CN104183559B - 膜覆盖的开放腔体传感器封装 - Google Patents
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Abstract
公开了一种膜覆盖的开放腔体封装。公开了用于通过批量处理来覆盖开放腔体集成电路封装的技术。在示例方法中,在单个批量引线框或衬底上模制多个开放腔体封装,每个开放腔体封装包括底板以及在所述底板周围布置的多个壁以形成腔体,所述壁中的每一个具有邻近所述底板的底端并且具有与所述底端相对的顶侧。至少一个半导体器件附接到所述底板并且在所述开放腔体封装中的每一个的腔体内,单个柔性薄膜粘附到所述多个开放腔体封装的壁的顶侧,以便基本上覆盖所有腔体。然后在各封装之间切断所述柔性薄膜。
Description
技术领域
本申请涉及集成电路模块,并且特别是涉及用于封装开放腔体集成电路封装中的传感器的技术。
背景技术
在很多情况下,集成电路器件嵌入在实心体封装中。一种流行的封装例如是塑料四方扁平封装(QFP),其具有从一般为平坦矩形的封装的四侧延伸的所谓的翼型引线。利用这种类型的封装,使用环氧树脂材料将集成电路器件接合到封装衬底。例如,封装衬底可以是引线框的管芯盘(paddle)部分。布线接合从器件上的接合焊盘附接到封装引线上的附接点。然后利用塑料模制化合物材料对器件和封装衬底进行压模成形(over-mold),塑料模制化合物材料在固化之后形成塑料封装主体。
实心体封装方法对于某些集成电路模块并非是恰当的。包括压力传感器或光学传感器的集成电路模块例如要求使用开放腔体封装,从而环境压力或外部光源可以到达器件。然而,在一些情况下,典型地对封装提供顶盖以保护内部部分,但更一般的是,提供在制造电路板或使用被封装的器件的其它单元期间气动拾取和放置机器可以使用的表面。
例如,图1图解可以与压力传感器一起使用的开放腔体封装的示例。封装110包括塑料封装主体115以及与之粘附的塑料顶盖120。塑料顶盖120在其中心中具有大的开孔,以允许环境压力到达封装内部的压力传感器。封装150包括陶瓷封装主体155和与之粘附的金属顶盖160。金属顶盖160也在中心具有开孔。
在制造像如图1所示的被封装的器件期间,使用气动拾取和放置机器而典型地一次一个地将每个顶盖放置在封装主体上,并且将每个顶盖胶粘或熔接到位。使用开放腔体封装来组装集成电路模块需要改进的处理。
发明内容
本发明实施例包括集成电路模块和用于产生这样的模块的方法。根据示例实施例,集成电路模块包括:开放腔体封装,包括底板以及在所述底板周围布置的多个壁,以形成腔体,所述壁中的每一个具有邻近所述底板的底端并且具有与所述底端相对的顶侧。半导体器件附接到所述开放腔体封装的底板,在腔体内,柔性薄膜粘附到所述壁的顶侧,从而基本上覆盖所述腔体。在一些实施例中,柔性薄膜通过粘接层粘附到所述壁的顶侧。在一些其它实施例中,所述柔性薄膜被激光熔接到所述壁的顶侧。
在一些实施例中,所述半导体器件是压力传感器器件。在其它实施例中,所述半导体器件是光学传感器器件。在这些实施例中的一些中,所述柔性薄膜可以对于所述第一波长基本上是透明的。
在一些实施例中,所述柔性薄膜由在回流焊接温度下分解的材料组成。在这些实施例中的一些中,所述柔性薄膜包括硝化纤维。在一些其它实施例中,所述柔性薄膜是微孔薄膜,其准许气体通过所述薄膜,但防止液体进入所述腔体。
在制备集成电路模块的示例方法中,在单个批量引线框或衬底上模制多个开放腔体封装,每个开放腔体封装包括底板以及在所述底板周围布置的多个壁,以形成腔体,所述壁中的每一个具有邻近所述底板的底端并且具有与所述底端相对的顶侧。至少一个半导体器件附接到所述底板并且在所述开放腔体封装中的每一个的腔体内,以及单个柔性薄膜片材粘附到所述多个开放腔体封装的壁的顶侧,以便基本上覆盖所有腔体。然后在各封装之间切断所述柔性薄膜。例如,可以通过用激光来去除各封装之间的柔性薄膜或通过利用同时切割各封装之间的引线框的修剪和形成处理来去除各封装之间的柔性薄膜来完成这种切断。
