CN104227980B - EMC continuous punching sheet-shaped LED lead frame die package structure - Google Patents
EMC continuous punching sheet-shaped LED lead frame die package structure Download PDFInfo
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- CN104227980B CN104227980B CN201410473805.8A CN201410473805A CN104227980B CN 104227980 B CN104227980 B CN 104227980B CN 201410473805 A CN201410473805 A CN 201410473805A CN 104227980 B CN104227980 B CN 104227980B
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- China
- Prior art keywords
- die
- fixed
- pin
- bushing
- pushing plate
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses EMC continuous punching sheet-shaped LED lead frame die package structure, it includes fixed half and moving half, cover half includes that the adhesive tape mold insert being positioned at centre and the die being positioned at both sides are bushing, the side of adhesive tape mold insert is fixed in die by side bumper block and fixes on seat, die is fixed seat bottom portion and is connected with needle pushing plate by screw, needle pushing plate is fixed in pushes pin in fixed plate, screw is positioned at needle pushing plate part and is fitted with spring and spring bushing, spring top exposes needle pushing plate and die is fixed seated connection and touched, also it is connected with on die is bushing and sequentially passes through die and fix seat, needle pushing plate is pushed pin and the pin that resets with fixed plate of pushing pin, adhesive tape mold insert center is fitted with sequentially passing through die and fixes seat, needle pushing plate enters packing element with fixed plate of pushing pin；Dynamic model includes that, side bumper block, die bushing with cover half adhesive tape mold insert one to one, die are fixed seat, needle pushing plate, fixed plate of pushing pin, spring, spring bushing, pushed pin and the pin that resets, and is fitted with die core insert in die is bushing.
Description
Technical field
The present invention relates to die package, particularly relate to EMC continuous punching sheet-shaped LED lead frame die package structure.
Background technology
EMC encapsulation is one of current high-end developing direction of LED industry, EMC support capsulation material is epoxy resin, this material has the advantages such as uv-resistant, hot conditions stability inferior is good, the coefficient of expansion is low, many support factories also illustrate that, both at home and abroad will progressively convert EMC support in backlight market, including illumination market the most in this way.The thermoplastic of the most original employing PPA resin injection can not meet high-end market demand for development, is substituted in the urgent need to new die package form.
Summary of the invention
The technical problem to be solved in the present invention is that the thermoplastic of existing employing PPA resin injection can not meet the demand that EMC encapsulates, and provides a kind of EMC continuous punching sheet-shaped LED lead frame die package structure for this.
The technical scheme is that EMC continuous punching sheet-shaped LED lead frame die package structure, it includes fixed half and moving half, described cover half includes that the adhesive tape mold insert being positioned at centre and the die being positioned at both sides are bushing, the side of described adhesive tape mold insert is fixed in die by side bumper block and fixes on seat, described die is fixed seat bottom portion and is connected with needle pushing plate by screw, described needle pushing plate is fixed in pushes pin in fixed plate, described screw is positioned at needle pushing plate part and is fitted with spring and spring bushing, described spring top exposes needle pushing plate and die is fixed seated connection and touched, also it is connected with on described die is bushing and sequentially passes through die and fix seat, needle pushing plate is pushed pin and the pin that resets with fixed plate of pushing pin, described adhesive tape mold insert center is fitted with sequentially passing through die and fixes seat, needle pushing plate enters packing element with fixed plate of pushing pin；Described dynamic model includes that, side bumper block, die bushing with cover half adhesive tape mold insert one to one, die are fixed seat, needle pushing plate, fixed plate of pushing pin, spring, spring bushing, pushed pin and the pin that resets, and is fitted with die core insert in described die is bushing.
The improvement of such scheme is also to be respectively and fixedly connected with on described fixed half and moving half to run through needle pushing plate and the contour post of fixed plate of pushing pin.
The invention has the beneficial effects as follows that the lead frame utilizing existing injection mold to produce is not in the case of changing；Being capable of the encapsulation of EMC thermosetting resin material, the most only our company saves diel expense, and effectively utilizes existing equipment for client, saves large quantities of development cost and development time for client；Also save the plenty of time for EMC support in marketing simultaneously.
Accompanying drawing explanation
Fig. 1 is cover half schematic diagram of the present invention；
Fig. 2 is the side view of Fig. 1；
Fig. 3 is dynamic model schematic diagram of the present invention；
Fig. 4 is the side view of Fig. 3；
In figure, 1, adhesive tape mold insert, 2, die core insert, 3, side bumper block, 4, enter packing element, 5, die fix seat, 6, push pin, 7, reset pin, 8, needle pushing plate, 9, fixed plate of pushing pin, 10, contour post, 11, spring, 12 spring bushings, 13, die bushing.
Detailed description of the invention
The present invention will be further described below in conjunction with the accompanying drawings.
