CN204160701U - EMC continuous punching sheet-shaped LED lead frame die package structure - Google Patents
EMC continuous punching sheet-shaped LED lead frame die package structure Download PDFInfo
- Publication number
- CN204160701U CN204160701U CN201420533335.5U CN201420533335U CN204160701U CN 204160701 U CN204160701 U CN 204160701U CN 201420533335 U CN201420533335 U CN 201420533335U CN 204160701 U CN204160701 U CN 204160701U
- Authority
- CN
- China
- Prior art keywords
- die
- pin
- pushing plate
- bushing
- needle pushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Abstract
The utility model discloses EMC continuous punching sheet-shaped LED lead frame die package structure, it comprises fixed half and moving half, it is bushing that cover half comprises the die being positioned at middle adhesive tape mold insert and being positioned at both sides, the side of adhesive tape mold insert is fixed on die holder by side bumper block, needle pushing plate is connected with by screw bottom die holder, needle pushing plate is fixed in pushes pin on fixed head, screw is positioned at needle pushing plate adapting part spring and spring bushing, spring top exposes needle pushing plate and contacts with die holder, also be connected with on die is bushing and run through die holder successively, needle pushing plate is pushed pin and the pin that resets with fixed head of pushing pin, adhesive tape mold insert center adaptation has and runs through die holder successively, needle pushing plate enters packing element with fixed head of pushing pin, dynamic model comprise with cover half one to one adhesive tape mold insert, die bushing, side bumper block, die holder, needle pushing plate, fixed head of pushing pin, spring, spring bushing, push pin and the pin that resets, the bushing interior adaptation of die has die core insert.
Description
Technical field
The utility model relates to die package, particularly relates to EMC continuous punching sheet-shaped LED lead frame die package structure.
Background technology
EMC encapsulation is one of current high-end developing direction of LED industry, EMC support capsulation material is epoxy resin, this material has the advantages such as uv-resistant, hot conditions stability inferior is good, the coefficient of expansion is low, many support factories also represent, to progressively convert EMC support in domestic and international backlight market, comprise illumination market also in this way.Therefore the thermoplastic of original employing PPA resin injection moulding can not meet high-end market demand for development, is substituted in the urgent need to new die package form.
Utility model content
The technical problems to be solved in the utility model is the existing demand adopting the thermoplastic of PPA resin injection moulding can not meet EMC encapsulation, provides a kind of EMC continuous punching sheet-shaped LED lead frame die package structure for this reason.
The technical solution of the utility model is: EMC continuous punching sheet-shaped LED lead frame die package structure, it comprises fixed half and moving half, it is bushing that described cover half comprises the die being positioned at middle adhesive tape mold insert and being positioned at both sides, the side of described adhesive tape mold insert is fixed on die holder by side bumper block, needle pushing plate is connected with by screw bottom described die holder, described needle pushing plate is fixed in pushes pin on fixed head, described screw is positioned at needle pushing plate adapting part spring and spring bushing, described spring top exposes needle pushing plate and contacts with die holder, also be connected with on described die is bushing and run through die holder successively, needle pushing plate is pushed pin and the pin that resets with fixed head of pushing pin, described adhesive tape mold insert center adaptation has and runs through die holder successively, needle pushing plate enters packing element with fixed head of pushing pin, described dynamic model comprise with cover half one to one adhesive tape mold insert, die bushing, side bumper block, die holder, needle pushing plate, fixed head of pushing pin, spring, spring bushing, push pin and the pin that resets, the bushing interior adaptation of described die has die core insert.
The improvement of such scheme described fixed half and moving half is also connected with respectively the contour post running through needle pushing plate and push pin fixed head.
The beneficial effects of the utility model be utilize existing injection mold to produce lead frame when not changing; The encapsulation of EMC thermosetting resin material can be realized, be not only our company and save diel expense, and effectively utilize existing equipment for client, for client saves large quantities of development cost and development time; Also save the plenty of time for EMC support in marketing simultaneously.
Accompanying drawing explanation
Fig. 1 is the utility model cover half schematic diagram;
Fig. 2 is the side view of Fig. 1;
Fig. 3 is the utility model dynamic model schematic diagram;
Fig. 4 is the side view of Fig. 3;
In figure, 1, adhesive tape mold insert, 2, die core insert, 3, side bumper block, 4, enter packing element, 5, die holder, 6, push pin, 7, reset pin, 8, needle pushing plate, 9, fixed head of pushing pin, 10, contour post, 11, spring, 12 spring bushings, 13, die is bushing.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described further.
As Fig. 1, shown in Fig. 2, the utility model comprises fixed half and moving half, described cover half comprises the die bushing 13 being positioned at middle adhesive tape mold insert 1 and being positioned at both sides, the side of described adhesive tape mold insert is fixed on die holder 5 by side bumper block 3, needle pushing plate 8 is connected with by screw bottom described die holder, described needle pushing plate is fixed in pushes pin on fixed head 9, described screw is positioned at needle pushing plate adapting part spring 11 and spring bushing 12, described spring top exposes needle pushing plate and contacts with die holder, also be connected with on described die is bushing and run through die holder successively, 6 and the reset pin 7 of pushing pin of needle pushing plate and fixed head of pushing pin, described adhesive tape mold insert center adaptation has and runs through die holder successively, needle pushing plate enters packing element 4 with fixed head of pushing pin, described dynamic model comprise with cover half one to one adhesive tape mold insert, die bushing, side bumper block, die holder, needle pushing plate, fixed head of pushing pin, spring, spring bushing, push pin and the pin that resets, the bushing interior adaptation of described die has die core insert 2.
