CN104180905B - Infrared temperature measurement method and device for MOCVD process growth - Google Patents

Infrared temperature measurement method and device for MOCVD process growth Download PDF

Info

Publication number
CN104180905B
CN104180905B CN201310192329.8A CN201310192329A CN104180905B CN 104180905 B CN104180905 B CN 104180905B CN 201310192329 A CN201310192329 A CN 201310192329A CN 104180905 B CN104180905 B CN 104180905B
Authority
CN
China
Prior art keywords
infrared
wavelength
measurement
emissivity
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310192329.8A
Other languages
Chinese (zh)
Other versions
CN104180905A (en
Inventor
甘志银
李欣
胡少林
李伟
李明超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Zhongyuan Semiconductor Technology Co.,Ltd.
Original Assignee
甘志银
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 甘志银 filed Critical 甘志银
Priority to CN201310192329.8A priority Critical patent/CN104180905B/en
Publication of CN104180905A publication Critical patent/CN104180905A/en
Application granted granted Critical
Publication of CN104180905B publication Critical patent/CN104180905B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Radiation Pyrometers (AREA)

Abstract

Disclosed are an infrared temperature measurement method and device for MOCVD process growth. The method and the device are characterized in that a temperature measurement process includes the following steps: firstly measuring the emissivity of an object and according to the Kirchhoff law, obtaining the emissivity of the object; comparing the emissivity and an emissivity threshold, and if the measured emissivity is smaller than the threshold, adopting a single wavelength and emissivity correction method to measure the temperature; or adopting a far-infrared double-wavelength method to measure the temperature and when the energy of a larger wavelength in the far infrared wavelengths exceeds a test measuring range, adopting near-infrared double wavelengths to measure the temperature and similarly, when the energy of a smaller wavelength in the near-infrared wavelengths is lower than the test measuring range, skipping to the far-infrared double wavelengths to measure the temperature. The advantages of the method and the device are that through effective combination advantages of single-wavelength and double-wavelength temperature measurement, different methods are selected for temperature measurement so that a temperature measurement problem of a complex surface in an MOCVD growth process is solved; and the measurement methods are automatically selected and the measurement precision is high and temperature measurement of the four wavelengths significantly expands the temperature measurement range.