Such as Fig. 1, shown in Fig. 2, the present invention includes fixed half and moving half, described cover half includes the adhesive tape mold insert 1 being positioned at centre and is positioned at the die bushing 13 on both sides, the side of described adhesive tape mold insert is fixed in die by side bumper block 3 and fixes on seat 5, described die is fixed seat bottom portion and is connected with needle pushing plate 8 by screw, described needle pushing plate is fixed in pushes pin in fixed plate 9, described screw is positioned at needle pushing plate part and is fitted with spring 11 and spring bushing 12, described spring top exposes needle pushing plate and die is fixed seated connection and touched, also it is connected with on described die is bushing and sequentially passes through die and fix seat, needle pushing plate and fixed plate of pushing pin push pin 6 and reset pin 7, described adhesive tape mold insert center is fitted with sequentially passing through die and fixes seat, needle pushing plate enters packing element 4 with fixed plate of pushing pin；Described dynamic model includes that, side bumper block, die bushing with cover half adhesive tape mold insert one to one, die are fixed seat, needle pushing plate, fixed plate of pushing pin, spring, spring bushing, pushed pin and the pin that resets, and is fitted with die core insert 2 in described die is bushing.
Heat radiation when using for the ease of the present invention, can also be respectively and fixedly connected with on fixed half and moving half and run through needle pushing plate and the contour post 10 of fixed plate of pushing pin.Entering packing element and fit in adhesive tape mold insert, and side bumper block bushing with die is installed along with in die fixed block and makes it fixing wherein；Spring 11 ejecting product after 6 die sinkings that makes to push pin makes it reset again；Die core insert 2 is assemblied in die bushing 13, with enter adhesive tape mold insert and side bumper block is installed along with in die fixed block and makes it fixing wherein.
Claims (2)
1.EMC continuous punching sheet-shaped LED lead frame die package structure, it is characterized in that it includes fixed half and moving half, described cover half includes that the adhesive tape mold insert being positioned at centre and the die being positioned at both sides are bushing, the side of described adhesive tape mold insert is fixed in die by side bumper block and fixes on seat, described die is fixed seat bottom portion and is connected with needle pushing plate by screw, described needle pushing plate is fixed in pushes pin in fixed plate, described screw is positioned at needle pushing plate part and is fitted with spring and spring bushing, described spring top exposes needle pushing plate and die is fixed seated connection and touched, also it is connected with on described die is bushing and sequentially passes through die and fix seat, needle pushing plate is pushed pin and the pin that resets with fixed plate of pushing pin, described adhesive tape mold insert center is fitted with sequentially passing through die and fixes seat, needle pushing plate enters packing element with fixed plate of pushing pin；Described dynamic model includes that, side bumper block, die bushing with cover half adhesive tape mold insert one to one, die are fixed seat, needle pushing plate, fixed plate of pushing pin, spring, spring bushing, pushed pin and the pin that resets, and is fitted with die core insert in described die is bushing.
2. EMC continuous punching sheet-shaped LED lead frame die package structure as claimed in claim 1, is characterized in that also being respectively and fixedly connected with on described fixed half and moving half and runs through needle pushing plate and the contour post of fixed plate of pushing pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410473805.8A CN104227980B (en) | 2014-09-17 | 2014-09-17 | EMC continuous punching sheet-shaped LED lead frame die package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410473805.8A CN104227980B (en) | 2014-09-17 | 2014-09-17 | EMC continuous punching sheet-shaped LED lead frame die package structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104227980A CN104227980A (en) | 2014-12-24 |
| CN104227980B true CN104227980B (en) | 2016-11-09 |
Family
ID=52217309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410473805.8A Active CN104227980B (en) | 2014-09-17 | 2014-09-17 | EMC continuous punching sheet-shaped LED lead frame die package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104227980B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101767410A (en) * | 2009-12-29 | 2010-07-07 | 凯达电子(昆山)有限公司 | Double-color mold with sequential slider drive mechanism |
| CN203141754U (en) * | 2012-12-29 | 2013-08-21 | 牟维军 | Die mechanism provided with metal insert |
| CN203792581U (en) * | 2014-04-29 | 2014-08-27 | 成都中科精密模具有限公司 | Novel plastic package mold with micro matrix lead frame attached to surface |
| CN204160701U (en) * | 2014-09-17 | 2015-02-18 | 安徽中智光源科技有限公司 | EMC continuous punching sheet-shaped LED lead frame die package structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013251422A (en) * | 2012-06-01 | 2013-12-12 | Apic Yamada Corp | Substrate for mounting led chip, led package, mold, and manufacturing methods of substrate for mounting led chip and led package |
-
2014
- 2014-09-17 CN CN201410473805.8A patent/CN104227980B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101767410A (en) * | 2009-12-29 | 2010-07-07 | 凯达电子(昆山)有限公司 | Double-color mold with sequential slider drive mechanism |
| CN203141754U (en) * | 2012-12-29 | 2013-08-21 | 牟维军 | Die mechanism provided with metal insert |
| CN203792581U (en) * | 2014-04-29 | 2014-08-27 | 成都中科精密模具有限公司 | Novel plastic package mold with micro matrix lead frame attached to surface |
| CN204160701U (en) * | 2014-09-17 | 2015-02-18 | 安徽中智光源科技有限公司 | EMC continuous punching sheet-shaped LED lead frame die package structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104227980A (en) | 2014-12-24 |
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Effective date of registration: 20201201 Address after: 244000 Tongling economic and Technological Development Zone, Anhui Patentee after: WENYI TRINITY TECHNOLOGY Co.,Ltd. Address before: Electronic industrial zone Tongguanshan District 244000 Anhui province Shicheng road in Tongling City Patentee before: ANHUI ZHONGZHI LIGHT SOURCE TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |