CN104219887A - BT (bismaleimide triazine) board manufacturing process - Google Patents
BT (bismaleimide triazine) board manufacturing process Download PDFInfo
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- CN104219887A CN104219887A CN201410403448.8A CN201410403448A CN104219887A CN 104219887 A CN104219887 A CN 104219887A CN 201410403448 A CN201410403448 A CN 201410403448A CN 104219887 A CN104219887 A CN 104219887A
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Abstract
The invention relates to a BT (bismaleimide triazine) board manufacturing process. The process includes the steps such as BT board cutting, BT board drilling, BT board dividing, BT board plating and BT board wire resistance welding. The BT board manufacturing process has the advantages that the BT board manufacturing process is simplified, production efficiency is improved, precision is significantly improved, BT board quality is improved, the process requirements for application of BT boards are met, scrappage is decreased, and great waste on resources and costs is avoided.
Description
Technical field
The present invention relates to and make BT plate field, particularly relate to a kind of BT plate manufacture craft.
Background technology
In recent years, along with the quick growth of mobile phone, LED display, market is also increasing to the demand of patch light-emitting diode, as the BT plate of patch light-emitting diode support plate, its consumption and the scope of application are also move towards popular gradually, the BT plate major part that current Chinese market uses is all import, mainly from the product of Japan, Korea S and Taiwan, grasps the inland of China enterprise manufacturing BT plate core technology few.
BT plate refers to BT substrate for materials processing becomes the general designation of BT, and herein carry BT plate and refer to the PCB support plate be applied in above patch light-emitting diode product, belonging to special PCB kind, is the simplest IC support plate.From common PCB unlike applying different PCB substrate, BT substrate mainly uses BT resin disclosed in Mitsubishi gas in the market, with BT resin for the substrate that raw material is formed has the advantages such as Gao Yinliang, moisture resistance, low-price electricity constant and low lost factor.
In prior art, BT plate is in manufacturing process, and step is very loaded down with trivial details, and production efficiency is very low, loaded down with trivial details due to step, causes the BT plate poor quality produced, does not reach technological requirement, cause scrappage very high, thus waste ample resources and cost.
Summary of the invention
In view of this, be necessary to provide a kind of simple, can enhance productivity, and improve quality, the BT plate manufacture craft of cost-saving and resource.
The present invention is achieved in that a kind of BT plate manufacture craft, comprises the following steps:
Step one: BT plate sheet material sawing sheet:
A: choose BT sheet material;
Extract BT sheet material, the thickness of BT sheet material is 0.06mm ~ 1.0mm, and is detected by electronic distance meter, testing requirement be the thickness of BT sheet material in the scope of 0.06mm ~ 1.0mm, and departure is in 0.015mm;
B: choose backing plate;
Extract backing plate, the thickness of backing plate is 2.5mm;
C: heat treatment;
Be placed on backing plate by BT sheet material, then backing plate and BT plate are placed in together in baking box and toast 240 minutes, baking temperature is at 110 DEG C ~ 130 DEG C;
D: anti-deformation process;
Baking box in step 3 arranges multiple air port, and the automatic temperature measurement display detecting internal temperature is set outside baking box, and automatic time alarm is set, when baking box internal cause extraneous factor or human factor cause internal temperature too high or time height time low time, can be undertaken regulating the temperature in baking box by multiple air port, make it reach normal baking temperature;
Step 2: the boring of BT plate;
Holed accurately by BT plate sheet material after sawing sheet, main operation is as follows;
A: precision measure;
Contrast drawing, and adopt the spacing of optical scanner measuring instrument measurement and positioning hole and location hole on BT plate, location hole to the precise information such as spacing, via aperture, groove width at the size in the spacing of the spacing of cutting hole, location hole and groove center spacing, groove center and groove center, die bond region and bonding wire region, die bond place and bonding wire place, and be labeled on drawing;
B:BT plate thickness is measured;
BT plate is placed on marble countertop gently, firmly can not presses BT plate plate face, slowly put down the inductor syringe needle of thickness measurement equipment, reading displayed numerical value after contacting with BT plate plate face;
C:BT plate is classified;
Measured the thickness of BT plate by step 2 after, be referred to together by the BT plate of consistency of thickness, filing sorted out by other BT plates according to thickness difference 0.02mm,
D: boring process;
Adopt drilling machine to hole, according to the measurement result in step one, BT plate carries out boring and the drill flute operation of tram;
E; Examination is checked and accepted;
