CN104167409A - Light rod and light source using same - Google Patents
Light rod and light source using same Download PDFInfo
- Publication number
- CN104167409A CN104167409A CN201410361287.0A CN201410361287A CN104167409A CN 104167409 A CN104167409 A CN 104167409A CN 201410361287 A CN201410361287 A CN 201410361287A CN 104167409 A CN104167409 A CN 104167409A
- Authority
- CN
- China
- Prior art keywords
- radiating part
- optical wand
- support portion
- light
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
The invention brings forward a light rod. The light rod comprises at least one LED chip, a substrate and a fluorescent glue. The substrate comprises a support part and a heat dissipation part. The support part is used for placing the at least one LED chip. The fluorescent glue is used for coating the support part of the substrate so as to seal the at least one LED chip. The heat dissipation part is connected with the support and is exposed outside the fluorescent glue for heat dissipation. The invention also provides a light source using the light rod. According to the light rod and the light source disclosed by the invention, the heat dissipation part is connected with the support and is exposed outside the fluorescent glue, the heat dissipation performance is good, and a large-power LED chip can be used.
Description
Technical field
The invention relates to lighting technical field, and particularly about a kind of optical wand and use its light source.
Background technology
Light-emitting diode (light emitting diode, LED) is because the features such as it is energy-conservation, safety, long service life are widely used.
Existing optical wand comprises substrate, LED chip and fluorescent glue, and wherein, described substrate is used for placing described LED chip, and described fluorescent glue covers whole substrate, to seal described LED chip.
But the fluorescent glue of existing optical wand covers whole substrate, causes poor radiation, affect the useful life of LED chip, particularly, when the power of LED chip is larger, easily cause the damage of element.
Therefore, be necessary to provide improved technical scheme to overcome the above technical problem existing in prior art.
Summary of the invention
The object of this invention is to provide the optical wand that a kind of thermal diffusivity is good.
The present invention proposes a kind of optical wand, and described optical wand comprises at least one LED chip, substrate and fluorescent glue.Described substrate comprises support portion and radiating part, and described support portion is used for placing described LED chip.Described fluorescent glue is for the support portion of coated described substrate, to seal described at least one LED chip.Wherein, described radiating part is connected with described support portion, and described radiating part is exposed outside described fluorescent glue, to dispel the heat.
Preferably, described optical wand comprises a plurality of LED chips, and described a plurality of LED chips are cascaded.
Preferably, described support portion comprises base and a plurality of lug boss being connected with described radiating part.
Preferably, the lug boss of described support portion comprises the face of being in the light and bottom surface, and described bottom surface is used for placing described light-emitting diode chip for backlight unit.Wherein, described in be in the light face and described light-emitting diode chip for backlight unit be positioned at the same side of described bottom surface, to adjust the lighting angle of described light-emitting diode chip for backlight unit.
Preferably, on the base of described support portion, be provided with circular hole.
Preferably, described a plurality of LED chip is positioned at the end face of described lug boss.
Preferably, described radiating part comprises the first radiating part and the second radiating part, and described the first radiating part is connected by glue with described the second radiating part.
Preferably, between described the first radiating part and described the second radiating part, be provided with close-fitting lines.
Preferably, on described the first radiating part, be provided with convex lines, on described the second radiating part, be provided with spill lines.
The present invention also provides a kind of light source, and described light source comprises optical wand.Described optical wand comprises LED chip, substrate and fluorescent glue.Described substrate comprises support portion and radiating part, and described support portion is used for placing described LED chip.Described fluorescent glue is for the support portion of coated described substrate, to seal described LED chip.Wherein, described radiating part is connected with described support portion, and described radiating part is exposed outside described fluorescent glue, to dispel the heat.
Radiating part in optical wand of the present invention and light source is connected with support portion, and exposed outside fluorescent glue, and thermal diffusivity is good, can use high-power LED chip.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technology hand end of the present invention, and can be implemented according to the content of specification, and for above and other objects of the present invention, feature and advantage can be become apparent, below especially exemplified by embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is the structural representation of the optical wand of first embodiment of the invention.
Fig. 2 is the structural representation of the optical wand of second embodiment of the invention.
Fig. 3 is the structural representation of the optical wand of third embodiment of the invention.
Fig. 4 is the structural representation of the optical wand of fourth embodiment of the invention.
Fig. 5 is the structural representation of the optical wand of fifth embodiment of the invention.