Heat radiation when using for the ease of the utility model, also can be connected with the contour post 10 running through needle pushing plate and push pin fixed head respectively on fixed half and moving half.Entering packing element fits in adhesive tape mold insert, to be arranged in die fixed block and to make it fixing wherein together with and side bumper block bushing with die; Spring 11 ejecting product after 6 die sinkings that makes to push pin makes it reset again; Die core insert 2 is assemblied in die bushing 13, with enter to be arranged on together with adhesive tape mold insert and side bumper block in die fixed block and to make it fixing wherein.
Claims (2)
1.EMC continuous punching sheet-shaped LED lead frame die package structure, it is characterized in that it comprises fixed half and moving half, it is bushing that described cover half comprises the die being positioned at middle adhesive tape mold insert and being positioned at both sides, the side of described adhesive tape mold insert is fixed on die holder by side bumper block, needle pushing plate is connected with by screw bottom described die holder, described needle pushing plate is fixed in pushes pin on fixed head, described screw is positioned at needle pushing plate adapting part spring and spring bushing, described spring top exposes needle pushing plate and contacts with die holder, also be connected with on described die is bushing and run through die holder successively, needle pushing plate is pushed pin and the pin that resets with fixed head of pushing pin, described adhesive tape mold insert center adaptation has and runs through die holder successively, needle pushing plate enters packing element with fixed head of pushing pin, described dynamic model comprise with cover half one to one adhesive tape mold insert, die bushing, side bumper block, die holder, needle pushing plate, fixed head of pushing pin, spring, spring bushing, push pin and the pin that resets, the bushing interior adaptation of described die has die core insert.
2. EMC continuous punching sheet-shaped LED lead frame die package structure as claimed in claim 1, is characterized in that described fixed half and moving half is also connected with respectively the contour post running through needle pushing plate and push pin fixed head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420533335.5U CN204160701U (en) | 2014-09-17 | 2014-09-17 | EMC continuous punching sheet-shaped LED lead frame die package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420533335.5U CN204160701U (en) | 2014-09-17 | 2014-09-17 | EMC continuous punching sheet-shaped LED lead frame die package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204160701U true CN204160701U (en) | 2015-02-18 |
Family
ID=52534425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420533335.5U Withdrawn - After Issue CN204160701U (en) | 2014-09-17 | 2014-09-17 | EMC continuous punching sheet-shaped LED lead frame die package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204160701U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104227980A (en) * | 2014-09-17 | 2014-12-24 | 安徽中智光源科技有限公司 | LED lead frame die packaging structure adopting continuous EMC (epoxy molding compound) punch tablet mode |
-
2014
- 2014-09-17 CN CN201420533335.5U patent/CN204160701U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104227980A (en) * | 2014-09-17 | 2014-12-24 | 安徽中智光源科技有限公司 | LED lead frame die packaging structure adopting continuous EMC (epoxy molding compound) punch tablet mode |
| CN104227980B (en) * | 2014-09-17 | 2016-11-09 | 安徽中智光源科技有限公司 | EMC continuous punching sheet-shaped LED lead frame die package structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204160701U (en) | EMC continuous punching sheet-shaped LED lead frame die package structure | |
| CN204354420U (en) | A kind of easily demoulding injection mold | |
| CN104227980B (en) | EMC continuous punching sheet-shaped LED lead frame die package structure | |
| CN203573987U (en) | SMD diode | |
| CN205178898U (en) | DC power supply apparatus | |
| CN204070171U (en) | A kind of module spliced direct type aquarium base | |
| CN204885016U (en) | Miniature temperature controller of no epoxy sealed | |
| CN203941871U (en) | New type fuse | |
| CN203839549U (en) | Insertion piece assembly of electrical connector | |
| CN203459531U (en) | Spring piece stamping die | |
| CN203484491U (en) | Punching die | |
| CN204201581U (en) | A kind of Novel LED light | |
| CN206352740U (en) | A kind of LED is molded waterproof sidelight source structure | |
| CN202816803U (en) | Alternating current contactor | |
| CN206236652U (en) | A kind of diode paster removes useless mould | |
| CN202816928U (en) | Combination structure of semiconductor lead frame and lower die spacing insert | |
| CN203659922U (en) | Dispensing-molded lens-based light-emitting diode (LED) light emitting device | |
| CN203125795U (en) | Mould ejector plate guide pillar fixing device | |
| CN204341502U (en) | A kind of hot pressing film strips tool of S. A. carrier band machine | |
| CN103934997A (en) | Injection molding machine | |
| CN202656348U (en) | Mould of thermoplastic box | |
| CN104227917A (en) | Novel injection molding machine | |
| CN201928252U (en) | Double-row solid-state relay | |
| CN202564279U (en) | Projection type mold cleaning/wetting alternative lead frame/semiconductor substrate | |
| CN203064690U (en) | Pressing plate tightening mechanism of spiral conveyer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150218 Effective date of abandoning: 20161012 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |