CN104143588B - 一种太阳能电池用n型硅片的表面钝化方法及其产品和应用 - Google Patents
一种太阳能电池用n型硅片的表面钝化方法及其产品和应用 Download PDFInfo
- Publication number
- CN104143588B CN104143588B CN201410351677.XA CN201410351677A CN104143588B CN 104143588 B CN104143588 B CN 104143588B CN 201410351677 A CN201410351677 A CN 201410351677A CN 104143588 B CN104143588 B CN 104143588B
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- type silicon
- passivation
- graphene oxide
- graphene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 84
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 84
- 239000010703 silicon Substances 0.000 title claims abstract description 84
- 238000002161 passivation Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 28
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 62
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 52
- 238000004528 spin coating Methods 0.000 claims abstract description 13
- 238000001338 self-assembly Methods 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 14
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 239000006185 dispersion Substances 0.000 claims description 11
- 239000008367 deionised water Substances 0.000 claims description 10
- 229910021641 deionized water Inorganic materials 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000002356 single layer Substances 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 6
- ZUHZZVMEUAUWHY-UHFFFAOYSA-N n,n-dimethylpropan-1-amine Chemical compound CCCN(C)C ZUHZZVMEUAUWHY-UHFFFAOYSA-N 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 239000008246 gaseous mixture Substances 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 150000001336 alkenes Chemical class 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 229920005591 polysilicon Polymers 0.000 description 6
- 239000000976 ink Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000006388 chemical passivation reaction Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 229910052593 corundum Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 238000010301 surface-oxidation reaction Methods 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 102100021765 E3 ubiquitin-protein ligase RNF139 Human genes 0.000 description 1
