CN104076760A - Remote control system, central control device, client and information acquisition device - Google Patents

Remote control system, central control device, client and information acquisition device Download PDF

Info

Publication number
CN104076760A
CN104076760A CN201310693566.2A CN201310693566A CN104076760A CN 104076760 A CN104076760 A CN 104076760A CN 201310693566 A CN201310693566 A CN 201310693566A CN 104076760 A CN104076760 A CN 104076760A
Authority
CN
China
Prior art keywords
information
sheet material
manufacturing process
control unit
varnish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310693566.2A
Other languages
Chinese (zh)
Inventor
伊藤久贵
二宫明人
大薮恭也
梅谷荣弘
松田广和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN104076760A publication Critical patent/CN104076760A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4093—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36307—Table with workpiece features and corresponding machining parameters, methods
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

The invention provides a remote control system, a central control device, a client and an information acquisition device. The remote control system for sheet manufacturing procedures is characterized in that the remote control system is provided with the central control device and a client device arranged at a different plate. The central control device is provided with a first information receive and transmit unit and an information generation unit. The client device is provided with a second information receive and transmit unit and a sheet manufacturing control unit. The first information receive and transmit unit is remotely connected to the second information receive and transmit unit through a network. The central control device generates third information related to sheet manufacturing conditions through the information generation unit based on first information related to optical semiconductor elements and optical semiconductor element devices and second information relates to varnish which are received by the first information receive and transmit unit. The third information is transmitted to the client device through the internet by the first information receive and transmit unit. The client device receives the third information through the second information receive and transmit unit. Manufacturing conditions for sheet manufacturing procedures are controlled through the sheet manufacturing control unit and based on the third information.

Description

Tele-control system and central control unit, client and information collecting device
Technical field
The present invention relates to a kind ofly by varnish, be made for the manufacture of the tele-control system of sheet material manufacturing process of sheet material with the semiconductor device of semiconductor element.
Background technology
In recent years, as the manufacture method of optical semiconductor device, studying following methods: manufacture the varnish comprise particle and curable resin, from this varnish, manufacture the cover sheets of the seal stock etc. in B stage, with this cover sheets covering optical semiconductor.
For example, following methods has been proposed: the luminescent coating that utilizes the thermoset resin by the B stage to form covers the light emitting diode that is installed on substrate, makes afterwards the luminescent coating C stage, manufactures thus LED matrix (for example, the following patent documentation 1 of reference).
Patent documentation 1: TOHKEMY 2009-060031 communique
Summary of the invention
The problem that invention will solve
Yet, in seal stock manufacturing works, manufacture the seal stock that comprises luminescent coating, therefore the seal stock shipment producing is arrived to LED matrix manufacturing works.In addition, in seal stock manufacturing works, from LED matrix manufacturing works, provide the information relevant to light emitting diode and LED matrix, based on this information and the information relevant to varnish, generate the creating conditions of seal stock of the LED matrix be suitable for being made as object.
Yet, the in the situation that of LED matrix manufacturing works semiconductor element and/or optical semiconductor device change, in seal stock manufacturing works, need to again manufacture accordingly seal stock with these changes, or further different types of seal stock of again manufacturing is transported to LED matrix manufacturing works.Therefore, there is cost time, this problem of time.
On the other hand, also consider seal stock manufacturing works are set in LED matrix manufacturing works, thereby omit described time, time.
Yet LED matrix manufacturing works exist the information relevant to varnish insufficient and cannot generate exactly this problem of creating conditions of seal stock.
The object of the present invention is to provide a kind of manufacturing works at optical semiconductor device can manufacture tele-control system and its central control unit, client terminal device and the information collecting device of the sheet material manufacturing process of the cover sheets that is suitable for optical semiconductor device simple and reliablely.
For the scheme of dealing with problems
In order to achieve the above object, the invention provides the tele-control system of a kind of sheet material manufacturing process, described sheet material is made by varnish, and for the manufacture of the semiconductor device with semiconductor element, it is characterized in that,
Described tele-control system comprises central control unit and the client terminal device arranging with described central control unit strange land,
Described central control unit has first information Transmit-Receive Unit and information generating unit,
Described client terminal device has the second information transmit-receive unit and sheet material production control unit,
The described first information Transmit-Receive Unit of described central control unit is connected by network remote with the second information transmit-receive unit of described client terminal device,
To optical semiconductor photoreactive semiconductor device relevant 1st information of described central control unit based on receiving with described first information Transmit-Receive Unit and 2nd information relevant with described varnish, by described information generating unit, generate and sheet material the 3rd relevant information of creating conditions, and by network, described the 3rd information is sent to described client terminal device with described first information Transmit-Receive Unit, described client terminal device receives described the 3rd information with described the second information transmit-receive unit, and creating conditions of described sheet material manufacturing process controlled according to described the 3rd information by described sheet material production control unit.
Preferably also comprise information collecting device, described central control unit is connected by network with described information collecting device,
Described information collecting device has the 3rd information transmit-receive unit,
Described information collecting device receives described the 1st information and the 2nd information by described the 3rd information transmit-receive unit, and by network, described the 1st information and described the 2nd information is sent to described central control unit with described the 3rd information transmit-receive unit.
Preferred described information collecting device comprises the 1st information collecting device and the 2nd information collecting device that is respectively used to accept described the 1st information and described the 2nd information.
Preferred described central control unit have storage described the 1st information the 1st information memory cell and for storing the 2nd information memory cell of described the 2nd information, described information generating unit reads described the 1st information and described the 2nd information from described the 1st information memory cell and described the 2nd information memory cell, described client terminal device has the 3rd information memory cell of described the 3rd information of storage, and described sheet material production control unit reads described the 3rd information from described the 3rd information memory cell.
Preferred described client terminal device also receives and comprises in varnish, varnish in contained particle, varnish the batch information of at least one in contained curable resin, semiconductor element, and/or the 4th information of semiconductor device manufacture information during unit, and according to described the 4th information, creating conditions of described sheet material manufacturing process carried out to Correction and Control.
Preferred described central control unit also based on to the 5th relevant Information generation and this sheet material the 3rd relevant information of creating conditions of creating conditions of the sheet material before this, and described and this sheet material the 3rd relevant information of creating conditions is sent to described client terminal device,
Described client terminal device is controlled creating conditions of described sheet material manufacturing process according to described and this sheet material the 3rd relevant information of creating conditions.
Preferred described client terminal device has the 4th information memory cell of described the 4th information of storage, and described sheet material production control unit reads the 4th information from described the 4th information memory cell.
Preferred described central control unit has the 5th information memory cell of described the 5th information of storage, and described information generating unit reads the 5th information from described the 5th information memory cell.
Preferably described and sheet material the 3rd relevant information of creating conditions further comprises the information relevant with creating conditions of varnish manufacturing process, and described sheet material production control unit is further controlled creating conditions of described varnish manufacturing process according to described the 3rd information.
The present invention also provides the central control unit in a kind of sheet material manufacturing process tele-control system, and described sheet material is made by varnish, and for the manufacture of the semiconductor device with semiconductor element, it is characterized in that, described central control unit comprises:
First information Transmit-Receive Unit, for receive 1st information relevant to optical semiconductor photoreactive semiconductor device and 2nd information relevant with described varnish by network, and
Information generating unit, is connected with described first information Transmit-Receive Unit, for the 3rd relevant information of creating conditions based on described the 1st information and the 2nd Information generation and sheet material, and sends described the 3rd information by described first information Transmit-Receive Unit.
Preferred described information generating unit be also configured to based on to the 5th relevant Information generation and this sheet material the 3rd relevant information of creating conditions of creating conditions of the sheet material before this, and by described first information Transmit-Receive Unit transmission and this sheet material the 3rd relevant information of creating conditions.
Preferred described central control unit has the 5th information memory cell of described the 5th information of storage, and described information generating unit reads the 5th information from described the 5th information memory cell.
Preferred described central control unit has the 1st information memory cell of described the 1st information of storage and for storing the 2nd information memory cell of described the 2nd information, described information generating unit reads described the 1st information and described the 2nd information from described the 1st information memory cell and described the 2nd information memory cell.
The present invention also provides the client terminal device in a kind of sheet material manufacturing process tele-control system, and described sheet material is made by varnish, and for the manufacture of the semiconductor device with semiconductor element, it is characterized in that, described client terminal device comprises:
The second information transmit-receive unit, for being connected with the central control unit of described sheet material manufacturing process tele-control system, receives and sheet material the 3rd relevant information of creating conditions, and
Sheet material production control unit, is connected with described the second information transmit-receive unit, for according to by described the second information transmit-receive unit, received to sheet material the 3rd relevant information of creating conditions, creating conditions of described sheet material manufacturing process controlled.
Preferred described client terminal device have storage described to the create conditions information memory cell of the 3rd relevant information of sheet material.
Preferably described the second information transmit-receive unit is also set to receive and comprises in varnish, varnish in contained particle, varnish the batch information of at least one in contained curable resin, semiconductor element, and/or the 4th information of semiconductor device manufacture information during unit, and
Described sheet material production control unit is also configured to, according to described the 4th information, creating conditions of described sheet material manufacturing process carried out to Correction and Control.
Preferred described client terminal device has the 4th information memory cell of storage the 4th information, and described sheet material production control unit reads the 4th information from described the 4th information memory cell.
The present invention also provides the information collecting device in a kind of sheet material manufacturing process tele-control system, and described sheet material is made by varnish, and for the manufacture of the semiconductor device with semiconductor element, it is characterized in that, described information collecting device comprises:
Information receiving unit, for receiving 1st information relevant to optical semiconductor photoreactive semiconductor device and 2nd information relevant with described varnish, and
Information transmitting unit, is connected with the central control unit in described information receiving unit and described sheet material manufacturing process tele-control system, for described the 1st information and the 2nd information that described information receiving unit is received, is sent to described central control unit.
The tele-control system of sheet material of the present invention manufacturing process be possess manufacture the varnish that comprises particle and curable resin varnish manufacturing process, from described varnish manufacture the B stage cover sheets sheet material manufacturing process and with the tele-control system of the described sheet material manufacturing process the manufacture method of the optical semiconductor device of the covering process of described cover sheets covering optical semiconductor.
In this system, preferably central control unit possesses the 1st information transmit-receive unit, the 1st information memory cell, the 2nd information memory cell and information generating unit, on the other hand, the client terminal device that is arranged at the position different from central control unit (strange land arrange position) possesses the 2nd information transmit-receive unit, the 3rd information memory cell and sheet material production control unit.
And, in central control unit, the 1st information transmit-receive unit receives 1st information relevant to optical semiconductor photoreactive semiconductor device and 2nd information relevant with described varnish, store respectively each the 1st information and the 2nd information into the 1st information memory cell and the 2nd information memory cell, by information generating unit, generate creating conditions of sheet material manufacturing process, can creating conditions of Jiang Gai sheet material manufacturing process offer client terminal device.
And, in client terminal device, with the 2nd information transmit-receive unit receive from central control unit, provide to the 3rd relevant information of creating conditions, store the 3rd information into the 3rd information memory cell, based on described the 3rd information, with creating conditions of sheet material production control unit controls sheet material manufacturing process.
Therefore, can in central control unit, determine dividually creating conditions of sheet material manufacturing process with client terminal device, and client terminal device can be controlled creating conditions of sheet material manufacturing process.
In addition, 3rd information relevant to creating conditions of sheet material manufacturing process providing from central control unit is based on the 1st information and the 2nd information.Therefore, 3rd information of client terminal device based on providing from central control unit, with sheet material production control unit, can control creating conditions of sheet material manufacturing process accurately.Its result, can manufacture the optical semiconductor device that is made as object accurately.
In addition, system of the present invention is preferably gone back creating conditions of varnish manufacturing process described in Generation and control, described the 2nd information that described the 1st information that described information generating unit is stored based on described the 1st information memory cell and described the 2nd information memory cell are stored, also generate described varnish manufacturing process described in create conditions, described the 3rd information that described sheet material production control unit is stored based on described the 3rd information memory cell, also control described varnish manufacturing process described in create conditions.
In this system, the 2nd information that the 1st information that information generating unit is stored based on the 1st information memory cell and the 2nd information memory cell are stored, also generate creating conditions of varnish manufacturing process, the 3rd information that sheet material production control unit is stored based on the 3rd information memory cell is also controlled creating conditions of varnish manufacturing process.Therefore, can manufacture accurately the cover sheets of the optical semiconductor device that is suitable for being made as object, and can manufacture accurately the optical semiconductor device that is made as object.
In addition, in system of the present invention, the 1st information preferably comprises the information relevant to the substrate that optical semiconductor is installed.
According to this system, the 1st packets of information is containing the relevant information of the substrate to optical semiconductor is installed, so central control unit also possesses the information relevant with the substrate that optical semiconductor is installed together to described each information.
Therefore, based on to based on relevant high-precision the 3rd information of creating conditions of the 1st Information generation, client terminal device can further be controlled creating conditions of sheet material manufacturing process accurately.
In addition, in system of the present invention, described client terminal device preferably possesses: the 4th information memory cell, in its storage particle, curable resin, varnish photoreactive semiconductor element the batch information of at least one and/or comprise each unit during the 4th information of manufacture of optical semiconductor device; And as the amending unit of sheet material production control unit, described the 4th information that it is stored based on described the 4th information memory cell, revises creating conditions described in described sheet material manufacturing process.
The batch information of particle, curable resin, varnish photoreactive semiconductor element is according to each batch and change.In addition, the manufacture of the optical semiconductor device during each unit according to each unit during and change.Therefore, the physical property of the optical semiconductor device of manufacturing sometimes according to each batch and/or each unit during and change.In this case, central control unit generates based on the 4th information that to create conditions be miscellaneous at every turn.
But, in this system, in client terminal device, the 4th information of the manufacture of the optical semiconductor device during being used as in particle that the amending unit of sheet material production control unit stores based on the 4th information memory cell, curable resin, varnish photoreactive semiconductor element the batch information of at least one and/or comprising each unit, can revise creating conditions of sheet material manufacturing process.Therefore, easily and the change of the manufacture of batch information and/or optical semiconductor device revise accordingly creating conditions of sheet material manufacturing process, can manufacture accurately the optical semiconductor device that is made as object.
In addition, in system of the present invention, preferred described central control unit possesses the 5th information memory cell of storage the 5th information, the 5th information is to manufacture creating conditions of described cover sheets before this relevant, described the 5th information of storing based on described the 5th information memory cell, generates for this and manufactures creating conditions of described cover sheets.
According to this system, central control unit can be accumulated and before this, be manufactured the 5th information that creating conditions of cover sheets is relevant.Therefore,, based on creating conditions of past accumulation, can be suitable for being made as in this manufacture the cover sheets of the optical semiconductor device of object, and can manufacture accurately the optical semiconductor device that is made as object at this.
Central control unit of the present invention be possess manufacture the varnish comprise particle and curable resin varnish manufacturing process, from described varnish manufacture the B stage cover sheets sheet material manufacturing process and with the manufacture method of the optical semiconductor device of the covering process of described cover sheets covering optical semiconductor, for generating the central control unit of creating conditions of described sheet material manufacturing process, preferably possess: the 1st information transmit-receive unit; The 1st information memory cell, the 1st information that its storage is relevant to described optical semiconductor; The 2nd information memory cell, the 2nd information that its storage is relevant to described varnish; And information generating unit, create conditions described in described the 2nd Information generation that described the 1st information that it is stored based on described the 1st information memory cell and described the 2nd information memory cell are stored.
This central control unit possesses the 1st information transmit-receive unit, the 1st information memory cell, the 2nd information memory cell and information generating unit.
Therefore, according to this central control unit, the 1st information transmit-receive unit receives 1st information relevant to optical semiconductor photoreactive semiconductor device and 2nd information relevant with described varnish, store respectively each the 1st information and the 2nd information into the 1st information memory cell and the 2nd information memory cell, can enough information generating unit generate creating conditions of sheet material manufacturing process.
Its result, according to creating conditions of described sheet material manufacturing process, can manufacture the optical semiconductor device that is made as object accurately.
In addition, preferred central control unit of the present invention also generates creating conditions of described varnish manufacturing process, described the 2nd information that described the 1st information that described information generating unit is stored based on described the 1st information memory cell and described the 2nd information memory cell are stored also generate described varnish manufacturing process described in create conditions.
In this central control unit, the 2nd information that the 1st information that information generating unit is stored based on the 1st information memory cell and the 2nd information memory cell are stored also generates creating conditions of varnish manufacturing process.Therefore, can manufacture accurately the cover sheets of the optical semiconductor device that is suitable for being made as object, and can manufacture accurately the optical semiconductor device that is made as object.
In addition, in central control unit of the present invention, described the 1st information preferably comprises the information relevant to the substrate that described optical semiconductor is installed.
According to this central control unit, the 1st packets of information is containing the relevant information of the substrate to optical semiconductor is installed, so central control unit can also possess the information relevant with the substrate that optical semiconductor is installed together to described each information.
Therefore, can manufacture accurately the optical semiconductor device that is made as object.
In addition, preferred central control unit of the present invention possesses the 5th information memory cell, the 5th information memory cell storage manufactures to this 5th information that creating conditions of described cover sheets is relevant before, described the 5th information of storing based on described the 5th information memory cell, generates for this and manufactures creating conditions of described cover sheets.
According to this central control unit, can accumulate and before this, manufacture the 5th information that creating conditions of cover sheets is relevant.Therefore,, based on creating conditions of past accumulation, can be suitable for being made as in this manufacture the cover sheets of the optical semiconductor device of object, and can manufacture accurately the optical semiconductor device that is made as object at this.
Client terminal device of the present invention be possess manufacture the varnish comprise particle and curable resin varnish manufacturing process, from described varnish manufacture the B stage cover sheets sheet material manufacturing process and with the manufacture method of the optical semiconductor device of the covering process of described cover sheets covering optical semiconductor, for controlling the client terminal device of creating conditions of described sheet material manufacturing process, preferably possess: the 2nd information transmit-receive unit; The 3rd information memory cell, its storage with described in the 3rd relevant information of creating conditions; And sheet material production control unit, described the 3rd information that it is stored based on described the 3rd information memory cell, control described sheet material manufacturing process described in create conditions.
According to this client terminal device, with the 2nd information transmit-receive unit receive from central control unit, provide to the 3rd relevant information of creating conditions, the 3rd relevant information of creating conditions of Jiang Yu sheet material manufacturing process stores the 3rd information memory cell into, based on described the 3rd information, with sheet material production control unit, can control accurately creating conditions of sheet material manufacturing process.
Therefore, can manufacture accurately the optical semiconductor device that is made as object.
In addition, preferred client terminal device of the present invention is also controlled creating conditions of described varnish manufacturing process, described the 3rd information that described sheet material production control unit is stored based on described the 3rd information memory cell, also control described varnish manufacturing process described in create conditions.
According to this client terminal device, the 3rd information that sheet material production control unit is stored based on the 3rd information memory cell, also control creating conditions of varnish manufacturing process, therefore the cover sheets of the optical semiconductor device that is suitable for being made as object can be manufactured accurately, and the optical semiconductor device that is made as object can be manufactured accurately.
In addition, client terminal device of the present invention preferably possesses: the 4th information memory cell, it stores the 4th information, and the 4th packets of information is containing the batch information of at least one and/or the manufacture of the optical semiconductor device during each unit in particle, curable resin, varnish photoreactive semiconductor element; And as the amending unit of sheet material production control unit, described the 4th information that it is stored based on described the 4th information memory cell, revises creating conditions described in described sheet material manufacturing process.
The batch information of particle, curable resin, varnish photoreactive semiconductor element is according to each batch and change.In addition, the manufacture of the optical semiconductor device during each unit according to each unit during and change.Therefore, the physical property of the optical semiconductor device of manufacturing sometimes according to each batch and/or unit during and change.In this case, according to the 4th Information generation, to create conditions be miscellaneous to central control unit at every turn.
But, in this client terminal device, be used as the amending unit of sheet material production control unit, in the particle of storing based on the 4th information memory cell, curable resin, varnish photoreactive semiconductor element, the 4th information of the manufacture of the batch information of at least one and/or the optical semiconductor device during each unit, can revise creating conditions of sheet material manufacturing process.Therefore, easily with the change of the manufacture of batch information and/or optical semiconductor device accordingly, correction sheet material manufacturing process creates conditions, and can manufacture accurately the optical semiconductor device that is made as object.
The effect of invention
According to the system of the present invention that possesses central control unit of the present invention and client terminal device, can in central control unit, generate and create conditions dividually with client terminal device, and client terminal device can be controlled and creates conditions.In addition, can manufacture accurately the optical semiconductor device that is made as object.
Accompanying drawing explanation
Fig. 1 illustrates the Sketch figure of an embodiment of system of the present invention.
Fig. 2 A～Fig. 2 E is the amplification sectional view of the seal stock shown in Fig. 1, Fig. 2 A illustrates the seal stock only consisting of luminescent coating, Fig. 2 B illustrates the seal stock that possesses a plurality of luminescent coatings that the concentration of fluorophor is different, Fig. 2 C illustrates possesses the seal stock that has the resin bed of the recess of opening downwards and be filled into the luminescent coating of recess, Fig. 2 D illustrates possesses the cross section roughly luminescent coating of trapezoidal shape and the seal stock that is formed at its resin bed around, Fig. 2 E illustrates the seal stock that possesses the luminescent coating of cross section essentially rectangular shape and be formed at its resin bed around.
Fig. 3 F～Fig. 3 G is the amplification sectional view of the seal stock shown in Fig. 1, Fig. 3 F illustrates the seal stock of luminescent coating that possesses resin bed, is formed at the upside of resin bed, Fig. 3 G illustrate possess resin bed, be formed at resin bed upside luminescent coating and at the downside of resin bed the seal stock with the functional layer of surrounding the mode of the part that is used to form optical semiconductor and forming.
Fig. 4 illustrates the Sketch figure of system of the variation of Fig. 1.
Fig. 5 A～Fig. 5 B is the amplification sectional view of variation of the seal stock of Fig. 2 A, and Fig. 5 A illustrates the state that cover sheets is configured in relatively to the upside of the sealant that covers optical semiconductor, and Fig. 5 B illustrates the state that cover sheets is laminated to the upper surface of sealant.
Description of reference numerals
1: system; 2: central control unit; 3: sheet material production control device (client terminal device); 6: the 1 storeies; 8: the 1CPU; 11: varnish; 12: seal stock; 13: optical semiconductor; 14: substrate; 15: the 1 information; 16: the 2 information; 17: the 3 information; 20: optical semiconductor device; 23: the 3 storeies; 24: the 4 storeies; 60: cover sheets; S1: varnish manufacturing process; S2: sheet material manufacturing process; S3: sealing process.
Embodiment
[structure of system]
System 1 as an embodiment of the invention is the system that is arranged at 5 photoreactive semiconductor device manufacturing works 4 of control department, and wherein, these optical semiconductor device manufacturing works 4 are arranged at the position different from this control department 5 (position that strange land arranges).By network, control department 5 is connected from each device in being arranged at the optical semiconductor device manufacturing works 4 of different position (strange land arrange position), sheet material manufacturing process is carried out to Long-distance Control.
System 1 Generation and control possesses creating conditions of the S1He of the varnish manufacturing process sheet material S2 of manufacturing process in the manufacture method of optical semiconductor device 20 of the S1 of varnish manufacturing process, the S2 of sheet material manufacturing process and sealing process S3 (example of covering process), wherein, in the Gai varnish S1 of manufacturing process, the varnish 11 that manufacture comprises particle and curable resin, in the Gai sheet material S2 of manufacturing process, the seal stock 12 of manufacturing as the cover sheets in B stage from varnish 11, in sealing operation S3 (example of covering process), with seal stock 12 encapsulating optical semiconductor elements 13.System 1 possesses central control unit 2 and as the sheet material production control device 3 of client terminal device.
Control department 5 possesses central control unit 2.
Central control unit 2 possesses the 1st information transmit-receive unit 37, as the 1st storer 6 of the 1st information memory cell, as the 2nd storer 7 of the 2nd information memory cell, as the 1CPU8 of information generating unit and as the 5th storer 10 of the 5th information memory cell.
The 1st storer 6 storage optical semiconductors 13, the substrate 14 that optical semiconductor 13 is installed and 1st information 15 relevant to optical semiconductor device 20.
As the 1st information 15, specifically as the information relevant to optical semiconductor 13, such as enumerating the shape of optical semiconductor 13, the peak luminous wavelength of the size of optical semiconductor 13, optical semiconductor 13, the installation number of the installation number of the optical semiconductor 13 of each unit area of substrate 14 and the optical semiconductor 13 of each substrate 14 etc.
In addition, as the 1st information 15, specifically as the information relevant to substrate 14, such as the surface configuration (whether having recess etc.) etc. that can enumerate the outer shape of substrate 14, the size of substrate 14 and substrate 14.
And, as the 1st information 15, specifically as the information relevant to optical semiconductor device 20, such as the light distribution characteristic etc. that can enumerate the colour temperature of optical semiconductor device 20, the total light flux of optical semiconductor device 20 and optical semiconductor device 20.Specifically, in the situation that be made as the color of the light of target, be natural light, target colour temperature is for example more than 4600K and for example for below 5500K.In addition, in the situation that be made as the color of the light of target, be white, target colour temperature is for example more than 3250K and for example for below 3800K.Select target colour temperature from said temperature scope.
Central control unit 2 is connected by network with the 1st information collecting device 21, is configured to the 1st information collecting device 21 input the 1st information 15 that have from optical semiconductor device manufacturing works 4.
The 2nd storer 7 storage 2nd information 16 relevant to varnish 11.
