20 parts, 20 parts of diluent.
Further, it is as follows that described high temperature resistant peelable type pressure sensitive adhesive obtains procedure of processing:
1st, 80 DEG C of reactor is added to be well mixed polyacrylate prepolymer, epoxy resin, tackifier, diluent;
2nd, the 50% of accelerator total amount is added, and is warming up to 100 DEG C, reaction 2 hours, cooling down discharging;
3rd, remaining accelerator and curing agent are added using preceding in coating, stirring at normal temperature made after 20 minutes in 8 hours
With.
Further, the glass transition temperature of described polyacrylate prepolymer is not higher than -30 DEG C, weight average molecular weight
It is 10000~50000, molecular weight distributing index is 1.5~2.5, and acid number is 30~90mgKOH/g, by acrylic acid, metering system
One or two monomers in acid, with the acrylic ester monomer such as butyl acrylate, Isooctyl acrylate monomer, hydroxy-ethyl acrylate,
One or more monomer copolymerization in vinylacetate, styrene is formed.
Further, the epoxide equivalent of described epoxy resin is 170~300g/eq, is glycidol ethers, shrinks sweet
One or more in grease class, glycidol amine, aliphatic category or alicyclic based epoxy resin.
Further, the solidification temperature of described epoxy hardener is less than 150 DEG C, and hardening time is less than 8 hours, is fat
One or more in the epoxy hardeners such as amine, aromatic amine, amide-type, modified amine, carboxylic acid and anhydrides.
Further, described accelerator be tertiary amines, quaternary ammonium salt, organic tin, organic phosphine, boron trifluoride and its
One or more in the accelerator such as complex compound.
Further, the softening point of described tackifier is more than or equal to 100 DEG C, is rosin and modified rosin class thickening tree
One or more in the tackifying resins such as fat, terpene resin, Petropols.
Further, described diluent is one or more in ethyl acetate, methyl alcohol, ethanol, toluene.
Further, the described adhesive tape containing the pressure sensitive adhesive is made up of base material and high temperature resistant peelable type pressure sensitive adhesive.
Further, the one side of described base material uses the release treatment of mould release, and another side sided corona treatment, layer upper surface is release
Power is 10~50g/25mm, and corona surface dyne value is not less than 48, and base material material is polyester film, Kapton, polyethylene
One kind in film, polypropylene film.
This specific embodiment has the beneficial effect that:A kind of high temperature resistant peelable type pressure sensitive adhesive described in this specific embodiment
And the adhesive tape containing the pressure sensitive adhesive, its high temperature resistant and strippable property significantly improve, the glue of 25 μm of 25 for being made μm PET bondline thickness
Band, 180 ° of peeling force controllables are 3~10N/25mm, and initial bonding strength (rolling ball method) is 12~18#, 180 DEG C of holding powers reach 1kg ×
1hr does not drop, stripping cold and hot to the 150 DEG C × 6hr of strippable property of standard SUS steel plates not cull.
Embodiment one:
1st, by polyacrylate prepolymer 100g, E44 (epoxy resin) 16g, pentalyn (tackifier) 10g,
Ethyl acetate (diluent) 10g adds 60 DEG C~80 DEG C of reactor to be well mixed;
2nd, dimethylethanolamine (accelerator) 1.5g is added, and is warming up to 90~120 DEG C, reacted 2 hours, cooling down goes out
Material;
3rd, remaining dimethylethanolamine (accelerator) 1.5g and polyamide 6 50 (curing agent) are added using preceding in coating
10g, stirring at normal temperature 10~30 minutes (being used in 8 hours);
4th, by above-mentioned pressure sensitive adhesive, it is applied in 25 μm of PET base materials, 140 DEG C of dryings 2 minutes after room temperature 24hr, are carried out
Performance test;
5th, performance data:180 ° of peeling forces are 4.5N/25mm, and initial bonding strength (rolling ball method) is 13#, and 180 DEG C of holding powers reach
1kg × 1hr does not drop, stripping cold and hot to the 150 DEG C × 6hr of strippable property of standard SUS steel plates not cull.