- 101001106970 Homo sapiens E3 ubiquitin-protein ligase RNF139 Proteins 0.000 description 1
- 101100247596 Larrea tridentata RCA2 gene Proteins 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 125000001967 indiganyl group Chemical group [H][In]([H])[*] 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1868—Passivation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Abstract
本发明公开了一种太阳能电池用N型硅片的表面钝化方法,包括以下步骤:首先对N型硅片表面进行亲水处理,再通过旋涂或层层自组装的方法在亲水处理后的N型硅片表面制备厚度可控的超薄氧化石墨烯薄膜,最后经热处理得到钝化后的硅片。本发明还公开了制备得到的钝化后的硅片在太阳能电池,尤其是在硅-石墨烯原型电池中的应用。本发明提供了一种太阳能电池用N型硅片的表面钝化方法,通过溶液法在硅片表面形成氧化石墨烯超薄(<3nm)钝化薄膜,该薄膜可以较好地钝化硅的表面,并且允许载流子自由遂穿,将其应用在硅-石墨烯原型电池上,可以明显提高电池的转换效率。
Description
技术领域
本发明涉及太阳能电池的技术领域,特别涉及一种太阳能电池用N型硅片的表面钝化方法及其产品和应用。
背景技术
硅太阳电池是可将太阳能转化为电能的器件,其工作原理是光生电子、空穴在电池内建电场作用下分离而产生电流。然而,被分离的电子,空穴在到达电极前,仍有一定的几率发生复合导致电流损失,降低太阳能电池的效率。硅太阳电池结构中,最易引起电子、空穴复合的是硅的表面,要获得较高的电池效率,硅表面的钝化至关重要。
表面钝化有化学钝化和场钝化两种方式,化学钝化通过减少半导体表面处的悬挂键,减少表面的复合中心来降低载流子在表面的复合,场钝化则通过使表面处的某一种载流子浓度减少来降低载流子在表面的复合。
目前,常用介电薄膜(如SiO2、SiNx、Al2O3)等来钝化硅的表面,这些介电薄膜一般兼具化学钝化和场钝化的功能(因其与硅接触的界面处带有固定电荷)。例如,公开号为CN102569531A的中国专利文献中公开了一种Al2O3介电薄膜钝化多晶硅片的方法:a、将多晶硅片背面抛光;b、将多晶硅片背面用化学试剂清洗后,淋干水滴;c、低温处理,在80-90℃下将硅片烘干,烘干时间为1h;d、使用PECVD法对多晶硅片进行等离子体Al2O3薄膜的沉积,沉积的Al2O3薄膜厚度约后在硅片表面形成厚度小于2nm的SiO2薄膜层;e、热处理,将沉积后的多晶硅片在400℃下进行退火处理;f、测试,对多晶硅片进行稳定状态下的少子寿命测试。
此类介电薄膜钝化层一般使用物理法形成,需要使用特定的真空设备且工艺比较复杂。更重要的是,形成的介电薄膜厚度一般在几十到上百纳米,否则其钝化效果会急剧下降。此类较厚的钝化层不适用于基于隧穿结的太阳电池,如商业化的HIT电池和研发领域的肖特基结电池(如硅-石墨烯原型电池)。对此类新型的隧穿结太阳电池,成膜工艺简单的超薄钝化膜(<3nm)具有重要的意义。
发明内容
本发明提供了一种太阳能电池用N型硅片的表面钝化方法,通过溶液法在硅片表面形成氧化石墨烯的钝化薄膜,所述薄膜可以较好地钝化硅的表面,并且允许载流子自由隧穿,将其应用在硅-石墨烯原型电池上,可以明显提高电池的效率。
本发明公开了一种太阳能电池用N型硅片的表面钝化方法,包括以下步骤:
(1)N型硅片表面的亲水处理;
(2)通过旋涂或层层自组装的方法在亲水处理后的N型硅片表面制备氧化石墨烯薄膜,再经热处理得到钝化后的N型硅片。
步骤(1)中,N型硅片在经亲水处理前,先进行化学清洗处理。
所述的硅片表面的亲水处理可以采用以下方法中的任意一种:
a、在RCA1溶液(NH4OH、H2O2和去离子水混合液,体积比为1:1~2:5~7)中浸泡5~15min;
b、在RCA2溶液(HCl、H2O2和去离子水混合液,体积比为1:1~2:6~8)中浸泡5~15min;
c、在30wt%的H2O2溶液中浸泡5~15min;
d、在H2SO4和H2O2混合液(体积比为1~5:1)中浸泡1~5min;
e、在10wt%的稀硝酸溶液中浸泡2~5min;
f、在68wt%的浓硝酸溶液中浸泡1~3min。
作为优选,步骤(2)所述的旋涂方法,具体步骤为:
a、配制0.005~0.1mg/ml的氧化石墨烯分散液,分散介质为去离子水、乙醇、异丙醇中的至少一种;
