CN104155939A - System, manufacturing condition determining apparatus, and manufacturing management apparatus - Google Patents

System, manufacturing condition determining apparatus, and manufacturing management apparatus Download PDF

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Publication number
CN104155939A
CN104155939A CN201410350676.3A CN201410350676A CN104155939A CN 104155939 A CN104155939 A CN 104155939A CN 201410350676 A CN201410350676 A CN 201410350676A CN 104155939 A CN104155939 A CN 104155939A
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CN
China
Prior art keywords
mentioned
information
creating conditions
optical semiconductor
varnish
Prior art date
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CN201410350676.3A
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Chinese (zh)
Inventor
伊藤久贵
二宫明人
大薮恭也
梅谷荣弘
松田广和
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Nitto Denko Corp
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Nitto Denko Corp
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Publication of CN104155939A publication Critical patent/CN104155939A/en
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4093—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36307—Table with workpiece features and corresponding machining parameters, methods
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

This system is provided with a manufacturing condition determining apparatus and a manufacturing management apparatus. The manufacturing condition determining apparatus is provided with: a first information storage region having stored therein first information relating to an optical semiconductor element and an optical semiconductor device; a second information storage region having stored therein second information relating to a varnish; and a determining means that determines manufacturing conditions on the basis of the first information stored in the first information storage region, and the second information stored in the second information storage region. The manufacturing management apparatus is provided with: a third information storage region having stored therein third information relating to the manufacturing conditions determined by means of the determining means; and a managing means that manages manufacturing conditions of a sheet manufacturing step on the basis of the third information stored in the third information storage region.

Description

Determine and management system
The application is to be that Dec 17, application number in 2013 are dividing an application of 201380003482.X (PCT/JP2013/083696), the denomination of invention application that is " system, create conditions determination device and manufacturing management device " the applying date.
Technical field
The present invention relates to a kind of system, create conditions determination device and manufacturing management device, in detail, relate to a kind of for the system creating conditions of the manufacture method of optical semiconductor device being determined and manage, create conditions determination device and manufacturing management device.
Background technology
In recent years, as the manufacture method of optical semiconductor device, studying following methods: manufacture the varnish that comprises particle and curable resin, from this varnish, manufacture the cover sheets such as seal stock in B stage, by this cover sheets, cover optical semiconductor.
For example, following methods has been proposed: the luminescent coating that utilizes the thermoset resin by the B stage to form covers the light emitting diode that is installed on substrate, makes afterwards the luminescent coating C stage, manufactures thus LED matrix (for example, the following patent documentation 1 of reference).
Patent documentation 1: TOHKEMY 2009-060031 communique
Summary of the invention
the problem that invention will solve
Yet, in seal stock manufacturing works, manufacture the seal stock that comprises luminescent coating, therefore the seal stock shipment producing is arrived to LED matrix manufacturing works.In addition, in seal stock manufacturing works, from LED matrix manufacturing works, provide the information relevant to light emitting diode and LED matrix, according to this information and the information relevant to varnish, determine to be suitable for to be made as the creating conditions of seal stock of the LED matrix of object.
Yet, the in the situation that of LED matrix manufacturing works semiconductor element and/or optical semiconductor device change, in seal stock manufacturing works, need to again manufacture accordingly seal stock with these changes, or further different types of seal stock of again manufacturing is transported to LED matrix manufacturing works.Therefore, there is cost time, this problem of time.
On the other hand, also consider seal stock manufacturing works are set in LED matrix manufacturing works, thereby omit above-mentioned work, time.
Yet LED matrix manufacturing works exist the information relevant to varnish inadequate and cannot determine exactly this problem of creating conditions of seal stock.
The object of the present invention is to provide a kind of manufacturing works at optical semiconductor device can manufacture the system of the cover sheets that is suitable for optical semiconductor device, create conditions determination device and manufacturing management device simple and reliablely.
for the scheme of dealing with problems
In order to achieve the above object, system of the present invention is the system of creating conditions and determining and managing to the sheet material manufacturing process in the manufacture method of optical semiconductor device, the manufacture method of this optical semiconductor device possesses: varnish manufacturing process, manufactures the varnish that comprises particle and curable resin; Above-mentioned sheet material manufacturing process, manufactures the cover sheets in B stage from above-mentioned varnish; And covering process, by above-mentioned cover sheets, cover optical semiconductor, the system is characterized in that, said system possesses the determination device of creating conditions and manufacturing management device, the above-mentioned determination device of creating conditions possesses: first information storage area, the first information that its storage is relevant with above-mentioned optical semiconductor device to above-mentioned optical semiconductor; The second information storage area, the second information that its storage is relevant to above-mentioned varnish; And determining means, above-mentioned the second information that store the above-mentioned first information that it is stored according to above-mentioned first information storage area and above-mentioned the second information storage area decides above-mentioned creating conditions, above-mentioned manufacturing management device possesses: the 3rd information storage area, its storage and above-mentioned the 3rd relevant information of creating conditions being determined by above-mentioned determining means; And administrative unit, its above-mentioned the 3rd information of storing according to above-mentioned the 3rd information storage area is managed above-mentioned the creating conditions of above-mentioned sheet material manufacturing process, and the above-mentioned determination device of creating conditions carries out telecommunication via network and above-mentioned manufacturing management device.
In order to achieve the above object, system of the present invention is the system of creating conditions and determining and managing to the sheet material manufacturing process in the manufacture method of optical semiconductor device, the manufacture method of this optical semiconductor device possesses: varnish manufacturing process, manufactures the varnish that comprises particle and curable resin; Above-mentioned sheet material manufacturing process, manufactures the cover sheets in B stage from above-mentioned varnish; And covering process, by above-mentioned cover sheets, cover optical semiconductor, the system is characterized in that, said system possesses the determination device of creating conditions and manufacturing management device, the above-mentioned determination device of creating conditions possesses: first information storage area, the first information that its storage is relevant with above-mentioned optical semiconductor device to above-mentioned optical semiconductor; The second information storage area, the second information that its storage is relevant to above-mentioned varnish; And determining means, above-mentioned the second information that store the above-mentioned first information that it is stored according to above-mentioned first information storage area and above-mentioned the second information storage area decides above-mentioned creating conditions, above-mentioned manufacturing management device possesses: the 3rd information storage area, its storage and above-mentioned the 3rd relevant information of creating conditions being determined by above-mentioned determining means; And administrative unit, its above-mentioned the 3rd information of storing according to above-mentioned the 3rd information storage area is managed above-mentioned the creating conditions of above-mentioned sheet material manufacturing process.
In this system, the determination device of creating conditions possesses first information storage area, the second information storage area and determining means, and on the other hand, manufacturing management device possesses the 3rd information storage area and administrative unit.
And, the determination device of creating conditions can store respectively each first information and the second information into first information storage area and the second information storage area, by determining means, decide creating conditions of sheet material manufacturing process, creating conditions of Jiang Gai sheet material manufacturing process offers manufacturing management device.
And, in manufacturing management device, by what provide from the determination device of creating conditions, store the 3rd information storage area into the 3rd relevant information of creating conditions, by administrative unit, according to above-mentioned the 3rd information, manage creating conditions of sheet material manufacturing process.
Therefore, can in the determination device of creating conditions, determine dividually creating conditions of sheet material manufacturing process with manufacturing management device, and can be managed by manufacturing management device.
In addition, three information relevant to creating conditions of sheet material manufacturing process providing from the determination device of creating conditions is based on the first information and the second information.Therefore, manufacturing management device can, according to the 3rd information providing from the determination device of creating conditions, be managed creating conditions of sheet material manufacturing process by administrative unit accurately.Its result, can manufacture the optical semiconductor device that is made as object accurately.
In addition, system of the present invention preferably also determines and manages creating conditions of above-mentioned varnish manufacturing process, above-mentioned the second information that store the above-mentioned first information that above-mentioned determining means is also stored according to above-mentioned first information storage area and above-mentioned the second information storage area decides above-mentioned the creating conditions of above-mentioned varnish manufacturing process, and above-mentioned the 3rd information that above-mentioned administrative unit is also stored according to above-mentioned the 3rd information storage area manages above-mentioned the creating conditions of above-mentioned varnish manufacturing process.
In this system, the second information that store the first information that determining means is also stored according to first information storage area and the second information storage area decides creating conditions of varnish manufacturing process, and the 3rd information that administrative unit is also stored according to the 3rd information storage area is managed creating conditions of varnish manufacturing process.Therefore, the cover sheets of the optical semiconductor device that is suitable for being made as object can be manufactured accurately, further the optical semiconductor device that is made as object can be manufactured accurately.
In addition, in system of the present invention, preferably the first information comprises the information relevant to the substrate that optical semiconductor is installed.
According to this system, the first information comprises the information relevant to the substrate that optical semiconductor is installed, and the determination device of therefore creating conditions can also possess the information relevant with the substrate that optical semiconductor is installed together to above-mentioned each information.