After boring and drill flute operate, BT plate is tested, bad product is weeded out, concrete acceptance method is: examine under a microscope via, if have in via not thoroughly, leak and bore, wrongly bore or have zigzag, all screen, again process or scrap;
Secondly, if having projection in via, protruding height is greater than 0.05mm, screens, and again processes;
Finally check the slotted eye that drill flute step is formed, if cell wall have green oil or leak base material phenomenon, then should again process or remedy, cell wall is monolateral has waveform or projection, and is highly greater than 0.05mm, screens, and again processes;
There is projection in cell wall both sides, if the summation of the height of projection on both sides is greater than 0.05mm, screen, and again process simultaneously;
Step 3: BT plate gong plate process;
BT plate sheet material after drill precise holes is carried out the process of gong plate:
A: cooling operation;
In gong plate process, in the process that gong cutter operates BT plate, by using the gong head of industrial alcohol to gong cutter to carry out sprinklings cooling, effectively can extend the useful life of gong cutter, and the qualification rate of raising BT plate;
B: gong groove;
By neatly superimposed for multiple BT plate, then via being arranged on die matrix behind location hole location, carry out gong slot machining by gong cutter, gong cutter when walking, adopts the lower sword end of gong cutter to process, reduce resistance, improve gong groove speed, instantly after sword end wear out failure, adopt gong blade part upper end to process, improve gong cutter utilization rate, be beneficial to and reduce costs;
C; The process of gong plate dead meal;
The gong slot machining station of BT plate arranges one and thinks corresponding hollow hole with gong groove, the width of the large beautiful gong groove in aperture of hollow hole, in cutting process, the discarded object produced directly is discharged from hollow hole, do not need the process again in later stage, increase work efficiency, reduce the probability of damage to BT plate;
Step 4: BT plate electroplating processes;
A: nog plate;
Ceramic grinder is adopted to carry out nog plate to BT plate, and, the pottery brush on ceramic grinder is changed to adhesive-bonded fabric brush, adopts adhesive-bonded fabric brush to carry out nog plate to BT plate;
B: heavy Copper treatment;
First: enter expansion cylinder;
Sent in expansion cylinder by BT plate and expand, be full of swelling agent in expansion cylinder, swelling agent is the mixture of potassium oxide and sodium oxide molybdena, its alkali equivalent is 0.2N ~ 0.4N, intensity is 35% ~ 50%, and expansion temperature is 65 DEG C ~ 75 DEG C, and the cylinder cycle of changing of expansion cylinder is 6000M2 ~ 7000M2;
Second: enter Chu Rubber slag cylinder;
After expanded, BT plate is sent into except Rubber slag cylinder carries out removal of impurities; contain liquor potassic permanganate except in Rubber slag cylinder, its potassium permanganate content is 40g/L ~ 80g/L, basicity is 0.9N ~ 1.3N, potassium manganate content is less than 25g/L, and cylinder temperature is 70 DEG C ~ 85 DEG C, and the cylinder cycle of changing of Qie Chu Rubber slag cylinder is 20000M2;
3rd: enter neutralization tank;
After slagging-off, BT plate is sent into neutralization tank and neutralizes, containing nertralizer in neutralization tank, its acidity is 1.8N ~ 3.6N, in and intensity be 80% ~ 120%, neutral temperature is 35 DEG C ~ 45 DEG C, and the cylinder cycle of changing of neutralization tank is 3000M2 ~ 3500M2;
4th: enter except oil cylinder;
After neutralization, BT plate is sent into and carries out removal operation except in oil cylinder, except oil cylinder has included degreaser JL-310, its base strength is 0.1N ~ 0.2N, in cylinder except oil temperature be 60 DEG C ~ 70 DEG C, and the cylinder cycle of changing of removing oil cylinder is 6000M2 ~ 7000M2, or carry out changing cylinder when being greater than 1g/L except in-oil cylinder content of copper ion;
5th: enter microetch cylinder;
After oil removing, BT plate is sent in microetch cylinder, carry out the operation of sulfuration microetch, containing sodium peroxydisulfate and sulfuric acid in microetch cylinder, wherein sulfuric acid content is 4% ~ 6%, sodium peroxydisulfate content is 80g/L ~ 120g/L, and cylinder temperature is 25 DEG C ~ 35 DEG C, and the cylinder cycle of changing of microetch cylinder is content of copper ion carries out changing cylinder when being greater than 25g/L;
6th: enter preimpregnation cylinder;
After sulfuration microetch, sent into by BT plate in preimpregnation cylinder, containing pre dip salt in preimpregnation cylinder, cylinder temperature is 18 DEG C ~ 32 DEG C, and the cylinder cycle of changing of preimpregnation cylinder is 4500M2 ~ 5000M2;
7th: enter active cylinder;
After preimpregnation, BT plate is sent in active cylinder, containing activator in active cylinder, activator levels is at the quantificational expression of 15% ~ 18%, PD2+ content to be 60% ~ 100%, PD2 PD2 be activator and receptor affinity, it is a kind of parameter being used for representing noncompetitive antaganist action intensity, its larger expression noncompetitive antaganist effect is stronger, and cylinder temperature is 30 DEG C ~ 44 DEG C, and the cylinder cycle of changing of active cylinder is content of copper ion carries out changing cylinder when being greater than 1.5g/L;
8th: enter speedization cylinder;