b、将步骤a制备的氧化石墨烯分散液滴在亲水处理后的N型硅片表面,铺展后,在N型硅片表面旋涂形成氧化石墨烯薄膜,旋涂转速为500~3000rpm,时间为30~60s,氧化石墨烯薄膜的厚度可通过旋涂的次数控制。
通过控制旋涂的次数可以精确的调控N型硅片表面形成氧化石墨烯薄膜的厚度。
作为优选,步骤(2)所述的层层自组装的方法,具体步骤为:
a、配制2wt%的聚二烯丙基二甲基胺盐酸盐溶液A,加入NaOH溶液或氨水调节pH值为8~10;
b、配制0.1~1mg/ml的氧化石墨烯分散液B,分散介质为去离子水,加入NaOH溶液或氨水调节pH值为8~10;
c、将表面经过亲水处理的N型硅片浸入到溶液A中10~30min,在N型硅片表面自组装一层带正电荷的聚二烯丙基二甲基胺单分子层;
d、用去离子水洗净硅片表面后,再将N型硅片浸入分散液B中10~30min,在N型硅片表面自组装一层带负电荷的氧化石墨烯单分子层;
e、重复在溶液A和分散液B中的浸渍过程,N型硅片表面形成厚度可控的氧化石墨烯薄膜。
通过调控N型硅片在溶液A和分散液B中浸渍的次数,可以精确的调控硅片表面形成氧化石墨烯薄膜的厚度。
作为优选,所述的热处理气氛为空气、O2、N2或H2/Ar混合气,热处温度为200~500℃,时间为0.5~2h。
本发明还公开了所述的钝化后的硅片在太阳能电池中的应用,优选为在硅-石墨烯原型电池中的应用。
作为优选,所述硅-石墨烯原型电池的结构依次为背面铝电极、沉积有氧化石墨烯钝化层的N型硅片衬底、单层石墨烯层和正面银电极。所述氧化石墨烯钝化层的厚度小于3nm。
与现有技术相比,本发明具有如下优点:
用简单的溶液旋涂或自组装方法,可形成厚度可控的超薄氧化石墨烯薄膜,所述的氧化石墨烯薄膜可有效地钝化硅表面,同时允许载流子自由隧穿;将沉积有氧化石墨烯薄膜的N型硅片应用在硅-石墨烯原型电池上,可以明显提高电池的效率。
附图说明
图1是实施例1制备的Si表面氧化石墨烯薄膜的AFM图像;
图2是实施例2制备的Si表面氧化石墨烯薄膜的AFM图像;
图3是实施例1制备的氧化石墨烯薄膜钝化前后硅片的少数载流子寿命
面扫描图及数值统计分布图;
图4是以实施例2中制备的氧化石墨烯薄膜钝化前后的硅片组装的硅-石
墨烯原型太阳电池的电流密度-电压曲线;
图5是以实施例2中制备的氧化石墨烯薄膜钝化前后的硅片组装的硅-石
墨烯原型太阳电池的外量子效率曲线。
具体实施方式
实施例1
a、经化学清洗的N型硅片在H2SO4和H2O2混合液(体积比为1:4)中浸泡2min,使硅表面形成一层极薄的氧化硅而使其亲水,此为氧化石墨烯薄膜钝化前的硅片;
b、配制0.01mg/ml的氧化石墨烯分散液,分散介质为乙醇;
c、将氧化石墨烯分散液滴在亲水处理后的硅片表面,铺展后,在硅片表面旋涂形成氧化石墨烯薄膜,旋涂转速为1000rpm,时间为30s;
d、将硅片在N2氛围中,400℃热处理1h。
图1为本实施例制备的钝化硅片表面氧化石墨烯薄膜的AFM图像,从图中可知,氧化石墨烯薄膜的厚度约为0.8nm。
图3为本实施例制备的钝化前、后硅片的少数载流子寿命面扫描图及数值统计分布图,从图中可知,硅片的有效少子寿命从钝化前的12μs提高到钝化后的33μs,对应的表面复合速度从钝化前的1667cm/s降低到钝化后的600cm/s。
实施例2
a、经化学清洗的N型硅片在H2SO4和H2O2混合液(体积比为1:4)中浸泡2min,使硅表面形成一层极薄的氧化硅而使其亲水,此为氧化石墨烯薄膜钝化前的硅片;
b、配制1wt%的聚二烯丙基二甲基胺盐酸盐溶液(A),加入NaOH溶液或氨水调节pH值为10;
c、配制1mg/ml的氧化石墨烯分散液(B),分散介质为去离子水,加入NaOH溶液或氨水调节pH值为10;
d、将表面经过亲水处理的硅片浸入到溶液A中30min,在硅片表面自组装一层带正电荷的聚二烯丙基二甲基胺单分子层;
e、用去离子水洗净硅片表面后,再将硅片浸入溶液B中30min,在硅片表面自组装一层带负电荷的氧化石墨烯单分子层;
f、重复在溶液A、B中的浸渍过程3次,在硅片表面形成氧化石墨烯薄膜。
g、将硅片在H2/Ar混合气氛围中,400℃热处理1h。
图2为本实施例制备的钝化硅片表面氧化石墨烯薄膜的AFM图像,从图中可知,氧化石墨烯薄膜的厚度约为2.4nm。
应用例
以实施例2中制备的氧化石墨烯薄膜钝化前、后的硅片来组装硅-石墨烯原型太阳电池,步骤为:在氧化石墨烯薄膜钝化前、后的300μm厚N型硅片表面转移一片6mm×6mm的单层石墨烯;在硅片背面热蒸发200nm的铝形成背面电极,在石墨烯上热蒸发200nm的银作为正面电极,分别得到氧化石墨烯薄膜钝化前、后的硅片组装的硅-石墨烯原型太阳电池。
图4为以实施例2中制备的钝化前、后的硅片组装硅-石墨烯原型太阳电池的电流密度-电压曲线,从图4可知,用氧化石墨烯薄膜钝化的硅片为基底组装的硅-石墨烯电池的短路电流,开路电压和填充因子和用未钝化的硅片为基底组装的电池相比,都有大幅提升,使电池效率从1.8%提高到6.2%。
