CN104181329A - Miniature three-axis vibration sensor assembled three-dimensionally through flexible circuit board - Google Patents
Miniature three-axis vibration sensor assembled three-dimensionally through flexible circuit board Download PDFInfo
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- CN104181329A CN104181329A CN201410448405.1A CN201410448405A CN104181329A CN 104181329 A CN104181329 A CN 104181329A CN 201410448405 A CN201410448405 A CN 201410448405A CN 104181329 A CN104181329 A CN 104181329A
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Abstract
The invention discloses three single-axis acceleration sensors arranged on a flexible integrated substrate, the substrate is bent to form a cubic structure, and the three single-axis acceleration sensors are orthogonal with one another. According to a miniature three-axis vibration sensor assembled three-dimensionally through a flexible circuit board, on the basis of the single-axis acceleration sensor, a simple and practical integrated carrier is designed through flexible materials, and the miniature three-axis vibration sensor assembled three-dimensionally is obtained through bending of the flexible carrier, and thus the complex assembly requirement for orthogonal connection of a rigid substrate is avoided.
Description
Technical field
Microminiature 3 axis vibration sensor that the present invention relates to the three-dimensional assembling of a kind of flexible electric circuit board, belong to electronic technology field.
Background technology
3 axis vibration sensor are used for measuring X, the Y of 3 dimension coordinate systems, the vibration acceleration characteristic of Z direction.General 3 axis vibration sensor are taking 3 single-axis acceleration sensors chips as core, the additional formation such as signal processing circuit, power supply and necessary EMC protecting network of sensor signal being processed to conversion.
Owing to will measuring 3 axial vibration accelerations, therefore need by 3 sensor chips according to the orthogonal assembling of its sensitive direction separately after rigidity be installed on sensor outer housing inwall, namely need the substrate carrier of 3 independent separate.As Fig. 1 signal.Therefore be different from the ordinary electronic wiring board of plane assembling.
When orthogonal assembling, respectively the sensor on 3 orthogonal directions substrates and signal processing need to realize power supply,, signal wire interconnection.At present conventional substrate is the PCB substrate of FR4 material or other are as AL
2o
3substrate, these are all rigid material substrates, in the time of design microminiature sensor, due to assembling space and volume requirement harshness, have following shortcoming:
1) line that interconnects between the substrate of 3 independent orthogonal is many, interconnection process process complexity;
2) manufacturing cost is high.
Summary of the invention
Technical matters to be solved by this invention is to provide microminiature 3 axis vibration sensor of the three-dimensional assembling of a kind of flexible electric circuit board, can reduce line, reduces process complexity, saves manufacturing cost.
For solving the problems of the technologies described above, the invention provides microminiature 3 axis vibration sensor of the three-dimensional assembling of a kind of flexible electric circuit board, it is characterized in that, on a flexible whole plate of substrate, 3 single-axis acceleration sensors are set, substrate bending forms cube structure, makes 3 single-axis acceleration sensors form orthogonal.
Substrate has 6 of 6 faces of bending formation cube, 6 form decussation and arrange on the whole plate of substrate launching, wherein, the central block that is positioned at point of crossing has an installation through hole, the surrounding of central block four pieces that stretch out, one directions X sensor and a Y-direction sensor are wherein set respectively on two adjacent pieces, power supply and EMC protecting network are set on the piece relative with Y-direction sensor, on the piece relative with directions X sensor, there is a lead hole; The piece at Y-direction sensor place continues to stretch out on the piece forming Z direction sensor is set, and X, Y, Z direction sensor are described single-axis acceleration sensors.
The cube structure forming after flexible substrate bending is installed in the housing of metal shell.
Metal shell arranges mounting hole on one of them side, for being connected with a tapped screw duct; On one of them face adjacent with this side, fairlead is set, is connected for drawing neck hole with integrated metal cover board cable, make integrated metal cover board cable draw neck hole and the inner formation perforation of metal shell.
Described integrated metal cover board cable is drawn in neck hole and is assembled with waterproof grommet by O-ring seal trip bolt.
X, Y, Z direction sensor on substrate also connect respectively a signal processing circuit, and the sensor that signal processing circuit is connected with it is positioned on same.
The beneficial effect that the present invention reaches:
Microminiature 3 axis vibration sensor of the three-dimensional assembling of flexible electric circuit board of the present invention are based on single-axis acceleration sensors, adopt flexible material to design simple and practical integrated carrier, curved by flexible carrier, reckon the actual amount after a discount microminiature 3 axis vibration sensor that showed the three-dimensional assembling of 3D, thereby avoid the complexity assembling requirement of rigid substrates orthogonal interconnection, can reduce line, reduce process complexity, save manufacturing cost.
Brief description of the drawings
The orthogonal assembling schematic diagram of Fig. 1;
Fig. 2 schematic block circuit diagram;
Fig. 3 profile schematic diagram;
Fig. 4 modular construction schematic diagram;
Fig. 5 flexible substrate physical dimension schematic diagram;
The bending of Fig. 6 flexible substrate structure and scheme of installation;
In figure,
1: metal shell; 11: mounting hole; 12: fairlead; 2: screw duct (internal thread); 3: integrated metal cover board cable is drawn neck hole; 4,5: waterproof grommet; 6: O-ring seal trip bolt; 7: substrate; 71: mounting hole; 72: fairlead.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.Following examples are only for technical scheme of the present invention is more clearly described, and can not limit the scope of the invention with this.
1 " microminiature 3 axis vibration sensor of the three-dimensional assembling of flexible electric circuit board " feature
1.1 technical scheme
The design is based on single-axis acceleration sensors, adopt flexible material to design simple and practical integrated carrier, curved by flexible carrier, reckon the actual amount after a discount microminiature 3 axis vibration sensor that showed the three-dimensional assembling of 3D, thereby avoided the complexity assembling requirement of rigid substrates orthogonal interconnection.
A) electric theory structure
3 axis vibration sensor technical schemes of the present invention are taking 3 single-axis acceleration sensors chips as core, the additional formation such as signal processing circuit, power supply and necessary EMC protecting network of sensor signal being processed to conversion.Electrical principle signal is as Fig. 2 signal.
B) shape requirement
Sensor physical dimension≤20.4mm × 20.4mm × 20.4mm that the design requires, outside drawing is illustrated as Fig. 3.
C) encapsulating structure: according to upper facial contour, adopt Al-alloy metal shell, wall thickness 1.5mm, 5 core shielded cables draw power supply,, X, Y, Z-direction sensor output signal.
D) processing technology: adopt flexible material substrate, realize the interconnection of the components and parts such as sensor chip and power supply, signal processing, reflow soldering process assembling.
1.2 scheme advantages
The design has adopted flexible material substrate, has the following advantages:
A) adopted flexible material substrate, the entirety that has realized substrate is integrated.
If employing rigid substrates, at least needs the substrate of 3 independent separate, and the substrate of 3 separation needs mutual perpendicular quadrature assembling (illustrating with reference to figure 1).
Adopt flexible material substrate, by flexible substrate curved, reckon the actual amount after a discount the existing orthogonal assembling of 3 axle sensor, the entirety that has realized substrate is integrated.
B) simple in structure, technological process is simple, electrical connection good reliability, and production efficiency is high.
If 3 separating base plates, each substrate needs to provide power supply, altogether ground wire and sensor output signal line to draw.And metal shell inside dimension is only 17mm × 17mm × 17mm, and in this spatial dimension, also have φ 5.5mm × 7.7mm nut, realize the interconnection welding of 3 independent separate substrates in above-mentioned space, processes complexity, connection reliability is poor, and production efficiency is low.
Adopt flexible material substrate, avoided above-mentioned rigid substrates technique packing problem completely.
2 designs and enforcement
2.1 outer cover metal structure member designs
As Fig. 4 signal, metal shell 1 is cube structure, and internal cavities is used for installing flexible substrate, and metal shell arranges mounting hole 11 on 1 one of them side, and for welding a tapped screw duct 2, screw duct 2 can be threaded connection with screw; On one of them face adjacent with this side, a fairlead 12 is set, welds for drawing neck hole 3 with integrated metal cover board cable, make integrated metal cover board cable draw neck hole 3 and form and connect with metal shell 1 internal cavities.Integrated metal cover board cable is drawn in neck hole 3 and is assembled with waterproof grommet 4,5 by O-ring seal trip bolt 6.The cube inner space that in the present embodiment, metal shell 1 forms is 17.3 mm × 17.3 mm × 17.3mm.
2.2 flexible substrate geometry and size design
For adapting to Fig. 4 enclosure structure, need to calculate design to flexible substrate physical dimension.Because metal shell structure part inner space is little, consider bonded adhesives thickness and flexible board bending angle, the board structure of design, form factor are illustrated as Fig. 5.Flexible substrate 7 is a whole plate, 6 formations that comprise cubical 6 faces of bent formation, 6 form decussation and arrange on the whole plate of substrate launching, wherein, the central block that is positioned at point of crossing has a mounting hole 71, can hold screw duct 2, in four pieces of the surrounding of central block, one directions X sensor and signal processing circuit 73 and a Y-direction sensor and signal processing circuit 74 are wherein set respectively on two adjacent pieces, power supply and EMC protecting network 76 are set on the piece relative with Y-direction sensor and signal processing circuit 74, on the piece relative with directions X sensor and signal processing circuit 73, there is a fairlead 72.On the outward extending piece of piece at Y-direction sensor and signal processing circuit 74 places, Z direction sensor and signal processing circuit 75 are set.X, Y, Z direction sensor are single-axis acceleration sensors chip.
According to the flexible substrate physical dimension of Fig. 5 design, after bending, forming a cube structure is installed in the housing of metal shell 1, as Fig. 6 signal, and make mounting hole 71 on the substrate mounting hole 11 on metal shell 1 relatively form and connect, the fairlead 12 of the fairlead 72 on substrate on metal shell 1 relatively forms and connects.
2.4 main processes
Main processes is as follows:
1) metal shell 1 part processing;
2) flexible substrate processing and manufacturing;
3) flexible substrate electronic devices and components assembling, reflow welding connect;
4) flexible substrate (reflow welding connect after) is adhesively fixed in the metal shell 1 of Fig. 4;
5) cable welding;
6) test in the middle of;
7) drying and processing;
8) tapped screw duct 2 laser bonding are on the mounting hole 11 of metal shell 1, and integrated metal cover board cable is drawn neck hole 3 laser bonding on the fairlead 12 of metal shell 1;
9) waterproof grommet 4,5 is drawn in neck hole 3 by O-ring seal trip bolt 6 being assembled into one metal cover board cables;
10) draw on neck hole 3 heat-shrinkable T bush is installed at integrated metal cover board cable.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the technology of the present invention principle; can also make some improvement and distortion, these improvement and distortion also should be considered as protection scope of the present invention.
Claims (6)
1. microminiature 3 axis vibration sensor for the three-dimensional assembling of flexible electric circuit board, is characterized in that, on a flexible whole plate of substrate, 3 single-axis acceleration sensors are set, and substrate bending forms cube structure, makes 3 single-axis acceleration sensors form orthogonal.
2. microminiature 3 axis vibration sensor of the three-dimensional assembling of flexible electric circuit board according to claim 1, it is characterized in that, substrate has 6 of 6 faces of bending formation cube, 6 form decussation and arrange on the whole plate of substrate launching, wherein, the central block that is positioned at point of crossing has an installation through hole, the surrounding of central block four pieces that stretch out, one directions X sensor and a Y-direction sensor are wherein set respectively on two adjacent pieces, power supply and EMC protecting network are set on the piece relative with Y-direction sensor, on the piece relative with directions X sensor, there is a lead hole, the piece at Y-direction sensor place continues to stretch out on the piece forming Z direction sensor is set, and X, Y, Z direction sensor are described single-axis acceleration sensors.
3. microminiature 3 axis vibration sensor of the three-dimensional assembling of flexible electric circuit board according to claim 1 and 2, is characterized in that, the cube structure forming after flexible substrate bending is installed in the housing of metal shell.