After activation, sent into by BT plate in speedization cylinder, containing accelerator in speedization cylinder, its acidity is 0.5N ~ 1.0N, and cylinder temperature is 18 DEG C ~ 32 DEG C, and changing the cylinder cycle is 3000M2 ~ 3500M2;
9th: enter chemical copper cylinder;
After cylinder taking-up changed rapidly by BT plate, BT plate is sent into chemical copper cylinder, mixed liquor containing formaldehyde, heavy copper liquid and NaOH in chemical copper cylinder, in mixed liquor, the content of copper ion is 1.5g/L ~ 2.5g/L, and sodium hydrate content is 8g/L ~ 12g/L, content of formaldehyde is 3g/L ~ 6g/L, cylinder temperature is 25 DEG C ~ 32 DEG C, and changing the cylinder cycle is 38000M2 ~ 40000M2, and the backlight degree in chemical copper cylinder is not less than 8.5 grades;
C: acidleach and copper plating treatment;
BT plate chemically copper cylinder take out after, sulfuric acid solution is adopted to carry out acidleach, in sulfuric acid solution, the content of sulfuric acid is 4% ~ 6%, after acidleach, enter the copper facing stage, containing copper sulphate in copper plating solution, sulfuric acid, copper ball, polishing material and wetting agent, copper ball is to produce copper ion, in copper plating solution, the content of chloride ion is 50PPm ~ 70PPm, copper sulphate content is 60g/L ~ 70g/L, sulfuric acid content is 190g/L ~ 220g/L, copper facing ambient temperature is 23 DEG C ~ 27 DEG C, the current density passed through in copper plating solution is 10ASF ~ 14ASF, the copper facing time is 50min ~ 65min,
Step 5: BT printed line roadlock welds;
A: choose welding surroundings;
Circuit welding resistance environment is chosen at dustiness and operates lower than in the dust-free room of 10 grades;
B:BT plate slice;
Light paints oneself film-discharging machine, and egative film is out after automatic OAI optical check, and all egative films being left in temperature is 20 DEG C ~ 22 DEG C, and humidity is in the environment of 52 DEG C ~ 58 DEG C;
C: welding resistance operates;
The operation of precision welding resistance is carried out to the circuit on BT plate;
D: polishing;
Nog plate ceramic grinder and sand-blasting machine is adopted to polish to BT plate egative film, what wherein nog plate ceramic grinder adopted is that adhesive-bonded fabric brush is polished to BT plate egative film, sand-blasting machine adopts diamond dust to polish to BT plate egative film, two kinds is all alligatoring plate face, the film or solder mask strong bonded can be made, avoid the generation of Lou copper, leakage nickel and leakage base material phenomenon;
E: spectrum assignment;
BT plate and the circuit that welded are carried out exposure-processed, exposure evacuated pressure is 680mm/hg ~ 760mm/hg, carrying out development treatment, development temperature is 28 DEG C ~ 32 DEG C, carries out drying and processing after development, and development bake out temperature is 72 DEG C ~ 78 DEG C, finally carry out high-temperature baking, baking temperature is 150 DEG C, and effective like this wire welding area that prevents produces green oil, the phenomenon generation that solder mask is smudgy, interrupted;
F: inspection;
Test to finished product, to test screening to the breach of wire welding area, crystal bonding area respectively, the finished product screen that breach is greater than 0.05mm is elected, and weeds out.
The advantage of a kind of BT plate manufacture craft provided by the invention is: technological process is simple, enhance productivity, and accuracy significantly improves, thus improve the quality of BT plate, meet the technological requirement that BT plate uses, reduce scrappage, thus waste ample resources and cost.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Described a kind of BT plate manufacture craft, comprises the following steps:
Step one: BT plate sheet material sawing sheet:
A: choose BT sheet material;
Extract BT sheet material, the thickness of BT sheet material is 0.06mm ~ 1.0mm, and is detected by electronic distance meter, testing requirement be the thickness of BT sheet material in the scope of 0.06mm ~ 1.0mm, and departure is in 0.015mm;
B: choose backing plate;
Extract backing plate, the thickness of backing plate is 2.5mm;
C: heat treatment;
Be placed on backing plate by BT sheet material, then backing plate and BT plate are placed in together in baking box and toast 240 minutes, baking temperature is at 110 DEG C ~ 130 DEG C;
D: anti-deformation process;
Baking box in step 3 arranges multiple air port, and the automatic temperature measurement display detecting internal temperature is set outside baking box, and automatic time alarm is set, when baking box internal cause extraneous factor or human factor cause internal temperature too high or time height time low time, can be undertaken regulating the temperature in baking box by multiple air port, make it reach normal baking temperature;
In BT plate sheet material sawing sheet process, not only simple to operate, save the operating time, and in bake process, by multiple sealing, BT plate is made not easily to produce the problem of distortion, bending and distortion, by multiple air port, automatic temperature measurement display and automatic time alarm, in bake process, can effectively control and monitor baking temperature, and remind the function of baking time, make the baking successful sheet material margin of tolerance little, can not cause size not in requiring, the phenomenon affecting client's installation occurs.