Therefore, manufacturing management device, according to relevant high-precision the 3rd information of creating conditions to determining based on the first information, can further be managed creating conditions of sheet material manufacturing process accurately.
In addition, in system of the present invention, preferred above-mentioned manufacturing management device also possesses: the 4th information storage area, it stores the 4th information, and the 4th packets of information is containing the batch information of at least one and/or the manufacture of the optical semiconductor device during per unit in particle, curable resin, varnish and optical semiconductor; And amending unit, its above-mentioned the 4th information of storing according to above-mentioned the 4th information storage area is revised above-mentioned the creating conditions of above-mentioned sheet material manufacturing process.
The batch information of particle, curable resin, varnish and optical semiconductor is by batch change.In addition, the manufacture of the optical semiconductor device during per unit is by change during each unit.The physical property of the optical semiconductor device of therefore, exist manufacturing by each batch and/or unit during and the situation of change.In this case, the determination device of creating conditions decides according to the 4th information that to create conditions be miscellaneous at every turn.
But, in this system, in manufacturing management device, the 4th creating conditions of information Lai Dui sheet material manufacturing process of the batch information that can be stored according to the 4th information storage area by amending unit, comprise in particle, curable resin, varnish and optical semiconductor at least one and/or the manufacture of the optical semiconductor device during per unit revised.Therefore, easily and the change of the manufacture of batch information and/or optical semiconductor device accordingly creating conditions of sheet material manufacturing process revised, can manufacture accurately the optical semiconductor device that is made as object.
In addition, in system of the present invention, preferably the above-mentioned determination device of creating conditions also possesses the 5th information storage area, the 5th information storage area storage manufactures to before this 5th information that creating conditions of above-mentioned cover sheets is relevant, and above-mentioned the 5th information that the above-mentioned determination device of creating conditions is stored according to above-mentioned the 5th information storage area decides for this manufactures creating conditions of above-mentioned cover sheets.
According to this system, the determination device of creating conditions can be stored and before this, manufacture the 5th information that creating conditions of cover sheets is relevant.Therefore, can according to creating conditions of past storage, in this manufacture, be suitable for being made as the cover sheets of the optical semiconductor device of object, further can manufacture accurately the optical semiconductor device that is made as object at this.
In addition, in system of the present invention, preferably the above-mentioned determination device of creating conditions carries out telecommunication via network and above-mentioned manufacturing management device.
According to this system, the determination device of creating conditions carries out telecommunication via network and manufacturing management device, therefore even if create conditions, determination device is positioned at long-rangely with respect to manufacturing management device, also creating conditions of the sheet material manufacturing process determining promptly can be offered to manufacturing management device in the determination device of creating conditions.
In addition, in system of the present invention, preferred above-mentioned manufacturing management device is arranged in sheet production apparatus, and the above-mentioned determination device of creating conditions is arranged at the control department that is positioned at far-end with respect to above-mentioned sheet production apparatus.
According to this system, even if manufacturing management device is arranged in sheet production apparatus, the determination device of creating conditions is arranged at the control department that is positioned at far-end with respect to sheet production apparatus, also because the determination device of creating conditions carries out telecommunication via network and manufacturing management device, and the creating conditions of sheet material manufacturing process determining in the determination device of creating conditions in the department of control promptly can be offered to manufacturing management device.
The determination device of creating conditions of the present invention is for determining the creating conditions of sheet material manufacturing process of the manufacture method of optical semiconductor device, and the manufacture method of this optical semiconductor device possesses: varnish manufacturing process, manufactures the varnish that comprises particle and curable resin; Above-mentioned sheet material manufacturing process, manufactures the cover sheets in B stage from above-mentioned varnish; And covering process, by above-mentioned cover sheets, covering optical semiconductor, this determination device of creating conditions is characterised in that to possess: first information storage area, the first information that its storage is relevant to above-mentioned optical semiconductor; The second information storage area, the second information that its storage is relevant to above-mentioned varnish; And determining means, above-mentioned the second information that store the above-mentioned first information that it is stored according to above-mentioned first information storage area and above-mentioned the second information storage area decides above-mentioned creating conditions.
This determination device of creating conditions possesses first information storage area, the second information storage area and determining means.
Therefore, according to this determination device of creating conditions, store respectively each first information and the second information into first information storage area and the second information storage area, can decide creating conditions of sheet material manufacturing process by determining means.
Its result, according to creating conditions of above-mentioned sheet material manufacturing process, can manufacture the optical semiconductor device that is made as object accurately.
In addition, of the present invention, create conditions in determination device, preferably the above-mentioned determination device of creating conditions also determines creating conditions of above-mentioned varnish manufacturing process, and above-mentioned the second information that store the above-mentioned first information that above-mentioned determining means is also stored according to above-mentioned first information storage area and above-mentioned the second information storage area decides above-mentioned the creating conditions of above-mentioned varnish manufacturing process.
At this, create conditions in determination device, the second information that store the first information that determining means is also stored according to first information storage area and the second information storage area decides creating conditions of varnish manufacturing process.Therefore, the cover sheets of the optical semiconductor device that is suitable for being made as object can be manufactured accurately, further the optical semiconductor device that is made as object can be manufactured accurately.
In addition, of the present invention, create conditions in determination device, the preferred above-mentioned first information comprises the information relevant to the substrate that above-mentioned optical semiconductor is installed.
According to this determination device of creating conditions, the first information comprises the information relevant to the substrate that optical semiconductor is installed, and the determination device of therefore creating conditions can also possess the information relevant with the substrate that optical semiconductor is installed together to above-mentioned each information.
Therefore, can manufacture accurately the optical semiconductor device that is made as object.
In addition, of the present invention, create conditions in determination device, preferably also possesses the 5th information storage area, the 5th information storage area storage manufactures to before this 5th information that creating conditions of above-mentioned cover sheets is relevant, and above-mentioned the 5th information that the above-mentioned determination device of creating conditions is stored according to above-mentioned the 5th information storage area decides for this manufactures creating conditions of above-mentioned cover sheets.
According to this determination device of creating conditions, can store and before this, manufacture the 5th information that creating conditions of cover sheets is relevant.Therefore, can according to creating conditions of past storage, in this manufacture, be suitable for being made as the cover sheets of the optical semiconductor device of object, further can manufacture accurately the optical semiconductor device that is made as object at this.
Manufacturing management device of the present invention is for managing the creating conditions of sheet material manufacturing process of the manufacture method of optical semiconductor device, and the manufacture method of this optical semiconductor device possesses: varnish manufacturing process, manufactures the varnish that comprises particle and curable resin; Above-mentioned sheet material manufacturing process, manufactures the cover sheets in B stage from above-mentioned varnish; And covering process, by above-mentioned cover sheets, covering optical semiconductor, this manufacturing management device is characterised in that to possess: the 3rd information storage area, its storage and above-mentioned the 3rd relevant information of creating conditions; And administrative unit, its above-mentioned the 3rd information of storing according to above-mentioned the 3rd information storage area manages above-mentioned the creating conditions of above-mentioned sheet material manufacturing process.
According to this manufacturing management device, the 3rd relevant information of creating conditions of Jiang Yu sheet material manufacturing process stores the 3rd information storage area into, can according to above-mentioned the 3rd information, manage accurately creating conditions of sheet material manufacturing process by administrative unit.
Therefore, can manufacture accurately the optical semiconductor device that is made as object.
In addition, in manufacturing management device of the present invention, preferred above-mentioned manufacturing management device also manages creating conditions of above-mentioned varnish manufacturing process, and above-mentioned the 3rd information that above-mentioned administrative unit is also stored according to above-mentioned the 3rd information storage area manages above-mentioned the creating conditions of above-mentioned varnish manufacturing process.
According to this manufacturing management device, the 3rd information that administrative unit is also stored according to the 3rd information storage area is managed creating conditions of varnish manufacturing process, therefore the cover sheets of the optical semiconductor device that is suitable for being made as object can be manufactured accurately, further the optical semiconductor device that is made as object can be manufactured accurately.
In addition, in manufacturing management device of the present invention, preferably also possess: the 4th information storage area, it stores the 4th information, and the 4th packets of information is containing the batch information of at least one and/or the manufacture of the optical semiconductor device during per unit in particle, curable resin, varnish and optical semiconductor; And amending unit, its above-mentioned the 4th information of storing according to above-mentioned the 4th information storage area is revised above-mentioned the creating conditions of above-mentioned sheet material manufacturing process.
The change by each batch of the batch information of particle, curable resin, varnish and optical semiconductor.In addition, the manufacture of the optical semiconductor device during per unit is by during each unit and change.The physical property of the optical semiconductor device of therefore, exist manufacturing by each batch and/or unit during and the situation of change.Under these circumstances, the determination device of creating conditions decides according to the 4th information that to create conditions be miscellaneous at every turn.