Embodiment
For further setting forth the present invention, reach technology hand end and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to the optical wand proposing according to the present invention and use embodiment, structure, feature and the effect thereof of its light source, be described in detail as follows:
Fig. 1 is the structural representation of the optical wand 1 of the first embodiment of the present invention.As shown in Figure 1, optical wand 1 comprises at least one light-emitting diode (light emitting diode, LED) chip 10, substrate 11 and fluorescent glue 12.Substrate 11 comprises support portion 111 and radiating part 112, and support portion 111 is for placing at least one LED chip 10.Fluorescent glue 12 is for the support portion 111 of coated substrate 11, with sealing LED chip 10.Wherein, radiating part 112 is connected with support portion 111, and radiating part 112 is exposed outside fluorescent glue 12, to dispel the heat.
In an embodiment of the present invention, support portion 111 and radiating part 112 are metal material and form.
In an embodiment of the present invention, optical wand 1 comprises a plurality of LED chips 10 (only illustrating 12 in figure), and a plurality of LED chips 10 are cascaded.
In an embodiment of the present invention, support portion 111 comprises the base that is connected with radiating part 112 and at a plurality of lug bosses of base projection, wherein, the number of lug boss is identical with the number of LED chip 10.
In an embodiment of the present invention, lug boss is rectangular column, the growing up in wide of lug boss, lug boss be wider than height.Lug boss comprises end face, the side adjacent with end face, bottom surface relative with end face and that be connected with radiating part 112.Wherein, the end face of lug boss refers to the plane of area minimum in lug boss.
In an embodiment of the present invention, LED chip 10 is positioned at the end face of lug boss, so that the lighting angle of LED chip 10 can approach 360 degree.
Particularly, LED chip 10 is when luminous, light, while getting to fluorescent material in fluorescent glue 12 and spread powder, diffuse reflection can occur, and (now fluorescent material is as new luminous point, spread powder can increase the concentration of fluorescent material above chip, also increased reflection sources), part light can be from fluorescent glue 12 penetrates out lower than the position of the end face of lug boss, thereby the lighting angle that makes LED chip 10 is greater than 180 degree, in addition, when fluorescent glue 12 overall volumes increase, especially fluorescent glue 12 thickness that cover on the side of the lug boss of support portion 111 increase, LED chip 10 is when luminous, light, while getting to fluorescent material in fluorescent glue 12 and spread powder, irreflexive angle occurs also can be increased thereupon, thereby the lighting angle that makes optical wand 1 is infinitely close to 360 degree, expanded the lighting angle of optical wand 1.
In one embodiment of the present invention, LED chip 10 is connected by transparent insulation glue (not shown) with support 10 faces, and fluorescent material or spread powder in this insulating cement, have been added, therefore, when the bottom emission of LED chip 10 goes out blue light, can there is diffuse reflection in fluorescent material and spread powder that blue light is got in insulating cement, thereby further increase LED chip 10 bottom light emission rates, thereby further expanded the lighting angle of optical wand 1.
In an embodiment of the present invention, on the base of support portion 111, be provided with bonding hole 20, to improve the bonding force of fluorescent glue 12.
In an embodiment of the present invention, radiating part 112 comprises that the first radiating part 1121 and the second radiating part 1122, the first radiating parts 1121 are connected by glue (not shown) with the second radiating part 1122.
In an embodiment of the present invention, between the first radiating part 1121 and the second radiating part 1122, be provided with close-fitting lines, to improve the bonding force of glue.
In an embodiment of the present invention, on the first radiating part 1121, be provided with convex lines, on the second radiating part 1122, be provided with spill lines.
Fig. 2 is the structural representation of the optical wand 2 of second embodiment of the invention.Optical wand 2 shown in Fig. 2 is basic identical with optical wand 1 structure shown in Fig. 1, and difference is only: the lug boss of support portion 111 comprises a plurality of face 1111 and a plurality of bottom surfaces 1112 of being in the light, and bottom surface 1112 is for placing LED chip 10.Wherein, be in the light face 1111 and LED chip 10 are positioned at the same side of bottom surface 1112, to adjust the lighting angle of LED chip 10.
In one embodiment of the present invention, the face 1111 that is in the light is adjacent with bottom surface 1112, and orthogonal.Fluorescent glue 12 is comprised of a plurality of triangular prisms, and the wherein two sides of each triangular prism is overlapping with the face of being in the light 1111 and bottom surface 1112 respectively.
Certainly it will be appreciated by those skilled in the art that, the face 1111 that is in the light can be adjusted according to the needs of LED chip 10 lighting angles with the angle of bottom surface 1112.
Fig. 3 is the structural representation of the optical wand of third embodiment of the invention.As shown in Figure 3, the pedestal 11 that comprises support portion 111 and radiating part 112 of the optical wand shown in Fig. 33 is the triangular prism of chamfered edge.Wherein, support portion 111 can not only be for supporting LED chip 10, and can with the heat that LED chip 10 is produced, conduct to fast radiating part 112 as enthusiasm (heat sink), thereby improve the radiating rate of LED chip 10.
