CN104178741B - 具有分割型磁体的溅射装置 - Google Patents

具有分割型磁体的溅射装置 Download PDF

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Publication number
CN104178741B
CN104178741B CN201410222220.9A CN201410222220A CN104178741B CN 104178741 B CN104178741 B CN 104178741B CN 201410222220 A CN201410222220 A CN 201410222220A CN 104178741 B CN104178741 B CN 104178741B
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China
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magnet
central
target
incorporated
screw rod
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CN201410222220.9A
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Chinese (zh)
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CN104178741A (zh
Inventor
刘桓圭
崔渽抆
高光洙
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IRUJA Co Ltd
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IRUJA Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/345Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455Movable magnets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • H01J37/3408Planar magnetron sputtering

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CN201410222220.9A 2013-05-23 2014-05-23 具有分割型磁体的溅射装置 Active CN104178741B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0058145 2013-05-23
KR20130058145 2013-05-23

Publications (2)

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CN104178741A CN104178741A (zh) 2014-12-03
CN104178741B true CN104178741B (zh) 2017-09-08

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Family Applications (1)

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CN201410222220.9A Active CN104178741B (zh) 2013-05-23 2014-05-23 具有分割型磁体的溅射装置

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KR (1) KR101899008B1 (ko)
CN (1) CN104178741B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108456859B (zh) * 2017-02-22 2021-05-07 北京北方华创微电子装备有限公司 磁控溅射腔室及磁控溅射设备
KR102181087B1 (ko) * 2018-08-23 2020-11-20 주식회사 아바코 스퍼터링장치 및 스퍼터링장치 제어방법
KR102180214B1 (ko) * 2018-09-03 2020-11-18 주식회사 아바코 스퍼터링장치 및 스퍼터링장치 제어방법
KR102375781B1 (ko) * 2018-11-15 2022-03-18 주식회사 아바코 스퍼터링장치 및 스퍼터링장치 제어방법
KR20200056588A (ko) * 2018-11-15 2020-05-25 주식회사 아바코 스퍼터링장치 및 스퍼터링장치 제어방법
CN112553583B (zh) * 2019-09-25 2023-03-28 亚威科股份有限公司 溅射装置及溅射装置控制方法
KR102353670B1 (ko) * 2019-10-07 2022-01-21 주식회사 에이치앤이루자 스퍼터링 장치용 원통형 캐소드
KR102301176B1 (ko) * 2019-12-27 2021-09-14 주식회사 에이치앤이루자 스퍼터링 장치용 캐소드 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3879009B2 (ja) * 1995-01-30 2007-02-07 キヤノンアネルバ株式会社 スパッタリングカソード
US10043642B2 (en) * 2008-02-01 2018-08-07 Oerlikon Surface Solutions Ag, Pfäffikon Magnetron sputtering source and arrangement with adjustable secondary magnet arrangement
US8137519B2 (en) * 2008-03-13 2012-03-20 Canon Anelva Corporation Sputtering cathode, sputtering apparatus provided with sputtering cathode, film-forming method, and method for manufacturing electronic device
KR101053054B1 (ko) * 2008-12-23 2011-08-01 주식회사 테스 마그네트론 스퍼터링 장치
KR101165432B1 (ko) 2010-05-25 2012-07-12 (주)이루자 마그넷 구동 방법 및 이를 이용한 스퍼터링 장치
JP5951975B2 (ja) 2010-12-28 2016-07-13 キヤノンアネルバ株式会社 スパッタリング装置
CN203096163U (zh) * 2013-02-27 2013-07-31 东莞汇海光电科技实业有限公司 一种磁场均匀镀膜调节装置

Also Published As

Publication number Publication date
KR101899008B1 (ko) 2018-09-14
CN104178741A (zh) 2014-12-03
KR20140138048A (ko) 2014-12-03

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