But, in this manufacturing management device, can according to the 4th information storage area, be stored by amending unit, comprise in particle, curable resin, varnish and optical semiconductor at least one batch information and/or the 4th creating conditions of information Lai Dui sheet material manufacturing process of the manufacture of the optical semiconductor device during per unit revise.Therefore, easily and the change of the manufacture of batch information and/or optical semiconductor device accordingly creating conditions of sheet material manufacturing process revised, can manufacture accurately the optical semiconductor device that is made as object.
the effect of invention
System of the present invention according to possessing create conditions determination device and manufacturing management device of the present invention can determine dividually with manufacturing management device in the determination device of creating conditions, and can be managed by manufacturing management device.In addition, can manufacture accurately the optical semiconductor device that is made as object.
Accompanying drawing explanation
Fig. 1 means the Sketch figure of an embodiment of system of the present invention.
Fig. 2 A～Fig. 2 E means the amplification sectional view of the seal stock shown in Fig. 1, Fig. 2 A illustrates the seal stock only consisting of luminescent coating, Fig. 2 B illustrates the seal stock that possesses a plurality of luminescent coatings that the concentration of fluorophor is different, Fig. 2 C illustrates possesses the seal stock that has the resin bed of the recess of opening downwards and be filled into the luminescent coating of recess, Fig. 2 D illustrates possesses the seal stock that cross section is roughly the luminescent coating of trapezoidal shape and is formed at its resin bed around, Fig. 2 E illustrates possesses the seal stock that cross section is roughly rectangular-shaped luminescent coating and is formed at its resin bed around.
Fig. 3 F～Fig. 3 G means the amplification sectional view of the seal stock shown in Fig. 1, Fig. 3 F illustrates the seal stock of the luminescent coating of the upside that possesses resin bed and be formed at resin bed, Fig. 3 G illustrate possess resin bed, be formed at resin bed upside luminescent coating and at the downside of resin bed the seal stock with the functional layer of surrounding the mode of the part that is used to form optical semiconductor and forming.
Fig. 4 illustrates the Sketch figure of system of the variation of Fig. 1.
Fig. 5 A～Fig. 5 B is the amplification sectional view of variation of the seal stock of Fig. 2 A, and Fig. 5 A illustrates the state that cover sheets is configured in relatively to the upside of the sealant that covers optical semiconductor, and Fig. 5 B illustrates the state that cover sheets is layered in to the upper surface of sealant.
Embodiment
[structure of system]
System 1 as an embodiment of the invention is to be arranged at the control department 5 of seal stock manufacturing works and the system of dividing the optical semiconductor device manufacturing works 4 that are arranged with sealing sheet material manufacturing works.Creating conditions of the S1He of the varnish manufacturing process sheet material S2 of manufacturing process in the manufacture method of 1 pair of optical semiconductor device 20 of system determines and manages, the manufacture method of this optical semiconductor device 20 possesses: the S1 of varnish manufacturing process, manufactures the varnish 11 that comprises particle and curable resin; The S2 of sheet material manufacturing process, the seal stock 12 of manufacturing as the cover sheets in B stage from varnish 11; And sealing process S3 (example of covering process), with seal stock 12, carry out encapsulating optical semiconductor element 13.System 1 possesses the determination device 2 and as the sheet material manufacturing management device 3 of manufacturing management device of creating conditions.
Control department 5 is for example arranged in the seal stock manufacturing works that can manufacture the seal stock 12 that seal stock 12 that the sheet production apparatus 34 (aftermentioned) of Yu You optical semiconductor device manufacturing works 4 manufactures is identical.
Control department 5 possesses the determination device of creating conditions 2.
The determination device 2 of creating conditions possesses first memory 6 as first information storage area, as the second memory 7 of the second information storage area, as a CPU8 of determining means and as the 5th storer 10 of the 5th information storage area.
There is the first information 15 relevant to optical semiconductor 13, the substrate 14 that optical semiconductor 13 is installed and optical semiconductor device 20 in first memory 6.
As the first information 15, specifically as the information relevant to optical semiconductor 13, such as enumerating the shape of optical semiconductor 13, the peak luminous wavelength of the size of optical semiconductor 13, optical semiconductor 13, the installation number of the installation number of the optical semiconductor 13 of each unit area of substrate 14 and the optical semiconductor 13 of each substrate 14 etc.
In addition, as the first information 15, specifically as the information relevant to substrate 14, such as the surface configuration (whether having recess etc.) etc. that can enumerate the outer shape of substrate 14, the size of substrate 14 and substrate 14.
And, as the first information 15, specifically as the information relevant to optical semiconductor device 20, such as the light distribution characteristic etc. that can enumerate the colour temperature of optical semiconductor device 20, the total light flux of optical semiconductor device 20 and optical semiconductor device 20.Specifically, in the situation that be made as the color of the light of target, be natural light, target colour temperature is for example more than 4600K and for example for below 5500K.In addition, in the situation that be made as the color of the light of target, be white, target colour temperature is for example more than 3250K and for example for below 3800K.Select target colour temperature from said temperature scope.
First memory 6 is configured to the first information source 21 having from optical semiconductor device manufacturing works 4 it is inputted.
Second memory 7 storage second information 16 relevant to varnish 11.
As the second information 16, specifically as the information relevant to particle, such as enumerating the kind of particle, the mean value of the maximum length of the blending ratio of particle, particle (being mean grain size in the situation that particle is ball shape) etc.In addition,, in the situation that particle comprises fluorophor described later, as the information relevant to particle, also can enumerate the absorption peak wavelength of fluorophor.In addition, as the second information 16, specifically as the information relevant to curable resin, such as enumerating the kind of curable resin, the blending ratio of the viscosity of curable resin, curable resin and the curing rate of curable resin etc.And, as the second information 16, specifically as the information relevant to varnish, for example, can enumerate the viscosity of varnish.In addition, as the second information 16, in the situation that releasing sheet 28 (aftermentioned) is provided with telltale mark (not shown), also can enumerate the relative position information of a plurality of varnish 11 after coating etc.
The second information 16 is configured to the second information source 22 inputs that have from the control department 5 of seal stock manufacturing works.
The one CPU8 is the determination device of creating conditions that the second information 16 that the first information 15 stored based on first memory 6 and second memory 7 are stored decides seal stock 12.
Pre-stored in a CPU8 have regulated procedure to process, and a CPU8 decides creating conditions of seal stock 12 according to routine processes.
As creating conditions of seal stock 12, such as enumerating the kind of the layer structure of seal stock 12, the coating condition of varnish 11 etc.In addition, at seal stock 12, be B described later in the situation that of the stage, also can enumerate make the A stage the heating condition of varnish 11 of varnish 11B during the stage, the illuminate condition of active energy beam etc.In addition, also can enumerate the hardness information (for example, compress ional resilience index) of the seal stock 12 in B stage.
As with reference to Fig. 2 A～Fig. 2 E and Fig. 3 F～Fig. 3 G, seal stock 12 for example with possess the luminescent coating 26 that contains fluorophor containing fluorophor seal stock, be that fluorophor sheet material forms.As the layer structure of seal stock 12, such as can enumerate shown in Fig. 2 A～Fig. 2 E luminescent coating 26 can directly contact with optical semiconductor 13 (dummy line) like that contact structures and shown in Fig. 3 F and Fig. 3 G such luminescent coating 26 can cover optical semiconductor 13, on the other hand between luminescent coating 26 and optical semiconductor 13 (dummy line) across the isolating construction at interval etc.
In Fig. 2 A～Fig. 2 E and Fig. 3 F～Fig. 3 G, the parts shown in dummy line represent to be embedded in the optical semiconductor 13 of seal stock 12.
Seal stock 12 as contact structures, the seal stock 12A only being formed by luminescent coating 26 like that as shown in Figure 2 A from example, possess like that as shown in Figure 2 B the concentration of fluorophor different and on thickness direction stacked a plurality of luminescent coating 26A and the seal stock 12B of 26B, possess like that as shown in Figure 2 C the resin bed 27 with the recess of opening and the seal stock 12C that is filled into the luminescent coating 26 of recess downwards, with reference to Fig. 2 D and Fig. 2 E, possess like that the luminescent coating 26 and the seal stock 12 that is formed at its resin bed 27 around of overlooking observation circular shape or overlooking observation essentially rectangular shape, as shown in Figure 2 D like that luminescent coating 26 form along with towards upside and width become large cross-section roughly trapezoidal shape seal stock 12D and as shown in Figure 2 E like that luminescent coating 26 form selection in the seal stock 12E etc. of cross-section essentially rectangular shape.
In addition, as the seal stock 12 of isolating construction, such as from shown in Fig. 3 F, possess like that resin bed 27 and be formed at resin bed 27 upside luminescent coating 26 seal stock 12F and shown in Fig. 3 G, possess like that resin bed 27, be formed at the upside of resin bed 27 luminescent coating 26, the downside of resin bed 27 look up observe form the seal stock 12F etc. of functional layer 29 of part that encirclement will form optical semiconductor 13 selection.In addition,, in Fig. 3 G, the functional material possess the light reflection functions such as wavelength conversion function, Chinese white (specifically, titania etc.) of fluorophor etc. in resin by mixing carrys out selection function layer 29.
