CN104190654A - IC chip recycling and cleaning method and system - Google Patents
IC chip recycling and cleaning method and system Download PDFInfo
- Publication number
- CN104190654A CN104190654A CN201410414445.4A CN201410414445A CN104190654A CN 104190654 A CN104190654 A CN 104190654A CN 201410414445 A CN201410414445 A CN 201410414445A CN 104190654 A CN104190654 A CN 104190654A
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- CN
- China
- Prior art keywords
- chip
- chemical liquid
- deionized water
- soak
- rinsing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/007—Heating the liquid
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to an IC chip recycling and cleaning method and system. The method comprises the following steps of IC chip recycling, chemical liquid solution soaking, cooling, ethyl alcohol soaking, deionized water rinsing and cleaning. According to the IC chip recycling and cleaning method and system, the steps of repeated degumming and chemical residue and impurity removal are executed, so that IC chips scrapped in the electronic product assembling process are recycled, the scrapped IC chips are reutilized, resource waste is greatly reduced, the recycled IC chips are not damaged, the quality of the IC chips is ensured, and reuse is not affected.
Description
Technical field
The present invention relates to a kind of IC chip recovery and rinsing method and system thereof.
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Background technology
In electronic product assembling process, have a large amount of chip rejection, at present also without any equipment and method for reclaiming in batches IC chip, therefore the IC chip of scrapping is all directly destroyed, and causes the significant wastage of resource, does not meet the green call of producing of energy-saving and emission-reduction.How IC chip is reclaimed, and can efficiently IC chip be cleaned in batches and remove photoresist that recycle be the problem that needs at present solution.
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Summary of the invention
The object of this invention is to provide a kind of IC chip recovery and rinsing method.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: a kind of IC chip recovery and rinsing method, and it comprises the following steps,
(1), IC chip reclaims: IC chip was never used and the integrated circuit scrapped in peel off collection;
(2), chemical liquid soaks: the IC chip reclaiming is soaked several times in IC chemical liquid, remove the glue of IC chip surface, soak at room temperature and soak for the first time, soaking temperature is afterwards 80～100 DEG C, and each soak time is 1～15min;
(3), cooling: naturally cooling 1～5min at room temperature and in ventilation;
(4), alcohol immersion: at room temperature, the IC chip soaking is put into ethanol soak in IC chemical liquid, remove the residual and granule foreign of the chemical liquid of IC chip surface, soak time is 1～5min;
(5), rinsed with deionized water: at room temperature, by IC chip rinsing in deionized water of soaking, further remove the residual and granule foreign of chemical liquid in ethanol, soak time is 1～5min;
(6), cleaned.
Optimize, after step (five) completes, again at room temperature, IC chip is put into ethanol and soak, guarantee that the residual and granule foreign of the chemical liquid of IC chip surface removes completely, soak time is 1～5min.
Further, when the chemical liquid of high temperature discharges in step (two), need to first drop to 40 DEG C discharges below again.
Optimize, secondary soaks in the ethanol of use is delivered to step (four) ethanol by pump and again utilizes.
The present invention also provides a kind of IC chip recovery and rinsing system, and it comprises chemical liquid immersion portion, cooling end, alcohol immersion portion, rinsed with deionized water portion successively.
Optimize, described chemical liquid immersion portion comprises that multiple temperature are the primary chemical liquid medicine dipping tank of room temperature, multiple secondary chemical liquid soaking compartment with heater block; Described cooling end is the automatic transfer station of chain; A described alcohol immersion portion comprises at least one alcohol immersion groove; Described rinsed with deionized water portion comprises at least one rinsed with deionized water groove, is provided with sprayer and bubbler in rinsed with deionized water groove.
Optimize, it also comprises the feed flow recovering mechanism for each soaking compartment and potcher are carried out to soak or deionized water supply and recovery.
Beneficial effect of the present invention is: the present invention reclaims by the step of repeatedly removing photoresist, going chemical residual and impurity the IC chip of scrapping in electronic product, not only discarded IC chip is reclaimed and re-used, greatly reduce the waste of resource, and the IC chip reclaiming is injury-free, the quality that has ensured IC chip, does not affect and reuses.
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Brief description of the drawings
Accompanying drawing 1 is the flow chart of IC chip recovery and rinsing method in the present invention;
Accompanying drawing 2 is the structural representation of IC chip recovery and rinsing system in the present invention
Wherein: 1, primary chemical liquid medicine dipping tank; 2, secondary chemical liquid soaking compartment; 3, the automatic transfer station of anticorrosion chain; 4(4 '), alcohol immersion groove; 5, rinsed with deionized water groove; 6, sprayer; 7, bubbler.
Detailed description of the invention
Below in conjunction with embodiment shown in the drawings, the present invention is described in detail below:
As shown in Figure 1, in the present embodiment, this IC chip recovery and rinsing method comprises the following steps successively:
One .IC chip reclaims, two. room temperature chemical liquid soaks, three. heating chemical liquid soaks, four. cooling, five. once alcohol immersion, six. rinsed with deionized water, seven. secondary alcohol immersion, eight. cleaned.