图5为以实施例2中制备的钝化前、后的硅片组装硅-石墨烯原型太阳电池的外量子效率曲线,从图5可知,氧化石墨烯钝化后,太阳电池的外量子效率明显提高,进一步证实了氧化石墨烯薄膜的钝化效应。
Claims (6)
1.一种太阳能电池用N型硅片的表面钝化方法,其特征在于,包括以下步骤:
(1)N型硅片表面亲水处理;
(2)通过旋涂或层层自组装的方法在亲水处理后的N型硅片表面制备氧化石墨烯薄膜,再经热处理得到钝化后的N型硅片;
所述的旋涂方法,具体步骤为:
a、配制0.005~0.1mg/ml的氧化石墨烯分散液,分散介质为去离子水、乙醇、异丙醇中的至少一种;
b、将步骤a制备的氧化石墨烯分散液滴在亲水处理后的N型硅片表面,铺展后,在N型硅片表面旋涂形成氧化石墨烯薄膜,旋涂转速为500~3000rpm,时间为30~60s,氧化石墨烯薄膜的厚度可通过旋涂的次数实现控制;
所述的层层自组装方法,具体步骤为:
a、配制0.1~2wt%的聚二烯丙基二甲基胺盐酸盐溶液A,加入NaOH溶液或氨水调节pH值为8~10;
b、配制0.1~1mg/ml的氧化石墨烯分散液B,分散介质为去离子水,加入NaOH溶液或氨水调节pH值为8~10;
c、将表面经过亲水处理的N型硅片浸入到溶液A中10~30min,在N型硅片表面自组装一层带正电荷的聚二烯丙基二甲基胺单分子层;
d、用去离子水洗净硅片表面后,再将N型硅片浸入分散液B中10~30min,在N型硅片表面自组装一层带负电荷的氧化石墨烯单分子层;
e、重复在溶液A和分散液B中的浸渍过程,N型硅片表面形成厚度可控的氧化石墨烯薄膜。
2.根据权利要求1所述的钝化方法,其特征在于,所述的热处理气氛为空气、O2、N2或H2/Ar混合气,热处理温度为200~500℃,热处理时间为0.5~2h。
3.一种根据权利要求1所述的表面钝化方法制备得到钝化后的N型硅片。
4.一种根据权利要求3所述的表面钝化后的N型硅片在太阳能电池中的应用。
5.根据权利要求4所述的应用,其特征在于,所述的太阳能电池为硅-石墨烯原型电池。
6.根据权利要求5所述的应用,其特征在于,所述硅-石墨烯原型电池的结构依次为背面铝电极、沉积有氧化石墨烯钝化层的N型硅片衬底、单层石墨烯层和正面银电极。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410351677.XA CN104143588B (zh) | 2014-07-23 | 2014-07-23 | 一种太阳能电池用n型硅片的表面钝化方法及其产品和应用 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410351677.XA CN104143588B (zh) | 2014-07-23 | 2014-07-23 | 一种太阳能电池用n型硅片的表面钝化方法及其产品和应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104143588A CN104143588A (zh) | 2014-11-12 |
CN104143588B true CN104143588B (zh) | 2016-05-11 |
Family
ID=51852721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410351677.XA Expired - Fee Related CN104143588B (zh) | 2014-07-23 | 2014-07-23 | 一种太阳能电池用n型硅片的表面钝化方法及其产品和应用 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104143588B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108221057B (zh) * | 2018-01-18 | 2020-05-08 | 西安润威光电科技有限公司 | 利用氧化石墨烯基晶硅制绒添加剂制备硅太阳能电池绒面的方法 |
CN109004054B (zh) * | 2018-07-11 | 2020-04-17 | 华中科技大学 | 一种硫化钼薄膜异质结太阳能电池及其制造方法 |
CN110246923B (zh) * | 2019-06-29 | 2024-05-28 | 深圳黑晶光电技术有限公司 | 一种串联型钙钛矿/同质结硅叠层太阳能电池及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2362459A1 (en) * | 2010-02-24 | 2011-08-31 | University College Cork-National University of Ireland, Cork | Modified graphene structure and method of manufacture thereof |