Specifically, as the seal stock 12 with above-mentioned various structures, can enumerate known seal stock, specifically, seal stock 12 as contact structures, for example, from TOHKEMY 2010-067641 communique, TOHKEMY 2009-231750 communique, TOHKEMY 2009-188207 communique, TOHKEMY 2009-182149 communique, TOHKEMY 2009-099784 communique, in the seal stock (fluorophor sheet material) that TOHKEMY 2009-060031 communique etc. is recorded, select (decision), and, seal stock 12 as isolating construction, for example, from TOHKEMY 2011-258634 communique, TOHKEMY 2011-228525 communique, TOHKEMY 2011-159874 communique, TOHKEMY 2011-082340 communique, TOHKEMY 2010-192844 communique, TOHKEMY 2010-153500 communique, in the seal stock (fluorophor sheet material) that TOHKEMY 2010-123802 communique etc. is recorded, select (decision).
Suitably select to there is the luminescent coating 26 of contact structures, the size of the concentration of fluorophor is different two luminescent coating 26A and luminescent coating 26B and resin bed 27 (comprising recess) is selected from scope described in above bulletin.
As the coating condition of varnish 11, such as enumerating, be and then coated with the shape of varnish 11 afterwards, be and then coated with the thickness of varnish 11 afterwards etc.In addition, above-mentioned shape comprises varnish 11 and is spaced from each other the shape that interval forms.
As shown in Figure 1, a CPU8 is configured to and can reads the second information 16 that the first information 15 that first memory 6 stores and second memory 7 are stored.
As shown in Figure 1, the 5th storer 10 is for storing the region of creating conditions of the seal stock 12 being determined by a CPU8.
In addition, be provided with posting field (not shown) in the 5th storer 10, this posting field (not shown) can record and before this, manufacture the 5th information 19 that creating conditions of seal stock 12 is relevant.In addition the 5th information 19 that, posting field recorded and stored is configured to and in this manufacture, by a CPU8, is read and again by a CPU8, determine creating conditions of seal stock 12.
Optical semiconductor device manufacturing works 4 are arranged on the position different from the seal stock manufacturing works (not shown) with control department 5 as required, specifically be arranged on the position (long-range position) away from seal stock manufacturing works (not shown), optical semiconductor device manufacturing works 4 possess sheet production apparatus 34 and packoff 32.
Sheet production apparatus 34 possesses varnish manufacturing installation 33, sheet material gasifying device 31 and sheet material manufacturing management device 3.
Varnish manufacturing installation 33 for example possesses container 52, and this container 52 is equipped with stirring machine 51.
Sheet material gasifying device 31 is such as possessing the apparatus for coating 53 such as divider, applicator, slit type coater.As apparatus for coating 53, preferably enumerate divider.In addition, sheet material gasifying device 31 can also possess dryer 55, and this dryer 55 has the well heater 54 that is spaced from each other arranged spaced on above-below direction.
Sheet material manufacturing management device 3 is positioned at long-range with respect to control department 5.Sheet material manufacturing management device 3 possesses the 3rd storer 23 as the 3rd information storage area, as the 4th storer 24 of the 4th information storage area and administrative unit as the 2nd CPU25 of amending unit.
The 3rd storer 23 is stored the 3rd relevant information 17 of creating conditions to the seal stock 12 being determined by a CPU8.
The 3rd information 17 comprises creating conditions by the seal stock 12 of a CPU8 decision.
The 3rd storer 23 is configured to the 3rd information 17 of determining the 5th storer 10 from 10 pairs of the 3rd storer 23 inputs of the 5th storer.
The 4th storer 24 storage the 4th information 18, the four information 18 comprise in particle, curable resin, varnish and optical semiconductor 13 batch information of at least one and/or the manufacture of the optical semiconductor device during per unit 20.
Batch information be along with batch change and the information that changes, specifically, can enumerate according to batch difference and the mean value of the maximum length of different particle (in the situation that particle is ball shape, mean grain size) etc., and, can enumerate according to batch difference and the viscosity of different curable resins etc.In addition, in the situation that particle comprises fluorophor, as the batch information of fluorophor, can enumerate according to batch difference and the absorption peak wavelength of different fluorophor.And, as according to batch difference and the different information relevant to varnish, can enumerate the viscosity of the varnish that batch difference by above-mentioned particle and/or curable resin causes.
As the manufacture of the optical semiconductor device 20 during each unit, with the manufacture of the optical semiconductor device 20 of every month, for example, from more than 1000, preferably select in 200,000 following scopes more than 5000 and for example.
The 4th storer 24 is configured to the second information source 22 input the 4th information 18 in the control department 5 of first information source 21 in Bei Cong optical semiconductor device manufacturing works 4 and seal stock manufacturing works (not shown).
As in the 4th information 18 from first information source 21 input the 4th information 18B, for example can enumerate the batch information of optical semiconductor 13, the manufacture of the optical semiconductor device 20 during each unit, and, as the 4th information 18A from the second information source 22 inputs, for example, can enumerate the batch information of the batch information of particle, the batch information of curable resin and varnish.
Pre-stored in the 2nd CPU25 have regulated procedure to process, the 3rd information 17 that the 2nd CPU25 stores based on the 3rd storer 23, to the S1 of varnish manufacturing process create conditions and creating conditions of the S2 of sheet material manufacturing process manages.In addition, the 4th information 18Dui varnish S1 of manufacturing process that the 2nd CPU25 can also store based on the 4th storer 24 create conditions and creating conditions of the S2 of sheet material manufacturing process revised.
The 2nd CPU25 is configured to and can reads the 4th information 18 that the 3rd information 17 that the 3rd storer 23 stores and the 4th storer 24 are stored.
The 2nd CPU25 is configured to and can manages respectively and revise creating conditions of the S1 of varnish manufacturing process and creating conditions of the S2 of sheet material manufacturing process to each varnish manufacturing installation 33 and sheet material gasifying device 31.
Packoff 32 possesses pressue device 35 and seal control device 36.
Pressue device 35 for example on above-below direction devices spaced apart relatively configure, can select pressuring machine having by two flat boards 41 etc., these two flat boards 41 can be pressed seal stock 12 and substrate 14 on above-below direction.
Seal control device 36 is configured to the air-proof condition that can control sealing process S3.In addition, be configured to and in seal control device 36, be provided with not shown storer, by the air-proof condition of the 21 input sealing process S3 from first information source, and, the air-proof condition of control sealing process S3.
Then, illustrate and utilize this system 1 in optical semiconductor device manufacturing works 4, to manufacture the method for optical semiconductor device 20.
1. the decision operation of creating conditions
In the method, first, the first information 15 is input to first memory 6 from first information source 21.Input without particular limitation of from the first information 15 to first memory 6, for example, by (via) connect first information source 21 and input the first information 15 with the circuits such as network of first memory 6.Or, can also such as from first information source 21 via after the communication units such as fax, mail, postal service, the first information 15 being input to first memory 6.
In addition, the second information 16 is input to second memory 7 from the second information source 22.The method that the second information 16 is input to second memory 7 is identical with the input method that the first information 15 is input to first memory 6.
Then, the one CPU8 reads the second information 16 that the first information 15 that first memory 6 stores and second memory 7 are stored, then, routine processes according to the rules, based on these first information 15 and the second information 16, determine creating conditions as the 3rd information 17 (being described in detail) of seal stock 12 below.
2. manufacturing management operation
Afterwards, the 3rd information 17 being determined by a CPU8 is recorded to the 5th storer 10, and then, the 3rd information 17 that is recorded to the 5th storer 10 is imported into the 3rd storer 23.
The method that the 3rd information 17 is input to the 3rd storer 23 is identical with the input method that the first information 15 is input to first memory 6.
In addition, the 4th information 18 is input to the 4th storer 24 from first information source 21 and the second information source 22.The method that the 4th information 18 is input to the 4th storer 24 is identical with the input method that the first information 15 is input to first memory 6.
Afterwards, the 2nd CPU25 reads the 3rd information 17 that the 3rd storer 23 is stored, then, routine processes according to the rules, based on the 3rd information 17Dui varnish S1 of manufacturing process create conditions and creating conditions of the S2 of sheet material manufacturing process manages.
And, in sheet production apparatus 34, based on creating conditions of being managed by the 2nd CPU25, implement successively the S1He of the varnish manufacturing process sheet material S2 of manufacturing process.
3. the S1 of varnish manufacturing process
In varnish manufacturing installation 33, first, according to creating conditions to implement the S1 of varnish manufacturing process by the 2nd CPU25 management.
Specifically, in the S1 of varnish manufacturing process, first, prepare respectively particle and curable resin, these particles and curable resin are mixed, varnish 11 is prepared as to the hardening resin composition containing particle.