Description

A kind of infrared measurement of temperature method and device of MOCVD technique growth
Technical field
The present invention relates to the multi-wavelength integrated temperature measurement method of non-contacting infrared field of temperature measurement, especially relate to table complicated and changeable The temp measuring method in face, a kind of metal-organic chemical vapor deposition equipment chemical vapor depsotition equipment(MOCVD)It is infrared that technique grows Temp measuring method and device.
Background technology
Metallochemistry vapour deposition(MetalOrganicChemicalVaporDeposition, abbreviation MOCVD)Equipment is A kind of semiconductor epitaxial growth equipment, its growing environment is complicated, and differential responses elementary reaction intracavity injects gas with various, and presses Strong difference is also larger, and these bring larger difficulty all to accurate thermometric;Epitaxial film growth needs to ensure uniformity, repetition simultaneously Property and controllability, in growth course the slide holder of substrate be typically rotated it is impossible to engaged test surface carries out thermometric.These Harsh test environment determines MOCVD technique thermometric and can only adopt contactless temperature-measuring method.
Industry to measure MOCVD technique growth temperature using Single wavelength plus emittance correction method of testing mostly at present, but Accurate thermometric problem during weak emissivity cannot be overcome;And though dual wavelength thermometric can ignore the impact to thermometric for the emissivity, light Bright interference surface is very big on the impact of its thermometric, directly results in and cannot use;Temperatures span during MOCVD growth technique simultaneously Scope is wider, there are currently no single-measurement method and can meet FR thermometric.Dual wavelength is adopted for weak reflectivity surface Thermometric, it can avoid the impact to thermometric for the emissivity;For the glossy surface larger easy measurement of reflectance this moment, so adopting Single wavelength modification method can accurate thermometric;For the low temperature extension of weak reflectivity surface, select far and near two in different-waveband Wavelength carries out dual wavelength design and can effectively expand temperature-measuring range, meets the thermometric demand of MOCVD technique growth.
But, Single wavelength thermometric(I.e. colour temperature method)The a certain wavelength energy being radiated by Measuring Object come thermometric, by object Emissivity impact ratio is larger, and all more sensitive to measurement height and measurement optical aperture, it is difficult to ensure that the standard of its measurement Really property;Accuracy can be ensured to a certain extent by emittance correction, but when emissivity is larger, corresponding reflectance is relatively Weak be just difficult accurately to measure, now the accuracy of Single wavelength thermometric just cannot be guaranteed.
Dual wavelength thermometric(I.e. colorimetric warming therapy)By measuring the energy ratio of two specific wavelengths come thermometric, it can overcome outer The impact to measurement of boundary's environment and emissivity, but require emittance to reach its accuracy of certain level guarantee and Precision;It cannot measure to epitaxial film interference surface on bright substrate simultaneously, is that it is applied to MOCVD technique growth thermometric Fatal defects.
Content of the invention
The invention aims to solving the problems, such as current MOCVD device growth technique thermometry, provide one Plant the Single wavelength of emittance correction and the temp measuring method of far and near infrared band four wavelength combinations.The present invention is the transmitting according to measurement Rate size is automatically selecting temp measuring method;Present invention composition is main to be included:Emissivity measurement, Single wavelength measurement and dual wavelength are surveyed Amount part, by computer software co-ordination.The infrared measurement of temperature method of the MOCVD technique growth of the present invention, comprises following step Suddenly:
Step 1, measures reflectance:According to the Kirchhoff's theorem of thermal conduction study, for emissivity ξ of nontransparent testee With reflectance r's and be 1, that is,:ξ=1-r, the reflectance r of Measuring Object, can be calculated corresponding emissivity:ξ;
Step 2, selects temp measuring method:Emissivity ξ of measurement in step 1 is compared with the emissivity threshold values K setting, if ξ<K, now adopts Single wavelength emittance correction method thermometric, enters step 5;Otherwise, using dual-wavelength method thermometric, enter step Rapid 3;
Step 3, measurement radiating object is in the ENERGY E selecting longer far infrared wavelength, if E is less than testing range, this Shi Caiyong far infrared dual wavelength thermometric enters step 5;If E is more than testing range, now carry out step 4;
Step 4, carries out dual wavelength thermometric according to Near-infrared Double wavelength radiation energy, if less near-infrared wavelength energy Less than testing range, then enter step 3, otherwise enter step 5;
