CN104197919A - Vertical-through-supported glass-metal hemispherical resonant microgyroscope - Google Patents
Vertical-through-supported glass-metal hemispherical resonant microgyroscope Download PDFInfo
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- CN104197919A CN104197919A CN201410390485.XA CN201410390485A CN104197919A CN 104197919 A CN104197919 A CN 104197919A CN 201410390485 A CN201410390485 A CN 201410390485A CN 104197919 A CN104197919 A CN 104197919A
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- hemispherical resonator
- mode
- resonator body
- gyro
- top braces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
- G01C19/5691—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially three-dimensional vibrators, e.g. wine glass-type vibrators
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Gyroscopes (AREA)
- Micromachines (AREA)
Abstract
The invention provides a vertical-through-supported glass-metal hemispherical resonant microgyroscope. The vertical-through-supported glass-metal hemispherical resonant microgyroscope comprises a cuboidal base body, a hemispherical resonator, a supporting column, a cavity, eight electrodes, a top supporting body and a top supporting column, wherein the supporting column is located at the center of the base body, and the eight electrodes are symmetrically distributed at the periphery of the base body; the hemispherical resonator is fixed by the supporting column and the top supporting body and is located in the cavity; the cuboidal base body and the top supporting body are connected together through bonding; the top supporting column is located at the center of the top supporting body. The vertical-through-supported glass-metal hemispherical resonant microgyroscope has the characteristics that the process is simple, the performance is excellent, the reliability is high, the vacuum encapsulation is facilitated, and the like.
Description
Technical field
The present invention relates to a kind of hemispherical reso nance gyroscope of field of micro electromechanical technology, particularly, relate to the micro-gyro of glass metal hemispherical resonator that a kind of up/down perforation supports.
Background technology
Gyroscope be a kind of can sensitive carrier angle or the inertia device of angular velocity, have very important effect in fields such as attitude control and navigator fixs.Along with science and techniques of defence and Aeronautics and Astronautics industrial expansion, inertial navigation system for gyrostatic requirement also to low cost, small size, high precision, multiaxis detection, high reliability, can adapt to the future development of various rugged surroundings.Gyroscope based on MEMS technology adopts micro-nano fabrication technique in batches, its cost, size, power consumption are all very low, and environmental suitability, mission life, reliability, integrated level have great raising compared with conventional art, thereby the micro-gyro of MEMS has become an important directions of MEMS technology broad research and application and development in the last few years.
Through the literature search of prior art is found, Chinese patent " harmonic oscillator of solid fluctuation gyro and solid fluctuation gyro " (number of patent application: CN201010294912.6) utilizes high performance alloy to produce the solid fluctuation gyro with cup-shaped oscillator by the precision machined method of machinery, on cup-shaped oscillator chassis, be bonded with piezoelectric patches as driving and detecting electrode, by apply the voltage signal of certain frequency on drive electrode, cup-shaped oscillator is applied to Piezoelectric Driving power, excitation oscillator produces the solid ripple under driven-mode, in the time having cup-shaped oscillator axis direction turning rate input, oscillator sensed-mode solid ripple to another degeneracy under corioliseffect transforms, the certain angle of phase phasic difference between the solid ripple of two degenerate modes, can detect the variation of input angular velocity by detecting the variation of detecting electrode output voltage on cup-shaped oscillator chassis.
This technology existence is following not enough: the cup-shaped resonant body volume of this solid fluctuation gyro is excessive, has limited its application under much necessary small size condition; The piezoelectric electrode on cup-shaped oscillator chassis is bonded on cup-shaped oscillator, has the possibility coming off under dither, and reliability is not high; The processing technology more complicated of gyro, processing cost is higher, is not suitable for producing in enormous quantities; Gyro driven-mode and sensed-mode frequency splitting are larger, cause the bandwidth of gyro larger, and quality factor are difficult to improve; Gyro fixed form is unstable, is difficult to meet the needs of the occasion of high reliability.
Summary of the invention
For defect of the prior art, the object of this invention is to provide the micro-gyro of glass metal hemispherical resonator that a kind of up/down perforation supports, simple, easy to process, the high Q value of this gyroscope structure, impact resistance be good, be beneficial to the features such as Vacuum Package.
