CN104144593A - Heat dissipation device of electronic element - Google Patents

Heat dissipation device of electronic element Download PDF

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Publication number
CN104144593A
CN104144593A CN201310300697.XA CN201310300697A CN104144593A CN 104144593 A CN104144593 A CN 104144593A CN 201310300697 A CN201310300697 A CN 201310300697A CN 104144593 A CN104144593 A CN 104144593A
Authority
CN
China
Prior art keywords
metallic sheath
electronic element
heat dissipation
metal sheath
dissipation device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310300697.XA
Other languages
Chinese (zh)
Inventor
宋刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHENGDU JINGRONG ELECTRONICS Co Ltd
Original Assignee
CHENGDU JINGRONG ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHENGDU JINGRONG ELECTRONICS Co Ltd filed Critical CHENGDU JINGRONG ELECTRONICS Co Ltd
Priority to CN201310300697.XA priority Critical patent/CN104144593A/en
Publication of CN104144593A publication Critical patent/CN104144593A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a heat dissipation device of an electronic element. The heat dissipation device of the electronic element comprises a metal sheath, finned heat dissipation holes are formed in the outer wall of the metal sheath, drum films are arranged on openings in one end of the metal sheath, a cooling solution is arranged in the metal sheath, metal cooling fins are further arranged on the metal sheath and placed in the cooling solution, and the other end of the metal sheath is detachably connected with the electronic element. Through structural improvement, the heat dissipation device of the electronic element is simple in structure and has the dual heat dissipation effect.

Description

A kind of heat radiator of electronic element
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of heat radiator of electronic element.
Background technology
In the prior art, along with scientific and technological innovation, electronic information is moulding gradually, all kinds of electronic components are used in daily life or industrial circle, electronic component is because need to provide the energy by electric power, so electronic component can produce a large amount of heating power when operation, these heating power need to dissipate in time, not so can damage electronic component.
Summary of the invention
For above-mentioned the deficiencies in the prior art part, the invention provides a kind of heat radiator of electronic element, effectively solved the problem that above-mentioned prior art exists.
To achieve these goals, the technical solution used in the present invention is: a kind of heat radiator of electronic element, comprise metallic sheath, described metallic sheath outer wall has fin type louvre, the opening of metallic sheath one end is provided with eardrum, and metallic sheath inside is provided with cooling solution, is also provided with metal fin on metallic sheath, metal fin is as in cooling solution, and the metallic sheath other end is connected with electronic element dismounting.
As preferably, described metallic sheath and electronic component are laminating.
As preferably, described fin type louvre is several, along metallic sheath height, arranges.
Compared with prior art, this beneficial effect of the invention: the present invention is by the improvement of structure, than prior art, radiating effect is more superior, stability is stronger, by the setting of fin type louvre, accomplishes double-radiation function.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Below in conjunction with drawings and the specific embodiments, the present invention is described in further detail.
Referring to Fig. 1, a kind of electronic component 6 heat abstractors, comprise metallic sheath 1, described metallic sheath 1 outer wall has fin type louvre 3, in the present embodiment, described fin type louvre 3 is several, along metallic sheath 1, highly arrange, the opening of metallic sheath 1 one end is provided with eardrum 4, and metallic sheath 1 inside is provided with cooling solution, is also provided with metal fin 2 on metallic sheath 1, metal fin 2 is as in cooling solution, metallic sheath 1 other end is connected with electronic component 6 dismountings, and in the present embodiment, described metallic sheath 1 is laminating with electronic component 6.
Fin type louvre 3 of the present invention can any shape be arranged on metallic sheath 1, and by the setting of fin type louvre 3, the present invention has the function of double-radiation function.

Claims (3)

1. a heat radiator of electronic element, comprise metallic sheath, it is characterized in that: described metallic sheath outer wall has fin type louvre, the opening of metallic sheath one end is provided with eardrum, metallic sheath inside is provided with cooling solution, on metallic sheath, be also provided with metal fin, metal fin is connected with electronic element dismounting as for the metallic sheath other end in cooling solution.
2. a kind of heat radiator of electronic element according to claim 1, is characterized in that: described metallic sheath and electronic component are laminating.
3. a kind of heat radiator of electronic element according to claim 1, is characterized in that: described fin type louvre is several, along metallic sheath height, arranges.
CN201310300697.XA 2013-07-18 2013-07-18 Heat dissipation device of electronic element Pending CN104144593A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310300697.XA CN104144593A (en) 2013-07-18 2013-07-18 Heat dissipation device of electronic element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310300697.XA CN104144593A (en) 2013-07-18 2013-07-18 Heat dissipation device of electronic element

Publications (1)

Publication Number Publication Date
CN104144593A true CN104144593A (en) 2014-11-12

Family

ID=51853627

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310300697.XA Pending CN104144593A (en) 2013-07-18 2013-07-18 Heat dissipation device of electronic element

Country Status (1)

Country Link
CN (1) CN104144593A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101610664A (en) * 2008-06-20 2009-12-23 萨帕铝型材(上海)有限公司 Liquid chiller and manufacture method thereof
CN102128438A (en) * 2011-02-24 2011-07-20 天津市中环晶瑞电子有限公司 High-power LED illumination lamp metal radiator and manufacturing method
CN202839753U (en) * 2012-09-05 2013-03-27 重庆三弓科技发展有限公司 Liquid radiator for electronic component

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101610664A (en) * 2008-06-20 2009-12-23 萨帕铝型材(上海)有限公司 Liquid chiller and manufacture method thereof
CN102128438A (en) * 2011-02-24 2011-07-20 天津市中环晶瑞电子有限公司 High-power LED illumination lamp metal radiator and manufacturing method
CN202839753U (en) * 2012-09-05 2013-03-27 重庆三弓科技发展有限公司 Liquid radiator for electronic component

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141112

WD01 Invention patent application deemed withdrawn after publication