Step 2: the boring of BT plate;
Holed accurately by BT plate sheet material after sawing sheet, main operation is as follows;
A: precision measure;
Contrast drawing, and adopt the spacing of optical scanner measuring instrument measurement and positioning hole and location hole on BT plate, location hole to the precise information such as spacing, via aperture, groove width at the size in the spacing of the spacing of cutting hole, location hole and groove center spacing, groove center and groove center, die bond region and bonding wire region, die bond place and bonding wire place, and be labeled on drawing;
B:BT plate thickness is measured;
BT plate is placed on marble countertop gently, firmly can not presses BT plate plate face, slowly put down the inductor syringe needle of thickness measurement equipment, reading displayed numerical value after contacting with BT plate plate face;
C:BT plate is classified;
Measured the thickness of BT plate by step 2 after, be referred to together by the BT plate of consistency of thickness, filing sorted out by other BT plates according to thickness difference 0.02mm,
D: boring process;
Adopt drilling machine to hole, according to the measurement result in step one, BT plate carries out boring and the drill flute operation of tram;
E; Examination is checked and accepted;
After boring and drill flute operate, BT plate is tested, bad product is weeded out, concrete acceptance method is: examine under a microscope via, if have in via not thoroughly, leak and bore, wrongly bore or have zigzag, all screen, again process or scrap;
Secondly, if having projection in via, protruding height is greater than 0.05mm, screens, and again processes;
Finally check the slotted eye that drill flute step is formed, if cell wall have green oil or leak base material phenomenon, then should again process or remedy, cell wall is monolateral has waveform or projection, and is highly greater than 0.05mm, screens, and again processes;
There is projection in cell wall both sides, if the summation of the height of projection on both sides is greater than 0.05mm, screen, and again process simultaneously;
In the drilling operation of BT plate, not only simple to operate, save the operating time, and accurately measured by the particularity that precision measure and BT plate thickness are measured, when effectively can ensure post-production, the reliability of precision, the qualification rate of product, by tight inspection, improves by the later stage greatly.
Step 3: BT plate gong plate process;
BT plate sheet material after drill precise holes is carried out the process of gong plate:
A: cooling operation;
In gong plate process, in the process that gong cutter operates BT plate, by using the gong head of industrial alcohol to gong cutter to carry out sprinklings cooling, effectively can extend the useful life of gong cutter, and the qualification rate of raising BT plate;
B: gong groove;
By neatly superimposed for multiple BT plate, then via being arranged on die matrix behind location hole location, carry out gong slot machining by gong cutter, gong cutter when walking, adopts the lower sword end of gong cutter to process, reduce resistance, improve gong groove speed, instantly after sword end wear out failure, adopt gong blade part upper end to process, improve gong cutter utilization rate, be beneficial to and reduce costs;
C; The process of gong plate dead meal;
The gong slot machining station of BT plate arranges one and thinks corresponding hollow hole with gong groove, the width of the large beautiful gong groove in aperture of hollow hole, in cutting process, the discarded object produced directly is discharged from hollow hole, do not need the process again in later stage, increase work efficiency, reduce the probability of damage to BT plate;
In the quick gong plate operation of BT plate, convenient to operation, save the operating time, operated by the cooling of industrial alcohol, improve in gong plate process greatly, environment residing for BT plate, prevent the high temperature because of script gong cutter from causing the generation of the metaboly of BT plate, by gong groove step and gong plate dead meal treatment step, multiple BT plate carries out gong groove simultaneously, increase work efficiency, and in gong plate dead meal processing procedure, hollow hole is adopted directly to be discharged by the dead meal produced in operating process, do not need shutdown process, enhance productivity, and the phenomenon damaging BT plate will be caused to occur because of the accumulation of dead meal.