For realizing above object, the invention provides the micro-gyro of glass metal hemispherical resonator that a kind of up/down perforation supports, comprising:
A rectangular parallelepiped matrix;
A hemispherical resonator body;
One is positioned at the pillar of matrix central authorities;
One is present in pillar cavity around;
Eight at the peripheral symmetrical electrode of matrix;
A top braces body;
A top braces post;
Wherein: the material of described hemispherical resonator body is glass metal; Described hemispherical resonator body is subject to described pillar and described top braces body is fixed, and is arranged in described cavity; Described rectangular parallelepiped matrix and described top braces body link together by bonding; Described electrode is symmetrically distributed in rectangular parallelepiped matrix periphery, for applying voltage, described hemispherical resonator body is driven, and detection of vertical is in the angular velocity of described hemispherical resonator body upper surface; Top braces post is positioned at top braces body central authorities, for fixing hemispherical resonator body.
It is that driven-mode and sensed-mode vibrate as reference that the present invention utilizes the special mode of hemispherical resonator body; By applying sinusoidal voltage on two electrodes relative in eight electrodes, by electrostatic force, hemispherical resonator body is energized at driven-mode and is vibrated; When have perpendicular to hemispherical resonator body upper surface turning rate input time, under the effect of coriolis force, the resonance manner of hemispherical resonator body can change to sensed-mode from driven-mode, the vibration of hemispherical resonator body under sensed-mode will make and the above-mentioned electric capacity of executing between electrode and the hemispherical resonator body that alive electrode is adjacent changes, using these two electrodes adjacent with executing alive electrode as detecting electrode; By detecting above-mentioned capacitance variations, detection of vertical is in the size of the angular velocity of hemispherical resonator body upper surface; Described driven-mode and sensed-mode mode coupling.
Compared with prior art, the present invention has following beneficial effect:
1, processing technology is plane fine process, easy to process, is beneficial to batch production;
2, except bottom shore supports, also add that top support structure supports, make resonant body more stable;
3, the supporting way of resonant body increases its rigidity of structure, and resonant body Q value is increased, and has improved detection sensitivity, and this is very important to the weak solid-state gyro of output signal;
4, common supporting way makes gyroscope structure have larger impact resistance up and down, makes gyro have good impact resistance;
5, after matrix and top braces body bonding, gyro is enclosed in an enclosure space, is conducive to the application under vacuum environment.
Brief description of the drawings
By reading the detailed description of non-limiting example being done with reference to the following drawings, it is more obvious that other features, objects and advantages of the present invention will become:
Fig. 1 is the perspective view of the present invention's one preferred embodiment;
Fig. 2 is rectangular parallelepiped matrix 1 top view of the present invention's one preferred embodiment;
Fig. 3 is that attempt in hemispherical resonator body 2 fronts of the present invention's one preferred embodiment;
Fig. 4 is that attempt at hemispherical resonator body 2 back sides of the present invention's one preferred embodiment;
Fig. 5 is the process chart of the present invention's one preferred embodiment;
In figure: 1 is rectangular parallelepiped matrix, 2 is hemispherical resonator body, and 3 is pillar, and 4 is cavity; 5 is electrode, and 6 is top braces body, and 7 is top braces post.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.Following examples will contribute to those skilled in the art further to understand the present invention, but not limit in any form the present invention.It should be pointed out that to those skilled in the art, without departing from the inventive concept of the premise, can also make some distortion and improvement.These all belong to protection scope of the present invention.
As shown in Figure 1, 2, the micro-gyro of glass metal hemispherical resonator that the present embodiment provides a kind of up/down perforation to support, comprising:
A rectangular parallelepiped matrix 1;
A hemispherical resonator body 2;
One is positioned at the pillar 3 of matrix central authorities;
One is present in pillar cavity 4 around;
Eight at the peripheral symmetrical electrode 5 of matrix;
A top braces body 6;
A top braces post 7;
Wherein: described hemispherical resonator body 2 is subject to described pillar 3 and described top braces body 6 is fixing, is arranged in described cavity 4; Described rectangular parallelepiped matrix 1 and described top braces body 6 link together by bonding.