As particle, such as selecting from fluorophor, filling agent etc.
Fluorophor has wavelength conversion function, such as from blue light can be transformed to sodium yellow yellow fluorophor, blue light can be transformed to the red-emitting phosphors etc. of red light and select.
As yellow fluorophor, for example, from (Ba, Sr, Ca) 2siO 4; Eu, (Sr, Ba) 2siO 4: silicate phosphor, for example Y such as Eu (positive barium silicate (BOS)) 3al 5o 12: Ce (YAG (yttrium aluminum garnet): Ce), Tb 3al 3o 12: Ce (TAG (terbium aluminium garnet): Ce) etc. have carbuncle type crystal structure carbuncle type fluorophor, such as in oxides of nitrogen fluorophor such as Ca-α-SiAlON etc., select.
As red-emitting phosphors, for example, from CaAlSiN 3: Eu, CaSiN 2: in the nitride phosphors such as Eu etc., select.
As the shape of fluorophor, such as selecting from spherical, tabular, needle-like etc.
The mean value of the maximum length of fluorophor (in the situation that being spherical, mean grain size) for example more than 0.1 μ m, preferably more than 1 μ m and for example below 200 μ m, preferably the scope below 100 μ m, select.
The absorption peak wavelength of fluorophor is for example more than 300nm, preferably 430nm is above and for example select the scope below 550nm, below preferred 470nm.
In the mode of using separately or use together, select fluorophor.
The blending ratio of fluorophor from respect to curable resin 100 Quality Mgmt Dept for example more than Wei0.1 Quality Mgmt Dept, be preferably 0.5 Quality Mgmt Dept more than and for example below Wei80 Quality Mgmt Dept, preferably the scope below 50 Quality Mgmt Dept, select.
As filling agent, for example from organosilicon particle (specifically, comprise organic silicon rubber particle) etc. for example, select in the inorganic fine particles such as organic particle, for example silicon dioxide (, smog silicon dioxide etc.), talcum, aluminium oxide, aluminium nitride, silicon nitride.In addition, the mean value of the maximum length of filling agent (in the situation that being spherical, mean grain size) for example more than 0.1 μ m, preferably more than 1 μ m and for example below 200 μ m, preferably the scope below 100 μ m, select.With the mode Selective filling agent of using separately or using together.The blending ratio of filling agent is from respect to curable resin 100 Quality Mgmt Dept for example more than 0.1 Quality Mgmt Dept, preferably more than 0.5 Quality Mgmt Dept and for example below 70 Quality Mgmt Dept, preferably select the scope below 50 Quality Mgmt Dept.
As curable resin, for example from two stage solidification type resins, select, this two stage solidification type resin has the reaction mechanism in two stages, by the reaction B stage (semi-solid preparation) of first stage, by the reaction C stage (completely curing) of subordinate phase.
As two stage solidification type resins, such as selection two stage solidification type active energy ray-curable resins from curing by heating the two stage solidification type thermoset resins that solidify, such as the irradiation by active energy beam (such as ultraviolet ray, electron ray etc.) etc.Preferably select two stage solidification type thermoset resins.
Specifically, as two stage solidification type thermoset resins, such as selecting from organic siliconresin, epoxy resin, polyimide resin, phenolics, urea resin, melamine resin, unsaturated polyester resin etc.From the viewpoint of photopermeability and permanance, preferably from two stage solidification type organic siliconresins, select.
As two stage solidification type organic siliconresins, such as selecting from there is condensation reaction/addition reaction curing type silicone resin etc. of these two kinds of reaction systems of condensation reaction and addition reaction.
As such condensation reaction/addition reaction curing type silicone resin, be selected from: for example contain silanol group two end polysiloxane, trialkoxy silane containing thiazolinyl, organic hydrogen polysiloxanes, the first condensation reaction of condensation catalyst and hydrosilylation catalysts/addition reaction curing type silicone resin, for example contain silanol group two end polysiloxane, silicon compound containing ethylenically unsaturated hydrocarbons base, silicon compound containing ethylenically unsaturated hydrocarbons base, organic hydrogen polysiloxanes, the second condensation reaction of condensation catalyst and hydrosilylation catalysts/addition reaction curing type silicone resin, for example contain two end silanol fundamental mode silicone oil, dialkoxy alkyl silane containing thiazolinyl, organic hydrogen polysiloxanes, three condensation reaction of condensation catalyst and hydrosilylation catalysts/addition reaction curing type silicone resin, for example contain the organopolysiloxane at least in 1 molecule with 2 thiazolinyl silylation, in 1 molecule, at least there is the organopolysiloxane of 2 hydrosilyl groups, four condensation reaction of hydrosilylation catalysts and cure retarder/addition reaction curing type silicone resin, for example contain first organopolysiloxane simultaneously with at least 2 ethylenically unsaturated hydrocarbons bases and at least 2 hydrosilyl groups in 1 molecule, containing ethylenically unsaturated hydrocarbons base and there is the second organopolysiloxane of at least 2 hydrosilyl groups in 1 molecule, five condensation reaction of hydrosilylation catalysts and hydrosilylation inhibitor/addition reaction curing type silicone resin, for example contain first organopolysiloxane simultaneously with at least 2 ethylenically unsaturated hydrocarbons bases and at least 2 silanol groups in 1 molecule, not containing thering is the second organopolysiloxane of at least 2 hydrosilyl groups in ethylenically unsaturated hydrocarbons base and 1 molecule, six condensation reaction of hydrosilylation inhibitor and hydrosilylation catalysts/addition reaction curing type silicone resin, seven condensation reaction/addition reaction curing type silicone the resin that for example contains silicon compound and boron compound or aluminium compound, such as eight condensation reaction that contains polyaluminosiloxane and silane coupling agent/addition reaction curing type silicone resin etc.
The viscosity of the two stage solidification type resins in A stage is for example more than 3000mPas, preferably 5000mPas is above and for example select the scope below 20000mPas, below preferred 15000mPas.In addition, the temperature of the two stage solidification type resins in A stage is adjusted to 25 ℃, uses E type circular cone with rotating speed 99s -1measure the viscosity of the two stage solidification type resins in A stage.By the method identical with said method, measure following viscosity.
The blending ratio of curable resin is from respect to containing the hardening resin composition (varnish) of particle for example more than 30 quality %, preferably more than 40 quality %, more preferably more than 50 quality % and for example below 98 quality %, preferably below 95 quality %, more preferably select the scope below 90 quality %.
In addition, as required, can also make to contain solvent containing the hardening resin composition of particle.
As solvent, be selected from: such as aliphatic hydrocarbons such as hexanes, such as aromatic hydrocarbons such as dimethylbenzene, siloxane such as vinyl cyclic dimethylsiloxane siloxane, two terminal ethylenyl groups dimethyl silicone polymers etc.Solvent is to become the compounding in containing the hardening resin composition of particle of the such compounding ratio of viscosity described later containing particle hardening resin composition.
When preparation contains the hardening resin composition of particle, specifically, as shown in Figure 1, in varnish manufacturing installation 33, the S1 of varnish manufacturing process based on by the 2nd CPU25 management creates conditions, for example, by the kind of the varnish 11 of the 2nd CPU25 management and layer structural correspondence seal stock 12, the kind of the particle of more particularly being managed by the 2nd CPU25, the blending ratio of particle, the mean value of the maximum length of particle is (in the situation that particle is ball shape, mean grain size), the kind of curable resin, the viscosity of curable resin, the blending ratio of curable resin, the absorption peak wavelength of fluorophor in the situation that particle comprises fluorophor, the viscosity of varnish 11 etc., come at above-mentioned each composition of the interior mixing of container 52.Then, with stirring machine 51, mix these above-mentioned each compositions.
Thus, prepare varnish 11.
In addition,, in the situation that curable resin is two stage solidification type resins, with the hardening resin composition containing particle in A stage, prepare varnish 11.
Viscosity by varnish 11 under 25 ℃, one air pressure conditions be for example adjusted into 1,000mPas above, preferably 4,000mPas is above and for example 1,000,000mPas is following, preferably 100, in the scope below 000mPas.
4. the S2 of sheet material manufacturing process
In sheet material gasifying device 31, after the S1 of varnish manufacturing process, according to implementing the S2 of sheet material manufacturing process by creating conditions of the 2nd CPU25 management.
That is, from varnish 11, form seal stock 12.
When forming seal stock 12, for example, first varnish 11 is applied to the surface of releasing sheet 28.
As releasing sheet 28, such as from polymer films such as polyethylene film, polyester films (PET etc.), such as ceramic sheet material, such as selecting metal forming etc.Preferably from polymer film, select.In addition, can also implement the lift-off processing such as fluorine processing on the surface of releasing sheet 28.In addition, the shape of releasing sheet 28 does not limit especially, such as observing selection essentially rectangular shape (comprising short strip shape, strip) etc. from overlooking.And, as releasing sheet 28, select whether to form telltale mark (not shown) and specifically labelled positional information, size etc.Form mark to guarantee to be coated with the region of varnish 11.