Case study on implementation two:
1st, by polyacrylate prepolymer 100g, E44 (epoxy resin) 8g, pentalyn (tackifier) 20g, second
Acetoacetic ester (diluent) 20g adds 60 DEG C~80 DEG C of reactor to be well mixed;
2nd, dimethylethanolamine (accelerator) 0.6g is added, and is warming up to 90~120 DEG C, reacted 2 hours, cooling down goes out
Material;
3rd, remaining dimethylethanolamine (accelerator) 0.4g and polyamide 6 50 (curing agent) are added using preceding in coating
3g, stirring at normal temperature 10~30 minutes (being used in 8 hours);
4th, by above-mentioned pressure sensitive adhesive, it is applied in 25 μm of PET base materials, 140 DEG C of dryings 2 minutes after room temperature 24hr, are carried out
Performance test;
5th, performance data:180 ° of peeling forces are 9.6N/25mm, and initial bonding strength (rolling ball method) is 15#, and 180 DEG C of holding powers reach
1kg × 1hr does not drop, stripping cold and hot to the 150 DEG C × 6hr of strippable property of standard SUS steel plates not cull.
Case study on implementation three:
1st, by polyacrylate prepolymer 100g, E44 (epoxy resin) 10g, pentalyn (tackifier) 5g, second
Acetoacetic ester (diluent) 10g adds 60 DEG C~80 DEG C of reactor to be well mixed;
2nd, dimethylethanolamine (accelerator) 0.6g is added, and is warming up to 90~120 DEG C, reacted 2 hours, cooling down goes out
Material;
3rd, remaining dimethylethanolamine (accelerator) 0.4g and polyamide 6 50 (curing agent) are added using preceding in coating
2g, stirring at normal temperature 10~30 minutes (being used in 8 hours);
4th, by above-mentioned pressure sensitive adhesive, it is applied in 25 μm of PET base materials, 140 DEG C of dryings 2 minutes after room temperature 24hr, are carried out
Performance test;
5th, performance data:180 ° of peeling forces are 7.9N/25mm, and initial bonding strength (rolling ball method) is 18#, and 180 DEG C of holding powers reach
1kg × 1hr does not drop, stripping cold and hot to the 150 DEG C × 6hr of strippable property of standard SUS steel plates not cull.
The above, is merely illustrative of the technical solution of the present invention and unrestricted, and those of ordinary skill in the art are to this hair
Other modifications or equivalent that bright technical scheme is made, without departing from the spirit and scope of technical solution of the present invention,
All should cover in the middle of scope of the presently claimed invention.
Claims (9)
1. a kind of high temperature resistant peelable type pressure sensitive adhesive and the adhesive tape containing the pressure sensitive adhesive, it is characterised in that:Described contains this
The adhesive tape of pressure sensitive adhesive is made up of base material and high temperature resistant peelable type pressure sensitive adhesive;Described high temperature resistant peelable type pressure sensitive adhesive by with
The raw material of lower parts by weight is prepared from:100 parts of polyacrylate prepolymer, 1~20 part of epoxy resin, epoxy hardener 0.5
~15 parts, 0.1~5 part of accelerator, 0~30 part of tackifier, 0~30 part of diluent.
2. a kind of high temperature resistant peelable type pressure sensitive adhesive according to claim 1 and the adhesive tape containing the pressure sensitive adhesive, it is special
Levy and be:It is as follows that described high temperature resistant peelable type pressure sensitive adhesive obtains procedure of processing:
(1), add 60 DEG C~80 DEG C mixing of reactor equal polyacrylate prepolymer, epoxy resin, tackifier, diluent
It is even;
(2) the 30~60% of accelerator total amount, is added, and is warming up to 90~120 DEG C, reaction 2 hours, cooling down discharging;
(3), in coating using preceding, remaining accelerator and curing agent are added, stirring at normal temperature is after 10~30 minutes, in 8 hours
Use.
3. a kind of high temperature resistant peelable type pressure sensitive adhesive according to claim 1 and the adhesive tape containing the pressure sensitive adhesive, it is special
Levy and be:The glass transition temperature of described polyacrylate prepolymer is not higher than -30 DEG C, and weight average molecular weight is 10000~
50000, molecular weight distributing index is 1.5~2.5, and acid number is 30~90mgKOH/g, by acrylic acid, methacrylic acid
Kind or two kinds of monomers, with acrylic ester monomer, the vinyl acetate such as butyl acrylate, Isooctyl acrylate monomer, hydroxy-ethyl acrylate
One or more monomer copolymerization in ester, styrene is formed.