Step 5 is calculated the accurate temperature of infrared survey, and shows temp measuring method and survey according to different step entrance Amount temperature.
Step 1 is to realize the emissivity of indirect Measuring Object by real-time measurement reflectance.
The described selection temp measuring method of step 2 is the size of the emissivity according to testee, and described threshold values K is according to reality Border Single wavelength thermometric accurately and effectively scope determining.
To in 4 for reflecting stronger smooth surface, that is, the bright interference surface of MOCVD technique growth is basis to step 2 Threshold values judges to adopt Single wavelength emittance correction method thermometric, and for the stronger rough surface of scattering then according to emissivity threshold values K judges to select temp measuring method, and that is, two kinds of surfaces are a kind of special temperature measuring applications under emissivity threshold values judges, in coarse technique table Face using remote, near infrared band dual-wavelength method thermometric, its concrete scope is:700nm~1 μm, 1.3 μm~2.0 μm;Smooth Interference surface adds emittance correction method thermometric using Single wavelength.Two methods are differentiated by emissivity measurement threshold values K Select.
Present invention also offers the temperature measuring equipment of the infrared measurement of temperature method using above-mentioned MOCVD technique growth, comprise three big Part:Emissivity measurement device, dual-wavelength measurement device and Single wavelength measurement apparatus are it is characterised in that emissivity measurement device portion Point:Stabilized lasers source 20 sends stabilized lasers road after top spectroscope 19 and reflexes to infrared sensor 21, and another road is anti- Sequentially pass through after being mapped to spectroscope 8 electric magnet but move baffle plate 4, spectroscope 2, infrared radiating body 1 reflection after through spectroscope 2, filter Sensor 18 is arrived after wave plate 3.Dual-wavelength measurement device part:Infrared radiating body 1 irradiating infrared light is through spectroscope 2, electric magnet It is divided into two-way after driving baffle plate 4, spectroscope 8:The first via is being divided into two-way after spectroscope 10, and a road is after filtering after piece 12 To sensor 15, piece 13 gathers far infrared dual wavelength energy respectively to sensor 14 after filtering on another road;Second tunnel is through undue Light microscopic 5 is separated into two-way, and piece 6 arrives sensor 7 after filtering on a road, and in addition piece 9 is adopted respectively to sensor 11 after filtering on a road Collect Near-infrared Double wavelength energy.The sensing of narration in this partial devices of Single wavelength measuring device part and dual-wavelength measurement device Device 15 collection light path is compatible, and that is, the two shares.
It is an advantage of the invention that:Grow the pluses and minuses of practical situation and the long temp measuring method of single-double wave in conjunction with MOCVD technique, carry Supply a kind of method that technique grows gamut thermometric, it is suitable for:400 1200 DEG C of wide temperature-measuring range;Test table complicated and changeable Face and environment, it is related to the surfaces such as coarse, smooth, bright interference.By effectively combining single-double wave long thermometric advantage, solve Complex surface thermometric problem in MOCVD growth course.Automatically select method of testing, accuracy of measurement is high, four wavelength simultaneously Thermometric greatly extends temperature-measuring range.
Brief description
Fig. 1 is the flow chart of invention thermometric;
Fig. 2 is the temp measuring method of the embodiment of the present invention one and the schematic diagram of device;
Fig. 3 is the temp measuring method of the embodiment of the present invention two and the schematic diagram of device.
In figure, 1 infrared radiating body, 2 spectroscopes, 3 filter plates, 4 solenoid actuated baffle plates, 5 spectroscopes, 6 filter plates, 7 red Outer sensor, 8 spectroscopes, 9 filter plates, 10 spectroscopes, 11 infrared sensors, 12 filter plates, 13 filter plates, 14 infrared sensings Device, 15 infrared sensors, 16 data acquisition process units, 17 data transmission interfaces, 18 infrared sensors, 19 spectroscopes, 20 steady Determine lasing light emitter, 21 infrared sensors.
Specific embodiment
Further illustrate embodiments of the invention below in conjunction with the accompanying drawings:
Embodiment one
The infrared measurement of temperature method and step of the MOCVD technique growth of the present embodiment is as follows:Referring to Fig. 1 and Fig. 2.Step 1, measurement Reflectance:According to the Kirchhoff's theorem of thermal conduction study, for nontransparent testee emissivity ξ and reflectance r's and be 1, I.e.:
ξ=1-r(1)
The reflectance of Measuring Object, by formula(1)Corresponding emissivity can be calculated:ξ;