When varnish 11 being applied to releasing sheet 28 surperficial, such as selecting the apparatus for coating 53 such as divider, applicator, slit type coater.Preferably select divider.
From the coating condition of varnish 11, select the thickness of seal stock 12 so that its for example become 10 μ m above, preferably 50 μ m above and for example 2000 μ m following, preferably below 1000 μ m.
That is to say, from the coating condition of apparatus for coating 53, select, varnish 11 is adjusted to by the creating conditions of the 2nd CPU25 management, specifically by the shape of the varnish 11 after the and then coating of the 2nd CPU25 management, the thickness of the varnish 11 after coating and then.
In addition, in the situation that releasing sheet 28 is formed with telltale mark (not shown), while use the sensor (not shown) that apparatus for coating 5 is equipped with to confirm to regulate varnish 11 with respect to specifically labelled relative position with respect to specifically labelled coating position.
Afterwards, in the situation that varnish 11 contains two stage solidification type resins, make the varnish 11B stage.Specifically, if select two stage solidification type resins from heat curing-type, varnish 11 is rendered to dryer 55 is interior to be heated varnish 11.
Heating condition from heating-up temperature is for example more than 40 ℃, preferably more than 80 ℃, more preferably more than 100 ℃ and for example below 200 ℃, preferably below 150 ℃, more preferably the scope below 140 ℃, select.Heat time for example from more than 1 minute, preferably more than 5 minutes, more preferably more than 10 minutes and for example below 24 hours, preferably below 1 hour, more preferably the scope below 0.5 hour, select.
On the other hand, if select two stage solidification type resins from active-energy curing type, use UV-lamp (not shown) to varnish 11 irradiation ultraviolet radiations.
Thus, be manufactured on the stacked seal stock 12 in surface of releasing sheet 28.
Compress ional resilience index during 25 ℃ of one of hardness information of seal stock 12 is for example adjusted to that 0.040MPa is above, preferably 0.050MPa is above, more preferably 0.075MPa is above, further preferably 0.100MPa is above and for example 0.145MPa is following, preferred following, more preferably following, the further preferred scope below 0.125MPa of 0.135MPa of 0.140MPa.
5. sealing process S3
In the pressue device 35 of packoff 32, after the S2 of sheet material manufacturing process, according to the condition of being controlled by seal control device 36, implement sealing process S3.
Specifically, in sealing process S3, first prepare to have installed the substrate 14 of optical semiconductor 13.
Substrate 14 is such as selecting in the insulated substrates such as multilayer board from stacked insulation course obtains silicon substrate, ceramic substrate, polyimide resin substrate, metal substrate.
In addition, on the surface of substrate 14, be formed with conductive pattern (not shown), this conductive pattern (not shown) possess electrode (not shown) that the terminal (not shown) for the optical semiconductor 13 with following explanation is electrically connected to and with the continuous wiring of this electrode (not shown).Conductive pattern is such as selecting from the conductors such as gold, copper, silver, nickel.
In addition, the surface of substrate 14 forms flat condition.Or, although also not shown, also can form downward recessed recess on the surface that optical semiconductor 13 will be installed of substrate 14.
The outer shape of substrate 14 does not limit especially, such as observing essentially rectangular shape from overlooking, overlook and observe selection circular shape etc.Suitably select the size of substrate 14, for example from maximum length for example more than 2mm, preferably 10mm is above and for example the scope below 300mm, below preferred 100mm, select.
The LED (light-emitting diode) that optical semiconductor 13 is is luminous energy by transformation of electrical energy, LD (laser diode) etc., for example, select from the short cross-section essentially rectangular shape of thickness specific surface direction length (with the orthogonal directions length of thickness direction quadrature).As optical semiconductor 13, preferably from send the blue led of blue light, select.According to purposes and the object size of selective light semiconductor element 13 suitably, specifically, thickness from for example more than 10 μ m and below 1000 μ m and maximum length for example more than 0.05mm, preferably 0.1mm is above and for example the scope below 5mm, below preferred 2mm, select.
The peak luminous wavelength of optical semiconductor 13 is for example more than 400nm, preferably 430nm is above and for example select the scope below 500nm, below preferred 470nm.
By optical semiconductor 13, for example upside-down mounting is installed to substrate 14 or wire-bonded is connected to substrate 14.
In addition, a plurality of (in Fig. 1 three) optical semiconductor 13 can be installed to a substrate 14.The installation numerical example of the optical semiconductor 13 of each substrate 14 as from more than 1, preferably more than 4 and for example below 2000, preferably the scope below 400, select.
Then, in the method, the substrate 14 that optical semiconductor 13 has been installed is arranged to pressue device 35.
Specifically, when the substrate 14 that optical semiconductor 13 has been installed is arranged to pressue device 35, the substrate 14 that optical semiconductor 13 has been installed is arranged to the flat board 41 of downside.
Then, the seal stock 12 that makes to be layered in the upper surface of releasing sheet 28 reverses up and down, makes the upside of itself and optical semiconductor 13 opposite.That is to say, seal stock 12 is configured to towards optical semiconductor 13.
Then, with seal stock 12, cover optical semiconductor 13.With seal stock 12 embedded light semiconductor elements 13.
Specifically, the pressurized conditions based on being controlled by seal control device 36, covers optical semiconductor 13 with seal stock 12.
Specifically, as shown in the arrow of Fig. 1, make seal stock 12 declines (pressing).In detail, seal stock 12 is pressurized to the substrate 14 that optical semiconductor 13 has been installed.
Thus, with seal stock 12, cover optical semiconductor 13.
That is to say, with seal stock 12 embedded light semiconductor elements 13, and in the situation that seal stock 12 possesses luminescent coating 26 (with reference to Fig. 2), with luminescent coating 26, cover optical semiconductor 13.
In detail, as shown in Fig. 2 A～Fig. 2 E, in the situation that select the layer structure of the luminescent coating 26 of seal stock 12 from contact structures, luminescent coating 26 directly contacts with the surface of optical semiconductor 13 (dummy line of Fig. 2), with luminescent coating 26, covers optical semiconductor 13.That is to say luminescent coating 26 encapsulating optical semiconductor elements 13.In other words, luminescent coating 26 doubles as sealant.
On the other hand, as shown in Fig. 3 F and Fig. 3 G, in the situation that select the layer structure of the luminescent coating 26 of seal stock 12 from isolating construction, luminescent coating 26 is configured to and the upside of optical semiconductor 13 (dummy line of Fig. 3) across resin bed 27 and covering optical semiconductor 13.On the other hand, resin bed 27 directly contacts and covers optical semiconductor 13 with the surface of optical semiconductor 13 (dummy line of Fig. 2).That is to say resin bed 27 encapsulating optical semiconductor elements 13 and form sealant.
Afterwards, if seal stock 12, in the B stage, makes the seal stock 12C stage.
For example, based on, the C heating condition of seal stock 12 in stage that control by seal control device 36, the illuminate condition of active energy beam makes the seal stock 12C stage.
Specifically, select two stage solidification type resins from thermohardening type in the situation that, the seal stock 12 in B stage is heated.
In detail specifically, while maintain the pressurized state of dull and stereotyped 41 pairs of seal stocks 12 and render in dryer.Thus, the seal stock 12 in B stage is heated.
Heating-up temperature is from for example more than 80 ℃, preferably more than 100 ℃ and for example below 200 ℃, preferably select the scope below 180 ℃.In addition, the heat time is from for example more than 10 minutes, preferably more than 30 minutes and for example below 10 hours, preferably select the scope below 5 hours.
By the heating to seal stock 12, make the seal stock 12C stage (completely curing) in B stage.
On the other hand, select two stage solidification type resins from active energy ray curable in the situation that, by seal stock 12 is irradiated to the seal stock 12C stage (completely curing) that active energy beam makes the B stage.Specifically, use seal stock 12 irradiation ultraviolet radiations to the B stage such as UV-lamp.
Thus, produce the optical semiconductor 13 that possesses seal stock 12, seals with seal stock 12 and the optical semiconductor device 20 that the substrate 14 of optical semiconductor 13 has been installed.
In Fig. 1, in an optical semiconductor device 20, be provided with a plurality of (three) optical semiconductor 13.
Afterwards, as shown by arrows, from seal stock 12, peel releasing sheet 28.
In addition, afterwards, in the situation that a plurality of optical semiconductors 13 being installed on to a substrate 14, can also cut off accordingly seal stock 12 and singualtion with each optical semiconductor 13 as required.
6. the manufacture during the accumulation of creating conditions, batch change and each unit
In the manufacture process of the seal stock 12 before this, by the S1 of varnish manufacturing process create conditions and the posting field (not shown) of the 5th storer 10 is recorded and be accumulated to creating conditions of the S2 of sheet material manufacturing process.