Wherein: step 1. IC chip was never used and the electronic product scrapped in peel off collection;
Step 2. can carry out repeatedly soaking 1～15min(in the IC chip of recovery IC chemical liquid at room temperature), thereby tentatively remove the glue of IC chip surface;
Step 3. the IC chip after completing steps two is put into the IC chemical liquid of 80～100 DEG C and again soak 1～15min(and can carry out repeatedly), remove glue completely, chemical liquid used is ANS909 chemical liquid, can effectively remove glue residual;
Step 4. the IC chip having removed photoresist is placed on to naturally cooling 1～5min in the automatic transfer station of anticorrosion chain, and temperature is room temperature, and transfer station is in ventilation.
Step 5. at room temperature, the IC chip soaking is put into ethanol soak in IC chemical liquid, remove the residual and granule foreign of the chemical liquid of IC chip surface, soak time is 1～5min;
Step 6. at room temperature, by IC chip rinsing in deionized water of soaking, further remove the residual and granule foreign of chemical liquid in ethanol, soak time is 1～5min;
Step 7. at room temperature, again IC chip is put into ethanol and soak, guarantee that the residual and granule foreign of the chemical liquid of IC chip surface removes completely, soak time is 1～5min.
Step 8. clean, put in storage and deposit.
Above-mentioned steps needs following IC chip recovery and rinsing system to complete:
This successively system comprise: chemical liquid immersion portion, cooling end, alcohol immersion portion, rinsed with deionized water portion, secondary alcohol immersion portion, feed flow recovering mechanism (not shown in the diagram) and the alarm fire suppression mechanism (not shown in the diagram) of each soaking compartment being carried out to soak supply and recovery.
As shown in Figure 2, in the present embodiment, described chemical liquid immersion portion comprises that primary chemical liquid medicine dipping tank that two temperature are room temperature 1, four have the secondary chemical liquid soaking compartment 2 of heater block; Described cooling end is the automatic transfer station 3 of anticorrosion chain; A described alcohol immersion portion comprises an alcohol immersion groove 4; Described rinsed with deionized water portion comprises a rinsed with deionized water groove 5, is provided with bubbler 7 and by the sprayer of deionized water atomisation 6, can makes deionized water fully contact with IC chip in rinsed with deionized water groove 5, and rinsing is more thorough; Secondary alcohol immersion portion comprises an alcohol immersion groove 4 '; Between alcohol immersion groove 4 and alcohol immersion groove 4 ', being also provided with part ethanol for alcohol immersion groove 4 ' is given off pumps to the air driven pump in alcohol immersion groove 4, if the less words of impurity can directly not discharged in the ethanol in alcohol immersion groove 4 ', again utilize but deliver in alcohol immersion groove 4.
In primary chemical liquid medicine dipping tank 1, soak time is set as 10min, in secondary chemical liquid soaking compartment 2, soak time is 20min, be primary chemical liquid medicine dipping tank 1 number than and the number of secondary chemical liquid soaking compartment 2 than than identical, ensureing that like this optimization must utilize primary chemical liquid medicine dipping tank 1 and secondary chemical liquid soaking compartment 2 with IC chip soak time in primary chemical liquid medicine dipping tank 1 and secondary chemical liquid soaking compartment 2.
In the time that in secondary chemical liquid soaking compartment 2, chemical liquid need to be changed, it should be noted that: first the chemical liquid of high temperature is first dropped to 40 DEG C and discharge again below.
How many above-mentioned each mentioned soaking compartment or potcher numbers can regulate according to output.
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that spirit is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.
Claims (7)
1. an IC chip recovery and rinsing method, is characterized in that, it comprises the following steps,
(1), IC chip reclaims: IC chip was never used and the electronic product scrapped in peel off collection;
(2), chemical liquid soaks: the IC chip reclaiming is soaked several times in IC chemical liquid, remove the glue of IC chip surface, soak at room temperature and soak for the first time, soaking temperature is afterwards 80～100 DEG C, and each soak time is 1～15min;
(3), cooling: naturally cooling 1～5min at room temperature and in ventilation;
(4), alcohol immersion: at room temperature, the IC chip soaking is put into ethanol soak in IC chemical liquid, remove the residual and granule foreign of the chemical liquid of IC chip surface, soak time is 1～5min;
(5), rinsed with deionized water: at room temperature, by IC chip rinsing in deionized water of soaking, further remove the residual and granule foreign of chemical liquid in ethanol, soak time is 1～5min;
(6), cleaned.
2. IC chip recovery and rinsing method according to claim 1, it is characterized in that: after step (five) completes, again at room temperature, IC chip is put into ethanol and soak, guarantee that the residual and granule foreign of the chemical liquid of IC chip surface removes completely, soak time is 1～5min.