The laser of stabilized lasers source 20 transmitting reflexes to infrared sensor 21 through spectroscope 19 and records its initial laser work( Rate, in addition a road light splitting is to spectroscope 8 and 3, after reflex to infrared sensor 18 through infrared radiating body 1 and record reflected light work( Rate.
Step 2, selects temp measuring method:Emissivity ξ of measurement in step 1 is compared with the emissivity threshold values K setting, if ξ<K, now adopts Single wavelength emittance correction method thermometric, enters step 5;Otherwise, using dual-wavelength method thermometric, enter step Rapid 3;
Step 1 measurement data processes the emissivity being calculated radiant body 1 through processing of circuit unit 16.Then, come with this Select the long temp measuring method of single-double wave.
Through baffle plate 4, baffle plate 4 is that the light of a solenoid actuated leads to a part of light through spectroscope 2 for the infrared radiating body 1 Road, is opened and closed by sequencing contro baffle plate and can measure the measurement of sensor dark current and emittance collection;
Step 3, measurement radiating object is in the ENERGY E selecting longer far infrared wavelength, if E is less than testing range, this Shi Caiyong far infrared dual wavelength thermometric enters step 5;If E is more than testing range, now carry out step 4;
Then the mirror 8 that is split is divided into two-way light, and a road is for far infrared dual-wavelength measurement, and a road is for Near-infrared Double Wavelength measurement;After the first via is filtered by filter plate 12 and 13 after spectroscope 10 more respectively again, then by sensor 14 and 15 points The energy that corresponding dual wavelength calculates Cai Ji not obtained by two-way wavelength;
Step 4, carries out dual wavelength thermometric according to Near-infrared Double wavelength radiation energy, if less near-infrared wavelength energy Less than testing range, then enter step 3, otherwise enter step 5;
The second road infrared light that same spectroscope 8 separates, divides after spectroscope 5 and is selected Near-infrared Double by filter plate 6 and 9 Wavelength is gathered two-way wavelength respectively by sensor 7 and 11 again and obtains corresponding Near-infrared Double wavelength energy;
Step 5 is calculated the accurate temperature of infrared survey, and shows temp measuring method and survey according to different step entrance Amount temperature.
Last this two-way output energy is obtained corresponding temperature-measuring results by signal acquisition process cell processing, and passes through interface Circuit 17 reaches host computer PC.The passage of wherein Single wavelength measurement is that the sensor 15 of phase co-wavelength corresponding with filter plate 3 is adopted The energy integrating is as Single wavelength thermometric compatible channels.Equally, when baffle plate 4 is closed, above-mentioned all the sensors record real-time dark current, can To be modified to thermometric, improve accuracy.
Using the temperature measuring equipment of the infrared measurement of temperature method of above-mentioned MOCVD technique growth, comprise:Emissivity measurement device, double Wavelength measuring apparatus and Single wavelength measurement apparatus three parts:Emissivity measurement device, dual-wavelength measurement device and Single wavelength are surveyed Amount device is it is characterised in that emissivity measurement device part:Stabilized lasers source 20 sends stabilized lasers through top spectroscope 19 A road reflexes to infrared sensor 21 afterwards, and another road sequentially passes through electric magnet and but moves baffle plate 4, spectroscope after reflexing to spectroscope 8 2nd, arrive sensor 18 after spectroscope 2, filter plate 3 after infrared radiating body 1 reflection.Dual-wavelength measurement device part:Infrared spoke Beam 1 irradiating infrared light is divided into two-way after spectroscope 2, solenoid actuated baffle plate 4, spectroscope 8:The first via is through spectroscope Being divided into two-way after 10, sensor 15 is arrived after piece 12 after filtering in a road, and piece 13 arrives sensor 14 respectively after filtering on another road Collection far infrared dual wavelength energy;Second tunnel is separated into two-way through spectroscope 5, and piece 6 arrives sensor 7, separately after filtering on a road Piece 9 collects Near-infrared Double wavelength energy respectively to sensor 11 after filtering on an outer road.This portion of Single wavelength measuring device part Separating device is compatible with the sensor 15 collection light path of narration in dual-wavelength measurement device, and that is, the two shares.
Embodiment two:
Embodiment two is identical with embodiment one, except that:Referring to Fig. 3, its reflection of the laser of stabilized lasers source 1 transmitting Photo measure part is the radiation path compatible measurement being gathered by sensor 15, reaches the purpose of emissivity measurement.It eliminates list Solely emissivity measurement passage, what other were similar does compatible channels such as with other passages:Sensor 7,11,14 Measurement channel, all with This embodiment is considered as same instance.