As the 2nd information 16, specifically as the information relevant to particle, such as enumerating the kind of particle, the mean value of the maximum length of the blending ratio of particle, particle (being mean grain size in the situation that particle is ball shape) etc.In addition,, in the situation that particle comprises fluorophor described later, as the information relevant to particle, also can enumerate the absorption peak wavelength of fluorophor.In addition, as the 2nd information 16, specifically as the information relevant to curable resin, such as enumerating the kind of curable resin, the blending ratio of the viscosity of curable resin, curable resin and the curing rate of curable resin etc.And, as the 2nd information 16, specifically as the information relevant to varnish, for example, can enumerate the viscosity of varnish.In addition, as the 2nd information 16, in the situation that releasing sheet 28 (aftermentioned) is provided with telltale mark (not shown), also can enumerate the relative position information of a plurality of varnish 11 after coating etc.
Central control unit 2 is connected by network with the 2nd information collecting device 22, is configured to the 2nd information collecting device 22 input the 2nd information 16 that have from optical semiconductor device manufacturing works 4.
In addition, control department 5 for example can also be arranged in the seal stock manufacturing works that can manufacture the seal stock 12 that seal stock 12 that the sheet production apparatus 34 (aftermentioned) of Yu Yong optical semiconductor device manufacturing works 4 manufactures is identical.Be configured to the 2nd information collecting device 22 input the 2nd information 16 that have from the control department 5 of seal stock manufacturing works.
1CPU8 is the information generating unit of creating conditions that the 2nd information 16 that the 1st information 15 of storing based on the 1st storer 6 and the 2nd storer 7 are stored generates seal stocks 12.
Pre-stored in 1CPU8 have regulated procedure to process, and 1CPU8 generates creating conditions of seal stock 12 according to routine processes.
As creating conditions of seal stock 12, such as enumerating the kind of the layer structure of seal stock 12, the coating condition of varnish 11 etc.In addition, at seal stock 12, be B described later in the situation that of the stage, also can enumerate and make the varnish 11 in A stage carry out the heating condition of varnish 11 of B during the stage, the illuminate condition of active energy beam etc.In addition, also can enumerate the compress ional resilience index of the seal stock 12 in B stage.
As with reference to Fig. 2 and Fig. 3, seal stock 12 for example with possess the luminescent coating 26 that contains fluorophor the seal stock containing fluorophor, be that fluorophor sheet material forms.As the layer structure of seal stock 12, such as can enumerate luminescent coating 26 can directly contact with optical semiconductor 13 (dummy line) as shown in Fig. 2 A～Fig. 2 E contact structures and shown in Fig. 3 F and Fig. 3 G like that luminescent coating 26 can cover optical semiconductor 13, on the other hand between luminescent coating 26 and optical semiconductor 13 (dummy line) across the isolating construction at interval etc.
In Fig. 2 and Fig. 3, dummy line illustrates the optical semiconductor 13 that is embedded in seal stock 12.
Seal stock 12 as contact structures, the seal stock 12A only being formed by luminescent coating 26 like that as shown in Figure 2 A from example, possess like that as shown in Figure 2 B the concentration of fluorophor different and on thickness direction stacked a plurality of luminescent coating 26A and the seal stock 12B of 26B, possess like that as shown in Figure 2 C the resin bed 27 with the recess of opening and the seal stock 12C that is filled into the luminescent coating 26 of recess downwards, with reference to Fig. 2 D and Fig. 2 E, possess like that the luminescent coating 26 and the seal stock 12 that is formed at its resin bed 27 around of overlooking observation circular shape or overlooking observation essentially rectangular shape, as shown in Figure 2 D like that along with luminescent coating 26 forms towards upside width become large cross-section roughly trapezoidal shape seal stock 12D and as shown in Figure 2 E like that luminescent coating 26 form selection in the seal stock 12E etc. of cross-section essentially rectangular shape.
In addition, as the seal stock 12 of isolating construction, such as from shown in Fig. 3 F, possess like that resin bed 27 and be formed at resin bed 27 upside luminescent coating 26 seal stock 12F or shown in Fig. 3 G, possess like that resin bed 27, be formed at resin bed 27 upside luminescent coating 26 and the downside of resin bed 27 look up observe form the seal stock 12G etc. of functional layer 29 of part that encirclement will form optical semiconductor 13 selection.In addition, in Fig. 3 G, by mixing, possess the functional material of the light reflection functions such as wavelength conversion function, Chinese white (specifically, titania etc.) of fluorophor etc. in resin, to come to select from functional layer 29.
Specifically, as the seal stock 12 with above-mentioned various structures, can enumerate known seal stock, specifically, seal stock 12 as contact structures, for example, from TOHKEMY 2010-067641 communique, TOHKEMY 2009-231750 communique, TOHKEMY 2009-188207 communique, TOHKEMY 2009-182149 communique, TOHKEMY 2009-099784 communique, in the seal stock (fluorophor sheet material) that TOHKEMY 2009-060031 communique etc. is recorded, select (decision), and, seal stock 12 as isolating construction, for example, from TOHKEMY 2011-258634 communique, TOHKEMY 2011-228525 communique, TOHKEMY 2011-159874 communique, TOHKEMY 2011-082340 communique, TOHKEMY 2010-192844 communique, TOHKEMY 2010-153500 communique, in the seal stock (fluorophor sheet material) that TOHKEMY 2010-123802 communique etc. is recorded, select (decision).
Suitably select to there is the luminescent coating 26 of contact structures, the size of the concentration of fluorophor is different two luminescent coating 26A and luminescent coating 26B and resin bed 27 (comprising recess) is selected the scope of recording from described Publication.
As the coating condition of varnish 11, such as enumerating, be and then coated with the shape of varnish 11 afterwards, be and then coated with the thickness of varnish 11 afterwards etc.In addition, described shape comprises varnish 11 and is spaced from each other the shape that interval forms.
As shown in Figure 1,1CPU8 is configured to read the 2nd information 16 that the 1st information 15 that the 1st storer 6 stores and the 2nd storer 7 are stored.
As shown in Figure 1, the 5th storer 10 is for storing the region of creating conditions of the seal stock 12 generating with 1CPU8.
In addition, be provided with posting field (not shown) in the 5th storer 10, this posting field (not shown) can record and before this, manufacture the 5th information 19 that creating conditions of seal stock 12 is relevant.In addition the 5th information 19 that, posting field recorded and accumulated is configured in this manufacture process, with 1CPU8, read and again with 1CPU8, generate creating conditions of seal stock 12.
Optical semiconductor device manufacturing works 4 possess sheet production apparatus 34 and packoff 32.
Sheet production apparatus 34 possesses varnish manufacturing installation 33, sheet material gasifying device 31 and sheet material production control device 3 (client terminal device).
Varnish manufacturing installation 33 for example possesses container 52, and this container 52 is equipped with stirring machine 51.
Sheet material gasifying device 31 is such as possessing the apparatus for coating 53 such as divider, applicator, slit type coater.As apparatus for coating 53, preferably enumerate divider.In addition, sheet material gasifying device 31 can also possess dryer 55, and this dryer 55 has the well heater 54 that is spaced from each other arranged spaced on above-below direction.
Sheet material production control device 3 (client terminal device) possess the 2nd information transmit-receive unit 38, as the 3rd storer 23 of the 3rd information memory cell, as the 4th storer 24 of the 4th information memory cell and sheet material production control unit as the 2CPU25 of amending unit.
The 1st information transmit-receive unit 37 of central control unit 2 is connected by network remote with the 2nd information transmit-receive unit 38 of sheet material production control device 3.
The 3rd storer 23 is stored the 3rd relevant information 17 of creating conditions to the seal stock 12 generating with 1CPU8.
The 3rd information 17 comprises creating conditions with the seal stock 12 of 1CPU8 generation.
The 3rd storer 23 is configured to by the 3rd information 17 generating with 1CPU8 from the 5th storer 10 inputs.
The 4th storer 24 storage the 4th information 18, the 4 information 18 comprise in particle, curable resin, varnish photoreactive semiconductor element 13 batch information of at least one and/or the manufacture of the optical semiconductor device 20 during each unit.
Batch information for along with batch the information that changes of change, specifically, can enumerate according to batch difference and the mean value of the maximum length of different particle (in the situation that particle is ball shape, mean grain size) etc., and, can enumerate according to batch difference and the viscosity of different curable resins etc.In addition, in the situation that particle comprises fluorophor, as the batch information of fluorophor, can enumerate according to batch difference and the absorption peak wavelength of different fluorophor.And, as from according to batch information that different and different varnish is relevant, can enumerate the viscosity of the varnish being caused by batch difference of described particle and/or curable resin.
As the manufacture of the optical semiconductor device 20 during each unit, with the manufacture of the optical semiconductor device 20 during every month, for example from more than 1000, be preferably more than 5000 and for example in 200,000 following scopes, select.
The 4th storer 24 is configured to the 2nd information collecting device 22 input the 4th information 18 in the 1st information collecting device 21 in Bei Cong optical semiconductor device manufacturing works 4 and optical semiconductor device manufacturing works 4 or control department 5.
As the 4th information 18B inputting from the 1st information collecting device 21 in the 4th information 18, for example can enumerate the batch information of optical semiconductor 13, the manufacture of the optical semiconductor device 20 during each unit, and, as the 4th information 18A from the 2nd information collecting device 22 inputs, for example, can enumerate the batch information of the batch information of particle, the batch information of curable resin and varnish.
Pre-stored in 2CPU25 have regulated procedure to process, the 3rd information 17 that 2CPU25 stores based on the 3rd storer 23, to the S1 of varnish manufacturing process create conditions and creating conditions of the S2 of sheet material manufacturing process controlled.In addition, the 4th information 18 that 2CPU25 can also store based on the 4th storer 24, to the S1 of varnish manufacturing process create conditions and creating conditions of the S2 of sheet material manufacturing process revised.
2CPU25 is configured to read the 4th information 18 that the 3rd information 17 that the 3rd storer 23 stores and the 4th storer 24 are stored.
2CPU25 is configured to each varnish manufacturing installation 33 and sheet material gasifying device 31 to control respectively and revise creating conditions of the S1 of varnish manufacturing process and creating conditions of the S2 of sheet material manufacturing process.
Packoff 32 possesses pressue device 35 and seal control device 36.
Pressue device 35 for example on above-below direction devices spaced apart opposite, can select pressuring machine having by two flat boards 41 etc., these two flat boards 41 can be pressed seal stock 12 and substrate 14 on above-below direction.
Seal control device 36 is configured to control the air-proof condition of sealing process S3.In addition, be configured to be provided with not shown storer in seal control device 36, by the air-proof condition from the 1st information collecting device 21 input sealing process S3, and, the air-proof condition of control sealing process S3.
Then, illustrate and utilize this system 1 in optical semiconductor device manufacturing works 4, to manufacture the method for optical semiconductor device 20.
1. the generation operation of creating conditions
In the method, first, with the 3rd information transmit-receive unit of the 1st information collecting device 21, receive the 1st information 15, and the 1st information 15 is sent to central control unit 2.The 1st information transmit-receive unit 37 of central control unit 2 receives the 1st information 15 and sends to the 1st storer 6.In described method for sending information, such as sending the 1st information 15 by the circuits such as network that the 1st information collecting device 21 is connected with central control unit 2.
In addition, with the 3rd information transmit-receive unit of the 2nd information collecting device 22, receive the 2nd information 16, the 2nd information 16 is sent to central control unit 2.The 1st information transmit-receive unit 37 of central control unit 2 receives the 2nd information 16 and sends to the 2nd storer 7.Described sending method with send to the sending method of the 1st storer 6 identical the 1st information 15.
Then, 1CPU8 reads the 2nd information 16 that the 1st information 15 that the 1st storer 6 stores and the 2nd storer 7 are stored, then, routine processes according to the rules, based on these the 1st information 15 and the 2nd information 16, generate creating conditions as the 3rd information 17 (being then described in detail) of seal stock 12.
2. production control operation
Afterwards, by the 3rd information 17 that 1CPU8 generates, be recorded to the 5th storer 10, then, the 3rd information 17 that the 5th storer 10 records is sent to sheet material production control device 3 by the 1st information transmit-receive unit 37, the 2nd information transmit-receive unit 38 of sheet material production control device 3 receives the 3rd information 17, sends to the 3rd storer 23.
The method that the 3rd information 17 is sent to the 3rd storer 23 with send to the sending method of the 1st storer 6 identical the 1st information 15.
In addition, with the 3rd information transmit-receive unit of the 1st information collecting device 21 and the 2nd information collecting device 22, the 4th information 18 is sent to sheet material production control device 3, the 2nd information transmit-receive unit 38 of sheet material production control device 3 receives the 4th information 18 and sends to the 4th storer 24.The method that the 4th information 18 is sent to the 4th storer 24 with send to the sending method of the 1st storer 6 identical the 1st information 15.
Afterwards, 2CPU25 reads the 3rd information 17 that the 3rd storer 23 is stored, then, routine processes according to the rules, based on the 3rd information 17Dui varnish S1 of manufacturing process create conditions and creating conditions of the S2 of sheet material manufacturing process controlled.
And, in sheet production apparatus 34, based on creating conditions of controlling with 2CPU25, implement successively the S1He of the varnish manufacturing process sheet material S2 of manufacturing process.
3. the S1 of varnish manufacturing process
In varnish manufacturing installation 33, first, according to the enforcement S1 of varnish manufacturing process that creates conditions controlling with 2CPU25.
Specifically, in the S1 of varnish manufacturing process, first, prepare respectively particle and curable resin, these particles and curable resin are mixed, varnish 11 is prepared as to the hardening resin composition containing particle.
As particle, such as selecting from fluorophor, filling agent etc.
Fluorophor has wavelength conversion function, such as from blue light can be transformed to sodium yellow yellow fluorophor, blue light can be transformed to the red-emitting phosphors etc. of red light and select.
As yellow fluorophor, for example, from (Ba, Sr, Ca) 2siO 4; Eu, (Sr, Ba) 2siO 4: silicate phosphor, for example Y such as Eu (positive barium silicate (BOS)) 3al 5o 12: Ce (YAG (yttrium aluminum garnet): Ce), Tb 3al 3o 12: Ce (TAG (terbium aluminium garnet): Ce) etc. have carbuncle type crystal structure carbuncle type fluorophor, such as in oxides of nitrogen fluorophor such as Ca-α-SiAlON etc., select.
As red-emitting phosphors, for example, from CaAlSiN 3: Eu, CaSiN 2: in the nitride phosphors such as Eu etc., select.
As the shape of fluorophor, such as selecting from spherical, tabular, needle-like etc.
The mean value of the maximum length of fluorophor (in the situation that being spherical, mean grain size) for example more than 0.1 μ m, be preferably 1 μ m more than and for example below 200 μ m, preferably the scope below 100 μ m, select.
The absorption peak wavelength of fluorophor for example more than 300nm, be preferably 430nm more than and for example below 550nm, preferably the scope below 470nm, select.
In the mode of using separately or use together, select fluorophor.