Step 4: BT plate electroplating processes;
A: nog plate;
Ceramic grinder is adopted to carry out nog plate to BT plate, and, the pottery brush on ceramic grinder is changed to adhesive-bonded fabric brush, adopts adhesive-bonded fabric brush to carry out nog plate to BT plate;
B: heavy Copper treatment;
First: enter expansion cylinder;
Sent in expansion cylinder by BT plate and expand, be full of swelling agent in expansion cylinder, swelling agent is the mixture of potassium oxide and sodium oxide molybdena, its alkali equivalent is 0.2N ~ 0.4N, intensity is 35% ~ 50%, and expansion temperature is 65 DEG C ~ 75 DEG C, and the cylinder cycle of changing of expansion cylinder is 6000M2 ~ 7000M2;
Second: enter Chu Rubber slag cylinder;
After expanded, BT plate is sent into except Rubber slag cylinder carries out removal of impurities; contain liquor potassic permanganate except in Rubber slag cylinder, its potassium permanganate content is 40g/L ~ 80g/L, basicity is 0.9N ~ 1.3N, potassium manganate content is less than 25g/L, and cylinder temperature is 70 DEG C ~ 85 DEG C, and the cylinder cycle of changing of Qie Chu Rubber slag cylinder is 20000M2;
3rd: enter neutralization tank;
After slagging-off, BT plate is sent into neutralization tank and neutralizes, containing nertralizer in neutralization tank, its acidity is 1.8N ~ 3.6N, in and intensity be 80% ~ 120%, neutral temperature is 35 DEG C ~ 45 DEG C, and the cylinder cycle of changing of neutralization tank is 3000M2 ~ 3500M2;
4th: enter except oil cylinder;
After neutralization, BT plate is sent into and carries out removal operation except in oil cylinder, except oil cylinder has included degreaser JL-310, its base strength is 0.1N ~ 0.2N, in cylinder except oil temperature be 60 DEG C ~ 70 DEG C, and the cylinder cycle of changing of removing oil cylinder is 6000M2 ~ 7000M2, or carry out changing cylinder when being greater than 1g/L except in-oil cylinder content of copper ion;
5th: enter microetch cylinder;
After oil removing, BT plate is sent in microetch cylinder, carry out the operation of sulfuration microetch, containing sodium peroxydisulfate and sulfuric acid in microetch cylinder, wherein sulfuric acid content is 4% ~ 6%, sodium peroxydisulfate content is 80g/L ~ 120g/L, and cylinder temperature is 25 DEG C ~ 35 DEG C, and the cylinder cycle of changing of microetch cylinder is content of copper ion carries out changing cylinder when being greater than 25g/L;
6th: enter preimpregnation cylinder;
After sulfuration microetch, sent into by BT plate in preimpregnation cylinder, containing pre dip salt in preimpregnation cylinder, cylinder temperature is 18 DEG C ~ 32 DEG C, and the cylinder cycle of changing of preimpregnation cylinder is 4500M2 ~ 5000M2;
7th: enter active cylinder;
After preimpregnation, BT plate is sent in active cylinder, containing activator in active cylinder, activator levels is at the quantificational expression of 15% ~ 18%, PD2+ content to be 60% ~ 100%, PD2 PD2 be activator and receptor affinity, it is a kind of parameter being used for representing noncompetitive antaganist action intensity, its larger expression noncompetitive antaganist effect is stronger, and cylinder temperature is 30 DEG C ~ 44 DEG C, and the cylinder cycle of changing of active cylinder is content of copper ion carries out changing cylinder when being greater than 1.5g/L;
8th: enter speedization cylinder;
After activation, sent into by BT plate in speedization cylinder, containing accelerator in speedization cylinder, its acidity is 0.5N ~ 1.0N, and cylinder temperature is 18 DEG C ~ 32 DEG C, and changing the cylinder cycle is 3000M2 ~ 3500M2;
9th: enter chemical copper cylinder;
After cylinder taking-up changed rapidly by BT plate, BT plate is sent into chemical copper cylinder, mixed liquor containing formaldehyde, heavy copper liquid and NaOH in chemical copper cylinder, in mixed liquor, the content of copper ion is 1.5g/L ~ 2.5g/L, and sodium hydrate content is 8g/L ~ 12g/L, content of formaldehyde is 3g/L ~ 6g/L, cylinder temperature is 25 DEG C ~ 32 DEG C, and changing the cylinder cycle is 38000M2 ~ 40000M2, and the backlight degree in chemical copper cylinder is not less than 8.5 grades;
C: acidleach and copper plating treatment;
BT plate chemically copper cylinder take out after, sulfuric acid solution is adopted to carry out acidleach, in sulfuric acid solution, the content of sulfuric acid is 4% ~ 6%, after acidleach, enter the copper facing stage, containing copper sulphate in copper plating solution, sulfuric acid, copper ball, polishing material and wetting agent, copper ball is to produce copper ion, in copper plating solution, the content of chloride ion is 50PPm ~ 70PPm, copper sulphate content is 60g/L ~ 70g/L, sulfuric acid content is 190g/L ~ 220g/L, copper facing ambient temperature is 23 DEG C ~ 27 DEG C, the current density passed through in copper plating solution is 10ASF ~ 14ASF, the copper facing time is 50min ~ 65min,
In BT plate electroplating operations engineering, by nog plate, heavy Copper treatment and acidleach and copper plating treatment three steps, and in heavy Copper treatment flow process, BT plate enter successively expansion cylinder, except Rubber slag cylinder, neutralization tank, except oil cylinder, microetch cylinder, preimpregnation cylinder, active cylinder, speedization cylinder and chemical copper cylinder, repeatedly carrying out copper facing operation after process, plating can not only be made even, and copper ion is fitted tightly on BT plate surface, useful life and the plating qualification rate of BT plate can be extended.