JP5582638B2 (ja) * | 2010-02-25 | 2014-09-03 | 独立行政法人産業技術総合研究所 | 太陽電池 |
US8900538B2 (en) * | 2011-07-31 | 2014-12-02 | International Business Machines Corporation | Doped, passivated graphene nanomesh, method of making the doped, passivated graphene nanomesh, and semiconductor device including the doped, passivated graphene nanomesh |
CN103746017B (zh) * | 2014-01-07 | 2017-11-14 | 中国科学院过程工程研究所 | 一种太阳能电池及其制备方法 |
-
2014
- 2014-07-23 CN CN201410351677.XA patent/CN104143588B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN104143588A (zh) | 2014-11-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105810779B (zh) | 一种perc太阳能电池的制备方法 | |
CN106992229A (zh) | 一种perc电池背面钝化工艺 | |
CN104143588B (zh) | 一种太阳能电池用n型硅片的表面钝化方法及其产品和应用 | |
CN107946471A (zh) | 一种基于硅纳米线阵列的异质结光伏电池及其制备方法 | |
CN103681965A (zh) | 柔性基底硅纳米线异质结太阳电池的制备方法 | |
CN102140037B (zh) | 实现氧化锌纳米线自组装的方法 | |
CN114335237B (zh) | 一种晶体硅太阳能电池的制备方法及晶体硅太阳能电池 | |
CN112152509B (zh) | 一种基于动态二极管的直流发电机及其制备方法 | |
CN102646751A (zh) | 具有超低纳米减反结构准黑硅高效太阳能电池的制备方法 | |
CN104638031A (zh) | 基于GaN纳米线阵列的太阳能电池及其制备方法 | |
CN102522505B (zh) | 无机与有机混合太阳能电池 | |
CN104681670A (zh) | 太阳能电池表面钝化方法 | |
CN113921649A (zh) | 一种硅基异质结太阳能电池制备方法 | |
CN111725350A (zh) | 一种提升太阳电池中多晶硅钝化接触结构钝化性能的方法 | |
CN107988615B (zh) | 一种氮化碳修饰ZnO/CdS光阳极材料的制备及应用 | |
Srivastava et al. | Nanostructured black silicon for efficient thin silicon solar cells: potential and challenges | |
CN114038924A (zh) | 一种基于rie等离子刻蚀制绒的背接触异质结太阳电池 | |
CN114038945A (zh) | 一种单面ald方式制备新型perc电池的方法 | |
CN105378938A (zh) | 太阳能电池的制造方法 | |
Kim et al. | Ultrathin SiO 2/Al 2 O 3 passivation for silicon heterojunctions using rapid thermal annealing | |
CN102610661A (zh) | 单晶硅太阳能电池前表面用叠层复合钝化膜 | |
CN114420767A (zh) | 太阳能电池的制备方法及太阳能电池 | |
Cui et al. | Light-induced anodisation of aluminium for rear surface passivation of silicon solar cells | |
Chen et al. | Nafion Passivation of c-Si Surface and Edge for Electron Paramagnetic Resonance | |
CN114038920B (zh) | 一种超高效的交叉指式背接触异质结太阳电池 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160511 Termination date: 20180723 |
|
CF01 | Termination of patent right due to non-payment of annual fee |