The blending ratio of fluorophor from respect to curable resin 100 Quality Mgmt Dept for example more than Wei0.1 Quality Mgmt Dept, be preferably 0.5 Quality Mgmt Dept more than and for example below Wei80 Quality Mgmt Dept,, preferably in the scope below 50 Quality Mgmt Dept, select.
As filling agent, for example from organosilicon particle (specifically, comprise organic silicon rubber particle) etc. for example, select in the inorganic fine particles such as organic particle, for example silicon dioxide (, smog silicon dioxide etc.), talcum, aluminium oxide, aluminium nitride, silicon nitride.In addition, the mean value of the maximum length of filling agent (in the situation that being spherical, mean grain size) for example more than 0.1 μ m, preferably more than 1 μ m and for example below 200 μ m, preferably the scope below 100 μ m, select.With the mode Selective filling agent of using separately or using together.The blending ratio of filling agent is from respect to curable resin 100 Quality Mgmt Dept for example more than 0.1 Quality Mgmt Dept, preferably more than 0.5 Quality Mgmt Dept and for example below 70 Quality Mgmt Dept, preferably select the scope below 50 Quality Mgmt Dept.
As curable resin, for example from two stage solidification type resins, select, this two stage solidification type resin has the reaction mechanism in two stages, by the reaction B stage (semi-solid preparation) of first stage, by the reaction C stage (completely curing) of subordinate phase.
As two stage solidification type resins, such as from by heating the two stage solidification type thermoset resins that solidify, such as by irradiating selection two stage solidification type active energy ray-curable resins that active energy beam (such as ultraviolet ray, electric wire etc.) solidifies etc.Preferably select two stage solidification type thermoset resins.
Specifically, as two stage solidification type thermoset resins, such as selecting from organic siliconresin, epoxy resin, polyimide resin, phenolics, urea resin, melamine resin, unsaturated polyester resin etc.From the viewpoint of photopermeability and permanance, preferably from two stage solidification type organic siliconresins, select.
As two stage solidification type organic siliconresins, such as selecting from there is condensation reaction/addition reaction curing type silicone resin etc. of these two kinds of reaction systems of condensation reaction and addition reaction.
As such condensation reaction/addition reaction curing type silicone resin, be selected from: for example contain silanol group two end polysiloxane, trialkoxy silane containing thiazolinyl, organic hydrogen polysiloxanes, the first condensation reaction of condensation catalyst and hydrosilylation catalysts/addition reaction curing type silicone resin, for example contain silanol group two end polysiloxane, silicon compound containing ethylenically unsaturated hydrocarbons base, silicon compound containing ethylenically unsaturated hydrocarbons base, organic hydrogen polysiloxanes, the second condensation reaction of condensation catalyst and hydrosilylation catalysts/addition reaction curing type silicone resin, for example contain two end silanol fundamental mode silicone oil, dialkoxy alkyl silane containing thiazolinyl, organic hydrogen polysiloxanes, three condensation reaction of condensation catalyst and hydrosilylation catalysts/addition reaction curing type silicone resin, for example contain the organopolysiloxane at least in 1 molecule with 2 thiazolinyl silylation, in 1 molecule, at least there is the organopolysiloxane of 2 hydrosilyl groups, four condensation reaction of hydrosilylation catalysts and cure retarder/addition reaction curing type silicone resin, for example contain first organopolysiloxane simultaneously with at least 2 ethylenically unsaturated hydrocarbons bases and at least 2 hydrosilyl groups in 1 molecule, containing ethylenically unsaturated hydrocarbons base and there is the second organopolysiloxane of at least 2 hydrosilyl groups in 1 molecule, five condensation reaction of hydrosilylation catalysts and hydrosilylation inhibitor/addition reaction curing type silicone resin, for example contain first organopolysiloxane simultaneously with at least 2 ethylenically unsaturated hydrocarbons bases and at least 2 silanol groups in 1 molecule, not containing thering is the second organopolysiloxane of at least 2 hydrosilyl groups in ethylenically unsaturated hydrocarbons base and 1 molecule, six condensation reaction of hydrosilylation inhibitor and hydrosilylation catalysts/addition reaction curing type silicone resin, seven condensation reaction/addition reaction curing type silicone the resin that for example contains silicon compound and boron compound or aluminium compound, such as eight condensation reaction that contains polyaluminosiloxane and silane coupling agent/addition reaction curing type silicone resin etc.
The viscosity of the two stage solidification type resins in A stage is for example more than 3000mPas, preferably 5000mPas is above and for example select the scope below 20000mPas, below preferred 15000mPas.In addition, the temperature of the two stage solidification type resins in A stage is adjusted to 25 ℃, uses E type circular cone with rotating speed 99s -1measure the viscosity of the two stage solidification type resins in A stage.By the method identical with described method, measure following viscosity.
The blending ratio of curable resin is from respect to containing the hardening resin composition (varnish) of particle for example more than 30 quality %, preferably more than 40 quality %, more preferably more than 50 quality % and for example below 98 quality %, preferably below 95 quality %, more preferably select the scope below 90 quality %.
In addition, as required, can also make to contain solvent containing the hardening resin composition of particle.
As solvent, be selected from: such as aliphatic hydrocarbons such as hexanes, such as aromatic hydrocarbons such as dimethylbenzene, siloxane such as vinyl cyclic dimethylsiloxane siloxane, two terminal ethylenyl groups dimethyl silicone polymers etc.Solvent is to become the compounding in containing the hardening resin composition of particle of the such compounding ratio of viscosity described later containing particle hardening resin composition.
When preparation contains the hardening resin composition of particle, specifically, as shown in Figure 1, in varnish manufacturing installation 33, the S1 of varnish manufacturing process based on controlling with 2CPU25 creates conditions, the kind of the varnish 11 of that for example control with 2CPU25 and layer structural correspondence seal stock 12, the kind of the particle of more particularly controlling with 2CPU25, the blending ratio of particle, the mean value of the maximum length of particle is (in the situation that particle is ball shape, mean grain size), the kind of curable resin, the viscosity of curable resin, the blending ratio of curable resin, the absorption peak wavelength of fluorophor in the situation that particle comprises fluorophor, the viscosity of varnish 11 etc., at each composition described in the interior mixing of container 52.Then, with stirring machine 51, mix each composition described in these.
Thus, prepare varnish 11.
In addition,, in the situation that curable resin is two stage solidification type resins, with the hardening resin composition containing particle in A stage, prepare varnish 11.
Viscosity by varnish 11 under 25 ℃, one air pressure conditions be for example adjusted into 1,000mPas above, preferably 4,000mPas is above and for example 1,000,000mPas is following, preferably 100, in the scope below 000mPas.
4. the S2 of sheet material manufacturing process
In sheet material gasifying device 31, after the S1 of varnish manufacturing process, according to the enforcement S2 of sheet material manufacturing process that creates conditions controlling with 2CPU25.
That is, from varnish 11, form seal stock 12.
When forming seal stock 12, for example, first varnish 11 is applied to the surface of releasing sheet 28.
As releasing sheet 28, such as from polymer films such as polyethylene film, polyester films (PET etc.), such as ceramic sheet material, such as selecting metal forming etc.Preferably from polymer film, select.In addition, can also implement the lift-off processing such as fluorine processing on the surface of releasing sheet 28.In addition, the shape of releasing sheet 28 does not limit especially, such as observing selection essentially rectangular shape (comprising brachmorphy strip, strip) etc. from overlooking.And, as releasing sheet 28, select whether to form telltale mark (not shown) and specifically labelled positional information, size etc.Form mark to guarantee to be coated with the region of varnish 11.
When varnish 11 being applied to releasing sheet 28 surperficial, such as selecting the apparatus for coating 53 such as divider, applicator, slit type coater.Preferably select divider.
From the coating condition of varnish 11, select the thickness of seal stock 12 so that its for example become 10 μ m above, preferably 50 μ m above and for example 2000 μ m following, preferably below 1000 μ m.
That is to say, from the coating condition of apparatus for coating 53, select varnish 11 to be adjusted to creating conditions of controlling with 2CPU25, the shape of the varnish 11 after the and then coating of specifically controlling with 2CPU25, be and then coated with the thickness of varnish 11 afterwards.
In addition, in the situation that releasing sheet 28 is formed with telltale mark (not shown), while use the sensor (not shown) that apparatus for coating 53 is equipped with to confirm to regulate varnish 11 with respect to specifically labelled relative position with respect to specifically labelled coating position.
Afterwards, in the situation that varnish 11 contains two stage solidification type resins, make the varnish 11B stage.Specifically, if select two stage solidification type resins from heat curing-type, varnish 11 is rendered to dryer 55 is interior to be heated varnish 11.
Heating condition from heating-up temperature is for example more than 40 ℃, preferably more than 80 ℃, more preferably more than 100 ℃ and for example below 200 ℃, preferably below 150 ℃, more preferably the scope below 140 ℃, select.Heat time for example from more than 1 minute, preferably more than 5 minutes, more preferably more than 10 minutes and for example below 24 hours, preferably below 1 hour, more preferably the scope below 0.5 hour, select.
On the other hand, if select two stage solidification type resins from active-energy curing type, use UV-lamp (not shown) to varnish 11 irradiation ultraviolet radiations.
Thus, be manufactured on the stacked seal stock 12 in surface of releasing sheet 28.
Compress ional resilience index by seal stock 12 25 ℃ time is for example adjusted to more than 0.040MPa, preferably more than 0.050MPa, more preferably more than 0.075MPa, further preferably more than 0.100MPa and for example below 0.145MPa, preferably below 0.140MPa, more preferably below 0.135MPa, the further preferred scope below 0.125MPa.
5. sealing process S3
In the pressue device 35 of packoff 32, after the S2 of sheet material manufacturing process, according to implementing sealing process S3 by the condition that seal control device 36 is controlled.
Specifically, in sealing process S3, first prepare to have installed the substrate 14 of optical semiconductor 13.
Substrate 14 is such as selecting in the insulated substrates such as multilayer board from stacked insulation course obtains silicon substrate, ceramic substrate, polyimide resin substrate, metal substrate.
In addition, on the surface of substrate 14, be formed with conductive pattern (not shown), this conductive pattern (not shown) possess electrode (not shown) that the terminal (not shown) for the optical semiconductor 13 with following explanation is electrically connected to and with the continuous wiring of this electrode (not shown).Conductive pattern is such as selecting from the conductors such as gold, copper, silver, nickel.
In addition, the surface of substrate 14 forms flat condition.Or, although also not shown, also can form recessed recess downwards on the surface that optical semiconductor 13 will be installed of substrate 14.
The outer shape of substrate 14 does not limit especially, such as observing essentially rectangular shape from overlooking, overlook and observe selection circular shape etc.Suitably select the size of substrate 14, for example from maximum length for example more than 2mm, preferably 10mm is above and for example the scope below 300mm, below preferred 100mm, select.
The LED (light-emitting diode) that optical semiconductor 13 is is luminous energy by transformation of electrical energy, LD (laser diode) etc., for example, select from the short cross-section essentially rectangular shape of thickness specific surface direction length (with the orthogonal directions length of thickness direction quadrature).As optical semiconductor 13, preferably from send the blue led of blue light, select.According to purposes and the object size of selective light semiconductor element 13 suitably, specifically, from thickness for example more than 10 μ m and below 1000 μ m and maximum length for example more than 0.05mm, preferably 0.1mm is above and for example the scope below 5mm, below preferred 2mm, select.
The peak luminous wavelength of optical semiconductor 13 is for example more than 400nm, preferably 430nm is above and for example select the scope below 500nm, below preferred 470nm.
For example optical semiconductor 13 upside-down mountings are installed to substrate 14 or wire-bonded is connected to substrate 14.
In addition, can a plurality of (in Fig. 1 3) optical semiconductor 13 be installed to a substrate 14.The installation numerical example of the optical semiconductor 13 of each substrate 14 as from more than 1, preferably more than 4 and for example below 2000, preferably the scope below 400, select.
Then, in the method, the substrate 14 that optical semiconductor 13 has been installed is arranged to pressue device 35.
When the substrate 14 that optical semiconductor 13 has been installed is arranged to pressue device 35, specifically, the substrate 14 that optical semiconductor 13 has been installed is arranged to the flat board 41 of downside.
Then, the seal stock 12 that makes to be layered in the upper surface of releasing sheet 28 reverses up and down, makes the upside of itself and optical semiconductor 13 opposite.That is to say, seal stock 12 is configured to towards optical semiconductor 13.
Then, with seal stock 12, cover optical semiconductor 13.With seal stock 12 embedded light semiconductor elements 13.
Specifically, the pressurized conditions based on controlling with seal control device 36, covers optical semiconductor 13 with seal stock 12.
Specifically, as shown in the arrow of Fig. 1, make seal stock 12 declines (pressing).In detail, seal stock 12 is pressurized to the substrate 14 that optical semiconductor 13 has been installed.
Thus, with seal stock 12, cover optical semiconductor 13.
That is to say, with seal stock 12 embedded light semiconductor elements 13, and in the situation that seal stock 12 possesses luminescent coating 26, with luminescent coating 26, cover optical semiconductors 13.
In detail, as shown in Fig. 2 A～Fig. 2 G, in the situation that select the layer structure of the luminescent coating 26 of seal stock 12 from contact structures, luminescent coating 26 directly contacts with the surface of optical semiconductor 13 (dummy line of Fig. 2), with luminescent coating 26, covers optical semiconductor 13.That is to say luminescent coating 26 encapsulating optical semiconductor elements 13.In other words, luminescent coating 26 doubles as sealant.
On the other hand, as shown in Fig. 3 F and Fig. 3 G, in the situation that select the layer structure of the luminescent coating 26 of seal stock 12 from isolating construction, luminescent coating 26 is configured to and the upside of optical semiconductor 13 (dummy line of Fig. 3) across resin bed 27 and covering optical semiconductor 13.On the other hand, resin bed 27 directly contacts and covers optical semiconductor 13 with the surface of optical semiconductor 13 (dummy line of Fig. 2).That is to say resin bed 27 encapsulating optical semiconductor elements 13 and form sealant.
Afterwards, if seal stock 12, in the B stage, makes the seal stock 12C stage.
For example, according to seal control device 36, control, the heating condition of seal stock 12 of C in the stage be, the illuminate condition of active energy beam makes the seal stock 12C stage.
Specifically, select two stage solidification type resins from thermohardening type in the situation that, the seal stock 12 in B stage is heated.
In detail specifically, while maintain the pressurized state of dull and stereotyped 41 pairs of seal stocks 12 and render in dryer.Thus, the seal stock 12 in B stage is heated.
Heating-up temperature for example from more than 80 ℃, preferably more than 100 ℃ and for example below 200 ℃, preferably the scope below 180 ℃, select.In addition, the heat time for example from more than 10 minutes, preferably more than 30 minutes and for example below 10 hours, preferably the scope below 5 hours, select.
By the heating of seal stock 12, make the seal stock 12C stage (completely curing) in B stage.