在一些实施例中,使用应用于覆盖所述封装的腔体的柔性薄膜的气动喷嘴(经常被称为“吸管”),将所述封装中的每一个相继放置在对应电路板或衬底。在这些实施例中的一些中,所述柔性薄膜由在回流焊接温度下分解的材料组成,所述方法进一步包括:使得所述封装经受回流温度,以便将所述封装附接到所述电路板或衬底,并且同时分解覆盖所述封装的腔体的柔性薄膜。
在阅读以下详细描述并且查看随附的附图时,本领域技术人员将认识到附加的特征和优点。
附图说明
附图的元件并非一定相对于彼此成比例。同样的标号指明对应的类似部分。可以组合各个所图解的实施例的特征,除非它们彼此互斥。在附图中描绘实施例并且在后面的描述中详细描述实施例。
图1图解开放腔体封装的示例。
图2图解以半刚性薄膜覆盖的开放腔体封装。
图3图解利用充分柔性的薄膜覆盖的开放腔体封装。
图4图解用于使用柔性薄膜片材来组装集成电路模块的处理。
图5是图解用于组装集成电路模块的处理的处理流程图。
具体实施方式
在下面的详细描述中参照随附的附图,附图形成描述的一部分,并且在附图中以图解方式示出其中可以实施本发明的具体实施例。在这一点上,参照所描述的(多个)图的定向来使用方向性术语(诸如“顶部”、“底部”、“前”、“后”、“前端”、“尾端”等)。因为实施例的部件可以位于多个不同的定向上,因此为了说明而绝非进行限制的目的来使用方向性术语。应理解,可以利用其它实施例,并且可以在不脱离本发明的范围的情况下作出结构或逻辑上的改变。因此,不应以进行限制的意义来看待下面的详细描述,并且本发明的范围由所附权利要求限定。
应理解,在此所描述的各个示例性实施例的特征可以相互组合,除非另外地具体注明或者除非这种组合明显是不可能的。
如上面讨论的那样,在制造像如图1所示那样的开放腔体封装器件期间,使用气动拾取和放置机器而典型地将每个顶盖一次一个地放置在封装主体上,并且胶粘或熔接到位。因为该处理一般是顺序地完成的,所以这是耗时且昂贵的处理。根据本发明的若干实施例,可以在批量处理中使用可以胶粘或层叠到封装的薄膜来一次覆盖很多封装。然后可以例如通过激光处理,或者通过用于切割各封装之间的批量引线框的同一修剪和形成处理来切割各封装之间的薄膜。
在一些实施例中,薄膜可以是充分柔性的,并且被胶粘或熔接到位,从而其完全密封开放腔体,因此提供环境保护。替换地,薄膜可以是相对稳定的,例如,在柔性上类似于薄纸板。
图2示出后一种方法的示例。集成电路模块200示出开放腔体封装210,开放腔体封装210具有粘附到封装的底板230周围的侧壁220的顶部的柔性但是半刚性的薄膜250。半刚性薄膜250具有足够的刚性,以甚至在气动拾取和放置机器的喷嘴拾取模块200的时候也保持其形状,但是为柔性的而足以由于基本上超过模块的重量的力而变形。
半刚性薄膜中的开孔260允许环境压力到达粘附到开放腔体封装240的底板的半导体器件240。在一些实施例中,半导体240可以是压力传感器,例如,或更一般地,压力换能器(诸如空气压力传感器或声学传感器、扬声器或谐振器)。在一些情况下,半导体器件240可以直接胶粘到塑料封装主体的底板,例如,如图2的示例所示。在其它情况下,半导体器件240可以粘附到承载其它器件和/或电导体的衬底,其中,衬底进而粘附到封装底板,或被模制在封装主体中以便形成底板。在一些情况下,器件可以被保护胶270保护,保护胶270在仍然允许压力作用力对传感器起作用的同时保持水分和其它污染物远离半导体器件240。
在其它实施例中,薄膜可以有相当的柔性并且完全密封在封装的顶部处的开孔,因此提供某种程度的环境保护,甚至不用使用保护胶。图3示出根据该方法的示例集成电路模块300,图3示出具有粘附到封装的底板230周围的侧壁220的顶部的柔性薄膜350的开放腔体封装210。半导体器件240再次被粘附到开放腔体封装210的底板;在图3所示的示例中,器件直接胶粘到塑料封装主体的底板。