That is to say, the 5th storer 10 is input to the 3rd storer 23 by the 3rd information 17, and using the 3rd information 17 as being the 5th information 19 of information in the past and be directly accumulated to the posting field of the 5th storer 10.
And, by this manufacture of seal stock 12, the one CPU8 reads and is accumulated to creating conditions of the S1 of varnish manufacturing process and creating conditions of the S2 of sheet material manufacturing process the 5th storer 10, that manufacture seal stock 12 before this, according to this, creates conditions and decides this creating conditions and this creating conditions of the S2 of sheet material manufacturing process of the S1 of varnish manufacturing process.
In addition, the batch information of at least one and/or the manufacture change of the optical semiconductor device 20 during each unit in particle, curable resin, varnish photoreactive semiconductor element 13.Change accordingly with this, their the 4th information 18 is input to the 4th storer 24 from first information source 21 and the second information source 22, then, the 2nd CPU25 reads the 4th information 18 that the 4th storer 24 is stored, routine processes according to the rules, to the S1 of varnish manufacturing process create conditions and/or creating conditions of the S2 of sheet material manufacturing process revised.
[action effect]
And in this system 1, the determination device 2 of creating conditions possesses first memory 6, second memory 7 and a CPU8, on the other hand, sheet material manufacturing management device 3 possesses the 3rd storer 23 and the 2nd CPU25.
And, the determination device 2 of creating conditions stores respectively each first information 15 and the second information 16 into first memory 6 and second memory 7, by a CPU8, determine creating conditions of the S2 of sheet material manufacturing process, can creating conditions of the Jiang Gai sheet material S2 of manufacturing process offer sheet material manufacturing management device 3.
And, in sheet material manufacturing management device 3, by storing the 3rd storer 23 from the determination device 2 of creating conditions is that provide into the 3rd relevant information 17 of creating conditions, according to above-mentioned the 3rd information 17, by the 2nd CPU25, creating conditions of the S2 of sheet material manufacturing process managed.
Therefore, can in the determination device 2 of creating conditions, determine dividually creating conditions of the S2 of sheet material manufacturing process with sheet material manufacturing management device 3, and can creating conditions by the sheet material manufacturing management device 3 management S2 of sheet material manufacturing process.
In addition, from the determination device 2 of creating conditions three information 17 relevant to creating conditions of the S2 of sheet material manufacturing process that provide based on the first information 15 and the second information 16.Therefore, the 3rd information 17 that sheet material manufacturing management device 3 can be based on providing from the determination device 2 of creating conditions, manages creating conditions of the S2 of sheet material manufacturing process accurately by the 2nd CPU25.Its result, can manufacture the optical semiconductor device 20 that is made as object accurately.
In addition, in this system 1, the second information 16 that the first information 15 that the one CPU8 stores based on first memory 6 and second memory 7 are stored, also determine creating conditions of the S1 of varnish manufacturing process, the 3rd information 17 that the 2nd CPU25 stores based on the 3rd storer 23, also manages creating conditions of the S1 of varnish manufacturing process.Therefore, the seal stock 12 of the optical semiconductor device 20 that is suitable for being made as object can be manufactured accurately, further the optical semiconductor device 20 that is made as object can be manufactured accurately.
And, according to this system 1, the first information 15 comprises the information relevant to the substrate 14 that optical semiconductor 13 is installed, and the determination device 2 of therefore creating conditions also possesses the information relevant with the substrate 14 that optical semiconductor 13 is installed together with the information relevant to optical semiconductor 13 and the information relevant with optical semiconductor device 20.
Therefore, sheet material manufacturing management device 3, according to high-precision three information 17 relevant to creating conditions of the S2 of sheet material manufacturing process determining based on the first information 15, can further be managed creating conditions of the S2 of sheet material manufacturing process accurately.
In addition, in this system 1, in sheet material manufacturing management device 3, the 4th information 18 of the batch information that comprises in particle, curable resin, varnish and optical semiconductor 13 at least one of being stored according to the 4th storer 24 by the 2nd CPU25 and/or the manufacture of the optical semiconductor device 20 during each unit, can revise creating conditions of the S2 of sheet material manufacturing process.Therefore, easily and the change of the manufacture of batch information and/or optical semiconductor device 20 accordingly, to the S1 of varnish manufacturing process create conditions and creating conditions of the S2 of sheet material manufacturing process revised, can manufacture accurately the optical semiconductor device 20 that is made as object.
And according to this system 1, the 5th storer 10 of the determination device 2 of creating conditions can be accumulated and manufacture the 5th information 19 that creating conditions of seal stock 12 is relevant before this.Therefore, can be based on the creating conditions of past accumulation, in this manufacture, be suitable for being made as the seal stock 12 of the optical semiconductor device 20 of object, and can manufacture accurately the optical semiconductor device 20 that is made as object at this.
According to this system 1, the determination device 2 of creating conditions can carry out telecommunication via network and sheet material manufacturing management device 3, therefore even if create conditions, determination device 2 is positioned at long-rangely with respect to sheet material manufacturing management device 3, also the creating conditions of the S2 of sheet material manufacturing process determining promptly can be offered to sheet material manufacturing management device 3 in the determination device 2 of creating conditions.
According to this system 1, even if sheet material manufacturing management device 3 is arranged in the sheet production apparatus 34 of optical semiconductor device manufacturing works 4, the determination device 2 of creating conditions is arranged on the control department 5 that is positioned at far-end with respect to seal stock manufacturing works, also because the determination device 2 of creating conditions is via network and sheet material manufacturing management device 3 telecommunications, and the creating conditions of the S2 of sheet material manufacturing process determining promptly can be offered to sheet material manufacturing management device 3 in the determination device 2 of creating conditions.
This determination device 2 of creating conditions possesses first memory 6, second memory 7 and a CPU8.
Therefore, according to this determination device 2 of creating conditions, can store respectively each first information 15 and the second information 16 into first memory 6 and second memory 7, by a CPU8, determine creating conditions of the S1 of varnish manufacturing process and creating conditions of the S2 of sheet material manufacturing process.
Its result, if based on creating conditions of the above-mentioned varnish S1 of manufacturing process and creating conditions of the S2 of sheet material manufacturing process, can manufacture the optical semiconductor device 20 that is made as object accurately.
In addition, at this, create conditions in determination device 2, the second information 16 that the first information 15 that the 2nd CPU25 stores based on first memory 6 and second memory 7 are stored, also determines creating conditions of the S1 of varnish manufacturing process and creating conditions of the S2 of sheet material manufacturing process.Therefore, the seal stock 12 of the optical semiconductor device 20 that is suitable for being made as object can be manufactured accurately, further the optical semiconductor device 20 that is made as object can be manufactured accurately.
In addition, according to this determination device 2 of creating conditions, the first information 15 comprises the information relevant to the substrate 14 that optical semiconductor 13 is installed, and the determination device 2 of therefore creating conditions can also possess the information relevant with the substrate 14 that optical semiconductor 13 is installed together with the information relevant to optical semiconductor 13 and the information relevant with optical semiconductor device 20.
Therefore, can manufacture accurately the optical semiconductor device 20 that is made as object.
According to this determination device 2 of creating conditions, can accumulate and before this, manufacture the 5th information 19 that creating conditions of seal stock 12 is relevant.Therefore, can be based on the creating conditions of past accumulation, in this manufacture, be suitable for being made as the seal stock 12 of the optical semiconductor device 20 of object, further can manufacture accurately the optical semiconductor device 20 that is made as object at this.
According to this sheet material manufacturing management device 3, can relevant to the S1 of varnish manufacturing process create conditions and three information 17 of creating conditions relevant with creating conditions of the S2 of sheet material manufacturing process stores the 3rd storer 23 into will be comprised, based on above-mentioned the 3rd information 17, by the 2nd CPU25, manage accurately relevant to the S1 of varnish manufacturing process creating conditions and the creating conditions of the S2 of sheet material manufacturing process.
Therefore, can manufacture accurately the optical semiconductor device 20 that is made as object.
In addition, according to this sheet material manufacturing management device 3, the 3rd information 17 that the 2nd CPU25 stores based on the 3rd storer 23, also management is relevant to the S1 of varnish manufacturing process creates conditions and the creating conditions of the S2 of sheet material manufacturing process, therefore the seal stock 12 of the optical semiconductor device 20 that is suitable for being made as object can be manufactured accurately, further the optical semiconductor device 20 that is made as object can be manufactured accurately.
In addition, in this sheet material manufacturing management device 3, the 4th information 18 of the batch information that comprises in particle, curable resin, varnish and optical semiconductor 13 at least one of being stored based on the 4th storer 24 by the 2nd CPU25 and/or the manufacture of the optical semiconductor device 20 during each unit, can the Dui Yu varnish S1 of manufacturing process relevant create conditions and creating conditions of the S2 of sheet material manufacturing process revised.Therefore, can be easily and the change of the manufacture of batch information and/or optical semiconductor device 20 accordingly, the Dui Yu varnish S1 of manufacturing process is relevant creates conditions and creating conditions of the S2 of sheet material manufacturing process revised, and can manufacture accurately the optical semiconductor device 20 that is made as object.