3. IC chip recovery and rinsing method according to claim 1, is characterized in that: when the chemical liquid of high temperature discharges in step (two), need to first drop to 40 DEG C and discharge below again.
4. IC chip recovery and rinsing method according to claim 2, is characterized in that: secondary soaks in the ethanol of use is delivered to step (four) ethanol by pump and again utilizes.
5. the system to IC chip recovery and rinsing according to the method for claim 1～4, is characterized in that: it comprises chemical liquid immersion portion, cooling end, alcohol immersion portion, rinsed with deionized water portion successively.
6. IC chip recovery and rinsing system according to claim 5, is characterized in that: described chemical liquid immersion portion comprises that multiple temperature are the primary chemical liquid medicine dipping tank of room temperature, multiple secondary chemical liquid soaking compartment with heater block; Described cooling end is the automatic transfer station of chain; A described alcohol immersion portion comprises at least one alcohol immersion groove; Described rinsed with deionized water portion comprises at least one rinsed with deionized water groove, is provided with sprayer and bubbler in rinsed with deionized water groove.
7. IC chip recovery and rinsing system according to claim 6, is characterized in that: it also comprises the feed flow recovering mechanism for each soaking compartment and potcher are carried out to soak or deionized water supply and recovery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410414445.4A CN104190654B (en) | 2014-08-21 | 2014-08-21 | IC chip recycling and cleaning method and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410414445.4A CN104190654B (en) | 2014-08-21 | 2014-08-21 | IC chip recycling and cleaning method and system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104190654A true CN104190654A (en) | 2014-12-10 |
| CN104190654B CN104190654B (en) | 2017-02-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410414445.4A Active CN104190654B (en) | 2014-08-21 | 2014-08-21 | IC chip recycling and cleaning method and system |
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| Country | Link |
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| CN (1) | CN104190654B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107180918A (en) * | 2017-04-25 | 2017-09-19 | 深圳市立德通讯器材有限公司 | A kind of AMOLED display screens IC does over again cleaning method |
| CN110071054A (en) * | 2018-01-23 | 2019-07-30 | 上海新阳半导体材料股份有限公司 | Gluing method is removed in a kind of post-processing of integrated antenna package |
| CN112951706A (en) * | 2019-11-26 | 2021-06-11 | 东莞新科技术研究开发有限公司 | Method for removing residual glue on surface of semiconductor |
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| CN1378235A (en) * | 2001-03-30 | 2002-11-06 | 华邦电子股份有限公司 | Cleaning method for reclaimed chip |
| US20040063595A1 (en) * | 2002-09-26 | 2004-04-01 | Park Dong-Jin | Composition for stripping photoresist and method of preparing the same |
| CN101944562A (en) * | 2010-09-03 | 2011-01-12 | 湘能华磊光电股份有限公司 | Method for removing light-emitting diode (LED) chip electrode |
| CN202700873U (en) * | 2012-07-26 | 2013-01-30 | 江阴迪林生物电子技术有限公司 | Chip online cleaning device |
| CN103676505A (en) * | 2013-12-23 | 2014-03-26 | 大连奥首科技有限公司 | Photoresist stripper for chip and preparation method and photoresist removing process thereof |
| CN103785641A (en) * | 2012-10-30 | 2014-05-14 | 王红亚 | Novel washing process |
-
2014
- 2014-08-21 CN CN201410414445.4A patent/CN104190654B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1378235A (en) * | 2001-03-30 | 2002-11-06 | 华邦电子股份有限公司 | Cleaning method for reclaimed chip |
| US20040063595A1 (en) * | 2002-09-26 | 2004-04-01 | Park Dong-Jin | Composition for stripping photoresist and method of preparing the same |
| CN101944562A (en) * | 2010-09-03 | 2011-01-12 | 湘能华磊光电股份有限公司 | Method for removing light-emitting diode (LED) chip electrode |
| CN202700873U (en) * | 2012-07-26 | 2013-01-30 | 江阴迪林生物电子技术有限公司 | Chip online cleaning device |
| CN103785641A (en) * | 2012-10-30 | 2014-05-14 | 王红亚 | Novel washing process |
| CN103676505A (en) * | 2013-12-23 | 2014-03-26 | 大连奥首科技有限公司 | Photoresist stripper for chip and preparation method and photoresist removing process thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107180918A (en) * | 2017-04-25 | 2017-09-19 | 深圳市立德通讯器材有限公司 | A kind of AMOLED display screens IC does over again cleaning method |
| CN110071054A (en) * | 2018-01-23 | 2019-07-30 | 上海新阳半导体材料股份有限公司 | Gluing method is removed in a kind of post-processing of integrated antenna package |
| CN112951706A (en) * | 2019-11-26 | 2021-06-11 | 东莞新科技术研究开发有限公司 | Method for removing residual glue on surface of semiconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104190654B (en) | 2017-02-15 |
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