4. microminiature 3 axis vibration sensor of the three-dimensional assembling of flexible electric circuit board according to claim 3, is characterized in that, metal shell arranges mounting hole on one of them side, for being connected with a tapped screw duct; On one of them face adjacent with this side, fairlead is set, is connected for drawing neck hole with integrated metal cover board cable, make integrated metal cover board cable draw neck hole and the inner formation perforation of metal shell.
5. microminiature 3 axis vibration sensor of the three-dimensional assembling of flexible electric circuit board according to claim 4, is characterized in that, described integrated metal cover board cable is drawn in neck hole and is assembled with waterproof grommet by O-ring seal trip bolt.
6. microminiature 3 axis vibration sensor of the three-dimensional assembling of flexible electric circuit board according to claim 2, it is characterized in that, X, Y, Z direction sensor on substrate also connect respectively a signal processing circuit, and the sensor that signal processing circuit is connected with it is positioned on same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410448405.1A CN104181329A (en) | 2014-09-04 | 2014-09-04 | Miniature three-axis vibration sensor assembled three-dimensionally through flexible circuit board |
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| CN201410448405.1A CN104181329A (en) | 2014-09-04 | 2014-09-04 | Miniature three-axis vibration sensor assembled three-dimensionally through flexible circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107863338A (en) * | 2017-11-08 | 2018-03-30 | 奥肯思（北京）科技有限公司 | A kind of boxlike three-dimensional systematic encapsulation |
| CN113363164A (en) * | 2021-06-29 | 2021-09-07 | 广东佛智芯微电子技术研究有限公司 | Square chip packaging method and packaging structure thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006112856A (en) * | 2004-10-13 | 2006-04-27 | Seiko Epson Corp | Sensor element substrate, its manufacturing method, and sensor |
| CN1821717A (en) * | 2006-03-27 | 2006-08-23 | 北京航空航天大学 | A Light small type intertia measuring unit |
| CN101038173A (en) * | 2007-02-07 | 2007-09-19 | 北京航空航天大学 | A implicit type structure mini inertia measurement unit |
| CN202002942U (en) * | 2010-12-09 | 2011-10-05 | 湖北航天技术研究院计量测试技术研究所 | Triaxial digital quartz flexible accelerometer |
| CN102313548A (en) * | 2011-09-29 | 2012-01-11 | 王皓冰 | Micro attitude and heading reference system based on 3D stereoscopic packaging technology |
| TWI400435B (en) * | 2010-01-28 | 2013-07-01 | Taiwan Semiconductor Mfg | Fixture and method for vibration or shock testing of mems component |
| WO2013131197A1 (en) * | 2012-03-09 | 2013-09-12 | Genesis Group Inc. | Dual fibre bragg grating accelerometer |
-
2014
- 2014-09-04 CN CN201410448405.1A patent/CN104181329A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006112856A (en) * | 2004-10-13 | 2006-04-27 | Seiko Epson Corp | Sensor element substrate, its manufacturing method, and sensor |
| CN1821717A (en) * | 2006-03-27 | 2006-08-23 | 北京航空航天大学 | A Light small type intertia measuring unit |
| CN101038173A (en) * | 2007-02-07 | 2007-09-19 | 北京航空航天大学 | A implicit type structure mini inertia measurement unit |
| TWI400435B (en) * | 2010-01-28 | 2013-07-01 | Taiwan Semiconductor Mfg | Fixture and method for vibration or shock testing of mems component |
| CN202002942U (en) * | 2010-12-09 | 2011-10-05 | 湖北航天技术研究院计量测试技术研究所 | Triaxial digital quartz flexible accelerometer |
| CN102313548A (en) * | 2011-09-29 | 2012-01-11 | 王皓冰 | Micro attitude and heading reference system based on 3D stereoscopic packaging technology |
| WO2013131197A1 (en) * | 2012-03-09 | 2013-09-12 | Genesis Group Inc. | Dual fibre bragg grating accelerometer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107863338A (en) * | 2017-11-08 | 2018-03-30 | 奥肯思（北京）科技有限公司 | A kind of boxlike three-dimensional systematic encapsulation |
| CN113363164A (en) * | 2021-06-29 | 2021-09-07 | 广东佛智芯微电子技术研究有限公司 | Square chip packaging method and packaging structure thereof |
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Application publication date: 20141203 |
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