[variation]
In explanation after Fig. 4, to the additional identical reference marker of the parts identical with Fig. 1, description is omitted.
In the embodiment of Fig. 1, the determination device 2 of creating conditions has man-to-man relation with sheet material manufacturing management device 3,, the determination device 2 of creating conditions is arranged to a sheet material manufacturing management device 3 that is.But the corresponding relation of create conditions determination device 2 and sheet material manufacturing management device 3 is not limited thereto, example as shown in Figure 4, can also arrange a plurality of sheet material manufacturing management devices 3 to the determination device 2 of creating conditions.
Specifically, in a plurality of optical semiconductor device manufacturing works 4 of separate setting, be provided with sheet material manufacturing management device 3 in separately.Create conditions determination device 2 and a plurality of sheet material manufacturing management device 3 is configured to the first information source 21 that can have respectively from a plurality of sheet material manufacturing management devices 3 a plurality of first information 15 is input to first memory 6, and the 3rd information 17 being determined by a CPU8 can be input to a plurality of the 3rd storeies 23 from the 5th storer 10.
In the embodiment of Fig. 4,2 couples one the sheet material manufacturing management device 3A of determination device (3) that creates conditions provides the 3rd information 17, and obtain the first information 15 and store first memory 6 into from the first information source 21 of a sheet material manufacturing management device 3A (3), with the 5th storer 10 these first information 15 of accumulation, and, can also provide the 3rd information 17 to other sheet material manufacturing management device 3B (or other a plurality of sheet material manufacturing management device 3B and 3C) (3).
That is to say, a plurality of first information 15 that determination device 2 of creating conditions can make to provide from a plurality of sheet material manufacturing management devices 3 (will store into the first information 15 of first memory 6, specifically the information relevant to optical semiconductor 13, the information relevant with substrate 14, the information relevant with optical semiconductor device 20) are unified.That is, the determination device 2 of creating conditions can be as can collecting the first information 15 of a plurality of sheet material manufacturing management devices 3 and providing the integrated type of three information 17 corresponding with them create conditions determination device 2 and performance function to a plurality of sheet material manufacturing management devices 3.
Therefore,, although be the determination device 2 of creating conditions, can provide high-precision the 3rd information 17 to each sheet material manufacturing management device 3.
In addition, in the embodiment of Fig. 1, the manufacturing process of 1 couple of S1 of varnish manufacturing process of system determines and manages.That is to say, by sheet material manufacturing management device 3, manage creating conditions of the S1 of varnish manufacturing process.But the manufacturing process that system 1 can also be configured to the system 1 Bu Dui varnish S1 of manufacturing process determines and manages.Specifically, can also only manage creating conditions of the S2 of sheet material manufacturing process regardless of putting creating conditions of the S1 of manufacturing process of paint in order.
Therefore according to this embodiment, the 2nd CPU25 does not need to manage creating conditions of the S1 of varnish manufacturing process, can make that the 2nd CPU25's is simple in structure.
In addition, in the embodiment of Fig. 1, as manufacturing management device of the present invention, make creating conditions of the sheet material manufacturing management device 3 management S2 of sheet material manufacturing process, the air-proof condition of seal control device 36 management sealing process S3, but, can also be for example that sheet material manufacturing management device 3 doubles as seal control device 36 and forms a manufacturing management device, the management S2 of sheet material manufacturing process creates conditions and the air-proof condition of sealing process S3.
In addition, in the embodiment of Fig. 2 and Fig. 3, the seal stock 12 that cover sheets of the present invention is made as to encapsulating optical semiconductor element 13 is illustrated, but be not limited thereto, example as shown in Figure 5, can also be chosen as in the upper stacked cover sheets 60 (with reference to arrow and Fig. 5 B of Fig. 5 A) of the resin bed of encapsulating optical semiconductor element 13 (sealant) 27 (with reference to Fig. 5 A) in advance.
In Fig. 5 A, cover sheets 60 is selected from the identical material of the seal stock 12 with Fig. 1.
In Fig. 5 B, cover sheets 60 covers the upside of optical semiconductors 13, specifically, and across resin bed 27 and in the upside devices spaced apart configuration of optical semiconductor 13.
And, in the embodiment of Fig. 2 and Fig. 3, seal stock 12 is chosen as to fluorophor sheet material (containing the seal stock of fluorophor), still, although for example not shown, seal stock 12 can also be chosen as to the seal stock 12 that does not contain sealant (resin bed) containing fluorophor.
In addition, in the explanation of Fig. 1, the first information 15 comprises the information relevant to the substrate 14 that optical semiconductor 13 is installed, but also can containing this information ground, not form the first information 15.
In addition, as the embodiment of illustration of the present invention and foregoing invention is provided, but this is only illustration, can not limit and make an explanation.In claims described later, comprise the known variation of the present invention of those skilled in the art.
utilizability in industry
System, create conditions determination device and manufacturing management device are for the manufacture of the cover sheets that is suitable for optical semiconductor device.
description of reference numerals
1: system; 2: the determination device of creating conditions; 3: sheet material manufacturing management device; 5: control department; 6: first memory; 8: the CPU; 11: varnish; 12: seal stock; 13: optical semiconductor; 14: substrate; 15 first information; 16: the second information; 17: the three information; 20: optical semiconductor device; 23: the three storeies; 24: the four storeies; 34: sheet production apparatus; 60: cover sheets; S1: varnish manufacturing process; S2: sheet material manufacturing process; S3: sealing process.

Claims (6)

1. the system of creating conditions and determining and managing to the sheet material manufacturing process in the manufacture method of optical semiconductor device, the manufacture method of this optical semiconductor device possesses: varnish manufacturing process, manufactures the varnish that comprises particle and curable resin; Above-mentioned sheet material manufacturing process, manufactures the cover sheets in B stage from above-mentioned varnish; And covering process, by above-mentioned cover sheets, cover optical semiconductor, the system is characterized in that,
Said system possesses the determination device of creating conditions and manufacturing management device,
The above-mentioned determination device of creating conditions possesses:
First information storage area, the first information that its storage is relevant with above-mentioned optical semiconductor device to above-mentioned optical semiconductor;
The second information storage area, the second information that its storage is relevant to above-mentioned varnish; And
Determining means, above-mentioned the second information that store the above-mentioned first information that it is stored according to above-mentioned first information storage area and above-mentioned the second information storage area decides above-mentioned creating conditions,
Above-mentioned manufacturing management device possesses:
The 3rd information storage area, its storage and above-mentioned the 3rd relevant information of creating conditions being determined by above-mentioned determining means; And
Administrative unit, its above-mentioned the 3rd information of storing according to above-mentioned the 3rd information storage area is managed above-mentioned the creating conditions of above-mentioned sheet material manufacturing process,
The above-mentioned determination device of creating conditions carries out telecommunication via network and above-mentioned manufacturing management device.
2. system according to claim 1, is characterized in that,
Above-mentioned manufacturing management device is arranged in sheet production apparatus,
The above-mentioned determination device of creating conditions is arranged at the control department that is positioned at far-end with respect to above-mentioned manufacturing management device.
3. system according to claim 1, is characterized in that,
Said system also determines and manages creating conditions of above-mentioned varnish manufacturing process,
Above-mentioned the second information that store the above-mentioned first information that above-mentioned determining means is also stored according to above-mentioned first information storage area and above-mentioned the second information storage area decides above-mentioned the creating conditions of above-mentioned varnish manufacturing process,
Above-mentioned the 3rd information that above-mentioned administrative unit is also stored according to above-mentioned the 3rd information storage area manages above-mentioned the creating conditions of above-mentioned varnish manufacturing process.
4. system according to claim 1, is characterized in that,
The above-mentioned first information comprises the information relevant to the substrate that above-mentioned optical semiconductor is installed.
5. system according to claim 1, is characterized in that,
Above-mentioned manufacturing management device also possesses:
The 4th information storage area, it stores the 4th information, and the 4th packets of information is containing the batch information of at least one and/or the manufacture of the optical semiconductor device during per unit in particle, curable resin, varnish and optical semiconductor; And
Amending unit, its above-mentioned the 4th information of storing according to above-mentioned the 4th information storage area is revised above-mentioned the creating conditions of above-mentioned sheet material manufacturing process.
6. system according to claim 1, is characterized in that,
The above-mentioned determination device of creating conditions also possesses the 5th information storage area, and the 5th information storage area storage manufactures to this 5th information that creating conditions of above-mentioned cover sheets is relevant before,
Above-mentioned the 5th information that the above-mentioned determination device of creating conditions is stored according to above-mentioned the 5th information storage area decides for this manufactures creating conditions of above-mentioned cover sheets.
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Application publication date: 20141119