On the other hand, select two stage solidification type resins from active energy ray curable in the situation that, by active energy beam being irradiated to seal stock 12, make the seal stock 12C stage (completely curing) in B stage.Specifically, use seal stock 12 irradiation ultraviolet radiations to the B stage such as UV-lamp.
Thus, produce the optical semiconductor 13 that possesses seal stock 12, seals with seal stock 12 and the optical semiconductor device 20 that the substrate 14 of optical semiconductor 13 has been installed.
In Fig. 1, in an optical semiconductor device 20, be provided with a plurality of (three) optical semiconductor 13.
Afterwards, as shown by arrows, from seal stock 12, peel releasing sheet 28.
In addition, afterwards, in the situation that a plurality of optical semiconductors 13 being installed on to a substrate 14, can also cut off accordingly seal stock 12 and singualtion with each optical semiconductor 13 as required.
6. the manufacture during the accumulation of creating conditions, batch change and each unit
In the manufacture process of the seal stock 12 before this, by the S1 of varnish manufacturing process create conditions and the S2 of sheet material manufacturing process create conditions record be accumulated to the posting field (not shown) of the 5th storer 10.
That is to say, the 5th storer 10 is input to the 3rd storer 23 by the 3rd information 17, and using the 3rd information 17 as the 5th information 19 that is past information, is directly accumulated to the posting field of the 5th storer 10.
And, by this manufacture of seal stock 12,1CPU8 reads and is accumulated to creating conditions of the S1 of varnish manufacturing process and creating conditions of the S2 of sheet material manufacturing process the 5th storer 10, that manufacture seal stock 12 before this, according to this, creates conditions and generates this creating conditions and this creating conditions of the S2 of sheet material manufacturing process of the S1 of varnish manufacturing process.
In addition, the batch information of at least one and/or the manufacture change of the optical semiconductor device 20 during each unit in particle, curable resin, varnish photoreactive semiconductor element.Change accordingly with this, these the 4th information 18 are sent to the 4th storer 24 from the 1st information collecting device 21 and the 2nd information collecting device 22, then, 2CPU25 reads the 4th information 18 that the 4th storer 24 is stored, routine processes according to the rules, to the S1 of varnish manufacturing process create conditions and/or creating conditions of the S2 of sheet material manufacturing process revised.
[action effect]
By the present invention, can realize Long-distance Control to being arranged at the sheet material manufacturing process of the position different from central control unit, client terminal device and information collecting device (position that strange land arranges).
And in this system 1, central control unit 2 possesses the 1st storer the 6, the 2nd storer 7 and 1CPU8, on the other hand, sheet material production control device 3 (client terminal device) possesses the 3rd storer 23 and 2CPU25.
And, central control unit 2 stores respectively each the 1st information 15 and the 2nd information 16 into the 1st storer 6 and the 2nd storer 7, with 1CPU8, generate creating conditions of the S2 of sheet material manufacturing process, this can be created conditions and offer sheet material production control device 3 (client terminal device).
And, in sheet material production control device 3, by storing the 3rd storer 23 into the 3rd relevant information 17 of creating conditions providing from central control unit 2, according to described the 3rd information 17, with 2CPU25, control creating conditions of the S2 of sheet material manufacturing process.
Therefore, can in central control unit 2, generate dividually creating conditions of the S2 of sheet material manufacturing process with sheet material production control device 3, and can control creating conditions of the S2 of sheet material manufacturing process by enough sheet material production control devices 3.
In addition, 3rd information 17 relevant to creating conditions of the S2 of sheet material manufacturing process providing from central control unit 2 is based on the 1st information 15 and the 2nd information 16.Therefore, the 3rd information 17 that sheet material production control device 3 can be based on providing from central control unit 2, controls creating conditions of the S2 of sheet material manufacturing process accurately with 2CPU25.Its result, can manufacture the optical semiconductor device 20 that is made as object accurately.
In addition, in this system 1, the 2nd information 16 that the 1st information 15 that 1CPU8 stores based on the 1st storer 6 and the 2nd storer 7 are stored, also generate creating conditions of the S1 of varnish manufacturing process, the 3rd information 17 that 2CPU25 stores based on the 3rd storer 23, also controls creating conditions of the S1 of varnish manufacturing process.Therefore, can manufacture accurately the seal stock 12 of the optical semiconductor device 20 that is suitable for being made as object, and can manufacture accurately the optical semiconductor device 20 that is made as object.
And, according to this system 1, the 1st information 15 comprises the information relevant to the substrate 14 that optical semiconductor 13 is installed, so central control unit 2 also possesses the information relevant with the substrate 14 that optical semiconductor 13 is installed together with the information relevant to optical semiconductor 13 and the information relevant with optical semiconductor device 20.
Therefore, sheet material production control device 3, according to high-precision 3rd information 17 relevant to creating conditions of the S2 of sheet material manufacturing process generating based on the 1st information 15, can further be controlled creating conditions of the S2 of sheet material manufacturing process accurately.
In addition, in this system 1, in sheet material production control device 3, use 2CPU25, in the particle of storing according to the 4th storer 24, curable resin, varnish photoreactive semiconductor element 13 batch information of at least one and/or comprise each unit during the 4th information 18 of manufacture of optical semiconductor device 20, can revise creating conditions of the S2 of sheet material manufacturing process.Therefore, easily and the change of the manufacture of batch information and/or optical semiconductor device 20 accordingly, to the S1 of varnish manufacturing process create conditions and creating conditions of the S2 of sheet material manufacturing process revised, can manufacture accurately the optical semiconductor device 20 that is made as object.
And according to this system 1, the 5th storer 10 of central control unit 2 can be accumulated and manufacture the 5th information 19 that creating conditions of seal stock 12 is relevant before this.Therefore, can be based on the creating conditions of past accumulation, in this manufacture, be suitable for being made as the seal stock 12 of the optical semiconductor device 20 of object, and can manufacture accurately the optical semiconductor device 20 that is made as object at this.
This central control unit 2 possesses the 1st storer the 6, the 2nd storer 7 and 1CPU8.
Therefore, according to this central control unit 2, can store respectively each the 1st information 15 and the 2nd information 16 into the 1st storer 6 and the 2nd storer 7, with 1CPU8, generate creating conditions of the S1 of varnish manufacturing process and creating conditions of the S2 of sheet material manufacturing process.
Its result, based on creating conditions of the described varnish S1 of manufacturing process and creating conditions of the S2 of sheet material manufacturing process, can manufacture the optical semiconductor device 20 that is made as object accurately.
In addition, in this central control unit 2, the 2nd information 16 that the 1st information 15 that 1CPU8 further stores based on the 1st storer 6 and the 2nd storer 7 are stored, generates creating conditions of the S1 of varnish manufacturing process and creating conditions of the S2 of sheet material manufacturing process.Therefore, can manufacture accurately the seal stock 12 of the optical semiconductor device 20 that is suitable for being made as object, and can manufacture accurately the optical semiconductor device 20 that is made as object.
In addition, according to this central control unit 2, the 1st information 15 comprises the information relevant to the substrate 14 that optical semiconductor 13 is installed, so central control unit 2 also possesses the information relevant with the substrate 14 that optical semiconductor 13 is installed together with the information relevant to optical semiconductor 13 and the information relevant with optical semiconductor device 20.
Therefore, can manufacture accurately the optical semiconductor device 20 that is made as object.
According to this central control unit 2, can accumulate and before this, manufacture the 5th information 19 that creating conditions of seal stock 12 is relevant.Therefore,, based on creating conditions of past accumulation, can be suitable for being made as in this manufacture the seal stock 12 of the optical semiconductor device 20 of object, and can manufacture accurately the optical semiconductor device 20 that is made as object at this.
According to this sheet material production control device 3, can relevant to the S1 of varnish manufacturing process create conditions and 3rd information 17 of creating conditions relevant with creating conditions of the S2 of sheet material manufacturing process stores the 3rd storer 23 into will be comprised, based on described the 3rd information 17, with 2CPU25, control accurately relevant to the S1 of varnish manufacturing process creating conditions and the creating conditions of the S2 of sheet material manufacturing process.
Therefore, can manufacture accurately the optical semiconductor device 20 that is made as object.
In addition, according to this sheet material production control device 3, the 3rd information 17 that 2CPU25 further stores based on the 3rd storer 23 is controlled relevant to the S1 of varnish manufacturing process creating conditions and the creating conditions of the S2 of sheet material manufacturing process, therefore the seal stock 12 of the optical semiconductor device 20 that is suitable for being made as object can be manufactured accurately, and the optical semiconductor device 20 that is made as object can be manufactured accurately.
In addition, in this sheet material production control device 3, use 2CPU25, the 4th information 18 of the batch information that comprises in particle, curable resin, varnish photoreactive semiconductor element at least one of storing based on the 4th storer 24 and/or the manufacture of the optical semiconductor device 20 during each unit, can the Dui Yu varnish S1 of manufacturing process relevant create conditions and creating conditions of the S2 of sheet material manufacturing process revised.Therefore, can be easily and the change of the manufacture of batch information and/or optical semiconductor device 20 accordingly, the Dui Yu varnish S1 of manufacturing process is relevant creates conditions and creating conditions of the S2 of sheet material manufacturing process revised, and manufactures the optical semiconductor device 20 that is made as object accurately.
[variation]
In explanation after Fig. 4, to the additional identical reference marker of the parts identical with Fig. 1, description is omitted.
In the embodiment of Fig. 1, central control unit 2 has man-to-man relation with sheet material production control device 3 (client terminal device),, a central control unit 2 is provided with to a sheet material production control device 3 that is.But the corresponding relation of central control unit 2 and sheet material production control device 3 is not limited thereto, example as shown in Figure 4, can also arrange a plurality of sheet material production control devices 3 to a central control unit 2.
Specifically, in a plurality of optical semiconductor device manufacturing works 4 of separate setting, be provided with sheet material production control device 3 in separately.Central control unit 2 and a plurality of sheet material production control device 3 are configured to the 1st information collecting device 21 that can have respectively from a plurality of sheet material production control devices 3 a plurality of the 1st information 15 are sent to the 1st storer 6, and can will from the 5th storer 10, send to a plurality of the 3rd storeies 23 by the 3rd information 17 that 1CPU8 generates.
In the embodiment of Fig. 4, a 2 couples one sheet material production control device 3A of central control unit (3) provides the 3rd information 17, and obtain the 1st information 15 and store the 1st storer 6 into from the 1st information collecting device 21 of a sheet material production control device 3A (3), by the 5th storer 10 accumulation the 1st information 15, and, can also offer the 3rd information 17 to other sheet material production control device 3B (or other a plurality of sheet material production control device 3B and 3C) (3).
That is to say, a plurality of the 1st information 15 that central control unit 2 can make to provide from a plurality of sheet material production control devices 3 (will store into the 1st information 15 of the 1st storer 6, specifically the information relevant to optical semiconductor 13, the information relevant with substrate 14, the information relevant with optical semiconductor device 20) are unified.That is, central control unit 2 can be as can collecting the 1st information 15 of a plurality of sheet material production control devices 3 and providing the integrated type central control unit 2 of 3rd information 17 corresponding with them and performance function to a plurality of sheet material production control devices 3.
Therefore in the time of, as a central control unit 2, can provide high-precision the 3rd information 17 to each sheet material production control device 3.
In addition, in the embodiment of Fig. 1, the manufacturing process of the system 1 Generation and control varnish S1 of manufacturing process.That is to say, with sheet material production control device 3, control creating conditions of the S1 of varnish manufacturing process.But, system 1 can also be configured to the not manufacturing process of the S1 of Generation and control varnish manufacturing process of system 1.Specifically, can also not control creating conditions of the S1 of varnish manufacturing process and only control creating conditions of the S2 of sheet material manufacturing process.
Therefore according to this embodiment, 2CPU25 does not need to control creating conditions of the S1 of varnish manufacturing process, can make that 2CPU25's is simple in structure.
In addition, in the embodiment of Fig. 1, packoff 32, sheet material gasifying device 31 and varnish manufacturing installation 33 are arranged at optical semiconductor device manufacturing works 4.But packoff 32, sheet material gasifying device 31 and varnish manufacturing installation 33 can also be arranged at respectively the factory of diverse location, connect by telecommunication network.
In addition, two information collecting devices are set in the embodiment of Fig. 1.As required, one or three above information collecting devices can also be set.
In addition, in the embodiment of Fig. 1, the 1st, the 2nd, the 3rd information transmit-receive unit can have respectively information receiving unit and information transmitting unit.
In addition, in the embodiment of Fig. 1, make sheet material production control device 3 control creating conditions of the S2 of sheet material manufacturing process as client terminal device of the present invention, seal control device 36 is controlled the air-proof condition of sealing process S3, but, for example can also make sheet material production control device 3 double as seal control device 36 and form a production control device, controlling creating conditions and the air-proof condition of sealing process S3 of the S2 of sheet material manufacturing process.
In addition, in the embodiment of Fig. 2 and Fig. 3, the seal stock 12 that cover sheets of the present invention is made as to encapsulating optical semiconductor element 13 is illustrated, but be not limited thereto, example as shown in Figure 5, can also be chosen as in the upper stacked cover sheets 60 (with reference to arrow and Fig. 5 B of Fig. 5 A) of the resin bed of encapsulating optical semiconductor element 13 (sealant) 27 (with reference to Fig. 5 A) in advance.
In Fig. 5 A, cover sheets 60 is selected from the identical material of the seal stock 12 with Fig. 1.
In Fig. 5 B, cover sheets 60 covers the upside of optical semiconductors 13, specifically, and across resin bed 27 and in the upside devices spaced apart configuration of optical semiconductor 13.
And, in the embodiment of Fig. 2 and Fig. 3, seal stock 12 is chosen as to fluorophor sheet material (containing the seal stock of fluorophor), still, although for example also not shown, can also be chosen as the seal stock 12 that does not contain sealant (resin bed) containing fluorophor.
In addition, in the explanation of Fig. 1, the 1st information 15 comprises the information relevant to the substrate 14 that optical semiconductor 13 is installed, but also can containing this information ground, not form the 1st information 15.