Claims (6)

1. a kind of infrared measurement of temperature method of MOCVD technique growth is it is characterised in that comprise the steps of:
Step 1, measures reflectance:According to the Kirchhoff's theorem of thermal conduction study, for nontransparent testee emissivity ξ with anti- Penetrate rate r and be 1, that is,:ξ=1-r, the reflectance r of Measuring Object, can be calculated corresponding emissivity:ξ;
Step 2, selects temp measuring method:Emissivity ξ of measurement in step 1 is compared with the emissivity threshold values K setting, if ξ<K, Now adopt Single wavelength emittance correction method thermometric, enter step 5;Otherwise, using dual-wavelength method thermometric, enter step 3;
Step 3, measurement radiating object, in the ENERGY E selecting longer far infrared wavelength, if E is less than testing range, is now adopted Enter step 5 with far infrared dual wavelength thermometric;If E is more than testing range, now carry out step 4;
Step 4, carries out dual wavelength thermometric according to Near-infrared Double wavelength radiation energy, if less near-infrared wavelength energy is less than Testing range, then enter step 3, otherwise enters step 5;
Step 5 is calculated the accurate temperature of infrared survey, and shows temp measuring method and measurement temperature according to different step entrance Degree.
2. the infrared measurement of temperature method of MOCVD technique growth according to claim 1 is it is characterised in that step 1 is by reality When measurement reflectance realizing the emissivity of indirect Measuring Object.
3. the infrared measurement of temperature method of MOCVD technique according to claim 1 growth is it is characterised in that the described choosing of step 2 Select the size of the emissivity that temp measuring method is according to testee, described threshold values K is according to actual Single wavelength thermometric accurate and effective Scope determining.
4. MOCVD technique according to claim 1 growth infrared measurement of temperature method it is characterised in that step 2 in 4 for Reflect stronger smooth surface, that is, the bright interference surface of MOCVD technique growth is to judge using Single wavelength transmitting according to threshold values Rate modification method thermometric, and then judge to select temp measuring method according to emissivity threshold values K for scattering stronger rough surface.
5. the infrared measurement of temperature method of MOCVD technique according to claim 1 growth is it is characterised in that red described in step 3 and 4 Outer dual wavelength temperature measurement fraction adopts four different wave lengths, is distributed near, remote two infrared bands, is distributed near infrared band scope It is 700nm~1 μm, the scope of far infrared band is 1.3 μm~2.0 μm.
6. the temperature measuring equipment used by infrared measurement of temperature method of the MOCVD technique growth described in claim 1, comprises:Emissivity is surveyed Amount device, dual-wavelength measurement device and Single wavelength measurement apparatus three parts are it is characterised in that emissivity measurement device part:Surely Determine lasing light emitter (20) and send stabilized lasers to reflex to infrared sensor (21), another Reuter through top spectroscope (19) Hou Yilu Sequentially pass through after being mapped to spectroscope (8) solenoid actuated baffle plate (4), spectroscope (2), after infrared radiating body (1) reflection through undue Light microscopic (2), filter plate (3) arrive sensor (18), dual-wavelength measurement device part afterwards:Infrared radiating body (1) irradiating infrared light warp Cross spectroscope (2), solenoid actuated baffle plate (4), spectroscope are divided into two-way after (8):The first via is divided after spectroscope (10) again Become two-way, piece (12) arrives sensor (15) afterwards after filtering on a road, piece (13) arrives sensor (14) respectively after filtering on another road Collection far infrared dual wavelength energy;Second tunnel is separated into two-way through spectroscope (5), and piece (6) arrives sensor after filtering on a road (7), in addition piece (9) collects Near-infrared Double wavelength energy respectively to sensor (11) after filtering on a road;Single wavelength measurement dress Put compatible with sensor (15) the collection light path in dual-wavelength measurement device, that is, the two shares.
CN201310192329.8A 2013-05-22 2013-05-22 Infrared temperature measurement method and device for MOCVD process growth Active CN104180905B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310192329.8A CN104180905B (en) 2013-05-22 2013-05-22 Infrared temperature measurement method and device for MOCVD process growth

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310192329.8A CN104180905B (en) 2013-05-22 2013-05-22 Infrared temperature measurement method and device for MOCVD process growth

Publications (2)

Publication Number Publication Date
CN104180905A CN104180905A (en) 2014-12-03
CN104180905B true CN104180905B (en) 2017-02-08