In the present embodiment, the material of described hemispherical resonator body 2 is glass metal, its formation method formation semi-spherical shape of bleeding in described cavity 4 of serving as reasons.Adopt glass metal to make material itself there is the characteristic of metal, can serve as the interior electrode of gyro, serve as interior electrode without the surface sputtering layer of metal at hemispherical resonator body.
In the present embodiment, the material of eight described electrodes 5 is ion doping silicon, and shape is rectangular parallelepiped, by by the foursquare mask plate of cross sectional shape, on rectangular parallelepiped matrix 1, adulterates and forms; Described electrode 5 is symmetrically distributed in rectangular parallelepiped matrix 1 upper surface, for applying voltage, described hemispherical resonator body 2 is driven, and detection of vertical is in the angular velocity of described hemispherical resonator body 2 upper surfaces.
In the present embodiment, described top braces body 6 is connected with described rectangular parallelepiped matrix 1 by the mode of bonding.
In the present embodiment, the material of described top braces post 7 is ion doping silicon, and shape is right cylinder, by the mask plate by cross sectional shape circle, on described top braces body 6, adulterates and forms, to resonant body electrode is derived.
Be the schematic diagram of hemispherical resonator body 2 as shown in Figure 3,4, as shown in the figure, the described hemispherical resonator body 2 in the present embodiment is semi-circular structure.
Be illustrated in figure 5 the present embodiment process flow diagram: first mask lithography venthole on the silicon rectangular parallelepiped matrix 1 through doping, as shown in Fig. 5 (a), wherein doped portion is electrode 5; Then continue mask lithography on rectangular parallelepiped matrix 1 and go out cavity 4 as shown in Fig. 5 (b); Then one deck glass metal that tiles on rectangular parallelepiped matrix 1, as after the hemispherical resonator body 2 and the internal electrode thereof that form, as shown in Fig. 5 (c); Heat subsequently glass metal, obtain hemispherical resonator body 2 by the air in cavity 4 is pumped, as shown in Fig. 5 (d), and by segment glass metal removal, as shown in Fig. 5 (e); In addition, on the silicon chip of doping, form the top braces body 6 as shown in Fig. 5 (f) at another sheet by the mode of mask lithography equally, wherein in the bottom surface of the top braces post 7 on top braces body 6 size and hemispherical resonator body 2, be removed part size and coincide; Finally, will link together by the mode of bonding through rectangular parallelepiped matrix 1 and the top braces body 6 of processing, form the one-piece construction of the micro-gyro of glass metal hemispherical resonator of up/down perforation support, as shown in Fig. 5 (g); In final formed structure, outer electrode 5 can the part outside top braces body 6 go between by outer electrode 5, and internal electrode can go between by top braces post 7.
In the present embodiment, driven-mode and the sensed-mode of hemispherical resonator body 2 match each other, and its implication is: the vibration shape of driven-mode and sensed-mode is similar, only differ mutually certain angle; In the middle of driven-mode and sensed-mode, not containing other mode of oscillation, frequency splitting is little; When hemispherical resonator body 2 spatial symmetries in the present embodiment form mode coupling when high; When hemispherical resonator body 2 spatial symmetries in the present embodiment when low mode coupling be difficult to form.
The micro-gyro of glass metal hemispherical resonator that up/down perforation described in the present embodiment supports, utilize silicon materials and doping techniques, adopt MEMS plane fine process, utilize sacrifice layer process at substrate spin coating thick photoresist as SU-8, utilize the mask plate of making to carry out photoetching; Develop afterwards, graphical, obtain rectangular parallelepiped matrix after processing 1, one and be positioned at the pillar 3 of rectangular parallelepiped matrix central authorities and one and be present in pillar cavity 4 around, and top braces body 6; Obtain a hemispherical resonator body 2 by the mode of heating glass and exhaust again; Finally, rectangular parallelepiped matrix 1 and top braces body 6 are linked together by the mode of bonding, form the one-piece construction of the micro-gyro of glass metal hemispherical resonator of up/down perforation support.
Above specific embodiments of the invention are described.It will be appreciated that, the present invention is not limited to above-mentioned specific implementations, and those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present invention.