Step 5: BT printed line roadlock welds;
A: choose welding surroundings;
Circuit welding resistance environment is chosen at dustiness and operates lower than in the dust-free room of 10 grades;
B:BT plate slice;
Light paints oneself film-discharging machine, and egative film is out after automatic OAI optical check, and all egative films being left in temperature is 20 DEG C ~ 22 DEG C, and humidity is in the environment of 52 DEG C ~ 58 DEG C;
C: welding resistance operates;
The operation of precision welding resistance is carried out to the circuit on BT plate;
D: polishing;
Nog plate ceramic grinder and sand-blasting machine is adopted to polish to BT plate egative film, what wherein nog plate ceramic grinder adopted is that adhesive-bonded fabric brush is polished to BT plate egative film, sand-blasting machine adopts diamond dust to polish to BT plate egative film, two kinds is all alligatoring plate face, the film or solder mask strong bonded can be made, avoid the generation of Lou copper, leakage nickel and leakage base material phenomenon;
E: spectrum assignment;
BT plate and the circuit that welded are carried out exposure-processed, exposure evacuated pressure is 680mm/hg ~ 760mm/hg, carrying out development treatment, development temperature is 28 DEG C ~ 32 DEG C, carries out drying and processing after development, and development bake out temperature is 72 DEG C ~ 78 DEG C, finally carry out high-temperature baking, baking temperature is 150 DEG C, and effective like this wire welding area that prevents produces green oil, the phenomenon generation that solder mask is smudgy, interrupted;
F: inspection;
Test to finished product, to test screening to the breach of wire welding area, crystal bonding area respectively, the finished product screen that breach is greater than 0.05mm is elected, and weeds out.
In BT printed line roadlock weldering operation, by choosing the steps such as welding surroundings, BT plate slice, welding resistance operation, polishing, spectrum assignment and inspection, can effectively prevent in circuit welding resistance process, occur leaking copper, leak nickel, leak the generation that the phenomenons such as green oil, weldering paint be smudgy, interrupted often appear in base material phenomenon and wire welding area, thus enhance productivity, save great amount of cost.
The advantage of a kind of BT plate manufacture craft provided by the invention is: technological process is simple, enhance productivity, and accuracy significantly improves, thus improve the quality of BT plate, meet the technological requirement that BT plate uses, reduce scrappage, thus waste ample resources and cost.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (1)
1. a BT plate manufacture craft, is characterized in that, comprises the following steps:
Step one: BT plate sheet material sawing sheet:
A: choose BT sheet material;
Extract BT sheet material, the thickness of BT sheet material is 0.06mm ~ 1.0mm, and is detected by electronic distance meter, testing requirement be the thickness of BT sheet material in the scope of 0.06mm ~ 1.0mm, and departure is in 0.015mm;
B: choose backing plate;
Extract backing plate, the thickness of backing plate is 2.5mm;
C: heat treatment;
Be placed on backing plate by BT sheet material, then backing plate and BT plate are placed in together in baking box and toast 240 minutes, baking temperature is at 110 DEG C ~ 130 DEG C;
D: anti-deformation process;
Baking box in step 3 arranges multiple air port, and the automatic temperature measurement display detecting internal temperature is set outside baking box, and automatic time alarm is set, when baking box internal cause extraneous factor or human factor cause internal temperature too high or time height time low time, can be undertaken regulating the temperature in baking box by multiple air port, make it reach normal baking temperature;
Step 2: the boring of BT plate;
Holed accurately by BT plate sheet material after sawing sheet, main operation is as follows;
A: precision measure;
Contrast drawing, and adopt the spacing of optical scanner measuring instrument measurement and positioning hole and location hole on BT plate, location hole to the precise information such as spacing, via aperture, groove width at the size in the spacing of the spacing of cutting hole, location hole and groove center spacing, groove center and groove center, die bond region and bonding wire region, die bond place and bonding wire place, and be labeled on drawing;
B:BT plate thickness is measured;
BT plate is placed on marble countertop gently, firmly can not presses BT plate plate face, slowly put down the inductor syringe needle of thickness measurement equipment, reading displayed numerical value after contacting with BT plate plate face;
C:BT plate is classified;
Measured the thickness of BT plate by step 2 after, be referred to together by the BT plate of consistency of thickness, filing sorted out by other BT plates according to thickness difference 0.02mm,
D: boring process;
Adopt drilling machine to hole, according to the measurement result in step one, BT plate carries out boring and the drill flute operation of tram;
E; Examination is checked and accepted;
After boring and drill flute operate, BT plate is tested, bad product is weeded out, concrete acceptance method is: examine under a microscope via, if have in via not thoroughly, leak and bore, wrongly bore or have zigzag, all screen, again process or scrap;