在没有为半导体器件240提供的附加保护的情况下,用非常薄的柔性薄膜350来密封图3中的集成电路模块300。然而,如果半导体器件240是压力传感器,则该方法可能将传感器的能力限制为跟踪环境压力,虽然这在相对高压力应用中(诸如在用于测量货车轮胎内部的压力的压力传感器中,其中,压力可能超过4bar)可能是有效的。
在不期望压力快速改变的情形中,至少部分地进行这种限制的该方法的一个变形特别地有效。在这些应用中,柔性薄膜可以是微孔薄膜,其准许气体通过薄膜,但防止液体或其它污染物进入腔体。用于这样的情况的示例材料是用于在通风头灯(ventingheadlight)组装中的使用的W.L. Gore制造的Goretex®薄膜。疏水薄膜(其为防水的)是可用的,同样的是疏油薄膜,其使油性流体、洗涤剂和酒精等的流动受限。在一些实施例中,诸如在半导体器件240是气体传感器的应用中,薄膜可以被选择为气体选择性开口,从而只有特定种类的气体能够穿透薄膜到达传感器。
图3中图解的实施例在使用除了压力传感器之外的器件的应用中也可以是合适的。例如,在一些实施例中,半导体器件240可以是光学传感器,适用于检测至少第一波长的光。示例包括具有集成光伏单元的相机芯片或系统。在这些实施例中的一些中,可以选择柔性薄膜350,从而其对于至少该第一波长基本上是透明的,从而甚至在柔性薄膜350在适当位置上的情况下,光学传感器是可操作的。
在一些应用中,可能想要的是只是到集成电路模块被安装在电子器件中的电路板上的时间为止,在开放腔体封装上具有“顶盖”,在此之后,可能优选在适当位置上不具有任何类型的顶盖或密封物。例如,当集成电路包括光学传感器时可能想要该方法。直到集成电路模块被安装为止在适当位置上具有顶盖为模块中的(多个)半导体器件提供了保护,并且还提供气动拾取和放置机器可以用于在电路板或其它衬底上放置集成电路模块以用于在适当的位置进行焊接的表面。然而,在安装集成电路模块之后,顶盖可能干扰半导体器件的操作。
对于该问题的一种解决方案是利用被设计为在焊料回流处理期间分解的柔性薄膜来密封开放腔体封装。根据该方法的柔性薄膜密封物在通常的室内和工厂温度下(例如在50至120华氏度之间)的稳定的,但在焊料回流期间经历的温度下(例如高于几百华氏度)快速分解。在一些实施例中,柔性薄膜可以至少部分地由硝化纤维材料(比如像在19世纪晚期和20世纪早期用作用于摄影、X射线和运动图片胶片的基底的材料)组成。合适的硝化纤维柔性薄膜在室温温度下会是稳定的,但在焊料回流温度下将自发地燃烧。用这样的薄膜密封的器件因此在运输到组装器期间并且在电路板组装的拾取和放置阶段期间维持密封。薄膜在回流处理期间自发地燃烧,使内部(多个)半导体器件暴露于大气压力和/或光。注意,在一些实施例中,黏性保护胶可以用于提供半导体器件的某种保护。
图4图解用于使用所讨论的任意柔性薄膜来组装集成电路模块的示例处理的特征。如在步骤410所示,在批量下框(subframe)或有关的衬底上模制开放腔体封装210(引线的或非引线的)。图4仅示出具有七个封装主体的横截面视图;应领会批量引线框可以在两个维度上扩展,允许制造封装主体的矩形阵列。
如在步骤420可见,例如,使用管芯和布线接合处理或倒装芯片处理,将半导体器件240集成到封装。如在步骤430所示,在单个批量处理中,单个薄膜片材490被层叠、胶粘、激光熔接、压印(emboss)或以另外的方式粘附到封装210的侧壁的顶部。最后,如在步骤440所示,切断各封装210之间的薄膜。这可以例如使用激光切割处理或使用用于切割各封装之间的引线框的同一修剪和形成处理来完成。