4. a kind of high temperature resistant peelable type pressure sensitive adhesive according to claim 1 and the adhesive tape containing the pressure sensitive adhesive, it is special
Levy and be:The epoxide equivalent of described epoxy resin is 170~300g/eq, is glycidol ethers, glycidol esters, contracting
One or more in water glycerine amine, aliphatic category or alicyclic based epoxy resin.
5. a kind of high temperature resistant peelable type pressure sensitive adhesive according to claim 1 and the adhesive tape containing the pressure sensitive adhesive, it is special
Levy and be:The solidification temperature of described epoxy hardener is less than 150 DEG C, and hardening time is less than 8 hours, is fatty amines, fragrance
One or more in the epoxy hardeners such as amine, amide-type, modified amine, carboxylic acid and anhydrides.
6. a kind of high temperature resistant peelable type pressure sensitive adhesive according to claim 1 and the adhesive tape containing the pressure sensitive adhesive, it is special
Levy and be:Described accelerator is that tertiary amines, quaternary ammonium salt, organic tin, organic phosphine, boron trifluoride and its complex compound etc. promote
One or more entered in agent.
7. a kind of high temperature resistant peelable type pressure sensitive adhesive according to claim 1 and the adhesive tape containing the pressure sensitive adhesive, it is special
Levy and be:The softening point of described tackifier is more than or equal to 100 DEG C, is rosin and modified rosin class tackifying resin, terpenes tree
One or more in the tackifying resins such as fat, Petropols.
8. a kind of high temperature resistant peelable type pressure sensitive adhesive according to claim 1 and the adhesive tape containing the pressure sensitive adhesive, it is special
Levy and be:Described diluent is one or more in ethyl acetate, methyl alcohol, ethanol, toluene.
9. a kind of high temperature resistant peelable type pressure sensitive adhesive according to claim 1 and the adhesive tape containing the pressure sensitive adhesive, it is special
Levy and be:The one side of described base material use the release treatment of mould release, another side sided corona treatment, layer upper surface off-type force be 10~
50g/25mm, corona surface dyne value is not less than 48, and base material material is polyester film, Kapton, polyethylene film, poly- third
One kind in alkene film.
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Cited By (16)
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CN107779132A (en) * | 2017-09-13 | 2018-03-09 | 苏州永诺电子材料有限公司 | Peelable type pressure sensitive adhesive and preparation method thereof and the method with its making diaphragm |
CN109021882A (en) * | 2018-06-29 | 2018-12-18 | 佛山市高明区爪和新材料科技有限公司 | A kind of house leakage-repairing glue |
CN109054669A (en) * | 2018-08-14 | 2018-12-21 | 新恒东薄膜材料(常州)有限公司 | Mute black Wear-resistant, high-temperature resistant adhesive tape of one kind and preparation method thereof |
CN109266257A (en) * | 2018-09-29 | 2019-01-25 | 广州都邦材料科技有限公司 | Acrylic Pressure Sensitive Adhesive and preparation method thereof, electronic product |
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CN110527454A (en) * | 2019-08-20 | 2019-12-03 | 常州都铂高分子有限公司 | A kind of novel high temperature resistant peelable type pressure sensitive adhesive tape |
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CN110527454A (en) * | 2019-08-20 | 2019-12-03 | 常州都铂高分子有限公司 | A kind of novel high temperature resistant peelable type pressure sensitive adhesive tape |
CN111440573A (en) * | 2019-09-26 | 2020-07-24 | 宁波激智创新材料研究院有限公司 | Formula of pressure-sensitive adhesive, pressure-sensitive adhesive glue, pressure-sensitive adhesive coating liquid and adhesive tape |
CN113134132A (en) * | 2020-01-20 | 2021-07-20 | 烟台华运新材料科技有限公司 | Release paper applied to medical indwelling needle patch |
CN112795268A (en) * | 2021-02-01 | 2021-05-14 | 汕头市亮彩新材料科技有限公司 | High-temperature-resistant molecular release layer coating and method for preparing broken drill powder by using same |
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CN114316838A (en) * | 2022-01-14 | 2022-04-12 | 安徽富印新材料有限公司 | Fluorescent antistatic pressure-sensitive adhesive tape |
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