Secondly, if having projection in via, protruding height is greater than 0.05mm, screens, and again processes;
Finally check the slotted eye that drill flute step is formed, if cell wall have green oil or leak base material phenomenon, then should again process or remedy, cell wall is monolateral has waveform or projection, and is highly greater than 0.05mm, screens, and again processes;
There is projection in cell wall both sides, if the summation of the height of projection on both sides is greater than 0.05mm, screen, and again process simultaneously;
Step 3: BT plate gong plate process;
BT plate sheet material after drill precise holes is carried out the process of gong plate:
A: cooling operation;
In gong plate process, in the process that gong cutter operates BT plate, by using the gong head of industrial alcohol to gong cutter to carry out sprinklings cooling, effectively can extend the useful life of gong cutter, and the qualification rate of raising BT plate;
B: gong groove;
By neatly superimposed for multiple BT plate, then via being arranged on die matrix behind location hole location, carry out gong slot machining by gong cutter, gong cutter when walking, adopts the lower sword end of gong cutter to process, reduce resistance, improve gong groove speed, instantly after sword end wear out failure, adopt gong blade part upper end to process, improve gong cutter utilization rate, be beneficial to and reduce costs;
C; The process of gong plate dead meal;
The gong slot machining station of BT plate arranges one and thinks corresponding hollow hole with gong groove, the width of the large beautiful gong groove in aperture of hollow hole, in cutting process, the discarded object produced directly is discharged from hollow hole, do not need the process again in later stage, increase work efficiency, reduce the probability of damage to BT plate;
Step 4: BT plate electroplating processes;
A: nog plate;
Ceramic grinder is adopted to carry out nog plate to BT plate, and, the pottery brush on ceramic grinder is changed to adhesive-bonded fabric brush, adopts adhesive-bonded fabric brush to carry out nog plate to BT plate;
B: heavy Copper treatment;
First: enter expansion cylinder;
Sent in expansion cylinder by BT plate and expand, be full of swelling agent in expansion cylinder, swelling agent is the mixture of potassium oxide and sodium oxide molybdena, its alkali equivalent is 0.2N ~ 0.4N, intensity is 35% ~ 50%, and expansion temperature is 65 DEG C ~ 75 DEG C, and the cylinder cycle of changing of expansion cylinder is 6000M2 ~ 7000M2;
Second: enter Chu Rubber slag cylinder;
After expanded, BT plate is sent into except Rubber slag cylinder carries out removal of impurities; contain liquor potassic permanganate except in Rubber slag cylinder, its potassium permanganate content is 40g/L ~ 80g/L, basicity is 0.9N ~ 1.3N, potassium manganate content is less than 25g/L, and cylinder temperature is 70 DEG C ~ 85 DEG C, and the cylinder cycle of changing of Qie Chu Rubber slag cylinder is 20000M2;
3rd: enter neutralization tank;
After slagging-off, BT plate is sent into neutralization tank and neutralizes, containing nertralizer in neutralization tank, its acidity is 1.8N ~ 3.6N, in and intensity be 80% ~ 120%, neutral temperature is 35 DEG C ~ 45 DEG C, and the cylinder cycle of changing of neutralization tank is 3000M2 ~ 3500M2;
4th: enter except oil cylinder;
After neutralization, BT plate is sent into and carries out removal operation except in oil cylinder, except oil cylinder has included degreaser JL-310, its base strength is 0.1N ~ 0.2N, in cylinder except oil temperature be 60 DEG C ~ 70 DEG C, and the cylinder cycle of changing of removing oil cylinder is 6000M2 ~ 7000M2, or carry out changing cylinder when being greater than 1g/L except in-oil cylinder content of copper ion;
5th: enter microetch cylinder;
After oil removing, BT plate is sent in microetch cylinder, carry out the operation of sulfuration microetch, containing sodium peroxydisulfate and sulfuric acid in microetch cylinder, wherein sulfuric acid content is 4% ~ 6%, sodium peroxydisulfate content is 80g/L ~ 120g/L, and cylinder temperature is 25 DEG C ~ 35 DEG C, and the cylinder cycle of changing of microetch cylinder is content of copper ion carries out changing cylinder when being greater than 25g/L;
6th: enter preimpregnation cylinder;
After sulfuration microetch, sent into by BT plate in preimpregnation cylinder, containing pre dip salt in preimpregnation cylinder, cylinder temperature is 18 DEG C ~ 32 DEG C, and the cylinder cycle of changing of preimpregnation cylinder is 4500M2 ~ 5000M2;
7th: enter active cylinder;
After preimpregnation, BT plate is sent in active cylinder, containing activator in active cylinder, activator levels is at the quantificational expression of 15% ~ 18%, PD2+ content to be 60% ~ 100%, PD2 PD2 be activator and receptor affinity, it is a kind of parameter being used for representing noncompetitive antaganist action intensity, its larger expression noncompetitive antaganist effect is stronger, and cylinder temperature is 30 DEG C ~ 44 DEG C, and the cylinder cycle of changing of active cylinder is content of copper ion carries out changing cylinder when being greater than 1.5g/L;
8th: enter speedization cylinder;
After activation, sent into by BT plate in speedization cylinder, containing accelerator in speedization cylinder, its acidity is 0.5N ~ 1.0N, and cylinder temperature is 18 DEG C ~ 32 DEG C, and changing the cylinder cycle is 3000M2 ~ 3500M2;