图5是更一般地图解图4的处理的处理流程图。如在方框510所示,在单个批量引线框或衬底上模制多个开放腔体封装,每个开放腔体封装包括底板以及在所述底板周围布置的多个壁以形成腔体,所述壁中的每一个具有邻近所述底板的底端并且具有与所述底端相对的顶侧。如在方框520所示,至少一个半导体器件附接到底板并且在开放腔体封装中的每一个的腔体内。单个柔性薄膜片材然后粘附到多个开放腔体封装的壁的顶侧,以便基本上覆盖所有腔体,如在方框530所示。16.这可以例如使用粘接剂,或者通过将柔性薄膜片材激光熔接到所述壁的顶侧来完成。
接下来,如在方框540所示,切断各封装之间的柔性薄膜。在一些实施例中,切断各封装之间的柔性薄膜包括:利用激光去除各封装之间的柔性薄膜。在一些其它实施例中,切断各封装之间的柔性薄膜包括:利用同时切割各封装之间的引线框的修剪和形成处理来去除各封装之间的柔性薄膜。
在一些实施例中,在方框510-540所示的操作后接拾取和放置处理,如在方框550所示,由此使用应用于覆盖所述封装的腔体的柔性薄膜的气动喷嘴在对应的电路板或衬底上放置封装中的每一个。该拾取和放置操作可以后接焊料回流操作,如在方框560所示。在一些实施例中,如上面讨论的那样,柔性薄膜可以由在回流焊接温度下分解的材料(例如硝化纤维)组成,其中,焊料回流处理可操作以同时将封装附接到电路板或其它衬底并且分解覆盖所述封装的腔体的柔性薄膜。应领会,可以通过与在方框510-540中所示的组装操作不同的实体和/或在不同的位置处执行方框550和560所示的拾取和放置以及焊料回流操作,而在一些情况下可以根本不执行这些操作。因此,在所图解的操作可以不在所有实施例中或所图解方法的每个实例中出现的意义上,利用指示这些操作是“可选”的虚线来示出方框550和560。
图4和图5所示的处理可以应用于包含任何各种类型的半导体器件的各种集成电路模块。如上面讨论的那样,在一些情况下,每个封装中的半导体器件是压力传感器器件。在一些实施例中,半导体器件是光学传感器器件,适用于检测在第一波长处的光。在这些实施例中的一些中,柔性薄膜对于所述第一波长基本上是透明的,从而传感器在柔性薄膜处于适当位置的情况下维持可操作。
如在此使用的那样,术语“具有”、“包含”、“包括”和“含有”等是指示所声明的要素或特征的存在性的开放式术语,而非排除附加的要素或特征。数量词“一个”、“某个”以及代词“这个”意图包括复数以及单数,除非上下文另外清楚地指示。
应理解,在此所描述的各个实施例的特征可以彼此组合,除非另外具体地注明。
虽然已经在此图解并且描述了具体实施例,但本领域技术人员应领会,在不脱离本发明的范围的情况下,可以由多种替换和/或等同的实现来代替对于所示出并且描述的具体实施例。在此所提供的各种技术的描述意图覆盖在此所讨论的具体实施例的任意适配或变形。因此,意图仅由所附权利要求及其等同物限定本发明。
Claims (16)
1.一种集成电路模块,包括:
开放腔体封装,包括底板以及在所述底板周围布置的多个壁以形成腔体,所述壁中的每一个具有邻近所述底板的底端并且具有与所述底端相对的顶侧;
半导体器件,在所述腔体内附接到所述开放腔体封装的所述底板;以及
柔性薄膜,粘附到所述壁的顶侧以便基本上覆盖所述腔体,
其中,所述柔性薄膜由在回流焊接温度下分解的材料组成。
2.如权利要求1所述的集成电路模块,其中,所述半导体器件是压力传感器器件。
3.如权利要求1所述的集成电路模块,其中,所述半导体器件是适用于检测在第一波长处的光的光学传感器器件。
4.如权利要求3所述的集成电路模块,其中,所述柔性薄膜对于所述第一波长基本上是透明的。
5.如权利要求1所述的集成电路模块,其中,所述柔性薄膜包括硝化纤维。
6.如权利要求1所述的集成电路模块,其中,所述柔性薄膜通过粘接层粘附到所述壁的顶侧。
7.如权利要求1所述的集成电路模块,其中,所述柔性薄膜被激光熔接到所述壁的顶侧。
8.一种组装集成电路模块的方法,所述方法包括:
在单个批量引线框或衬底上模制多个开放腔体封装,每个开放腔体封装包括底板以及在所述底板周围布置的多个壁以形成腔体,所述壁中的每一个具有邻近所述底板的底端并且具有与所述底端相对的顶侧;
将至少一个半导体器件附接到所述底板并且在所述开放腔体封装中的每一个的腔体内;
将单个柔性薄膜片材粘附到所述多个开放腔体封装的壁的顶侧,以便基本上覆盖所有腔体,其中,所述柔性薄膜片材由在回流焊接温度下分解的材料组成;
切断各封装之间的柔性薄膜片材;以及
使得所述封装经受焊料回流温度,以便同时地将所述封装附接到电路板或另外的衬底,并且使覆盖所述封装的腔体的所述柔性薄膜片材分解。
9.如权利要求8所述的方法,其中,所述至少一个半导体器件是压力传感器器件。
10.如权利要求8所述的方法,其中,所述半导体器件是适用于检测在第一波长处的光的光学传感器器件,并且其中,所述柔性薄膜片材对于所述第一波长基本上是透明的。
11.如权利要求8所述的方法,进一步包括:使用应用于覆盖所述封装的腔体的柔性薄膜片材的气动喷嘴,在对应的电路板或另外的衬底上放置所述封装中的每一个。
12.如权利要求8所述的方法,其中,所述柔性薄膜片材包括硝化纤维。
13.如权利要求8所述的方法,其中,将所述柔性薄膜片材粘附到所述壁的顶侧包括:使用粘接剂粘附所述柔性薄膜片材。
14.如权利要求8所述的方法,其中,将所述柔性薄膜片材粘附到所述壁的顶侧包括:通过激光熔接到所述壁的顶侧来粘附所述柔性薄膜片材。
15.如权利要求8所述的方法,其中,切断各封装之间的柔性薄膜片材包括:利用激光来去除各封装之间的柔性薄膜片材。
16.如权利要求8所述的方法,其中,切断各封装之间的柔性薄膜片材包括:利用同时切割各封装之间的引线框的修剪和形成处理来去除各封装之间的柔性薄膜片材。
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2014
- 2014-05-20 DE DE201410107074 patent/DE102014107074A1/de not_active Ceased
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Patent Citations (4)
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US6011294A (en) * | 1996-04-08 | 2000-01-04 | Eastman Kodak Company | Low cost CCD packaging |
US5983727A (en) * | 1997-08-19 | 1999-11-16 | Pressure Profile Systems | System generating a pressure profile across a pressure sensitive membrane |
CN101398615A (zh) * | 2007-09-26 | 2009-04-01 | 富士胶片株式会社 | 激光雕刻用树脂组合物和激光雕刻用树脂印刷版原版 |
CN101970339A (zh) * | 2007-12-05 | 2011-02-09 | 芬兰技术研究中心 | 压力、声压变化、磁场、加速、振动或气体组成的测量器 |
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US9153706B2 (en) | 2015-10-06 |
US20140346623A1 (en) | 2014-11-27 |
CN104183559A (zh) | 2014-12-03 |
DE102014107074A1 (de) | 2014-11-27 |
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