Wherein, fluorescent glue 12 is for wrapping up support portion 111, and with sealing LED chip 10, fluorescent glue 12 is half-cylindrical, makes the lighting angle of optical wand 3 larger.
In addition,, in order to increase the adhesion of fluorescent glue 12 and substrate 11, on substrate 11, be also provided with metal leg.Certainly it will be appreciated by those skilled in the art that, part metals pin can be exposed to outside fluorescent glue 12, for heat radiation.
Fig. 4 is the structural representation of the optical wand of fourth embodiment of the invention.As shown in Figure 4, the shape approximation of the substrate 11 of the optical wand shown in Fig. 44 is semicylinder.Wherein, support portion 111 can not only be for supporting LED chip 10, and can with the heat that LED chip 10 is produced, conduct to fast radiating part 112 as enthusiasm (heat sink), thereby improve the radiating rate of LED chip 10.
Wherein, fluorescent glue 12 is for wrapping up support portion 111, and with sealing LED chip 10, fluorescent glue 12 is half-cylindrical, makes the lighting angle of optical wand 3 larger.
In addition,, in order to increase the adhesion of fluorescent glue 12 and substrate 11, on substrate 11, be also provided with metal leg.Certainly it will be appreciated by those skilled in the art that, part metals pin can be exposed to outside fluorescent glue 12, for heat radiation.
Fig. 5 is the structural representation of the optical wand of fifth embodiment of the invention.As shown in Figure 5, the optical wand 5 shown in Fig. 5, the substrate 11 of optical wand 5 comprises the lug boss relative with a side of placing LED chip 10.Particularly, LED chip 10 is when luminous, light, while getting to fluorescent material in fluorescent glue 12 and spread powder, diffuse reflection can occur, and (now fluorescent material is as new luminous point, spread powder can increase the concentration of fluorescent material above chip, also increased reflection sources), part light can penetrate out from the gap between fluorescent glue 12 protrusions portions, thereby has expanded the lighting angle of optical wand 5.
In addition,, in order to increase the adhesion of fluorescent glue 12 and substrate 11, on substrate 11, be also provided with metal leg 1120.Certainly it will be appreciated by those skilled in the art that, part metals pin 1120 can be exposed to outside fluorescent glue 12, for heat radiation.
The present invention also provides a kind of light source, and light source comprises as Fig. 1 or as Fig. 2 or as Fig. 3 or as Fig. 4 or optical wand as shown in Figure 5.Optical wand comprises at least one light-emitting diode (light emitting diode, LED) chip 10, substrate 11 and fluorescent glue 12.Substrate 11 comprises support portion 111 and radiating part 112, and support portion 111 is for placing at least one LED chip 10.Fluorescent glue 12 is for the support portion 111 of coated substrate 11, with sealing LED chip 10.Wherein, radiating part 112 is connected with support portion 111, and exposed outside fluorescent glue 12, to dispel the heat.
Optical wand 1,2,3,4,5 of the present invention and use the radiating part 112 in its light source to be connected with support portion 111, and radiating part 112 is exposed outside fluorescent glue 12, and thermal diffusivity is good, can use high-power LED chip 10.
Above, only embodiments of the invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with embodiment, yet not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be not depart from technical solution of the present invention content, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (10)
1. an optical wand, is characterized in that, described optical wand comprises:
At least one LED chip;
Substrate, described substrate comprises support portion and radiating part, described support portion is used for placing described at least one LED chip; And
Fluorescent glue, described fluorescent glue is for the support portion of coated described substrate, to seal described at least one LED chip;
Wherein, described radiating part is connected with described support portion, and described radiating part is exposed outside described fluorescent glue, to dispel the heat.
2. optical wand as claimed in claim 1, is characterized in that, described optical wand comprises a plurality of LED chips, and described a plurality of LED chips are cascaded.
3. optical wand as claimed in claim 2, is characterized in that, described support portion comprises base and a plurality of lug boss being connected with described radiating part.
4. optical wand as claimed in claim 3, is characterized in that, the lug boss of described support portion comprises:
Face is in the light; And
Bottom surface, described bottom surface is used for placing described light-emitting diode chip for backlight unit;
Wherein, described in be in the light face and described light-emitting diode chip for backlight unit be positioned at the same side of described bottom surface, to adjust the lighting angle of described light-emitting diode chip for backlight unit.
5. optical wand as claimed in claim 3, is characterized in that, on the base of described support portion, is provided with circular hole.
6. optical wand as claimed in claim 3, is characterized in that, described a plurality of LED chips are positioned at the end face of described lug boss.
