CN104178741B - 具有分割型磁体的溅射装置 - Google Patents
具有分割型磁体的溅射装置 Download PDFInfo
- Publication number
- CN104178741B CN104178741B CN201410222220.9A CN201410222220A CN104178741B CN 104178741 B CN104178741 B CN 104178741B CN 201410222220 A CN201410222220 A CN 201410222220A CN 104178741 B CN104178741 B CN 104178741B
- Authority
- CN
- China
- Prior art keywords
- magnet
- central
- target
- incorporated
- screw rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0058145 | 2013-05-23 | ||
KR20130058145 | 2013-05-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104178741A CN104178741A (zh) | 2014-12-03 |
CN104178741B true CN104178741B (zh) | 2017-09-08 |
Family
ID=51960078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410222220.9A Active CN104178741B (zh) | 2013-05-23 | 2014-05-23 | 具有分割型磁体的溅射装置 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101899008B1 (ko) |
CN (1) | CN104178741B (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108456859B (zh) * | 2017-02-22 | 2021-05-07 | 北京北方华创微电子装备有限公司 | 磁控溅射腔室及磁控溅射设备 |
KR102181087B1 (ko) * | 2018-08-23 | 2020-11-20 | 주식회사 아바코 | 스퍼터링장치 및 스퍼터링장치 제어방법 |
KR102180214B1 (ko) * | 2018-09-03 | 2020-11-18 | 주식회사 아바코 | 스퍼터링장치 및 스퍼터링장치 제어방법 |
KR102375781B1 (ko) * | 2018-11-15 | 2022-03-18 | 주식회사 아바코 | 스퍼터링장치 및 스퍼터링장치 제어방법 |
KR20200056588A (ko) * | 2018-11-15 | 2020-05-25 | 주식회사 아바코 | 스퍼터링장치 및 스퍼터링장치 제어방법 |
CN112553583B (zh) * | 2019-09-25 | 2023-03-28 | 亚威科股份有限公司 | 溅射装置及溅射装置控制方法 |
KR102353670B1 (ko) * | 2019-10-07 | 2022-01-21 | 주식회사 에이치앤이루자 | 스퍼터링 장치용 원통형 캐소드 |
KR102301176B1 (ko) * | 2019-12-27 | 2021-09-14 | 주식회사 에이치앤이루자 | 스퍼터링 장치용 캐소드 장치 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3879009B2 (ja) * | 1995-01-30 | 2007-02-07 | キヤノンアネルバ株式会社 | スパッタリングカソード |
US10043642B2 (en) * | 2008-02-01 | 2018-08-07 | Oerlikon Surface Solutions Ag, Pfäffikon | Magnetron sputtering source and arrangement with adjustable secondary magnet arrangement |
US8137519B2 (en) * | 2008-03-13 | 2012-03-20 | Canon Anelva Corporation | Sputtering cathode, sputtering apparatus provided with sputtering cathode, film-forming method, and method for manufacturing electronic device |
KR101053054B1 (ko) * | 2008-12-23 | 2011-08-01 | 주식회사 테스 | 마그네트론 스퍼터링 장치 |
KR101165432B1 (ko) | 2010-05-25 | 2012-07-12 | (주)이루자 | 마그넷 구동 방법 및 이를 이용한 스퍼터링 장치 |
JP5951975B2 (ja) | 2010-12-28 | 2016-07-13 | キヤノンアネルバ株式会社 | スパッタリング装置 |
CN203096163U (zh) * | 2013-02-27 | 2013-07-31 | 东莞汇海光电科技实业有限公司 | 一种磁场均匀镀膜调节装置 |
-
2014
- 2014-05-21 KR KR1020140060658A patent/KR101899008B1/ko active IP Right Grant
- 2014-05-23 CN CN201410222220.9A patent/CN104178741B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR101899008B1 (ko) | 2018-09-14 |
CN104178741A (zh) | 2014-12-03 |
KR20140138048A (ko) | 2014-12-03 |
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GR01 | Patent grant |