Claims (18)

  1. The tele-control system of 1.Yi Zhong sheet material manufacturing process, described sheet material is made by varnish, and for the manufacture of the semiconductor device with semiconductor element, it is characterized in that, described tele-control system comprises central control unit and the client terminal device arranging with described central control unit strange land
    Described central control unit has first information Transmit-Receive Unit and information generating unit,
    Described client terminal device has the second information transmit-receive unit and sheet material production control unit,
    The described first information Transmit-Receive Unit of described central control unit is connected by network remote with the second information transmit-receive unit of described client terminal device,
    To optical semiconductor photoreactive semiconductor device relevant 1st information of described central control unit based on receiving with described first information Transmit-Receive Unit and 2nd information relevant with described varnish, by described information generating unit, generate and sheet material the 3rd relevant information of creating conditions, and by network, described the 3rd information is sent to described client terminal device with described first information Transmit-Receive Unit, described client terminal device receives described the 3rd information with described the second information transmit-receive unit, and creating conditions of described sheet material manufacturing process controlled according to described the 3rd information by described sheet material production control unit.
  2. 2. according to the tele-control system of the sheet material manufacturing process of claim 1, it is characterized in that, also comprise information collecting device, described central control unit is connected by network with described information collecting device,
    Described information collecting device has the 3rd information transmit-receive unit,
    Described information collecting device receives described the 1st information and the 2nd information by described the 3rd information transmit-receive unit, and by network, described the 1st information and described the 2nd information is sent to described central control unit with described the 3rd information transmit-receive unit.
  3. 3. according to the tele-control system of the sheet material manufacturing process of claim 2, it is characterized in that, described information collecting device comprises the 1st information collecting device and the 2nd information collecting device that is respectively used to accept described the 1st information and described the 2nd information.
  4. 4. according to the tele-control system of the sheet material manufacturing process of claim 1～3 any one, it is characterized in that,
    Described central control unit have storage described the 1st information the 1st information memory cell and for storing the 2nd information memory cell of described the 2nd information, described information generating unit reads described the 1st information and described the 2nd information from described the 1st information memory cell and described the 2nd information memory cell, described client terminal device has the 3rd information memory cell of described the 3rd information of storage, and described sheet material production control unit reads described the 3rd information from described the 3rd information memory cell.
  5. 5. according to the tele-control system of the sheet material manufacturing process of claim 1～3 any one, it is characterized in that,
    Described client terminal device also receives and comprises in varnish, varnish in contained particle, varnish the batch information of at least one in contained curable resin, semiconductor element, and/or the 4th information of semiconductor device manufacture information during unit, and according to described the 4th information, creating conditions of described sheet material manufacturing process carried out to Correction and Control.
  6. 6. according to the tele-control system of the sheet material manufacturing process of claim 1～3 any one, it is characterized in that,
    Described central control unit also based on to the 5th relevant Information generation and this sheet material the 3rd relevant information of creating conditions of creating conditions of the sheet material before this, and described and this sheet material the 3rd relevant information of creating conditions is sent to described client terminal device,
    Described client terminal device is controlled creating conditions of described sheet material manufacturing process according to described and this sheet material the 3rd relevant information of creating conditions.
  7. 7. according to the tele-control system of the sheet material manufacturing process of claim 5, it is characterized in that, described client terminal device has the 4th information memory cell of described the 4th information of storage, and described sheet material production control unit reads the 4th information from described the 4th information memory cell.
  8. 8. according to the tele-control system of the sheet material manufacturing process of claim 6, it is characterized in that, described central control unit has the 5th information memory cell of described the 5th information of storage, and described information generating unit reads the 5th information from described the 5th information memory cell.
  9. 9. according to the tele-control system of the sheet material manufacturing process of claim 1～3 any one, it is characterized in that, described sheet material the 3rd relevant information of creating conditions further comprises the information relevant to creating conditions of varnish manufacturing process, and described sheet material production control unit is further controlled creating conditions of described varnish manufacturing process according to described the 3rd information.
  10. Central control unit in 10.Yi Zhong sheet material manufacturing process tele-control system, described sheet material is made by varnish, and for the manufacture of the semiconductor device with semiconductor element, it is characterized in that, and described central control unit comprises:
    First information Transmit-Receive Unit, for receive 1st information relevant to optical semiconductor photoreactive semiconductor device and 2nd information relevant with described varnish by network, and
    Information generating unit, is connected with described first information Transmit-Receive Unit, for the 3rd relevant information of creating conditions based on described the 1st information and the 2nd Information generation and sheet material, and sends described the 3rd information by described first information Transmit-Receive Unit.
  11. 11. according to the central control unit in the sheet material manufacturing process tele-control system of claim 10, it is characterized in that,
    Described information generating unit be also configured to based on to the 5th relevant Information generation and this sheet material the 3rd relevant information of creating conditions of creating conditions of the sheet material before this, and described in sending by described first information Transmit-Receive Unit to this sheet material the 3rd relevant information of creating conditions.
  12. 12. according to the central control unit in the sheet material manufacturing process tele-control system of claim 11, it is characterized in that, described central control unit has the 5th information memory cell of described the 5th information of storage, and described information generating unit reads the 5th information from described the 5th information memory cell.
  13. 13. according to claim 10 to the central control unit in the sheet material manufacturing process tele-control system of 12 any one, it is characterized in that, described central control unit has the 1st information memory cell of described the 1st information of storage and for storing the 2nd information memory cell of described the 2nd information, described information generating unit reads described the 1st information and described the 2nd information from described the 1st information memory cell and described the 2nd information memory cell.
  14. Client terminal device in 14.Yi Zhong sheet material manufacturing process tele-control system, described sheet material is made by varnish, and for the manufacture of the semiconductor device with semiconductor element, it is characterized in that, and described client terminal device comprises:
    The second information transmit-receive unit, for being connected with the central control unit of described sheet material manufacturing process tele-control system, receives and sheet material the 3rd relevant information of creating conditions, and
    Sheet material production control unit, is connected with described the second information transmit-receive unit, for according to by described the second information transmit-receive unit, received to sheet material the 3rd relevant information of creating conditions, creating conditions of described sheet material manufacturing process controlled.
  15. 15. according to the client terminal device in the sheet material manufacturing process tele-control system of claim 14, it is characterized in that, described client terminal device have storage described to the create conditions information memory cell of the 3rd relevant information of sheet material.
  16. 16. according to the client terminal device in the sheet material manufacturing process tele-control system of claims 14 or 15, it is characterized in that,
    Described the second information transmit-receive unit is also set to receive and comprises in varnish, varnish in contained particle, varnish the batch information of at least one in contained curable resin, semiconductor element, and/or the 4th information of semiconductor device manufacture information during unit, and
    Described sheet material production control unit is also configured to, according to described the 4th information, creating conditions of described sheet material manufacturing process carried out to Correction and Control.
  17. 17. according to the client terminal device in the sheet material manufacturing process tele-control system of claim 16, it is characterized in that, described client terminal device has the 4th information memory cell of storage the 4th information, and described sheet material production control unit reads the 4th information from described the 4th information memory cell.
  18. Information collecting device in 18.Yi Zhong sheet material manufacturing process tele-control system, described sheet material is made by varnish, and for the manufacture of the semiconductor device with semiconductor element, it is characterized in that, and described information collecting device comprises:
    Information receiving unit, for receiving 1st information relevant to optical semiconductor photoreactive semiconductor device and 2nd information relevant with described varnish, and
    Information transmitting unit, is connected with the central control unit in described information receiving unit and described sheet material manufacturing process tele-control system, for described the 1st information and the 2nd information that described information receiving unit is received, is sent to described central control unit.
CN201310693566.2A 2013-03-28 2013-12-17 Remote control system, central control device, client and information acquisition device Pending CN104076760A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013069496A JP5373215B1 (en) 2013-03-28 2013-03-28 System, manufacturing condition determination device and manufacturing management device
JP2013-069496 2013-03-28