Claims (6)
1. the micro-gyro of glass metal hemispherical resonator that up/down perforation supports, is characterized in that, comprising:
A rectangular parallelepiped matrix;
A hemispherical resonator body;
One is positioned at the pillar of described matrix central authorities;
One is present in institute's pillar cavity around;
Eight at the peripheral symmetrical electrode of institute's matrix;
A top braces body;
A top braces post;
Wherein: the material of described hemispherical resonator body is glass metal; Described hemispherical resonator body is subject to described pillar and described top braces body is fixed, and is arranged in described cavity; Described rectangular parallelepiped matrix and described top braces body link together; Described electrode is symmetrically distributed in described rectangular parallelepiped matrix periphery, for applying voltage, described hemispherical resonator body is driven, and detection of vertical is in the angular velocity of described hemispherical resonator body upper surface; Top braces post is positioned at top braces body central authorities.
2. the micro-gyro of glass metal hemispherical resonator that a kind of up/down perforation according to claim 1 supports, is characterized in that, the material of eight described electrodes is ion doping silicon, and shape is rectangular parallelepiped.
3. the micro-gyro of glass metal hemispherical resonator that a kind of up/down perforation according to claim 1 supports, is characterized in that, the material of described top braces post is ion doping silicon.
4. the micro-gyro of glass metal hemispherical resonator that a kind of up/down perforation according to claim 1 supports, is characterized in that, described top braces body is connected with described rectangular parallelepiped matrix by the mode of bonding.
5. the micro-gyro of glass metal hemispherical resonator that a kind of up/down perforation according to claim 1 supports, is characterized in that, described hemispherical resonator body is the formation semi-spherical shape of bleeding in described cavity.
6. the micro-gyro of glass metal hemispherical resonator supporting according to a kind of up/down perforation described in claim 1-5 any one, is characterized in that, it is that driven-mode and sensed-mode vibrate as reference that described micro-gyro utilizes the special mode of hemispherical resonator body; By applying sinusoidal voltage on two electrodes relative in eight electrodes, by electrostatic force, hemispherical resonator body is energized at driven-mode and is vibrated; When have perpendicular to hemispherical resonator body upper surface turning rate input time, under the effect of coriolis force, the resonance manner of hemispherical resonator body can change to sensed-mode from driven-mode, the vibration of hemispherical resonator body under sensed-mode will make and the above-mentioned electric capacity of executing between electrode and the hemispherical resonator body that alive electrode is adjacent changes, using these two electrodes adjacent with executing alive electrode as detecting electrode; By detecting above-mentioned capacitance variations, detection of vertical is in the size of the angular velocity of hemispherical resonator body upper surface; Described driven-mode and sensed-mode mode coupling.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410390485.XA CN104197919B (en) | 2014-08-08 | 2014-08-08 | The glass metal hemispherical resonator microthrust test of up/down perforation support |
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| CN201410390485.XA CN104197919B (en) | 2014-08-08 | 2014-08-08 | The glass metal hemispherical resonator microthrust test of up/down perforation support |
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| CN104197919A true CN104197919A (en) | 2014-12-10 |
| CN104197919B CN104197919B (en) | 2017-06-13 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104913773A (en) * | 2015-05-29 | 2015-09-16 | 上海交通大学 | Semi-spherical micro gyroscope packaging structure and preparation method thereof |
| CN105424019A (en) * | 2015-08-14 | 2016-03-23 | 南京理工大学 | Micro-hemispherical resonant gyroscope based on borosilicate glass annealing forming and manufacturing method thereof |
| CN108871302A (en) * | 2018-06-22 | 2018-11-23 | 上海交通大学 | Electrode resonance microthrust test |
| CN117367397A (en) * | 2023-12-07 | 2024-01-09 | 湖南二零八先进科技有限公司 | Preparation method of hemispherical harmonic oscillator |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117367397A (en) * | 2023-12-07 | 2024-01-09 | 湖南二零八先进科技有限公司 | Preparation method of hemispherical harmonic oscillator |
| CN117367397B (en) * | 2023-12-07 | 2024-02-13 | 湖南二零八先进科技有限公司 | Preparation method of hemispherical harmonic oscillator |
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| CN104197919B (en) | 2017-06-13 |
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