CN104140299A - Low-cost surface-metallized ceramic - Google Patents
Low-cost surface-metallized ceramic Download PDFInfo
- Publication number
- CN104140299A CN104140299A CN201410365607.XA CN201410365607A CN104140299A CN 104140299 A CN104140299 A CN 104140299A CN 201410365607 A CN201410365607 A CN 201410365607A CN 104140299 A CN104140299 A CN 104140299A
- Authority
- CN
- China
- Prior art keywords
- parts
- low
- metallized
- powder
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses low-cost surface-metallized ceramic which is characterized by comprising, by weight, 15-60 parts of iron-based brazing filler metal, 31-81 parts of talcum powder, 1-5 parts of strontium oxide, 1.5-11.8 parts of molybdenum disulfide, 5-11 parts of silicon dioxide, 12-30 parts of organosilicone modified phenolic resin, 25-60 parts of graphite, 20-60 parts of trumpet shell powder, 1.5-3 parts of sodium fluosilicate, 40-50 parts of Xuyong soil, 4.5-7.6 parts of titanium oxide, 15-31 parts of titanium alloy, 1-8 parts of ficus microcarpa bits and 1-40 parts of chitin. The low-cost surface-metallized ceramic has the advantages that the metallization process is simplified, production cost is lowered, the utilization rate of metallized alloy is improved, due to the fact that liquid metallized alloy is better in fluidity than powder, spreading is facilitated, and the thickness of films is more even.
Description
Technical field
The present invention relates to a kind of pottery of low-cost surface metalation.
Background technology
That pottery has is high temperature resistant, high strength, high rigidity, high-wearing feature, high many good performances such as anticorrosive, and still, pottery is poor toughness at normal temperatures, is difficult to prepare the part of complicated shape.Only have the obdurability of metal and ceramic wear resistance, erosion resistance, high thermal resistance are combined, just can become desirable structured material.Generally need to could link together with metal at ceramic surface metallization.
At present, for the method for ceramic surface pre-metallization, mainly containing method is that molybdenum powder and oxidation manganese powder are hybridly prepared into slurry, is coated in ceramic surface, then at 1500 ℃ of sintering, at ceramic surface, forms metal molybdenum layer.The method belongs to high temperature conjunction, and it will inevitably bring following problem:
(1) equipment requirements is strict;
(2) large size and baroque joint easily produce large internal stress;
(3) connect temperature and surpass multiple Mo-Mn method, electroless plating and vapour deposition etc.The method is high to equipment requirements, manufacturing cost is high.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of pottery of low-cost surface metalation.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
A pottery for low-cost surface metalation, is characterized in that, comprises the material of following parts by weight: iron-based solder 15-60 part, talcum powder 31-81 part, strontium oxide 1-5 part, molybdenumdisulphide 1.5-11.8 part, silicon-dioxide 5-11 part, Effect of Organosilicon-modified Phenol-formaldehyde Resin 12-30 part, graphite 25-60 part, Concha rapanae thomasianae powder 20-60 part, Sodium Silicofluoride 1.5-3 part, Xuyong soil 40-50 part, titanium oxide 4.5-7.6 part, titanium alloy 15-31 part, banyan wood chip 1-8 part, chitin 1-40 part.
The invention has the beneficial effects as follows: the present invention not only makes metallization process be simplified, reduced production cost, and having improved the utilization ratio of metallization alloy, liquid metal alloy is compared powdery and is had better mobility this is beneficial to it and sprawls, and the thickness of rete is more even.
Embodiment
Embodiment 1
A pottery for low-cost surface metalation, comprises the material of following parts by weight: 35 parts of iron-based solders, 36 parts of talcum powder, 2 parts of strontium oxides, 7 parts of molybdenumdisulphide, 5 parts of silicon-dioxide, 12 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resins, 25 parts, graphite, 20 parts, Concha rapanae thomasianae powder, 3 parts of Sodium Silicofluorides, 50 parts, Xuyong soil, 7.6 parts of titanium oxide, 31 parts of titanium alloys, 8 parts of banyan wood chips, 25 parts of chitins.
Claims (1)
1. a pottery for low-cost surface metalation, is characterized in that, comprises the material of following parts by weight: iron-based solder 15-60 part, talcum powder 31-81 part, strontium oxide 1-5 part, molybdenumdisulphide 1.5-11.8 part, silicon-dioxide 5-11 part, Effect of Organosilicon-modified Phenol-formaldehyde Resin 12-30 part, graphite 25-60 part, Concha rapanae thomasianae powder 20-60 part, Sodium Silicofluoride 1.5-3 part, Xuyong soil 40-50 part, titanium oxide 4.5-7.6 part, titanium alloy 15-31 part, banyan wood chip 1-8 part, chitin 1-40 part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410365607.XA CN104140299A (en) | 2014-07-30 | 2014-07-30 | Low-cost surface-metallized ceramic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410365607.XA CN104140299A (en) | 2014-07-30 | 2014-07-30 | Low-cost surface-metallized ceramic |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104140299A true CN104140299A (en) | 2014-11-12 |
Family
ID=51849652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410365607.XA Pending CN104140299A (en) | 2014-07-30 | 2014-07-30 | Low-cost surface-metallized ceramic |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104140299A (en) |
-
2014
- 2014-07-30 CN CN201410365607.XA patent/CN104140299A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101545057B (en) | Method for preparing diamond/Cu composite material with high heat conductivity | |
CN101168807B (en) | High heat conductivity copper-base composite material and preparation method thereof | |
CN103819214B (en) | AlN ceramic bonded copper substrate and preparation method thereof | |
CN102586704B (en) | Preparation method of high thermal conductivity graphite whisker/copper composite | |
CN101181749A (en) | Atomized alloyed powder substituting cobalt and nickel in diamond tools | |
CN102586703B (en) | Method for preparing graphite whisker reinforced aluminum matrix composite material | |
CN104409425A (en) | High-thermal-conductivity silicon nitride ceramic copper-clad plate and manufacturing method thereof | |
WO2008081758A1 (en) | Process for producing metallized aluminum nitride substrate | |
CN105585326B (en) | A kind of technique of nanometer of foil diffusion connection carbon/silicon carbide ceramic matrix composite | |
CN101332545A (en) | Active solder and preparation method thereof | |
CN105585328A (en) | Technology for connecting SiC ceramic matrix composite and metal through nano foil | |
CN103332942A (en) | Low temperature sintered Ni metal fiber composite ceramic substrate | |
CN102226245B (en) | Ceramic alloy material, and application thereof in ceramic-to-metal sealed electrode | |
CN102430744B (en) | Casting process of highly-abrasionproof composite lining plate | |
CN105948779A (en) | Preparation method of silicon nitride ceramic/metal composite plate | |
CN104140299A (en) | Low-cost surface-metallized ceramic | |
CN106083090A (en) | One does not glue aluminum castable | |
CN105152654A (en) | Ceramic material for high-temperature-resistant components and preparation method of ceramic material | |
CN107838576A (en) | A kind of microwave magnetron sealing alloy solder | |
CN103864467B (en) | A kind of ceramic surface metallization method | |
CN104008787A (en) | High-temperature-resistant tinned copper wire | |
CN101624665A (en) | Preparation method of tungsten-plated SiC particle reinforced copper-based composite material used for electronic packaging | |
CN104177132A (en) | Surface metallized ceramic | |
CN104140300A (en) | Low-cost ceramic | |
CN104876647A (en) | Tungsten metalizing process of ceramic tube for ceramic discharge tube |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141112 |
|
WD01 | Invention patent application deemed withdrawn after publication |