Publications (1)

Publication Number Publication Date
CN104076760A true CN104076760A (en) 2014-10-01

Family

ID=49954936

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201510185187.1A Pending CN104932430A (en) 2013-03-28 2013-12-17 Manufacturing management apparatus
CN201310693566.2A Pending CN104076760A (en) 2013-03-28 2013-12-17 Remote control system, central control device, client and information acquisition device
CN201410350676.3A Pending CN104155939A (en) 2013-03-28 2013-12-17 System, manufacturing condition determining apparatus, and manufacturing management apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201510185187.1A Pending CN104932430A (en) 2013-03-28 2013-12-17 Manufacturing management apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201410350676.3A Pending CN104155939A (en) 2013-03-28 2013-12-17 System, manufacturing condition determining apparatus, and manufacturing management apparatus

Country Status (5)

Country Link
JP (1) JP5373215B1 (en)
KR (1) KR20150134341A (en)
CN (3) CN104932430A (en)
TW (2) TW201438290A (en)
WO (1) WO2014155863A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015024571A (en) * 2013-07-26 2015-02-05 日東電工株式会社 Sheet manufacturing method and sheet manufacturing apparatus
KR101475863B1 (en) * 2013-09-24 2014-12-23 (주)파워보이스 Device and method for outputting sound wave, and mobile device and method for generating control information corresponding to the sound wave

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101383295A (en) * 2007-09-03 2009-03-11 日东电工株式会社 Process for producing optical semiconductor device and slice used in same process
JP2009197185A (en) * 2008-02-25 2009-09-03 Hitachi Chem Co Ltd Transparent thermal conductive adhesive film and its application
JP2010067641A (en) * 2008-09-08 2010-03-25 Nitto Denko Corp Sheet for sealing optical semiconductor element and optical semiconductor device using the same
CN101798490A (en) * 2009-02-06 2010-08-11 信越化学工业株式会社 Adhesive composite, adhesive sheet, cutting-die attach film and semiconductor device
CN101864249A (en) * 2009-04-17 2010-10-20 古河电气工业株式会社 Adhesive film and wafer processing tape
CN102097341A (en) * 2009-12-10 2011-06-15 日东电工株式会社 Manufacturing method for semiconductor device
JP2011228525A (en) * 2010-04-21 2011-11-10 Nitto Denko Corp Optical semiconductor device
CN102270728A (en) * 2010-06-07 2011-12-07 日东电工株式会社 Encapsulating sheet for optical semiconductor
WO2013030998A1 (en) * 2011-08-31 2013-03-07 日立化成工業株式会社 Resin composition, resin sheet, resin sheet with metal foil, hardened resin sheet, structure, and semiconductor device for power or light source

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4018438B2 (en) * 2002-04-30 2007-12-05 キヤノン株式会社 Management system for managing semiconductor exposure equipment
US20050086120A1 (en) * 2003-10-16 2005-04-21 Taiwan Semiconductor Manufacturing Co., Ltd. Method of managing subcontracting for backend outsourcing business
JP5080881B2 (en) * 2007-06-27 2012-11-21 ナミックス株式会社 Method for manufacturing sealed body of light emitting diode chip
JP4915869B2 (en) * 2007-10-17 2012-04-11 日東電工株式会社 Manufacturing method of optical semiconductor device
JP5064254B2 (en) * 2008-01-30 2012-10-31 日東電工株式会社 Resin sheet for optical semiconductor element sealing and optical semiconductor device
JP5078644B2 (en) * 2008-02-06 2012-11-21 日東電工株式会社 Resin sheet for optical semiconductor element sealing and optical semiconductor device
JP5064278B2 (en) * 2008-03-25 2012-10-31 日東電工株式会社 Resin sheet for optical semiconductor element sealing and optical semiconductor device
JP5190993B2 (en) * 2008-11-20 2013-04-24 日東電工株式会社 Sheet for optical semiconductor encapsulation
JP5107886B2 (en) * 2008-12-24 2012-12-26 日東電工株式会社 Manufacturing method of optical semiconductor device
JP5366587B2 (en) * 2009-02-20 2013-12-11 日東電工株式会社 Processed sheet for optical semiconductor encapsulation
JP5744386B2 (en) * 2009-10-07 2015-07-08 日東電工株式会社 Optical semiconductor encapsulant
JP5340191B2 (en) * 2010-02-02 2013-11-13 日東電工株式会社 Optical semiconductor device
JP5716227B2 (en) * 2010-12-17 2015-05-13 アピックヤマダ株式会社 Resin molding equipment

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101383295A (en) * 2007-09-03 2009-03-11 日东电工株式会社 Process for producing optical semiconductor device and slice used in same process
JP2009197185A (en) * 2008-02-25 2009-09-03 Hitachi Chem Co Ltd Transparent thermal conductive adhesive film and its application
JP2010067641A (en) * 2008-09-08 2010-03-25 Nitto Denko Corp Sheet for sealing optical semiconductor element and optical semiconductor device using the same
CN101798490A (en) * 2009-02-06 2010-08-11 信越化学工业株式会社 Adhesive composite, adhesive sheet, cutting-die attach film and semiconductor device
CN101864249A (en) * 2009-04-17 2010-10-20 古河电气工业株式会社 Adhesive film and wafer processing tape
CN102097341A (en) * 2009-12-10 2011-06-15 日东电工株式会社 Manufacturing method for semiconductor device
JP2011228525A (en) * 2010-04-21 2011-11-10 Nitto Denko Corp Optical semiconductor device
CN102270728A (en) * 2010-06-07 2011-12-07 日东电工株式会社 Encapsulating sheet for optical semiconductor
WO2013030998A1 (en) * 2011-08-31 2013-03-07 日立化成工業株式会社 Resin composition, resin sheet, resin sheet with metal foil, hardened resin sheet, structure, and semiconductor device for power or light source

Also Published As

Publication number Publication date
CN104932430A (en) 2015-09-23
TWI447967B (en) 2014-08-01
WO2014155863A1 (en) 2014-10-02
TW201438290A (en) 2014-10-01
JP2014192503A (en) 2014-10-06
CN104155939A (en) 2014-11-19
JP5373215B1 (en) 2013-12-18
KR20150134341A (en) 2015-12-01
TW201417351A (en) 2014-05-01

Similar Documents

Publication Publication Date Title
CN1702141B (en) Mold compound with fluorescent material and a light-emitting device made therefrom
JP5766411B2 (en) Phosphor layer and light emitting device
CN104185908B (en) For the phosphor in the inorganic bonding agent of LED applications
CN104428880A (en) Production method for sealing layer-coated semiconductor element and semiconductor device
CN103155187A (en) Optoelectronic semiconductor component and method for producing same
CN103311414A (en) Phosphor encapsulating sheet, light emitting diode device, and producing method thereof
JP5427709B2 (en) Phosphor layer transfer sheet and light emitting device
CN103154146A (en) Phosphor-containing sheet, led light emitting device using same, and method for manufacturing led light emitting device
CN103715344A (en) Phosphor layer attaching kit, optical semiconductor element-phosphor layer attaching body, and optical semiconductor device
KR20130029348A (en) Encapsulating sheet, producing method thereof, light emitting diode device, and producing method thereof
CN103715335A (en) Phosphor adhesive sheet, optical semiconductor element-phosphor layer pressure-sensitive adhesive body, and optical semiconductor device
JP2020184641A (en) Manufacturing method of optoelectronic component and optoelectronic component
CN106661425A (en) Silicone-based sealant composition and semiconductor light-emitting device
CN109690181A (en) Thin slice is used in optical-semiconductor element covering
CN106233475A (en) Wavelength converting member and manufacture method thereof
TWI659834B (en) Laminate body and method for producing light-emitting device using the same
CN104076760A (en) Remote control system, central control device, client and information acquisition device
KR20210008412A (en) Conversion element manufacturing method, conversion element and light emitting device
CN104995755A (en) Manufacturing method for optical semiconductor device
CN103959488B (en) System, manufacturing condition determination device and manufacturing management device
CN105408989A (en) Method for producing sealed semiconductor element and method for manufacturing semiconductor device
CN103855289A (en) Encapsulating sheet, optical semiconductor device, and producing method thereof
CN203150612U (en) Light-emitting unit assembly and lighting device
CN103296177A (en) Light-emitting device, lighting device, light-emitting device assembly and method for manufacturing light-emitting device
KR20160072109A (en) Phosphor-sheet evaluation method and manufacturing method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141001

WD01 Invention patent application deemed withdrawn after publication