7. optical wand as claimed in claim 1, is characterized in that, described radiating part comprises the first radiating part and the second radiating part, and described the first radiating part is connected by glue with described the second radiating part.
8. optical wand as claimed in claim 7, is characterized in that, between described the first radiating part and described the second radiating part, is provided with close-fitting lines.
9. optical wand as claimed in claim 8, is characterized in that, on described the first radiating part, is provided with convex lines, on described the second radiating part, is provided with spill lines.
10. a light source, is characterized in that, described light source comprises the optical wand as described in claim 1-9 any one.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410361287.0A CN104167409A (en) | 2014-03-18 | 2014-07-25 | Light rod and light source using same |
| KR1020150003228A KR20150108736A (en) | 2014-03-18 | 2015-01-09 | Light bar and light source using same |
| PCT/CN2015/074170 WO2015139580A1 (en) | 2014-03-18 | 2015-03-13 | Light bar and light source using same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410100897.5 | 2014-03-18 | ||
| CN201410100897.5A CN103904070A (en) | 2014-03-18 | 2014-03-18 | Light bar and lighting source using same |
| CN201410361287.0A CN104167409A (en) | 2014-03-18 | 2014-07-25 | Light rod and light source using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104167409A true CN104167409A (en) | 2014-11-26 |
Family
ID=50995324
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410100897.5A Pending CN103904070A (en) | 2014-03-18 | 2014-03-18 | Light bar and lighting source using same |
| CN201410361287.0A Pending CN104167409A (en) | 2014-03-18 | 2014-07-25 | Light rod and light source using same |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410100897.5A Pending CN103904070A (en) | 2014-03-18 | 2014-03-18 | Light bar and lighting source using same |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR20150108736A (en) |
| CN (2) | CN103904070A (en) |
| TW (1) | TW201537090A (en) |
| WO (1) | WO2015139580A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015139580A1 (en) * | 2014-03-18 | 2015-09-24 | 深圳市光之谷新材料科技有限公司 | Light bar and light source using same |
| CN110277482A (en) * | 2019-07-03 | 2019-09-24 | 华南理工大学 | A kind of terrace with edge substrate LED car lamp |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104167410A (en) * | 2014-07-25 | 2014-11-26 | 深圳市光之谷新材料科技有限公司 | LED display unit and display apparatus using same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101451677A (en) * | 2007-12-07 | 2009-06-10 | 富士迈半导体精密工业（上海）有限公司 | Solid lighting device |
| WO2012009921A1 (en) * | 2010-07-19 | 2012-01-26 | Huizhou Light Engine Ltd. | Phosphor coating films and lighting apparatuses using the same |
| JP2012248687A (en) * | 2011-05-27 | 2012-12-13 | Toshiba Lighting & Technology Corp | Light-emitting module and illumination apparatus |
| CN203800044U (en) * | 2014-03-18 | 2014-08-27 | 深圳市光之谷新材料科技有限公司 | Lighting bar, and light source using same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103904070A (en) * | 2014-03-18 | 2014-07-02 | 深圳市光之谷新材料科技有限公司 | Light bar and lighting source using same |
-
2014
- 2014-03-18 CN CN201410100897.5A patent/CN103904070A/en active Pending
- 2014-07-25 CN CN201410361287.0A patent/CN104167409A/en active Pending
- 2014-08-22 TW TW103129059A patent/TW201537090A/en unknown
-
2015
- 2015-01-09 KR KR1020150003228A patent/KR20150108736A/en not_active Application Discontinuation
- 2015-03-13 WO PCT/CN2015/074170 patent/WO2015139580A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101451677A (en) * | 2007-12-07 | 2009-06-10 | 富士迈半导体精密工业（上海）有限公司 | Solid lighting device |
| WO2012009921A1 (en) * | 2010-07-19 | 2012-01-26 | Huizhou Light Engine Ltd. | Phosphor coating films and lighting apparatuses using the same |
| JP2012248687A (en) * | 2011-05-27 | 2012-12-13 | Toshiba Lighting & Technology Corp | Light-emitting module and illumination apparatus |
| CN203800044U (en) * | 2014-03-18 | 2014-08-27 | 深圳市光之谷新材料科技有限公司 | Lighting bar, and light source using same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015139580A1 (en) * | 2014-03-18 | 2015-09-24 | 深圳市光之谷新材料科技有限公司 | Light bar and light source using same |
| CN110277482A (en) * | 2019-07-03 | 2019-09-24 | 华南理工大学 | A kind of terrace with edge substrate LED car lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103904070A (en) | 2014-07-02 |
| WO2015139580A1 (en) | 2015-09-24 |
| TW201537090A (en) | 2015-10-01 |
| KR20150108736A (en) | 2015-09-30 |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141126 |
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