9th: enter chemical copper cylinder;
After cylinder taking-up changed rapidly by BT plate, BT plate is sent into chemical copper cylinder, mixed liquor containing formaldehyde, heavy copper liquid and NaOH in chemical copper cylinder, in mixed liquor, the content of copper ion is 1.5g/L ~ 2.5g/L, and sodium hydrate content is 8g/L ~ 12g/L, content of formaldehyde is 3g/L ~ 6g/L, cylinder temperature is 25 DEG C ~ 32 DEG C, and changing the cylinder cycle is 38000M2 ~ 40000M2, and the backlight degree in chemical copper cylinder is not less than 8.5 grades;
C: acidleach and copper plating treatment;
BT plate chemically copper cylinder take out after, sulfuric acid solution is adopted to carry out acidleach, in sulfuric acid solution, the content of sulfuric acid is 4% ~ 6%, after acidleach, enter the copper facing stage, containing copper sulphate in copper plating solution, sulfuric acid, copper ball, polishing material and wetting agent, copper ball is to produce copper ion, in copper plating solution, the content of chloride ion is 50PPm ~ 70PPm, copper sulphate content is 60g/L ~ 70g/L, sulfuric acid content is 190g/L ~ 220g/L, copper facing ambient temperature is 23 DEG C ~ 27 DEG C, the current density passed through in copper plating solution is 10ASF ~ 14ASF, the copper facing time is 50min ~ 65min,
Step 5: BT printed line roadlock welds;
A: choose welding surroundings;
Circuit welding resistance environment is chosen at dustiness and operates lower than in the dust-free room of 10 grades;
B:BT plate slice;
Light paints oneself film-discharging machine, and egative film is out after automatic OAI optical check, and all egative films being left in temperature is 20 DEG C ~ 22 DEG C, and humidity is in the environment of 52 DEG C ~ 58 DEG C;
C: welding resistance operates;
The operation of precision welding resistance is carried out to the circuit on BT plate;
D: polishing;
Nog plate ceramic grinder and sand-blasting machine is adopted to polish to BT plate egative film, what wherein nog plate ceramic grinder adopted is that adhesive-bonded fabric brush is polished to BT plate egative film, sand-blasting machine adopts diamond dust to polish to BT plate egative film, two kinds is all alligatoring plate face, the film or solder mask strong bonded can be made, avoid the generation of Lou copper, leakage nickel and leakage base material phenomenon;
E: spectrum assignment;
BT plate and the circuit that welded are carried out exposure-processed, exposure evacuated pressure is 680mm/hg ~ 760mm/hg, carrying out development treatment, development temperature is 28 DEG C ~ 32 DEG C, carries out drying and processing after development, and development bake out temperature is 72 DEG C ~ 78 DEG C, finally carry out high-temperature baking, baking temperature is 150 DEG C, and effective like this wire welding area that prevents produces green oil, the phenomenon generation that solder mask is smudgy, interrupted;
F: inspection;
Test to finished product, to test screening to the breach of wire welding area, crystal bonding area respectively, the finished product screen that breach is greater than 0.05mm is elected, and weeds out.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105307410A (en) * | 2015-10-26 | 2016-02-03 | 苏州福莱盈电子有限公司 | Non-residual adhesive opening copper plating process for circuit board |
| CN105887053A (en) * | 2016-05-06 | 2016-08-24 | 广东利尔化学有限公司 | Chemical copper plating pretreatment process for printed wiring board |
| CN106061139A (en) * | 2016-06-17 | 2016-10-26 | 奥士康精密电路（惠州）有限公司 | Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board |
| CN107072049A (en) * | 2017-03-28 | 2017-08-18 | 江门市高智电子科技有限公司 | Gong groove technique for BT plates |
| CN110740576A (en) * | 2019-09-18 | 2020-01-31 | 惠州市亚科芯基电子科技有限公司 | novel BT (BT) board manufacturing method based on electroplating hole filling process |
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| CN110753448A (en) * | 2019-08-05 | 2020-02-04 | 惠州市亚科芯基电子科技有限公司 | Method for manufacturing multilayer BT (BT) board |
| CN110831350A (en) * | 2019-11-14 | 2020-02-21 | 四会富仕电子科技股份有限公司 | Method for manufacturing bottomless copper circuit board |
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| CN105307410A (en) * | 2015-10-26 | 2016-02-03 | 苏州福莱盈电子有限公司 | Non-residual adhesive opening copper plating process for circuit board |
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| CN110753449B (en) * | 2019-08-05 | 2024-04-05 | 惠州市亚科芯基电子科技有限公司 | Novel BT plate manufacturing method based on OSP |
| CN110740576A (en) * | 2019-09-18 | 2020-01-31 | 惠州市亚科芯基电子科技有限公司 | novel BT (BT) board manufacturing method based on electroplating hole filling process |
| CN110831350A (en) * | 2019-11-14 | 2020-02-21 | 四会富仕电子科技股份有限公司 | Method for manufacturing bottomless copper circuit board |
| CN111405840A (en) * | 2020-04-27 | 2020-07-10 | 江苏苏杭电子有限公司 | Method for manufacturing stepped groove for PCB (printed circuit board) embedding capacity by PCB (printed circuit board) appearance processing machine |
| CN111405840B (en) * | 2020-04-27 | 2021-02-09 | 江苏苏杭电子有限公司 | Method for manufacturing stepped groove for PCB (printed circuit board) embedding capacity by PCB (printed circuit board) appearance processing machine |
| CN112004328A (en) * | 2020-08-31 | 2020-11-27 | 珠海智锐科技有限公司 | Manufacturing method of BT (BT) plate |
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