Family

ID=51962132

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310192329.8A Active CN104180905B (en) 2013-05-22 2013-05-22 Infrared temperature measurement method and device for MOCVD process growth

Country Status (1)

Country Link
CN (1) CN104180905B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105300526B (en) * 2015-09-22 2018-05-01 南京理工大学 Method based on basic function multi-wavelength fitting radiation temperature measurement
CN111014290A (en) * 2019-12-13 2020-04-17 中冶南方工程技术有限公司 Simple low-cost cold-rolled strip steel infrared temperature measurement method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102889934A (en) * 2011-07-18 2013-01-23 甘志银 Method for measuring temperature in real time

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013092502A (en) * 2011-10-27 2013-05-16 Jfe Steel Corp Temperature measuring apparatus and emissivity measuring device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102889934A (en) * 2011-07-18 2013-01-23 甘志银 Method for measuring temperature in real time

Also Published As

Publication number Publication date
CN104180905A (en) 2014-12-03

Similar Documents

Publication Publication Date Title
CN102889934B (en) Method for measuring temperature in real time
US8338194B2 (en) Method for the in-situ determination of the material composition of optically thin layers
CN103048050B (en) Radiation temperature measurement method and instrument for measuring real temperature of target
CN104458013B (en) A kind of more mould measuring systems in engine thermal safeguard structure temperature field
CN104697639B (en) A kind of MOCVD device real-time temperature measurement system self-calibrating device and method
CN107611049B (en) A kind of epitaxial wafer multi-parameter in-situ monitoring method and device based on real time spectrum
CN106979832B (en) Optical fiber spectroscopic temperature measurement system and temperature measurement method thereof
KR101434720B1 (en) A 3d scanner
CN107110709B (en) The method for calibrating the high temperature counter device of CVD or PVD reactor
CN105136310B (en) The ultraviolet temp measuring method and device of MOCVD epitaxy piece surface temperature measurement
CN107677621A (en) The temperature measuring equipment of multispectral optical technology fusion
CN105092053B (en) Three wavelength for MOCVD epitaxy growth are excused from a college course positive infrared monitoring method and device
CN104180905B (en) Infrared temperature measurement method and device for MOCVD process growth
CN104819777B (en) A kind of method for improving turbulent flame filtering Rayleigh scattering temperature measurement accuracy
TW201314194A (en) Object characteristics measurement system
CN105806491A (en) Three-wavelength two-dimensional temperature field measuring device and method
KR20140096308A (en) Apparatus and method to measure temperature of 3d semiconductor structures via laser diffraction
CN105928625B (en) Metal surface dynamic temperature point measuring method based on reflectivity change
CN104303275B (en) Determined in pulsed laser anneal using the depth of fusion of infrared-interference technique
CN104439122A (en) Combined type continuous casting blank surface temperature measurement method and instrument
CN105333962B (en) A kind of thermometry and system for correcting two waveband temperature measurement error
CN108489631A (en) A kind of absorption spectrum intensity compares temp measuring method
CN104697666B (en) A kind of MOCVD reaction chambers temp measuring method
CN103822713A (en) Method and device for detecting spectral resolution of spectral imager
CN104075809B (en) Infrared optics temperature measuring device, method and MOCVD system

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20180731

Address after: 528251 1, No. 5, Nanzhou street, Ping Zhou, Nanhai District, Foshan, Guangdong

Patentee after: Guangdong RealFaith Semiconductor Equipment Co., Ltd.

Address before: 528251 C, first floor, west of Foshan Road, Nansha Road, Guangdong.

Patentee before: Gan Zhiyin

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 528251 1, No. 5, Nanzhou street, Ping Zhou, Nanhai District, Foshan, Guangdong

Patentee after: Guangdong Zhongyuan Semiconductor Technology Co.,Ltd.

Address before: 528251 1, No. 5, Nanzhou street, Ping Zhou, Nanhai District, Foshan, Guangdong

Patentee before: GUANGDONG REAL FAITH SEMICONDUCTOR Co.,Ltd.